Cooling flow channel assembly, controller and vehicle

Abstract

The utility model discloses a cooling flow channel assembly, a controller and a vehicle. The cooling flow channel assembly comprises a cooling flow channel; and the first heat dissipation structure is arranged in the cooling flow channel and used for cooling a first heating component, and the first heat dissipation structure is suitable for being arranged corresponding to the first heating component. The first heat dissipation structure is arranged in the cooling flow channel for the first heating component with the large heat dissipation requirement, the flow resistance of the whole cooling flow channel assembly can be reasonably configured, the heat dissipation capacity of the cooling flow channel assembly is matched with the heat dissipation requirement of the first heating component, and therefore the heat dissipation efficiency of the whole vehicle is improved when the cooling flow channel assembly is arranged on the whole vehicle. A liquid inlet and a liquid outlet do not need to be distinguished, the requirement for vehicle arrangement is low, more vehicle types and arrangement spaces can be adapted, and the requirement for vehicle arrangement flexibility is met.

Description

TECHNICAL FIELD

[0001] The present application relates to a cooling flow channel assembly, in particular to a cooling flow channel assembly, a controller and a vehicle. BACKGROUND

[0002] With the increasing demand for intelligentization and comfort of vehicles, the number of vehicle parts increases, the space requirement in the vehicle is large, and the layout space of the whole vehicle parts is increasingly limited. The compatibility and flexibility of the layout of the parts are also increasingly required. In the related art, the position distribution of the heating components on the circuit board of the intelligent driving domain controller on the vehicle is uneven, and there are individual components, such as control chips, which have tens of times more heat than other components. The intelligent driving domain controller is usually cooled by a cooling flow channel assembly. However, if the inlet and outlet are interchanged in some limited layout space, the heat dissipation capacity of the cooling flow channel assembly to the chip region with large local heat will be obviously inconsistent or the heat dissipation performance after replacement will not meet the requirements, and it is difficult to meet the flexibility requirements of the layout of the whole vehicle parts. SUMMARY

[0003] The present application provides a cooling flow channel assembly, a controller and a vehicle.

[0004] In a first aspect, the present application provides a cooling flow channel assembly, comprising:

[0005] a cooling flow channel;

[0006] a first heat dissipation structure, the first heat dissipation structure being arranged in the cooling flow channel and being used for cooling a first heating component, the first heat dissipation structure being adapted to be arranged correspondingly to the first heating component.

[0007] In this way, the first heat dissipation structure is arranged in the cooling flow channel for the first heating component with large heat dissipation demand, which can realize reasonable configuration of the flow resistance of the whole cooling flow channel assembly, so that the heat dissipation capacity of the cooling flow channel assembly matches the heat dissipation demand of the first heating component, thereby making the cooling flow channel assembly arranged in the whole vehicle without distinguishing the inlet and outlet, which has low requirements on the vehicle layout and can be adapted to more vehicle models and layout spaces, and meets the flexibility requirements of the vehicle layout.

[0008] Optionally, the first heat dissipation structure comprises a first heat dissipation rib, and an extension direction of the first heat dissipation rib is consistent with an extension direction of the cooling flow channel at the first heat dissipation rib.

[0009] Optionally, the first heat dissipation structure comprises a plurality of first heat dissipation ribs, and a groove for fluid circulation is formed between adjacent first heat dissipation ribs.

[0010] Optionally, the first heat dissipation structure comprises a plurality of first heat dissipation ribs, and the plurality of first heat dissipation ribs are arranged side by side along a first direction, and the first direction is perpendicular to an extension direction of the cooling flow channel at the first heat dissipation rib.

[0011] Optionally, the plurality of first heat dissipation ribs have different widths.

[0012] Optionally, in the first direction, the width of the first heat dissipation ribs in the middle is greater than the width of the first heat dissipation ribs on the two sides.

[0013] Optionally, the cooling flow channel assembly further comprises a first flow channel port and a second flow channel port, the first flow channel port and the second flow channel port are respectively connected with the cooling flow channel;

[0014] The first flow channel port is configured as an inlet, and the second flow channel port is configured as an outlet.

[0015] Or, the second flow channel port is configured as an inlet, and the first flow channel port is configured as an outlet.

