Semiconductor waste gas burner

By introducing a dust collector and a spiral blade structure into the semiconductor exhaust gas burner, the problem of particulate matter adhesion was solved, achieving stable operation and efficient combustion of the equipment, extending its service life and reducing costs.

CN224108212UActive Publication Date: 2026-04-10XIAMEN JUNMO CORE SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-27
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

Existing semiconductor process exhaust gas burners lack particulate impurity interception structures, causing particulate matter to sinter and adhere to the inner wall of the burner, affecting gas flow, accelerating structural wear, and shortening equipment lifespan.

Method used

A dust collector and spiral blade structure were designed. The rough texture on the spiral blades intercepts particulate matter in the exhaust gas. A gas preheating structure is set on the inner tube. Combined with a flow retarder and a waste heat utilization system, the airflow path and temperature control are optimized.

Benefits of technology

It effectively intercepts particulate matter, protects the burner structure, extends equipment life, improves combustion efficiency, reduces operating costs, and improves gas preheating efficiency through waste heat recovery.

✦ Generated by Eureka AI based on patent content.

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Abstract

The semiconductor waste gas burner comprises a bottom cabinet, a burner body is arranged in the center of the upper portion of the bottom cabinet, the top of the burner body is connected with a mixer, the mixer is connected with a dust remover through a first pipeline, a vertical inner pipe is arranged in the dust remover, and the bottom of the inner pipe is open. The bottom cabinet is provided with a dust collector below a bottom opening of the dust remover, the top of the inner pipe is communicated with the first pipeline, a spiral blade is arranged in the dust remover and located on the outer side area of the inner pipe, an air inlet pipe is arranged on the side wall, located on the top of the spiral blade, of the dust remover, rough grains are arranged on the spiral blade, and a gas preheating structure is arranged on the inner pipe. The utility model provides a semiconductor waste gas burner, which is favorable for solving the problems that some existing semiconductor process waste gas burners are not provided with particle impurity intercepting structures, so that particles are sintered and adhered to the inner walls of the burners, the gas flow is influenced, and the structural abrasion of the burners is accelerated.
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Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor waste gas treatment technical field especially relates to a semiconductor waste gas combustor. BACKGROUND

[0002] Semiconductor refers to the material of conductivity between conductor and insulator at normal temperature. From the angle of science and technology or economic development, the importance of semiconductor is very huge. The core unit in most electronic products, such as computer, mobile phone or digital recorder, is closely related to semiconductor.

[0003] In the prior art, such as the combustion treatment device for semiconductor process waste gas disclosed by Chinese patent CN221463844U, a combustor with a cylinder structure is provided, a combustion chamber is arranged in the combustor, an air inlet tank is connected to the front end of the combustor, a wind pipe is arranged at one end of the air inlet tank, a lighter is connected to the air inlet tank, an inner cylinder is arranged in the air inlet tank, a first gas chamber and a second gas chamber in annular cavity structure are formed in the inner cylinder, a first wind pipe and a second wind pipe are arranged at one end of the first gas chamber and the second gas chamber respectively, the first wind pipe is connected with an external semiconductor process waste gas discharge pipeline, the second wind pipe is connected with an external combustible gas pipeline, and a flow guide structure is arranged on the side wall of the first gas chamber and / or the second gas chamber.

[0004] In the above technical solution, although the combustor helps the waste gas to mix with the combustible gas sufficiently, the semiconductor process waste gas in the plant waste gas pipeline is mixed with the combustible gas in the air inlet tank and then directly enters the combustion chamber for combustion. However, in fact, the semiconductor process waste gas in the plant waste gas pipeline is often mixed with some small particles. If these particles are not intercepted in advance, they will be easily sintered and adhered to the inner wall of the combustor at high temperature after entering the combustor. The roughness of the inner wall of the combustor will increase after accumulation for a long time, which will first affect the gas flow and secondly accelerate the corrosion of the combustor structure, thereby shortening the service life of the equipment. UTILITY MODEL CONTENTS

[0005] The utility model provides a semiconductor waste gas combustor, and is favorable to solve the problem that some semiconductor process waste gas combustors are not provided with a particle impurity interception structure, and the particles are sintered and adhered to the inner wall of the combustor, thereby affecting the gas flow and accelerating the wear of the combustor structure.

