Integrated circuit chip test positioning device

Abstract

The utility model discloses an integrated circuit chip testing and positioning device, which relates to the technical field of integrated circuit chip testing and comprises a positioning frame, a positioning block is fixedly connected to the top of the positioning frame, a positioning assembly is arranged on the positioning frame, one end of an extension rod is fixedly connected with a mounting plate, and the other end of the extension rod is fixedly connected with a clamping plate. Pressure sensors are symmetrically arranged on the surface of the mounting plate, and one side of each pressure sensor is fixedly connected with a rubber plate. A connecting plate is driven to move through an electric push rod, a connecting rod is driven to move in a sliding groove through movement of the connecting plate, so that a sliding block is driven to slide along the sliding groove, a mounting plate is driven to move towards a positioning block under the action of the sliding block, and a rubber plate is driven to move through the mounting plate and is matched with the positioning block to press and fix a chip. The pressurization force of the rubber plate is detected through the pressure sensor, the force applied to the chips is changed according to different chips, and it is guaranteed that the chips can be positioned and fixed and cannot be damaged.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit chip test technical field, concretely is a kind of integrated circuit chip test positioning device. BACKGROUND

[0002] Integrated circuit is a kind of miniature electronic device or component, all components constitute a whole in structure, make electronic component micro-miniaturization, low power consumption and high reliability, integrated circuit has the advantages such as small size, light weight, few lead and soldering point, long life, high reliability, good performance, low cost, easy mass production, integrated circuit chip needs to be detected in production process, chip test mode is more, but test must be positioned to chip, there are some deficiencies in the use of common chip positioning device, for example, the flexibility of positioning device positioning is poor, cannot be positioned and fixed to multiple specifications of chip.

[0003] After searching, the existing public patent number: CN202220153329.1, public patent name: integrated circuit chip test positioning device, including base plate, the base plate top outer wall is fixedly connected with the symmetrically arranged guide rod, two The outer wall of the guide rod is slidably connected with the same support plate, the support plate one side outer wall is also fixedly connected with the symmetrically arranged fixed rod, two The bottom end of the fixed rod is fixedly connected with the pressing plate, and the bottom outer wall of the two pressing plates is fixedly connected with the insulating rubber pad. The utility model discloses a guide rod, support plate, fixed rod, pressing plate, guide rail, electric telescopic rod and insulating rubber pad are arranged, after integrated circuit chip is placed, the integrated circuit chip can be pressed and stabilized, the positioning effect of integrated circuit chip is reached, and the insulating rubber pad plays a protective role on integrated circuit chip, it is more practical, and it is suitable for extensive promotion and use.

[0004] However, the compression spring elastic force is fixed when the above-mentioned device is used, the extrusion force cannot be changed according to the different chips, the chip is easily damaged, and the chip test is not conducive. UTILITY MODEL CONTENTS

[0005] Technical problem solved

[0006] In view of the defects of the prior art, the utility model provides an integrated circuit chip test positioning device, which solves the problems that the extrusion force cannot be changed according to the different chips, the chip is easily damaged, and the chip test is not conducive.

[0007] Technical scheme

[0008] In order to achieve the above object, the utility model discloses an integrated circuit chip test positioning device through the following technical schemes: a positioning frame, the positioning frame top fixedly connected with the locating block, be provided with positioning assembly on the positioning frame, positioning assembly includes the electric push rod fixedly connected in the positioning frame, the electric push rod telescopic end fixedly connected with the connecting plate, the positioning frame top is equipped with the sliding slot, the sliding slot is slidably connected with the sliding block, the sliding block one side fixedly connected with the connecting rod, the connecting rod is fixedly connected on one side of connecting plate, the sliding block other side fixedly connected with the extension rod, the extension rod one end fixedly connected with the mounting plate, the mounting plate surface is equipped with the pressure sensor, the pressure sensor one side fixedly connected with the rubber plate.

[0009] Preferably, the positioning frame surface fixedly connected with the heat conduction plate, the heat conduction plate bottom evenly distributed with the cooling fin.

[0010] Preferably, the positioning frame is provided with angle adjusting assembly, the angle adjusting assembly includes the pivot that is symmetrically arranged in the both sides of positioning frame, the pivot one end rotationally connected with the fixed frame, the fixed frame bottom fixedly connected with the bottom plate, the fixed frame one side fixedly installed with the stepper motor, the stepper motor output shaft end is fixedly connected with the pivot.