[0016] Optionally, the cooling flow channel further comprises:

[0017] A first heat dissipation region, the first heat dissipation structure is arranged in the first heat dissipation region;

[0018] A second heat dissipation structure, a second heat dissipation region, the second heat dissipation region is adjacent to the first flow channel port, and the second heat dissipation structure is arranged in the second heat dissipation region;

[0019] And / or, a third heat dissipation structure, a third heat dissipation region, the third heat dissipation region is adjacent to the second flow channel port, and the third heat dissipation structure is arranged in the third heat dissipation region.

[0020] Optionally, the second heat dissipation structure and / or the third heat dissipation structure comprises a heat dissipation column.

[0021] Optionally, a groove for fluid flow is formed between adjacent first heat dissipation ribs; the second heat dissipation structure and / or the third heat dissipation structure comprises a plurality of heat dissipation columns, the plurality of heat dissipation columns are arranged at intervals, and at least one of the heat dissipation columns is arranged opposite to the groove.

[0022] Optionally, the cooling flow channel assembly further comprises a shell and a cover plate, the cooling flow channel is formed between the shell and the cover plate, the cross-sectional area of the flow channel at the second heat dissipation region is greater than the cross-sectional area of the flow channel at the third heat dissipation region, and the number of heat dissipation columns in the second heat dissipation region is greater than the number of heat dissipation columns in the third heat dissipation region.

[0023] Optionally, the cooling flow channel assembly further comprises a shell and a cover plate, the cooling flow channel is formed between the shell and the cover plate, and the side of the shell away from the cooling flow channel comprises a heat dissipation boss, wherein at least one heat dissipation boss is adapted to be in contact with the first heat generating component.

[0024] Optionally, the cooling flow channel further comprises a fourth heat dissipation structure, the fourth heat dissipation structure is adapted to be arranged corresponding to a second heat generating component whose heat generation is less than or equal to that of the first heat generating component.

[0025] Optionally, the fourth heat dissipation structure comprises second heat dissipation ribs, the number of the first heat dissipation ribs in the first heat dissipation structure is greater than or equal to the number of the second heat dissipation ribs in the fourth heat dissipation structure.

[0026] Optionally, the cooling flow channel is a U-shaped liquid cooling flow channel structure, a V-shaped liquid cooling flow channel structure or a Y-shaped liquid cooling flow channel structure.

[0027] In a second aspect, the present application further provides a controller, the controller comprising a first heat generating component and the cooling flow channel assembly of the first aspect.

[0028] Optionally, the controller further comprises:

[0029] a circuit board, the first heat generating component is arranged on the circuit board;

[0030] a lower shell, the circuit board is arranged in an enclosed cavity formed by the shell and the lower shell.

[0031] Optionally, the controller further comprises a second heat generating component, the second heat generating component is arranged on the circuit board, and the heat generation of the second heat generating component is less than or equal to that of the first heat generating component.

[0032] Optionally, the controller comprises an intelligent driving domain controller.

[0033] In a third aspect, the present application further provides a vehicle, the vehicle comprising the cooling flow channel assembly of the first aspect or the controller of the second aspect. BRIEF DESCRIPTION OF DRAWINGS

[0034] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings in which:

[0035] Figure 1 is a schematic diagram of a controller according to an embodiment of the present application;

[0036] Figure 2 is a schematic diagram of a cooling flow channel assembly according to an embodiment of the present application;

[0037] Figure 3 is another schematic diagram of a cooling flow channel assembly according to an embodiment of the present application;

[0038] Figure 4 is still another schematic diagram of a cooling flow channel assembly according to an embodiment of the present application;

[0039] Figure 5is yet another schematic view of a cooling runner assembly according to an embodiment of the present application;

[0040] Figure 6 is yet another schematic view of a cooling runner assembly according to an embodiment of the present application;

[0041] Figure 7 is yet another schematic view of a controller according to an embodiment of the present application.

[0042] Reference Signs:

[0043] cooling runner assembly 1; cooling runner 11;

[0044] first heat dissipation structure 111; second heat dissipation structure 112; third heat dissipation structure 113; fourth heat dissipation structure 114; first heat dissipation rib 1111; second heat dissipation rib 1141; third heat dissipation rib 1151; groove 1112; heat dissipation column 1113; housing 12; heat dissipation boss 1201-1220; cover plate 13; first runner port 14; second runner port 15; first heat dissipation area 16; second heat dissipation area 17; third heat dissipation area 18; fourth heat dissipation area 19;

[0045] lower shell 2;

[0046] control board 3; first heat generating component 321; second heat generating component 322; heat generating element 301-320. DETAILED DESCRIPTION

[0047] Embodiments of the present application are described in detail below with reference to the attached drawing figures, wherein the same or like reference numerals are used throughout the drawings to refer to the same or like elements or elements having the same or similar functionality. It will be apparent to those skilled in the art that the described embodiments are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work under the premise that the scope of protection of the present application.