[0006] The utility model is implemented as follows:

[0007] The utility model provides a kind of semiconductor waste gas combustor, including bottom cabinet, bottom cabinet upper center is provided with combustor main body, combustor main body inside is equipped with combustion chamber, the top of combustion chamber is equipped with igniter, the top of combustor main body is connected with the mixer of upper narrow lower wide hollow frustum structure, the top of mixer is connected with dust collector by first pipeline in central position, the top of mixer is uniformly provided with a plurality of supplementary air pipes at first pipeline connection place periphery, the bottom of mixer is communicated with combustion chamber by a plurality of uniform gas distribution pipes that are evenly arranged on the periphery of igniter, the inside of dust collector is equipped with vertical inner tube, the bottom of inner tube is opened, the bottom of dust collector is provided with dust collector below the opening of dust collector, the top of inner tube is communicated with first pipeline, the inside of dust collector is equipped with helical blade in the area outside inner tube, the lateral outside end of helical blade is connected with the inner wall of dust collector, the sidewall of dust collector on the top of helical blade is provided with inlet pipe for connecting external semiconductor waste gas pipeline, helical blade is equipped with rough grain, semiconductor waste gas can spiral down along helical blade after entering dust collector by the inlet pipe, then up after entering inner cylinder, enter combustor main body by first pipeline, form spiral circuitous airflow path structure, gas preheating structure is provided on the inner tube.

[0008] On the basis of the above technical solutions, the bottom cabinet is further provided with a flow buffer on the side away from the dust collector, and the bottom of the flow buffer is communicated with the bottom of the combustor main body through a second pipeline.

[0009] On the basis of the above technical solutions, the flow buffer is further provided with a flow divider inside, and the lateral outside end of the flow divider is connected with the inner wall of the flow buffer.

[0010] On the basis of the above technical solutions, the area of the flow divider containing the flow channels constitutes a flow buffer area for controlling the speed of the airflow, and the flow divider is further provided with a heat exchange area outside the flow channels, and a waste heat pipeline is connected between the heat exchange area and the inner tube of the dust collector to form a circulation pipeline, a heat-conducting medium capable of circulating is arranged in the waste heat pipeline, and the waste heat pipeline on the inner tube constitutes the gas heat exchange structure; the bottom area of the waste heat pipeline penetrates the bottom cabinet, and the bottom cabinet is further provided with a waste heat temperature control module connected with the waste heat pipeline.

[0011] On the basis of the above technical solutions, the connection between the dust collector and the bottom cabinet is detachable.

[0012] On the basis of the above technical solutions, the waste heat pipeline on the inner tube is arranged in a spiral winding structure and is arranged on the inner wall of the inner tube by a cylindrical carrier.

[0013] On the basis of the above technical solutions, the rough grain is arranged on the upper and lower end faces of the helical blade.

[0014] On the basis of the above technical solutions, the several slow-flow zones and the heat exchange zones are distributed radially inside and outside the flow divider.

[0015] Compared with the prior art, the utility model at least has the following advantages:

[0016] 1. The utility model discloses a dust remover and spiral blade, which can effectively intercept the particulate impurities in the waste gas and prevent them from entering the combustor. This not only protects the combustor structure and prolongs the service life of the equipment, but also improves the combustion efficiency and reduces the operation cost.

