Temperature cycle test equipment
The temperature cycling test equipment, designed with a carrier disk and temperature control platform, solves the problems of slow temperature response and slow heating and cooling speed, achieving fast temperature response and efficient testing, and is suitable for temperature cycling testing of chips.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2026-04-07
AI Technical Summary
In existing temperature cycling testing equipment, the temperature response of the chip under test is slow, which affects the test accuracy. In addition, the heating and cooling rate is slow, resulting in low test efficiency and low energy consumption.
The design employs a carrier disk, a first temperature control platform, and a second temperature control platform. Temperature is transferred directly to both sides of the chip under test through a temperature transfer cover. Combined with the electrical connection of the test probe, it achieves rapid temperature response and fast heating and cooling speeds, preventing temperature differences from affecting test accuracy.
It improves testing accuracy and efficiency, reduces energy consumption, and is suitable for mass chip testing.
Smart Images
Figure CN224095958U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to test equipment technical field especially relates to a temperature cycle test equipment. BACKGROUND
[0002] Temperature cycle test is a reliability test method, is used for testing the stability and reliability of product under different temperature environment, and it can expose potential material defects and manufacturing quality defects in product, assesses product weak point, therefore is widely used in each field. In the test process, the test condition needs to be adjusted according to the product application condition, such as temperature change rate, cycle number etc.
[0003] At present, the temperature cycle test of chip is generally carried out through high-low temperature oven. In the prior art, after the chip to be tested is placed into the high-low temperature oven, the heating wire and compressor condenser inside the oven body are used to heat and cool, and the temperature is propagated to the chip to be tested through air to achieve the purpose of reciprocating heating of the chip to be tested in the oven body, but the high-low temperature oven indirectly transmits temperature to the chip to be tested through air, and the temperature response is slow, thereby affecting the test precision, and due to the slow heating and cooling speed, the test efficiency is affected, and the problem of low energy utilization rate is caused. UTILITY MODEL CONTENT
[0004] The utility model aims at providing a temperature cycle test equipment to solve the problem that the temperature response of the chip to be tested is slow in the prior test process, thereby affecting the test precision, and due to the slow heating and cooling speed, the test efficiency is affected, and the problem of low energy utilization rate is caused.
[0005] To achieve the above purpose, the utility model adopts the following technical scheme:
[0006] The utility model provides a temperature cycle test equipment for temperature cycle test of chip to be tested, which comprises:
[0007] A carrier disc is provided with a placing groove, and the chip to be tested can be placed in the placing groove;
[0008] A first temperature control platform can carry the carrier disc and transfer temperature on one side of the chip to be tested;
[0009] A second temperature control platform is provided with a temperature transfer cover plate, which can be pressed on the carrier disc; the first temperature control platform can transfer temperature on the other side of the chip to be tested through the temperature transfer cover plate;
[0010] A test assembly is provided with a test probe, and the test assembly can be pressed on the temperature transfer cover plate to electrically connect the test probe to the chip to be tested.
[0011] As an optional solution for the above-mentioned temperature cycling test equipment, a film is provided on the side of the temperature transfer cover plate facing the carrier plate, and conductive contacts are provided on the film. The temperature transfer cover plate has a through groove, and the test probe, the through groove, the conductive contacts and the chip under test can be arranged relative to each other in sequence.
[0012] As an optional solution for the above-mentioned temperature cycling test equipment, the outer periphery of the temperature transfer cover plate has a number of positioning protrusions on the side facing the carrier plate, and the film has a number of mounting through holes, with the number of positioning protrusions being inserted into the number of mounting through holes one by one.
[0013] As an optional solution for the above-mentioned temperature cycling test equipment, the placement slot includes a positioning surface and a guide surface, the positioning surface being perpendicular to the bottom of the placement slot; the guide surface is inclined toward the opening of the placement slot and is located above the positioning surface.
[0014] As an optional solution for the aforementioned temperature cycling test equipment, the carrier tray is also provided with a clearance groove, which is connected to the diagonal of the placement groove.
[0015] As an optional solution for the aforementioned temperature cycle testing equipment, the outer periphery of the first temperature control platform is provided with several positioning components, the carrier plate is provided with several first positioning holes, and the temperature transfer cover is provided with several second positioning holes. The several positioning components can be inserted into the several first positioning holes and the several second positioning holes in a corresponding manner.