[0048] The terms "first", "second", "third", "fourth" and the like in the description and in the claims of the present application, and above-described drawings, if any, are used to distinguish between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the use of the terms so clad can be interchanged, where appropriate, to refer to a similar embodiment to that described herein. Furthermore, the terms "comprise" and "have", and any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or apparatus that comprises a list of steps or units not necessarily limited to those clearly identified, but can include other not clearly recited steps or units inherent to such processes, methods, products, or apparatus.

[0049] The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0050] With the increasing demand for vehicle intelligence and comfort, the number of vehicle parts increases, the space requirement inside the vehicle is large, and the layout space of the whole vehicle parts is increasingly limited. The compatibility and flexibility of the layout of the parts are also increasingly required. In the related art, the position distribution of the heating components on the circuit board of the intelligent driving domain controller on the vehicle is uneven, and there are individual components, such as control chips, whose heat dissipation is tens of times larger than that of other components. The intelligent driving domain controller is usually cooled by a cooling flow channel assembly, but if in some limited layout space, such as the installation position of the water pump, the water inlet and outlet pipeline direction is required, the liquid inlet and outlet need to be interchanged, and the cooling flow channel assembly has obvious inconsistent heat dissipation capacity for the chip region with large local heat dissipation, or the heat dissipation performance after replacement does not meet the demand, which is difficult to meet the layout flexibility demand of the whole vehicle parts.

[0051] Please refer to Figures 1-7 According to a first aspect of the present disclosure, according to the schematic view of the cooling flow channel assembly 1 shown in the exemplary embodiments of the present application, the cooling flow channel assembly 1 comprises:

[0052] a cooling flow channel 11;

[0053] a first heat dissipation structure 111, the first heat dissipation structure 111 is arranged in the cooling flow channel 11, and is used for cooling the first heating component 321, the first heat dissipation structure 111 is adapted to be arranged correspondingly with the first heating component 321.

[0054] The cooling flow channel assembly 1 can be used for heat dissipation of a controller or other components to be cooled, for example, an intelligent driving domain controller on a vehicle, wherein the intelligent driving domain controller includes a control chip with high heat generation, which is a first heat-generating component 321 and the heat generation of the control chip is tens of times of that of other components on the intelligent driving domain controller. In the related art, the liquid inlet of the cooling flow channel 11 is arranged on the side close to the control chip, so as to meet the heat dissipation requirement of the control chip. However, when the liquid inlet and the liquid outlet are interchanged, the liquid inlet is far away from the control chip, and is affected by the flow path and the flow resistance of the cooling flow channel assembly 1. When the fluid reaches the region of the control chip, the heat dissipation capacity of the region of the control chip is obviously inconsistent with that before the liquid inlet and the liquid outlet are interchanged, and the heat dissipation requirement of the control chip cannot be met. In the embodiment of the present application, the cooling flow channel assembly 1 includes the cooling flow channel 11, the cooling liquid flows into the cooling flow channel 11 from the liquid inlet, circulates in the cooling flow channel 11, and then flows out from the liquid outlet, so as to achieve heat dissipation. The outside of the shell 12 is in contact with the first heat-generating component 321 with high heat dissipation requirement, and the cooling flow channel 11 is formed in the inside of the shell 12. The first heat dissipation structure 111 is arranged at the position corresponding to the first heat-generating component 321 in the cooling flow channel 11. That is, the first heat dissipation structure 111 and the first heat-generating component 321 are arranged opposite to each other on the inside and outside of the shell 12. The first heat dissipation structure 111 is arranged in the cooling flow channel 11 to perform targeted heat dissipation on the first heat-generating component 321, so as to reasonably configure the flow resistance of the entire cooling flow channel assembly 1, match the heat dissipation capacity of the cooling flow channel assembly 1 with the requirement of the first heat-generating component 321, and make the heat dissipation capacity consistent or close when the fluid flows through the region where the first heat-generating component 321 is located when the liquid inlet and the liquid outlet are interchanged. Therefore, when the cooling flow channel assembly 1 is arranged on the vehicle, it is not necessary to distinguish the liquid inlet and the liquid outlet, the requirement for the vehicle arrangement is low, more vehicle models and arrangement spaces can be adapted, the requirement for the flexibility of the vehicle arrangement is met, and meanwhile, multiple vehicle models can be compatible, and the use cost is reduced.