[0011] Preferably, the rubber plate and mounting plate height are same, the rubber plate and locating block height and length are same.

[0012] Preferably, the sliding slot is symmetrically equipped with the positioning frame top, the connecting rod is slidably connected in the sliding slot.

[0013] Preferably, the positioning frame is equipped with the through -hole with the same diameter as the connecting rod, and the connecting rod is symmetrically arranged about the electric push rod.

[0014] Preferably, the fixed frame is symmetrically arranged in the central position of the top of the bottom plate.

[0015] Beneficial effects

[0016] The utility model provides a kind of integrated circuit chip test positioning device, and compared with prior art, at least have following beneficial effects:

[0017] Through the movement of connecting plate driven by electric push rod, the connecting rod is moved in sliding slot by the movement of connecting plate, to drive the sliding block to slide along the sliding slot, the mounting plate is moved to the locating block under the action of sliding block, the rubber plate is moved by the mounting plate, and the chip is fixed by the cooperation of locating block, the pressing force of rubber plate is detected by pressure sensor, the force exerted on chip is changed according to different chip, to ensure that chip can be positioned and fixed, and chip is not damaged. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a structural schematic view of the utility model;

[0019] Figure 2 It is a structural schematic view of the angle adjusting assembly of the utility model;

[0020] Figure 3 It is a structural schematic view of the positioning assembly of the utility model;

[0021] Figure 4 It is a structural schematic view of the positioning frame and the heat conduction plate of the utility model.

[0022] In the figure: 1, positioning frame; 2, positioning block; 3, positioning assembly; 301, electric push rod; 302, connecting plate; 303, sliding groove; 304, connecting rod; 305, sliding block; 306, extension rod; 307, mounting plate; 308, pressure sensor; 309, rubber plate; 4, heat conduction plate; 5, cooling fin; 6, angle adjusting assembly; 601, rotating shaft; 602, fixed frame; 603, stepping motor; 604, bottom plate. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0024] Embodiment one:

[0025] Please refer to Figures 1-4 The utility model provides a technical scheme: positioning frame 1, positioning block 2 is fixedly connected to the top of positioning frame 1, positioning assembly 3 is arranged on positioning frame 1, positioning assembly 3 includes electric push rod 301 fixedly connected in the inside of positioning frame 1, the telescopic end of electric push rod 301 is fixedly connected with connecting plate 302, sliding groove 303 is set up in the top of positioning frame 1, sliding block 305 is slidably connected in sliding groove 303, connecting rod 304 is fixedly connected to one side of sliding block 305, connecting rod 304 is fixedly connected to one side of connecting plate 302, extension rod 306 is fixedly connected to the other side of sliding block 305, mounting plate 307 is fixedly connected to one end of extension rod 306, pressure sensor 308 is symmetrically arranged on the surface of mounting plate 307, rubber plate 309 is fixedly connected to one side of pressure sensor 308.

[0026] To the above content analysis: the chip is placed on the top of the positioning frame 1, one side with positioning block 2 fit, through the electric push rod 301 drive connecting plate 302 movement, through the movement of connecting plate 302 drive connecting rod 304 in the chute 303 movement, thus drive the slider 305 along the chute 303 sliding, under the action of slider 305 drive mounting plate 307 to the positioning block 2 moves, through the mounting plate 307 drive rubber plate 309 movement, with positioning block 2 each other cooperation on the chip compression fixed, through the pressure sensor 308 to the rubber plate 309 pressurization degree detection, according to different chip to change the force on the chip, ensure that both can be fixed on the chip positioning, also will not cause damage to the chip.

[0027] Example two:

[0028] Please refer to Figures 1-4 , the utility model provides a technical scheme based on example one: the surface of positioning frame 1 is fixedly connected with heat conduction plate 4, and the bottom of heat conduction plate 4 is uniformly distributed with radiating fin 5.

[0029] To the above content analysis: the heat generated during chip testing is introduced into radiating fin 5 through heat conduction plate 4, and the chip is cooled through heat exchange between radiating fin 5 and air.

[0030] Example three:

[0031] Please refer to Figures 1-4 , the utility model provides a technical scheme based on example one: angle adjusting assembly 6 is arranged on positioning frame 1, angle adjusting assembly 6 includes rotation shaft 601 symmetrically arranged on both sides of positioning frame 1, one end of rotation shaft 601 is rotatably connected with fixed frame 602, bottom plate 604 is fixedly connected with the bottom of fixed frame 602, stepping motor 603 is fixedly installed on one side of fixed frame 602, and the output shaft end of stepping motor 603 is fixedly connected with rotation shaft 601. Fixed frame 602 is symmetrically arranged at the central position on the top of bottom plate 604.