[0017] 2. The utility model discloses a rough grain on the spiral blade, which increases the resistance of the gas flowing through the spiral blade, improves the particulate matter interception effect, and through the reasonable use of the spiral blade to guide and control the speed of the airflow, the gas preheating structure on the inner tube is matched, so that the waste gas is intercepted and preheated and treated before entering the combustion chamber. This process ensures the uniformity of the gas heating, makes the airflow temperature relatively stable and balanced, reduces the heating burden of the front end area of the combustion chamber, and is beneficial to the subsequent more efficient and stable combustion and purification. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will be briefly introduced the drawings needed to be used in the embodiments, it should be understood, the following drawings only show some embodiments of the utility model, therefore should not be regarded as the limitation to the scope, for the ordinary skilled person in the art, under the premise of not paying the creative labor, still can obtain other related drawings according to these drawings.

[0019] Figure 1 It is a structural schematic diagram of the semiconductor waste gas combustor in an embodiment;

[0020] Figure 2 It is Figure 1 It is an internal structure schematic diagram of the semiconductor waste gas combustor in an embodiment;

[0021] Figure 3 It is Figure 2 It is a structural schematic diagram of the mixer and igniter in an embodiment;

[0022] Figure 4 It is Figure 2 It is a local structure schematic diagram of the rough grain on the spiral blade in an embodiment;

[0023] Figure 5 It is Figure 2 It is a structural schematic diagram of the flow divider in an embodiment;

[0024] Figure 6 It is a sectional view of the flow divider in an embodiment.

[0025] Annotations in the figure: 100, base cabinet; 110, dust collector; 120, waste heat temperature control module; 121, waste heat pipeline; 130, sleeve connector; 200, burner main body; 210, igniter; 300, dust remover; 310, inner tube; 320, spiral blade; 321, coarse grain; 330, preheating tube; 400, flow buffer; 410, flow divider; 411, flow dividing channel; 500, first pipeline; 600, second pipeline; 700, mixer; 710, air equalizing chamber; 720, supplementary air pipeline; 730, air equalizing pipeline; 800, air inlet pipeline; 900, air outlet pipeline; a, flow buffer area; b, heat exchange area. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only to represent selected embodiments of the present application.

[0027] In the description of the present application, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0028] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to one element or there can be a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration, and do not represent the only embodiment.

[0029] The present application will be further described in detail below in combination with the drawings and specific embodiments.

[0030] In combination Figures 1 to 6The embodiment discloses a semiconductor waste gas burner, which effectively intercepts particulate impurities in waste gas, prevents the particulate impurities from entering the inside of the burner, optimizes a gas flow path, improves combustion efficiency, and ensures stable operation and long service life of the equipment through a unique design.

[0031] As shown in Figure 1 , the semiconductor waste gas burner specifically comprises a bottom cabinet 100, a burner body 200, a mixer 700, a dust remover 300, a flow buffer 400, an air inlet pipe 800, a first pipeline 500, a second pipeline 600, and an air outlet pipe 900.

[0032] The bottom cabinet 100 is a support structure of the entire burner and is assembled from aluminum alloy profiles and panels. The bottom cabinet 100 not only provides a stable mounting platform but also facilitates maintenance and repair of the equipment. The inside of the bottom cabinet 100 provides sufficient assembly space, and various control modules and auxiliary equipment, such as a waste heat temperature control module 120, can be arranged to realize intelligent control and efficient operation of the burner.

[0033] The burner body 200 is located at the center above the bottom cabinet 100 and is a core area of the combustion reaction. The burner body 200 is internally provided with a combustion chamber for accommodating and combusting a mixture of waste gas and combustible gas. A igniter 210 is arranged at the top of the combustion chamber for igniting the mixture and starting the combustion reaction.

[0034] The mixer 700 is connected to the top of the burner body 200 and adopts a hollow conical frustum structure that is narrow at the top and wide at the bottom. The inside of the mixer 700 is provided with a gas uniformizing chamber 710, which is beneficial to the mixing and uniform distribution of gas. The top center of the mixer 700 is connected to the dust remover 300 through the first pipeline 500 to receive waste gas that has been subjected to dust removal treatment. Six supplementary gas pipes 720 are uniformly arranged around the connection between the top of the mixer 700 and the first pipeline 500, which are used to introduce combustible gas and mix the combustible gas with the waste gas in the mixer 700. The bottom of the gas uniformizing chamber 710 is connected to the combustion chamber through six gas uniformizing pipes 730.