[0055] In some possible embodiments, the first heat dissipation structure 111 includes a first heat dissipation rib 1111 (only part is shown in the figure), and the extension direction of the first heat dissipation rib 1111 is consistent with the extension direction of the cooling flow channel 11 at the first heat dissipation rib 1111. By arranging the first heat dissipation rib 1111, the fluid contact area can be increased, the local heat dissipation area can be increased, and the heat dissipation performance can be improved. Meanwhile, the extension direction of the first heat dissipation rib 1111 is consistent with the extension direction of the cooling flow channel 11 at the first heat dissipation rib 1111, so that the flow resistance can be reduced, and the heat dissipation performance can be improved. Meanwhile, compared with the structure in the form of a heat dissipation needle or a heat dissipation column, the cooling liquid does not flow around the heat dissipation needle or the heat dissipation column, and vortex is not easily formed, so that the heat dissipation performance is not reduced.

[0056] In some possible embodiments, when the cooling flow channel 11 has a bend, a third heat dissipation fin 1151 is arranged at the bend, and the extending direction of the third heat dissipation fin 1151 is consistent with the extending direction of the cooling flow channel 11 at the bend, so that the fluid can be guided to be uniformly distributed. For example Figure 4 As shown in the enlarged view of the first heat dissipation structure 111 on the right, the groove 1112 can be a cuboid. When the inlet and the outlet are interchanged, that is, the flow direction of the cooling fluid is different, the contact area, the flow rate, and the flow resistance of the first heat dissipation structure 111 are consistent or close, so that the heat dissipation performance of the first heat dissipation structure 111 is consistent.

[0057] In some possible embodiments, the first heat dissipation structure 111 includes a plurality of first heat dissipation fins 1111, and a groove 1112 for fluid flow is formed between adjacent first heat dissipation fins 1111. For example Figure 4 As shown in the enlarged view of the first heat dissipation structure 111 on the right, the groove 1112 can be a cuboid. When the inlet and the outlet are interchanged, that is, the flow direction of the cooling fluid is different, the contact area, the flow rate, and the flow resistance of the first heat dissipation structure 111 are consistent or close, so that the heat dissipation performance of the first heat dissipation structure 111 is consistent.

[0058] In some possible embodiments, the first heat dissipation structure 111 includes a plurality of first heat dissipation fins 1111, and the plurality of first heat dissipation fins 1111 are arranged side by side in a first direction, and the first direction is perpendicular to the extending direction of the cooling flow channel 11 at the first heat dissipation fin. By arranging the plurality of first heat dissipation fins 1111 side by side in the first direction, the contact area can be further increased, and the extending direction of the first heat dissipation fin 1111 is consistent with the extending direction of the cooling flow channel 11 at the first heat dissipation fin.

[0059] In some possible embodiments, the widths of the plurality of first heat dissipation fins 1111 are different, so as to finely design the heat dissipation according to the heat generation characteristics of the first heat-generating component 321, and improve the heat dissipation performance. For example, if the middle part of the first heat-generating component 321 generates more heat, the width of the middle first heat dissipation fin 1111 can be greater than that of the first heat dissipation fin 1111 on the two sides. If the heat generation of the first heat-generating component 321 increases linearly, the width of the first heat dissipation fin 1111 can also be designed to increase linearly.

[0060] In some possible embodiments, in the first direction, the width of the middle first heat dissipation fin 1111 is greater than the width of the first heat dissipation fin 1111 on the two sides. For example, the first heat-generating component 321 is a control chip, and generally, the middle part of the control chip generates more heat. Therefore, the width of the middle first heat dissipation fin 1111 can be greater than that of the first heat dissipation fin 1111 on the two sides. In this way, the local area with large heat dissipation can be designed for targeted heat dissipation, and the heat dissipation performance can be improved.

[0061] In some possible embodiments, the cooling flow channel assembly 1 further comprises a first flow channel port 14 and a second flow channel port 15, which are respectively connected with the cooling flow channel 11; the first flow channel port 14 is configured as an inlet port, and the second flow channel port 15 is configured as an outlet port; or, the second flow channel port 15 is configured as an inlet port, and the first flow channel port 14 is configured as an outlet port. Through the configuration of the first flow channel port 14 and the second flow channel port 15, the inlet port and the outlet port can be interchanged according to the vehicle model arrangement environment and requirements, so as to meet the requirement of vehicle arrangement flexibility.

