Micro-resistance test true four-wire circuit board

Abstract

The utility model relates to the technical field of circuit boards, and particularly discloses a micro-resistance test true four-wire circuit board, which comprises a substrate, two symmetrically arranged test areas are arranged on the substrate, and each test area is composed of a first test PAD and a second test PAD. A signal contact area used for receiving coil product signals is arranged between the first test PAD and the second test PAD. The signal contact area comprises a plurality of first contact areas connected with the first test PAD and a plurality of second contact areas connected with the second test PAD, the plurality of first contact areas and the plurality of second contact areas are distributed in a rectangular staggered manner, so that the signal contact area can be distributed in a zebra crossing manner; when the coil type product is placed at any position of the signal contact area, two signals can be contacted, the data accuracy of the micro-resistance test can be ensured to the greatest extent, and the test precision of the coil type product is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely is a kind of microresistance test true four-wire circuit board. BACKGROUND

[0002] Four-wire type test of coil product is a kind of high-precision microresistance measurement method, mainly used to eliminate the influence of test lead resistance on measurement results, so as to accurately obtain the resistance value of coil;The four-wire type test mode on the market is usually to use four wires to lead out probe for measurement, that is, two are used to provide constant current (excitation line), and the other two are used to measure the voltage of the measured coil (detection line), through this separated way, the lead resistance and contact resistance in current wiring can be ignored;

[0003] However, due to the uncertainty of single pin position of coil product during single test, the above test method cannot directly test the probe, so that the accuracy of microresistance measurement of coil product is not high, therefore we need to propose a microresistance test true four-wire circuit board to solve the above problems, so that it can adapt to different coil product test use and improve the microresistance test precision of coil product. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of microresistance test true four-wire circuit board, can adapt to different coil product test use, improve the microresistance test precision of coil product, to solve the problem proposed in background art.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of microresistance test true four-wire circuit board, including substrate, the substrate is provided with two test areas symmetrically, the test area is composed of first test PAD and second test PAD, signal contact area for receiving coil product signal is provided between the first test PAD and second test PAD;

[0006] The signal contact area includes a plurality of first contact areas connected with the first test PAD and a plurality of second contact areas connected with the second test PAD, and the plurality of first contact areas and the plurality of second contact areas are distributed in a rectangular staggered manner.

[0007] Preferably, the first test PAD includes a first signal area and a first connecting area, the first connecting area is perpendicular to one end of the first signal area, a plurality of first contact areas are fixed on one side of the first connecting area at equal intervals, and the first connecting area is arranged in parallel with the first signal area.

[0008] Preferably, the other end of the first signal area is integrally formed with a protruding area, the first contact area is located between the first connecting area and the protruding area, and the protruding area and the first signal area form an L-shaped structure.

[0009] Preferably, the second test PAD comprises a second signal area aligned with the convex area, one side of the second signal area is integrally formed with a second connecting area, one end of a plurality of second contact areas is connected with the second connecting area, and the spacing between adjacent two second contact areas is the same.

[0010] Preferably, the spacing between the first contact area and the second contact area is 0.1±0.01mm, and the line width of the plurality of first contact areas and the plurality of second contact areas is 0.15±0.01mm.

[0011] Preferably, a plurality of mounting holes are opened on the substrate, and the plurality of mounting holes are arranged side by side on one side of the test area.

[0012] Preferably, the test area comprises a copper layer, a nickel-gold layer and a gold plating layer, one side of the copper layer is connected with the substrate, and the nickel-gold layer is located between the copper layer and the gold plating layer.

[0013] Preferably, the substrate is one of glass cloth board, paper substrate and ceramic substrate.

[0014] Compared with the prior art, the utility model has the beneficial effects that:

[0015] 1. The utility model mainly through a plurality of first contact area and a plurality of second contact area are staggered distribution of rectangle, make signal contact area can be zebra crossing distribution, when testing, coil type product is placed in signal contact area arbitrary position can contact two signals, can guarantee the data accuracy of microresistance test to the maximum, improve coil type product test precision. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the structural schematic diagram of the utility model;

[0017] Figure 2 It is the signal contact area structural schematic diagram of the utility model;

[0018] Figure 3 It is the test area structure schematic diagram of the utility model.