[0035] The dust remover 300 is used to intercept particulate impurities in waste gas. In combination with Figure 2 , the dust remover 300 is internally provided with a vertical inner pipe 310, and the bottom of the inner pipe 310 is open and corresponds to a dust collector 110 below the bottom cabinet 100. A spiral blade 320 is arranged in the outer side area of the inner pipe 310 in the dust remover 300. The transversely outer end of the spiral blade 320 is connected to the inner side wall of the dust remover 300 to form a spiral-shaped air flow channel. The spiral blade 320 is provided with rough lines 321, which can increase the contact area and friction between the waste gas and the blade and are beneficial to the deposition and interception of particulate matter.

[0036] The dust collector 110 is located in the bottom cabinet 100, corresponding to the bottom opening of the dust collector 300, for collecting the intercepted particulate matter. The dust collector 110 and the bottom cabinet 100 are connected by a detachable structure, and in this embodiment, a drawer type connection structure is adopted. The dust collector 110 is a top opening box structure, and its top opening is connected to the bottom of the dust collector 300 through a sleeve connector 130 after installation. The sleeve connector 130 is a flexible cover, such as nylon fabric, and the connection part is connected and fixed by a clamp. This structure is convenient for cleaning and maintenance.

[0037] During operation, the semiconductor waste gas enters the dust collector 300 through the inlet pipe 800, and first spirals downward along the spiral blade 320. Due to the design of the spiral blade 320, the waste gas forms a spiral and circuitous airflow path during the downward process, increasing the contact time and contact area with the blade, which is beneficial to the deposition of particulate matter. Then, the waste gas enters the inner tube 310 through the bottom opening of the inner tube 310, and spirals upward along the inner tube 310, and enters the burner body 200 through the first pipe 500. This design not only effectively intercepts particulate matter, but also optimizes the gas flow path and improves the combustion efficiency.

[0038] In order to further optimize the combustion process, the embodiment is provided with a flow buffer 400 above the bottom cabinet 100, on the side of the burner body 200 away from the dust collector 300. The bottom of the flow buffer 400 is connected to the bottom of the burner body 200 through the second pipe 600, and receives the burned gas. The top of the flow buffer 400 is connected with an exhaust pipe 900 for discharging the treated gas. The flow buffer 400 is provided with a flow divider 410 inside, and a plurality of flow dividing channels 411 are arranged on the flow divider 410, which can uniformly disperse the gas into the flow buffer 400, forming a flow buffer area a. This structure effectively controls the flow rate of the gas at this point, that is, the gas at the output end of the burner will not be quickly discharged, but will be stably output, which is beneficial to the increase of the residence time of the gas in the combustion chamber, and further beneficial to the full combustion of the gas. In addition, after the flow rate is slowed down, the heat carried by the burned gas can be efficiently recovered in the flow buffer 400, which not only reduces heat loss, but also is beneficial to the cooling effect of the gas at the discharge end.

[0039] In order to fully utilize the waste heat generated by the burner, the embodiment further provides a waste heat utilization system. The system includes a waste heat pipe 121 located in the heat exchange area b of the flow divider 410 and a waste heat temperature control module 120 inside the bottom cabinet 100.

[0040] Specifically, the flow buffer 400 is internally provided with a flow divider 410, the transverse outer side of the flow divider 410 is connected with the inner wall of the flow buffer 400, and a plurality of flow dividing channels 411 are arranged on the flow divider 410 and longitudinally penetrate the flow divider 410. The flow divider 410 includes a flow buffer area a formed by the area where the flow dividing channels 411 are located, and a heat exchange area b is arranged on the periphery of the flow divider 410. The heat exchange area b and the inner tube 310 of the dust collector 300 are connected by a waste heat pipeline 121 forming a circulation pipeline, and a heat conducting medium capable of circulating flow is arranged in the waste heat pipeline 121. The waste heat pipeline 121 located on the inner tube 310 constitutes the gas heat exchange structure; the bottom area of the waste heat pipeline 121 penetrates the bottom cabinet 100, and the bottom cabinet 100 is internally provided with a waste heat temperature control module 120 connected with the waste heat pipeline 121.