[0016] As an optional solution for the above-mentioned temperature cycling test equipment, the temperature cycling test equipment further includes a first lifting component and a second lifting component. The driving end of the first lifting component is connected to the second temperature control platform and is used to drive the second temperature control platform to rise and fall. The driving end of the second lifting component is connected to the test component and is used to drive the test component to rise and fall.
[0017] As an optional solution for the above-mentioned temperature cycling test equipment, the outer periphery of the test component is also provided with several guide members, and the temperature transfer cover plate is provided with several positioning grooves. The several guide members can be inserted into the several positioning grooves one by one.
[0018] As an optional solution to the above-mentioned temperature cycling test equipment, the temperature cycling test equipment also includes a temperature sensor, which is used to detect the temperature of the chip under test.
[0019] As an optional solution for the above-mentioned temperature cycling test equipment, the placement slots are provided in a plurality of ways, and the plurality of chips under test can be placed in the plurality of placement slots in a corresponding manner; the test probes are provided in a plurality of groups, and the plurality of test probes can be electrically connected to the plurality of chips under test in a corresponding manner.
[0020] The beneficial effects of this utility model are as follows:
[0021] This temperature cycling testing equipment includes a carrier tray, a first temperature control platform, a second temperature control platform, and a testing component. The carrier tray has placement slots where the chip under test (DUT) can be placed, facilitating its storage, transport, and transfer. The first temperature control platform carries the carrier tray and transfers temperature to one side of the DUT. The second temperature control platform has a temperature transfer cover that presses against the carrier tray, allowing it to transfer temperature to the other side of the DUT. The testing component has test probes that press against the temperature transfer cover, enabling the probes to electrically connect to the DUT and perform temperature cycling tests. This temperature cycling testing equipment transfers temperature through direct contact, resulting in a fast temperature response and preventing temperature differences between the two sides of the DUT, thus avoiding any impact on testing accuracy. Furthermore, the rapid heating and cooling rates result in high testing efficiency and improved energy utilization. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the structure of the temperature cycling test equipment provided in the embodiment of this utility model;
[0023] Figure 2 This is a first partial enlarged view of the temperature cycling testing device provided in an embodiment of the present utility model;
[0024] Figure 3 This is a second partial enlarged view of the temperature cycling testing device provided in an embodiment of the present utility model;
[0025] Figure 4 This is a third enlarged view of the temperature cycling test equipment provided in an embodiment of the present invention.
[0026] In the picture:
[0027] 1. Carrier tray; 11. Placement slot; 111. Positioning surface; 112. Guide surface; 12. Clearance slot; 13. First positioning hole; 2. First temperature control platform; 3. Second temperature control platform; 31. Temperature transfer cover plate; 311. Through slot; 312. Positioning protrusion; 313. Second positioning hole; 314. Positioning slot; 32. Film; 321. Conductive contact; 4. Test assembly; 41. Test probe; 42. Guide; 5. Chip under test. Detailed Implementation
[0028] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Moreover, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0032] like Figures 1-4 As shown, this embodiment provides a temperature cycling test device for performing temperature cycling tests on the chip 5 under test.
[0033] The temperature cycling test equipment includes a carrier tray 1, a first temperature control platform 2, a second temperature control platform 3, and a test component 4. The carrier tray 1 has a placement slot 11, in which the chip under test 5 can be placed. The placement slot 11 can support the chip under test 5, making it convenient for the carrier tray 1 to store and support the chip under test 5 and to transfer and transport the chip under test 5.
[0034] The first temperature control platform 2 can carry the carrier plate 1 and is used to transfer temperature on one side of the chip under test 5. The second temperature control platform 3 is provided with a temperature transfer cover plate 31, which can be pressed onto the carrier plate 1. The second temperature control platform 3 can transfer temperature on the other side of the chip under test 5 through the temperature transfer cover plate 31. The test component 4 is provided with a test probe 41, which can be pressed onto the temperature transfer cover plate 31 so that the test probe 41 is electrically connected to the chip under test 5. This allows the test component 4 to perform temperature cycling tests on the chip under test 5. This temperature cycling test device transfers temperature through direct contact, has a fast temperature response, and can prevent temperature differences from appearing on both sides of the chip under test 5, thus avoiding affecting the test accuracy of the chip under test 5. At the same time, due to the fast heating and cooling speed, the test efficiency is high, thereby improving the energy consumption utilization rate.