[0019] In the drawing: 1, substrate;2, test area;201, copper layer;202, nickel-gold layer;203, gold plating layer;21, first test PAD;211, first signal area;212, first connecting area;213, first contact area;214, convex area;22, second test PAD;221, second signal area;222, second connecting area;223, second contact area;3, mounting hole. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of the present application.

[0021] Please refer to Figures 1-3 The present application provides a technical solution: a micro-resistance test true four-wire circuit board, comprising a substrate 1, the substrate 1 is provided with two test areas 2 arranged symmetrically, the test area 2 is composed of a first test PAD 21 and a second test PAD 22, a signal contact area for receiving coil product signals is arranged between the first test PAD 21 and the second test PAD 22;

[0022] The signal contact area comprises a plurality of first contact areas 213 connected with the first test PAD 21 and a plurality of second contact areas 223 connected with the second test PAD 22, the plurality of first contact areas 213 and the plurality of second contact areas 223 are distributed in a rectangular staggered manner, and the signal contact area can be distributed in a zebra line manner through the rectangular staggered distribution of the plurality of first contact areas 213 and the plurality of second contact areas 223, so that the coil product can contact two signals at any position of the signal contact area during testing, and the data accuracy of the micro-resistance test can be maximized to improve the test precision of the coil product.

[0023] The first test PAD 21 comprises a first signal area 211 and a first connecting area 212, the first connecting area 212 is perpendicular to one end of the first signal area 211, a plurality of first contact areas 213 are fixed on one side of the first connecting area 212 at equal intervals, and the first connecting area 212 is arranged in parallel with the first signal area 211, as shown in Figure 1 The area of the first signal area 211 is large, so that the connection of the test signal can be realized through the probe or the solder wire.

[0024] The other end of the first signal area 211 is integrally formed with a protruding area 214, the first contact area 213 is located between the first connecting area 212 and the protruding area 214, the protruding area 214 and the first signal area 211 form an L-shaped structure, through the setting of the protruding area, the test area of the first signal area 211 can be increased and the distance between the first signal area 211 and the second signal area 221 can be reduced, so that the connection of the testing instrument is facilitated.

[0025] The second test PAD 22 includes a second signal area 221 aligned with the convex area 214, one side of the second signal area 221 is integrally formed with a second connecting area 222, one end of a plurality of second contact areas 223 is connected with the second connecting area 222, the interval between adjacent two second contact areas 223 is the same, through the setting of the second signal area 221, it is convenient to connect the excitation signal through the probe or the solder wire and the like.

[0026] The interval between the first contact area 213 and the second contact area 223 is 0.1±0.01mm, the line width of the plurality of first contact areas 213 and the plurality of second contact areas 223 is 0.15±0.01mm, the length of the first contact area 213 and the second contact area 223 is 8±0.01mm, the total length of the substrate 1 is 26mm, the total width of the substrate 1 is 13mm, the first contact area 213 and the second contact area 223 are both arranged in strip shape, and are alternately arranged like a zebra line, through this design, the coil type product can be placed in any position of the test area 2, and there are two signal contacts, and through the signal excitation point and the test point, the data accuracy of the micro-resistance test can be maximized.

[0027] A plurality of mounting holes 3 are arranged on the substrate 1, and the plurality of mounting holes 3 are arranged side by side on one side of the test area 2, through the mounting hole 3, the circuit board can be fixed on the test instrument, and the test instrument uses an LCR instrument.

[0028] The test area 2 includes a copper layer 201, a nickel gold layer 202 and a gold plating layer 203, one side of the copper layer 201 is connected with the substrate 1, the nickel gold layer 202 is located between the copper layer 201 and the gold plating layer 203, through the gold plating layer 203, the oxidation of the copper surface can be prevented, the strong conductivity of copper is used to improve the conductivity of the coil type product connection, through the setting of the nickel gold layer 202, the connection force between the copper layer 201 and the solder wire during soldering of the signal area can be guaranteed.