[0041] Through the circulating flow of the heat conducting medium, the waste heat generated by the burner can be effectively transferred to the inner tube 310 of the dust collector 300 when the gas is transferred to the flow buffer 400, and the exhaust gas entering the burner is preheated. At the same time, the waste heat temperature control module 120 adopts a PID temperature controller to monitor the temperature, and is matched with an electric heating device for appropriate auxiliary heating, and is matched with a stable pump body, so as to monitor and control the temperature in the waste heat pipeline 121, and ensure the safe and stable operation of the system.

[0042] Further, in combination with Figure 2 As shown, the waste heat pipeline 121 located on the inner tube 310 is arranged in a spiral winding structure and is arranged on the inner wall of the inner tube 310 through a cylindrical carrier, which is a preheating pipe 330. This makes the exhaust gas pass through the inner tube 310 and can be efficiently preheated.

[0043] Working principle: when the semiconductor exhaust gas enters the dust collector 300, it first spirally descends along the spiral blade 320. Due to the design of the spiral blade 320 and the arrangement of the coarse thread 321, the exhaust gas is in full contact and friction with the blade during the downward process, so that the particulate matters in the exhaust gas are deposited on the blade or enter the dust collector 110 with the airflow under the action of centrifugal force and friction. In this way, the particulate matters in the exhaust gas are effectively intercepted to prevent them from entering the interior of the burner.

[0044] The exhaust gas after dust removal treatment enters the inner tube 310 and is mixed with the combustible gas introduced from the supplementary gas pipeline 720 in the mixer 700. The mixed gas enters the combustion chamber and is ignited and burned under the action of the igniter 210. Due to the adoption of the upper-narrow lower-wide hollow frustum structure of the mixer 700, it is beneficial to the uniform distribution and full mixing of the gas, and the combustion efficiency is improved.

[0045] In order to further improve the combustion efficiency, the gas preheating structure is arranged on the inner tube 310. The structure uses the waste heat generated by the burner to preheat the exhaust gas entering the burner, thereby increasing the temperature of the exhaust gas. In this way, the exhaust gas is more easily to reach the temperature condition required for combustion during the combustion process, thereby reducing the ignition energy consumption and the combustion reaction time.

[0046] In order to optimize the combustion process, the flow buffer 400 is arranged. The flow buffer 400 is internally provided with a flow divider 410, which can uniformly disperse the burned gas into the flow buffer 400 to form a flow buffer area a. Under the action of the flow buffer area a, the gas in the burner body 200 stays for a longer time, which can be fully combusted to achieve a more ideal purification effect. At the same time, the flow buffer 400 can also recover part of the heat for preheating the exhaust gas entering the burner or for other purposes.

[0047] The waste heat generated by the burner is transferred to the inner tube 310 of the dust collector 300 through the circulation of the heat-conducting medium to preheat the exhaust gas. In this way, not only the combustion efficiency can be improved, but also the energy can be saved and the operation cost can be reduced. At the same time, the waste heat temperature control module 120 can monitor and control the temperature in the waste heat pipeline 121 to ensure the safe and stable operation of the system.

[0048] The semiconductor exhaust gas burner of the utility model is not only suitable for waste gas treatment in the semiconductor manufacturing industry, but also can be applied to other fields which need to treat waste gas containing particulate impurities. For example, in the chemical industry, metallurgy, printing and dyeing industries, there are a large number of waste gas treatment needs, and the burner of the utility model can provide an efficient, reliable and energy-saving waste gas treatment scheme.