[0032] To the above content analysis: the rotation shaft 601 and the positioning frame 1 are rotated under the drive of the stepping motor 603, so that the chip on the surface of the positioning frame 1 is rotated, which facilitates changing the angle of the chip during chip testing and facilitates testing the chip at different angles.

[0033] Example four:

[0034] Please refer to Figures 1-4 , the utility model provides a technical scheme based on example one: the height of rubber plate 309 and mounting plate 307 is same, and the height and length of rubber plate 309 and positioning block 2 are same.

[0035] To the above content analysis: the rubber plate 309 is moved by the mounting plate 307, and the chip is extruded and fixed by cooperating with the positioning block 2.

[0036] Embodiment five:

[0037] With reference to Figures 1-4 The utility model provides a technical scheme based on embodiment one: the chute 303 symmetry is set up in the positioning stand 1 top, and the connecting rod 304 is slidably connected in the chute 303.

[0038] The above content is analyzed: through the movement of connecting rod 304, the slider 305 is driven to slide along the chute 303, the position of rubber plate 309 is changed, the distance between rubber plate 309 and positioning block 2 is changed, and different size chips are clamped.

[0039] Embodiment six:

[0040] With reference to Figures 1-4 The utility model provides a technical scheme based on embodiment one: the positioning stand 1 is set up with the through hole of the same diameter with connecting rod 304, and connecting rod 304 is symmetrically arranged about electric push rod 301.

[0041] The above content is analyzed: through the through hole, the connecting rod 304 is limited, and the stability of the sliding of connecting rod 304 is guaranteed.

[0042] It should be noted that, in this document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0043] Although the embodiments of the utility model have been shown and described, it is understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit chip testing and positioning device, characterized in that, include: A positioning frame (1) is provided, with a positioning block (2) fixedly connected to the top of the positioning frame (1). A positioning component (3) is provided on the positioning frame (1). The positioning component (3) includes an electric push rod (301) fixedly connected inside the positioning frame (1). A connecting plate (302) is fixedly connected to the telescopic end of the electric push rod (301). A sliding groove (303) is provided on the top of the positioning frame (1). A slider (305) is slidably connected in the sliding groove (303). A connecting rod (304) is fixedly connected to one side of the slider (305). The connecting rod (304) is fixedly connected to one side of the connecting plate (302). An extension rod (306) is fixedly connected to the other side of the slider (305). A mounting plate (307) is fixedly connected to one end of the extension rod (306). Pressure sensors (308) are symmetrically arranged on the surface of the mounting plate (307). A rubber plate (309) is fixedly connected to one side of the pressure sensor (308).

2. The integrated circuit chip testing and positioning device according to claim 1, characterized in that: A heat-conducting plate (4) is fixedly connected to the surface of the positioning frame (1), and heat sinks (5) are evenly distributed at the bottom of the heat-conducting plate (4).

3. The integrated circuit chip testing and positioning device according to claim 1, characterized in that: An angle adjustment component (6) is provided on the positioning frame (1). The angle adjustment component (6) includes a rotating shaft (601) symmetrically arranged on both sides of the positioning frame (1). One end of the rotating shaft (601) is rotatably connected to a fixed frame (602). A base plate (604) is fixedly connected to the bottom of the fixed frame (602). A stepper motor (603) is fixedly installed on one side of the fixed frame (602). The output shaft end of the stepper motor (603) is fixedly connected to the rotating shaft (601).

4. The integrated circuit chip testing and positioning device according to claim 1, characterized in that: The rubber plate (309) is at the same height as the mounting plate (307), and the rubber plate (309) is at the same height and length as the positioning block (2).

5. The integrated circuit chip testing and positioning device according to claim 1, characterized in that: The slide groove (303) is symmetrically opened on the top of the positioning frame (1), and the connecting rod (304) is slidably connected in the slide groove (303).

6. The integrated circuit chip testing and positioning device according to claim 5, characterized in that: The positioning frame (1) has a through hole with the same diameter as the connecting rod (304), and the connecting rod (304) is symmetrically arranged about the electric push rod (301).

7. The integrated circuit chip testing and positioning device according to claim 3, characterized in that: The fixing frame (602) is symmetrically arranged at the top center of the base plate (604).

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