[0062] In some possible embodiments, the cooling flow channel 11 further comprises:

[0063] a first heat dissipation region 16, wherein the first heat dissipation structure 111 is arranged in the first heat dissipation region 16;

[0064] a second heat dissipation structure 112 and a second heat dissipation region 17, wherein the second heat dissipation region 17 is adjacent to the first flow channel port 14, and the second heat dissipation structure 112 is arranged in the second heat dissipation region 17;

[0065] and / or a third heat dissipation structure 113 and a third heat dissipation region 18, wherein the third heat dissipation region 18 is adjacent to the second flow channel port 15, and the third heat dissipation structure 113 is arranged in the third heat dissipation region 18. Through the arrangement of the second heat dissipation structure 112 or the third heat dissipation structure 113 adjacent to the first flow channel port 14 or the second flow channel port 15, wherein the second heat dissipation region 17 is located between the first flow channel port 14 and the first heat dissipation region 16, and the third heat dissipation region 18 is located between the second flow channel port 15 and the first heat dissipation region, the flow resistance of the fluid flowing through the second heat dissipation region 17 or the third heat dissipation region 18 can be controlled, so as to avoid that the flow resistance is too large or too small, and the overall heat dissipation performance is improved.

[0066] In some possible embodiments, the second heat dissipation structure 112 and / or the third heat dissipation structure 113 comprises a heat dissipation column 1113.

[0067] In some possible embodiments, the heat dissipation column 1113 comprises a plurality of rows of heat dissipation columns 1113, and adjacent two rows of heat dissipation columns 1113 are arranged in a staggered manner. The cooling liquid flowing through the heat dissipation column 1113 changes the direction of the fluid to both sides of the heat dissipation column 1113, and changes the direction through the plurality of rows of heat dissipation columns 1113, so that the cooling liquid flow rate is uniformly distributed in the flow channel. The heat dissipation column 1113 can be circular, directional or any columnar structure.

[0068] In some possible embodiments, the second heat dissipation structure 112 and / or the third heat dissipation structure 113 comprises a plurality of heat dissipation columns 1113, which are arranged at intervals, and at least one heat dissipation column 1113 is arranged opposite to the groove 1112. The heat dissipation column 1113 arranged opposite to the groove 1112 can effectively achieve the effect of disturbing flow and reducing flow resistance.

[0069] In some possible embodiments, the cooling flow channel assembly 1 further comprises a shell 12 and a cover plate 13, the cooling flow channel 11 is formed between the shell 12 and the cover plate 13, the cross-sectional area of the flow channel at the second heat dissipation area 17 is larger than that at the third heat dissipation area 18, and the number of heat dissipation columns 1113 in the second heat dissipation area 17 is more than that in the third heat dissipation area 18. It can be understood that when too many heat dissipation columns 1113 are designed, the flow resistance of the cooling flow channel assembly 1 will be too large, and the power of the cooling liquid supply pump will be larger, which indirectly reduces the heat dissipation efficiency; when too few heat dissipation columns 1113 are designed, the flow resistance of the cooling flow channel assembly 1 will be small, but the contact area between the cooling liquid and the heat dissipation column 1113 is small, the cross-sectional area of the cooling flow channel 11 is large, and the flow rate of the cooling liquid is low, which will reduce the heat dissipation performance. In some possible cases, the cross-sectional areas of the second heat dissipation area 17 and the third heat dissipation area 18 of the cooling flow channel 11 are different due to product arrangement, and different numbers of heat dissipation columns 1113 are arranged according to different cross-sectional areas, which can effectively realize that when the inlet and outlet are interchanged, the flow resistance when flowing through the second heat dissipation area 17 or the third heat dissipation area 18 to the first heat dissipation area 16 is matched with the heat exchange capacity of the first heat dissipation area 16.