[0035] Meanwhile, several placement slots 11 are provided, and several chips under test 5 can be placed one-to-one in each of the several placement slots 11. Several sets of test probes 41 are provided, and several sets of test probes 41 can be electrically connected one-to-one to several chips under test 5. Thus, several chips under test 5 can be placed on the carrier 1 at the same time, enabling the temperature cycle testing equipment to test several chips under test 5 at the same time. Its testing speed is relatively fast and it is suitable for large-scale testing of chips under test 5. Optionally, the temperature cycle testing equipment also includes a temperature sensor, which is used to detect the temperature of the chip under test 5. By detecting the real-time temperature of the chip under test 5 through the temperature sensor, the detection accuracy is improved, and the difference in temperature rise and fall caused by the failure of the first temperature control platform 2 and / or the second temperature control platform 3 is prevented.
[0036] like Figure 2 and Figure 3 As shown, a film 32 is provided on the side of the temperature transfer cover plate 31 facing the carrier plate 1. A conductive contact 321 is provided on the film 32. The temperature transfer cover plate 31 has a through groove 311. The test probe 41, the through groove 311, the conductive contact 321 and the chip under test 5 can be arranged in sequence relative to each other. After the test probe 41 passes through the through groove 311, it can abut against the conductive contact 321, causing the film 32 to deform. Then the conductive contact 321 can abut against the chip under test 5, thereby realizing the electrical connection between the test probe 41 and the chip under test 5. By using the film 32 and the conductive contact 321, the test probe 41 can be prevented from directly contacting the chip under test 5. At the same time, the film 32 and the conductive contact 321 provide buffering to prevent damage to the chip under test 5.
[0037] Specifically, the outer periphery of the heat transfer cover plate 31 has a plurality of positioning protrusions 312 protruding on the side facing the carrier plate 1, and the film 32 has a plurality of mounting through holes. The plurality of positioning protrusions 312 are inserted into the plurality of mounting through holes one by one. Thus, through the positioning installation between the positioning protrusions 312 and the mounting through holes, the through groove 311 can be aligned with the conductive contact 321 on the film 32, preventing misalignment that would cause the heat transfer cover plate 31 to block the conductive contact 321 and affect the circuit connection.
[0038] like Figure 3 and Figure 4 As shown, the placement slot 11 includes a positioning surface 111 and a guide surface 112. The positioning surface 111 is perpendicular to the bottom of the placement slot 11, and the guide surface 112 is inclined toward the opening of the placement slot 11 and is located above the positioning surface 111. Thus, the guide surface 112 guides the placement of the chip under test 5 within the placement slot 11, reducing placement difficulty and allowing the chip under test 5 to slide to the bottom of the slot. The positioning surface 111 positions the chip under test 5, preventing test failure due to positional errors during temperature cycling testing. Optionally, the carrier tray 1 also has a clearance slot 12, which connects to the diagonal of the placement slot 11. This clearance slot 12 avoids damage to the diagonal portion of the chip under test 5 and facilitates removal of the chip under test 5 from the clearance slot 12.
[0039] Furthermore, the outer periphery of the first temperature control platform 2 is provided with several positioning components. The carrier plate 1 has several first positioning holes 13, and the temperature transfer cover plate 31 has several second positioning holes 313. The positioning components can be inserted one-to-one into the several first positioning holes 13 and several second positioning holes 313, thereby positioning the carrier plate 1 and the temperature transfer cover plate 31 to prevent misalignment between the carrier plate 1 and the temperature transfer cover plate 31 from affecting the temperature cycle test. Optionally, the positioning components are positioning pins.