[0049] At the same time, with the continuous improvement of environmental awareness and the increasingly strict environmental protection regulations, the requirements for waste gas treatment equipment are also getting higher and higher. The semiconductor exhaust gas burner of the utility model has the advantages of high efficiency, energy saving, environmental protection and the like, and meets the development trend of future waste gas treatment equipment. Therefore, the utility model has broad application prospect and market potential.

[0050] The above embodiments are only used to illustrate the technical solutions of the utility model, but not limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. A semiconductor exhaust gas burner characterized by comprising: The application relates to a semiconductor waste gas treatment device, which comprises a bottom cabinet, a burner main body arranged at the top center of the bottom cabinet, a combustion chamber arranged in the burner main body, an igniter arranged at the top of the combustion chamber, a mixer with a narrow top and a wide bottom in a hollow conical structure connected to the top of the burner main body, a dust collector connected to the top center of the mixer through a first pipeline, a plurality of supplementary air pipes uniformly arranged around the connection position between the top of the mixer and the first pipeline, a plurality of air uniformizing pipes uniformly arranged around the igniter and communicated with the combustion chamber, a vertical inner tube arranged in the dust collector, an opening arranged at the bottom of the inner tube, a dust collector arranged below the opening of the dust collector, the top of the inner tube communicated with the first pipeline, a spiral blade arranged in the dust collector and located outside the inner tube, the lateral outer end of the spiral blade connected with the inner wall of the dust collector, an air inlet pipe arranged on the lateral wall of the dust collector and located above the spiral blade and used for connecting an external semiconductor waste gas pipeline, rough lines arranged on the spiral blade, and the semiconductor waste gas entering the dust collector through the air inlet pipe can spiral downward along the spiral blade, then upwardly enter the inner tube through the opening at the bottom of the inner tube and enter the burner main body through the first pipeline, so that a spiral and circuitous airflow path structure is formed, and a gas preheating structure is arranged on the inner tube.

2. A semiconductor exhaust gas combustor according to claim 1, wherein A flow slowing device is further arranged on the side of the burner main body away from the dust collector, the bottom of the flow slowing device communicated with the bottom of the burner main body through a second pipeline, and an exhaust pipe connected to the top of the flow slowing device.

3. A semiconductor exhaust gas combustor according to claim 2, wherein A flow splitter is arranged in the flow slowing device and connected with the inner wall of the flow slowing device, a plurality of flow splitting channels are arranged on the flow splitter, and the flow splitting channels longitudinally penetrate the flow splitter.

4. A semiconductor exhaust gas combustor according to claim 3, wherein The area of the flow splitter containing the flow splitting channels constitutes a flow slowing area for controlling the airflow speed, a heat exchange area is arranged around the flow splitter, a waste heat pipeline connected with the inner tube of the dust collector and forming a circulation pipeline is arranged between the heat exchange area and the inner tube of the dust collector, a heat conducting medium capable of circulating is arranged in the waste heat pipeline, and the waste heat pipeline arranged on the inner tube constitutes a gas heat exchange structure; the bottom area of the waste heat pipeline penetrates the bottom cabinet, and a waste heat temperature control module connected with the waste heat pipeline is arranged in the bottom cabinet.

5. A semiconductor exhaust gas combustor according to claim 1, wherein The connection structure between the dust collector and the bottom cabinet is detachable.

6. A semiconductor exhaust gas combustor according to claim 4, wherein The waste heat pipeline arranged on the inner tube is arranged in a spiral winding structure and arranged on the inner wall of the inner tube through a cylindrical loading body.

7. A semiconductor exhaust gas combustor according to claim 1, wherein The rough lines are arranged on the upper and lower end faces of the spiral blade.

8. A semiconductor exhaust gas combustor according to claim 4, wherein A plurality of flow slowing areas and heat exchange areas are distributed radially inside and outside the flow splitter.

Citation Information

Patent Citations

  • Combustion treatment device for semiconductor process waste gas

    CN221463844U