[0070] In some possible embodiments, when the inlet and outlet are interchanged, the paths to the first heat dissipation area 16 are different, for example, referring to Figures 5-6 A schematic diagram of the fluid flow direction in the cooling flow channel 11, when the first flow channel port 14 is set as the inlet and the second flow channel port 15 is set as the outlet, the fluid enters from the first flow channel port 14, passes through the second heat dissipation area 17 and the fourth heat dissipation area 19, and reaches the first heat dissipation area 16; when the first flow channel port 14 is set as the outlet and the second flow channel port 15 is set as the inlet, the fluid enters from the second flow channel port 15, passes through the third heat dissipation area 18, and reaches the first heat dissipation area 16. Therefore, by arranging different numbers of heat dissipation columns 1113 in the second heat dissipation area 17 and / or the third heat dissipation area 18, the flow resistance when the inlet and outlet are interchanged and reach the first heat dissipation area 16 can be matched with the heat dissipation capacity of the first heat dissipation area 16.

[0071] In some possible embodiments, the cooling flow channel assembly 1 further comprises a housing 12 and a cover plate 13, the cooling flow channel 11 is formed between the housing 12 and the cover plate 13, the housing 12 away from the cooling flow channel 11 side comprises heat dissipation bosses 1201-1220, wherein at least one heat dissipation boss 1220 is adapted to be in contact with the first heat-generating component 321. To transfer heat to the cooling flow channel 11 through the heat dissipation bosses 1201-1220. For example, in the embodiment shown in the present application, the housing 12 comprises heat dissipation bosses 1201-1220, which are arranged corresponding to the heat-generating components 301-320 on the circuit board 3 of the controller 1000, wherein the heat dissipation boss 1201 is in contact with the heat-generating component 301; the heat dissipation boss 1202 is in contact with the heat-generating component 302; in this order, the heat dissipation boss 1220 is in contact with the heat-generating component 320, wherein the first heat-generating component 321 comprises the heat-generating component 320.

[0072] In some possible embodiments, the cooling flow channel 11 further comprises a fourth heat dissipation structure 114, which is adapted to be arranged corresponding to a second heat-generating component 322 with a heat generation less than or equal to the first heat-generating component 321. The second heat-generating component 321 or the second heat-generating component 322 can be any combination of the heat-generating components 301-320, for example, in the embodiment of the present application, the first heat-generating component comprises the heat-generating component 320, and the second heat-generating component comprises the heat-generating components 301-306, so as to flexibly cool the heat-generating components. For another example, the first heat-generating component 321 is a control chip, and the second heat-generating component 322 is a combination of a capacitor or a resistor; the present disclosure does not limit this.

[0073] In some possible embodiments, the heat generation of the first heat-generating component 321 is greater than or equal to the heat generation of the second heat-generating component 322, and the fourth heat dissipation structure 114 comprises a second heat dissipation rib 1141, the number of the first heat dissipation ribs 1111 in the first heat dissipation structure 111 is greater than or equal to the number of the first heat dissipation ribs 1141 in the fourth heat dissipation structure 114. The first heat dissipation area 16 corresponding to the first heat-generating component 321 with large heat generation increases the heat dissipation area through the first heat dissipation rib 1111, and improves the heat dissipation performance, and the fourth heat dissipation area 19 corresponding to the second heat-generating component 322 with small heat generation tries to reduce the number of the first heat dissipation ribs 1141; both can meet the different needs of different heat-generating components for heat dissipation performance, and at the same time, try to reduce the flow resistance of the cooling liquid flowing through the intelligent driving domain controller, and improve the overall heat dissipation performance.

[0074] In some possible embodiments, the cooling flow channel 11 is a U-shaped liquid cooling flow channel structure, a V-shaped liquid cooling flow channel structure or a Y-shaped liquid cooling flow channel structure, so as to reduce the space requirement of the cooling flow channel assembly 1. The cooling flow channel 11 can also be other forms of flow channels, and the present disclosure does not limit this.

[0075] According to the second aspect of the present disclosure, a controller 1000 is also provided, comprising the first heat-generating component 321 and the cooling channel assembly 1 of the first aspect to achieve integrated cooling for the heat-generating components 301-320 in the controller 1000. The first heat-generating component 321 with high heat dissipation requirement is provided with the first heat dissipation structure 111 in the cooling channel 11, so that the flow resistance of the entire cooling channel assembly 1 can be reasonably configured, and the heat dissipation capacity of the cooling channel assembly 1 can be matched with the requirement of the heat-generating components 301-320, so that when the cooling channel assembly 1 is arranged in the vehicle, the inlet and outlet of the cooling channel assembly 1 do not need to be distinguished, the requirement for the vehicle arrangement is low, more vehicle models and arrangement spaces can be adapted, the requirement for the flexibility of the vehicle arrangement can be met, and meanwhile, the cooling channel assembly 1 can be compatible with multiple vehicle models, and the use cost can be reduced.