[0029] The substrate 1 is one of a glass cloth board, a paper substrate 1 and a ceramic substrate 1, the substrate 1 is used to support the test area 2, so that the circuit board remains flat and is not easy to deform, and the stability of the circuit board is improved.

[0030] In the test, two test signals of the coil material to be tested are respectively connected to two signal contact areas, and four signals are finally guided to LCR test instruments through probes or solder wires at four points of the two first signal areas 211 and the two second signal areas 221, and finally the micro-resistance of the LCR is tested. Since the area of the signal contact area is large, for example, the coil to be tested, two measurement signal leads, flexibility, and each product position cannot be consistent, through the practical circuit board, it can be ensured that the coil test pin is true four-wire in any position in the signal contact area, that is, the test signal and the excitation signal, a constant current excitation signal line, and an adjacent signal test line, to realize true four-wire testing, solve the problem that many test monomers on the market cannot directly output true four-wire for testing, and true four-wire (excitation signal +, test signal +, excitation signal -, test signal -), through the above designed adapter plate, the two test points of the adapter plate itself, and the situation that the pointer cannot be used, two wires become true four-wire testing, which greatly improves the micro-resistance accuracy of the test monomer.

[0031] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A true four-wire circuit board for microresistance testing, characterized in that: Includes a substrate (1), on which two test areas (2) are arranged symmetrically. The test area (2) is composed of a first test PAD (21) and a second test PAD (22). A signal contact area for receiving signals from coil-type products is provided between the first test PAD (21) and the second test PAD (22). The signal contact area includes a plurality of first contact areas (213) connected to the first test PAD (21) and a plurality of second contact areas (223) connected to the second test PAD (22), wherein the plurality of first contact areas (213) and the plurality of second contact areas (223) are arranged in a rectangular staggered pattern.

2. The microresistivity test true four-wire circuit board according to claim 1, characterized in that: The first test PAD (21) includes a first signal area (211) and a first connection area (212). The first connection area (212) is perpendicular to one end of the first signal area (211). A plurality of first contact areas (213) are fixed at equal intervals on one side of the first connection area (212), and the first connection area (212) is arranged parallel to the first signal area (211).

3. A true four-wire circuit board for micro-resistance testing according to claim 2, characterized in that: The other end of the first signal area (211) is integrally formed with a protrusion area (214), and the first contact area (213) is located between the first connection area (212) and the protrusion area (214). The protrusion area (214) and the first signal area (211) form an L-shaped structure.

4. A true four-wire circuit board for micro-resistance testing according to claim 3, characterized in that: The second test PAD (22) includes a second signal area (221) aligned with the raised area (214). A second connection area (222) is integrally formed on one side of the second signal area (221). One end of a plurality of second contact areas (223) is connected to the second connection area (222), and the spacing between two adjacent second contact areas (223) is the same.

5. A true four-wire circuit board for micro-resistance testing according to claim 4, characterized in that: The spacing between the first contact area (213) and the second contact area (223) is set to 0.1±0.01mm, and the line width of the plurality of first contact areas (213) and the plurality of second contact areas (223) is 0.15±0.01mm.

6. A true four-wire circuit board for micro-resistance testing according to claim 1, characterized in that: The substrate (1) has multiple mounting holes (3) arranged side by side on one side of the test area (2).

7. A true four-wire circuit board for micro-resistance testing according to claim 1, characterized in that: The test area (2) includes a copper layer (201), a nickel-gold layer (202) and a gold plating layer (203). One side of the copper layer (201) is connected to the substrate (1), and the nickel-gold layer (202) is located between the copper layer (201) and the gold plating layer (203).

8. A true four-wire circuit board for micro-resistance testing according to claim 7, characterized in that: The substrate (1) is configured as one of fiberglass cloth board, paper substrate (1) and ceramic substrate (1).

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