[0040] like Figures 1-3As shown, the temperature cycling test equipment also includes a first lifting component and a second lifting component. The driving end of the first lifting component is connected to the second temperature control platform 3 and is used to drive the second temperature control platform 3 to rise and fall. Thus, the second temperature control platform 3 can drive the temperature transfer cover plate 31 to rise and fall, so that the temperature transfer cover plate 31 abuts against or detaches from the carrier plate. The driving end of the second lifting component is connected to the test component 4 and is used to drive the test component 4 to rise and fall. Thus, the test component 4 can drive the test probe 41 to rise and fall, so that the test probe 41 is electrically connected to or detached from the chip under test 5. Optionally, the outer periphery of the test component 4 is also provided with several guide members 42, and the temperature transfer cover plate 31 is provided with several positioning grooves 314. The several guide members 42 can be inserted into the several positioning grooves 314 one by one. Thus, through the setting of the guide members 42 and the positioning grooves 314, the test component 4 and the temperature transfer cover plate 31 can be guided and aligned, and the test probe 41 can be electrically connected to the chip under test 5, thereby avoiding damage to the test probe 41 due to misalignment between the test component 4 and the temperature transfer cover plate 31.
[0041] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A temperature cycling test device for performing temperature cycling tests on a chip (5) under test, characterized in that, The temperature cycling test equipment includes: A carrier disk (1) is provided with a placement slot (11) on the carrier disk (1), and the chip under test (5) can be placed in the placement slot (11); The first temperature control platform (2) is capable of carrying the carrier disk (1) and is used to transfer temperature on one side of the chip under test (5). The second temperature control platform (3) is provided with a temperature transfer cover plate (31), which can be pressed onto the carrier plate (1); the first temperature control platform (2) can transfer temperature to the other side of the chip under test (5) through the temperature transfer cover plate (31). Test component (4), the test component (4) is provided with test probe (41), the test component (4) can be pressed onto the temperature transfer cover plate (31) so that the test probe (41) is electrically connected to the chip under test (5).
2. The temperature cycling testing equipment according to claim 1, characterized in that, The heat transfer cover plate (31) has a film (32) on the side facing the carrier plate (1), and a conductive contact (321) is provided on the film (32). The heat transfer cover plate (31) has a through groove (311). The test probe (41), the through groove (311), the conductive contact (321) and the chip under test (5) can be arranged relative to each other in sequence.
3. The temperature cycling testing equipment according to claim 2, characterized in that, The outer periphery of the heat transfer cover plate (31) facing the carrier plate (1) has a plurality of positioning protrusions (312), and the film (32) has a plurality of mounting through holes, and the plurality of positioning protrusions (312) are inserted into the plurality of mounting through holes one by one.
4. The temperature cycling testing device according to claim 1, characterized in that, The placement groove (11) includes a positioning surface (111) and a guide surface (112). The positioning surface (111) is perpendicular to the bottom of the placement groove (11). The guide surface (112) is inclined toward the opening of the placement groove (11) and is located above the positioning surface (111).
5. The temperature cycling testing device according to claim 4, characterized in that, The carrier (1) is also provided with a clearance groove (12), which is connected to the opposite corner of the placement groove (11).
6. The temperature cycling testing equipment according to claim 1, characterized in that, The outer periphery of the first temperature control platform (2) is provided with several positioning components. The carrier plate (1) is provided with several first positioning holes (13). The temperature transfer cover plate (31) is provided with several second positioning holes (313). The several positioning components can be inserted into the several first positioning holes (13) and the several second positioning holes (313) in a corresponding manner.
7. The temperature cycling testing equipment according to claim 1, characterized in that, The temperature cycling test equipment further includes a first lifting component and a second lifting component. The driving end of the first lifting component is connected to the second temperature control platform (3) and is used to drive the second temperature control platform (3) to rise and fall. The driving end of the second lifting component is connected to the test component (4) and is used to drive the test component (4) to rise and fall.
8. The temperature cycling testing device according to claim 7, characterized in that, The outer periphery of the test component (4) is also provided with several guide members (42), and the temperature transfer cover plate (31) is provided with several positioning grooves (314). The several guide members (42) can be inserted into the several positioning grooves (314) one by one.
9. The temperature cycling testing device according to claim 1, characterized in that, The temperature cycling test equipment also includes a temperature sensor, which is used to detect the temperature of the chip under test (5).
10. The temperature cycling testing device according to any one of claims 1 to 9, characterized in that, The placement slots (11) are provided in a plurality of places, and the plurality of chips under test (5) can be placed in the plurality of placement slots (11) in a corresponding manner; the test probes (41) are provided in a plurality of groups, and the plurality of test probes (41) can be electrically connected to the plurality of chips under test (5) in a corresponding manner.