[0076] In some possible embodiments, the controller 1000 further comprises a circuit board 3, and the first heat-generating component 321 is arranged on the circuit board 3; and a lower shell 2, and the circuit board 3 is arranged in the closed cavity formed by the shell 12 and the lower shell 2.

[0077] In some possible embodiments, the controller 1000 further comprises a second heat-generating component 322, and the second heat-generating component 322 is arranged on the circuit board 3, wherein the heat generation of the second heat-generating component 322 is less than or equal to that of the first heat-generating component 321. The second heat-generating component 322 can be any combination of the heat-generating components 301-320, for example, in the embodiments of the present application, the second heat-generating component 322 is a combination of 301-306, so as to flexibly cool the heat-generating components. Since the controller has all the beneficial effects of the above cooling channel assembly 1, they will not be repeated here.

[0078] In some possible embodiments, the controller 1000 comprises an intelligent driving domain controller. The controller comprises a cooling flow channel assembly 1 circuit board 3, a lower shell 2. The cooling flow channel assembly 1 comprises a cover plate 13 and a shell 12, both of which are welded into one body, and a cavity between the two forms a cooling flow channel 11. The cooling flow channel assembly 1 further comprises a first flow channel port 14 and a second flow channel port 15, so that the cooling liquid can enter from the first flow channel port 14 and flow out from the second flow channel port 15, or enter from the second flow channel port 15 and flow out from the first flow channel port 14. The circuit board 3 is installed on the shell 12, and the heat-emitting components 301-320 transfer heat to the flow channel through the heat dissipation bosses 1201-1220 on the shell 12, and then the cooling liquid carries away the heat-emitting components 301-320 in the intelligent driving domain controller to achieve cooling of the heat-emitting components 301-320 in the intelligent driving domain controller. After the circuit board 3 is installed, the lower shell 2 is installed to enclose the cavity between the shell 12 and the lower shell 2. The second heat dissipation area 17 and the third heat dissipation area 18 adjacent to the first flow channel port 14 and the second flow channel port 15 are provided with circular heat dissipation columns 1113 to change the direction of the cooling liquid and achieve uniform cooling liquid flow rate. In the cooling flow channel 11, the first heat dissipation area 16 corresponding to the first heat-emitting component 321 is provided with a first heat dissipation rib 1111 to locally increase the heat dissipation area and improve the heat dissipation performance. The remaining areas are not provided with heat dissipation structures or provided with heat dissipation ribs of heat dissipation structures, for example, a fourth heat dissipation area 19 corresponding to a second heat-emitting component 322 is provided with a smaller number of second heat dissipation ribs 1141 to reduce the flow resistance of the cooling liquid flowing through the intelligent driving domain controller, while meeting the heat dissipation needs of the heat-emitting components 301-320 corresponding to different areas. In some possible embodiments, the heat-emitting components 301-320 on the circuit board 3 are provided with heat-conducting glue on the surface to conduct heat. When the controller 1000 is arranged on a vehicle, due to the limitation of the arrangement space, the positions of the liquid inlet and the liquid outlet are limited. According to the embodiments of the present application, the liquid inlet and the liquid outlet can be interchanged, and the controller 1000, especially for the first heat-emitting component 321 with large heat emission in the controller 1000, has consistent or close heat dissipation performance, is more suitable for the environment, can be applied more widely, and has higher economic value.

[0079] According to a third aspect of the present application, the present application also provides a vehicle (not shown) comprising the cooling flow channel assembly 1 of the first aspect or the controller 1000 of the second aspect. Since the vehicle has all the advantages of the cooling flow channel assembly 1 and the controller 1000, further description is omitted here.

[0080] The preferred embodiments of the present disclosure are described in detail above with reference to the drawings, but the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

[0081] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other manners. For example, the division of the units is only a logical function division, and there can be another division manner in actual implementation. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In this way, the actual division of the units can be different from the division in the embodiment.

[0082] The above describes only to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some technical features; and these modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A cooling channel assembly, characterized in that, include: Cooling channels; A first heat dissipation structure is disposed in the cooling channel for cooling a first heat-generating component. The first heat dissipation structure is adapted to be disposed corresponding to the first heat-generating component. A first flow channel opening and a second flow channel opening are respectively connected to the cooling flow channel; The first heat dissipation area, wherein the first heat dissipation structure is disposed in the first heat dissipation area; The second heat dissipation structure and the second heat dissipation area are adjacent to the first flow channel opening, and the second heat dissipation structure is disposed in the second heat dissipation area. And / or, a third heat dissipation structure, a third heat dissipation area, wherein the third heat dissipation area is adjacent to the second flow channel opening, and the third heat dissipation structure is disposed in the third heat dissipation area.

2. The cooling channel assembly according to claim 1, characterized in that, The first heat dissipation structure includes: The first heat dissipation fin extends in the same direction as the cooling channel at the first heat dissipation fin.

3. The cooling channel assembly according to claim 2, characterized in that, The first heat dissipation structure includes a plurality of first heat dissipation fins, and grooves for fluid flow are formed between adjacent first heat dissipation fins.

4. The cooling channel assembly according to claim 2, characterized in that, The first heat dissipation structure includes a plurality of first heat dissipation fins, which are arranged side by side along a first direction, the first direction being perpendicular to the extension direction of the cooling channel at the first heat dissipation fins.

5. The cooling channel assembly according to claim 4, characterized in that, The widths of the plurality of first heat dissipation fins are different.

6. The cooling channel assembly according to claim 5, characterized in that, In the first direction, the width of the first heat dissipation rib in the middle is greater than the width of the first heat dissipation ribs on both sides.

7. The cooling channel assembly according to any one of claims 4-6, characterized in that, The first flow channel is configured as a liquid inlet, and the second flow channel is configured as a liquid outlet; Alternatively, the second flow channel is configured as an inlet, and the first flow channel is configured as an outlet.

8. The cooling channel assembly according to claim 7, characterized in that, The second and / or third heat dissipation structures include heat dissipation columns.

9. The cooling channel assembly according to claim 8, characterized in that, A groove for fluid flow is formed between adjacent first heat dissipation fins; the second heat dissipation structure and / or the third heat dissipation structure includes a plurality of heat dissipation columns, which are spaced apart, wherein at least one of the heat dissipation columns is arranged opposite to the groove.

10. The cooling channel assembly according to claim 9, characterized in that, The cooling channel assembly further includes a housing and a cover plate, the cooling channel being formed between the housing and the cover plate, the cross-sectional area of ​​the channel in the second heat dissipation area being larger than the cross-sectional area of ​​the channel in the third heat dissipation area, and the number of heat dissipation columns in the second heat dissipation area being greater than the number of heat dissipation columns in the third heat dissipation area.

11. The cooling channel assembly according to claim 1, characterized in that, The cooling channel assembly further includes a housing and a cover plate, the cooling channel being formed between the housing and the cover plate, and the side of the housing away from the cooling channel including a heat dissipation boss, wherein at least one heat dissipation boss is adapted to contact the first heat-generating component.

12. The cooling channel assembly according to claim 2, characterized in that, The cooling channel further includes a fourth heat dissipation structure, which is adapted to correspond to a second heat dissipation component whose heat generation is less than or equal to that of the first heat dissipation component.

13. The cooling channel assembly according to claim 12, characterized in that, The fourth heat dissipation structure includes a second heat dissipation fin, wherein the number of the first heat dissipation fins in the first heat dissipation structure is greater than or equal to the number of the second heat dissipation fins in the fourth heat dissipation structure.

14. The cooling channel assembly according to claim 1, characterized in that, The cooling channel is a U-shaped liquid cooling channel structure, a V-shaped liquid cooling channel structure, or a Y-shaped liquid cooling channel structure.

15. A controller, characterized in that, The controller includes a first heating element and a cooling channel assembly as described in any one of claims 1-14.

16. The controller according to claim 15, characterized in that, The controller also includes: A circuit board, wherein the first heating element is disposed on the circuit board; The lower shell contains the circuit board disposed within the enclosed cavity formed by the housing and the lower shell.

17. The controller according to claim 16, characterized in that, The controller also includes: A second heating element is disposed on the circuit board, and the heat output of the second heating element is less than or equal to that of the first heating element.

18. The controller according to any one of claims 15-17, characterized in that, The controller includes an intelligent driving domain controller.

19. A vehicle, characterized in that, The vehicle includes a cooling channel assembly as described in any one of claims 1-14 or a controller as described in any one of claims 15-17.

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