Heat dissipation structure of high-power laser system
By integrating the pump source and pump source heat sink on an aluminum alloy heat sink substrate in the fiber laser system, with the fiber coiled in the mounting slot on side A, the problems of insufficient contact area and poor overall heat dissipation design in the existing fiber laser system heat dissipation structure are solved, achieving efficient overall heat dissipation and space saving.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-26
- Publication Date
- 2026-04-10
AI Technical Summary
Existing fiber laser systems suffer from problems such as insufficient contact area, strong dependence on cooling medium, poor flexibility, and poor overall heat dissipation design, resulting in low heat transfer efficiency, large equipment size, and unsatisfactory heat dissipation effect.
The heat dissipation substrate is made of aluminum alloy. The pump source and pump source heat dissipation plate are integrated on the B side. The optical fiber is coiled in the mounting groove on the A side to increase the contact area between the optical fiber and the heat dissipation substrate. The heat dissipation fins and the fan work together to form an overall heat dissipation system.
This increases the contact area between the optical fiber and the heat dissipation substrate, enhances heat transfer efficiency, saves space, and achieves a highly efficient overall heat dissipation effect.
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Figure CN224110658U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of optical fiber laser technology especially relates to a high -power laser system heat radiation structure. BACKGROUND
[0002] In the field of optical fiber laser technology, a large amount of heat is generated in the working process of the optical fiber and the pump source. With the continuous improvement of laser power, efficient heat dissipation becomes a key factor to ensure the stable operation of the system and the performance of the laser. Currently, the cooling system needs to meet the heat dissipation requirements in a compact space, while ensuring good heat dissipation effect, so as to prevent problems such as performance degradation of the optical fiber and shortening of the service life of the pump source due to overheating.
[0003] The existing optical fiber cooling system has many shortcomings: the existing optical fiber cooling system mainly uses coiled water cooling or air cooling devices; for example, the optical fiber is coiled in a cylindrical cooling plate or a micro-channel cooling tank, however, such design has the following problems:
[0004] Insufficient contact area: the contact area between the optical fiber and the heat dissipation substrate is limited, the heat transfer efficiency is low, the local temperature is too high, and hot spots are easily formed;
[0005] Strong dependence on cooling medium: the water cooling system needs complex sealing structure to prevent leakage, which increases the processing cost and maintenance difficulty; the air cooling has the problems of low heat dissipation efficiency and the need for large volume fan;
[0006] Poor flexibility: the diameter of the coiled optical fiber is fixed, the heat dissipation path cannot be dynamically adjusted according to the thermal load, and it is difficult to adapt to different power scenarios.
[0007] On the other hand, the overall heat dissipation structure design is not good, the heat generated by the optical fiber and the pump source is not uniformly and efficiently managed, the pump source and the optical fiber heat dissipation system are independent of each other, not only occupy space, but also are difficult to work together, resulting in large equipment size and unsatisfactory heat dissipation effect, which cannot meet the increasing heat dissipation requirements of high-power optical fiber laser systems.
[0008] Therefore, based on the above technical problems, the technical personnel in the field urgently need to develop a high-power laser system heat dissipation structure. UTILITY MODEL CONTENTS
[0009] The utility model aims at providing a high -power laser system heat radiation structure, through the B face of the heat dissipation substrate of aluminum alloy material integrates the pump source and the pump source heat dissipation plate, and the optical fiber is coiled in the installation groove of A face to increase the contact area between the optical fiber and the heat dissipation substrate, so as to improve the heat dissipation effect, the pump source and the heat dissipation system are assembled together, the space is saved, and the heat dissipation fin can meet the overall heat dissipation requirement.
[0010] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme:
[0011] The utility model discloses a high -power laser system heat dissipation structure, this heat dissipation structure includes:
[0012] The heat dissipation substrate is made of aluminum alloy material, and is divided into an A surface and a B surface.
[0013] A pump source integrated on the B surface of the heat dissipation substrate, and the pump source is connected with the heat dissipation substrate through a pump source heat dissipation plate.
[0014] An optical fiber integrated on the A surface of the heat dissipation substrate.
[0015] The B surface of the heat dissipation substrate is provided with heat dissipation fins, and the A surface of the heat dissipation substrate is processed with an optical fiber groove, and the optical fiber is located in the optical fiber groove.
[0016] Further, the edge of the B surface of the heat dissipation substrate is reserved as a mounting area.
[0017] The middle area of the B surface of the heat dissipation substrate is provided with the heat dissipation fins.
[0018] The mounting position of the pump source and the pump source heat dissipation plate is provided with a mounting groove, and the mounting groove is formed by adjacent heat dissipation fins.
[0019] Further, the A surface of the heat dissipation substrate is processed with the optical fiber groove near the center.
[0020] The optical fiber groove is configured as a winding structure from outside to inside, and the optical fiber is arranged in the optical fiber groove along the slotting track of the optical fiber groove.
[0021] Further, the slotting depth and the slotting diameter of the optical fiber groove are matched with the optical fiber diameter d. Further, the bottom of the pump source heat dissipation plate is symmetrically provided with a heat insulation plate, and the heat insulation plate is configured as a long strip structure that can be embedded into the corresponding mounting groove.
[0022] The pump source heat dissipation plate is connected with the heat dissipation substrate through two heat insulation plates.
[0023] Further, the pump source heat dissipation plate is provided with a mounting hole at the position matched with the pump source, and the pump source is assembled and fixed to the mounting hole through a fastener.
[0024] Further, the pump source heat dissipation plate is provided with a fan at one end of the edge close to the heat dissipation substrate.
[0025] Further, the pump source heat dissipation plate includes:
[0026] A heat dissipation plate connected with the pump source.
[0027] A plurality of transverse fins formed on the side of the heat sink away from the corresponding pump source;
[0028] The transverse fins of the two heat sinks are arranged opposite to each other, and the bottom of the heat sink is provided with the heat insulation plate.
[0029] In the above technical solution, the high-power laser system heat dissipation structure has the following beneficial effects:
[0030] The heat dissipation structure of the utility model discloses through the B face of the heat dissipation base plate of aluminium alloy material and integrates the pump source and the pump source heat dissipation plate, and the optical fiber is coiled in the installation groove of A face to increase the contact area of optical fiber and heat dissipation base plate, thereby improving the heat dissipation effect, and the pump source and the heat dissipation system are assembled together, save the space, and the heat dissipation fin can satisfy the overall heat dissipation requirement. BRIEF DESCRIPTION OF DRAWINGS
[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments described in the utility model, and other drawings can also be obtained by those skilled in the art according to these drawings.
[0032] Figure 1 The structure diagram of the A face of the heat dissipation base plate of the high-power laser system heat dissipation structure provided by the utility model embodiment is shown.
[0033] Figure 2 The structure diagram of the optical fiber groove of the high-power laser system heat dissipation structure provided by the utility model embodiment is shown.
[0034] Figure 3 The structure diagram of the B face of the heat dissipation base plate of the high-power laser system heat dissipation structure provided by the utility model embodiment is shown.
[0035] Figure 4 The structure explosion diagram of the high-power laser system heat dissipation structure provided by the utility model embodiment is shown.
[0036] Figure 5 The structure diagram of the pump source heat dissipation plate of the high-power laser system heat dissipation structure provided by the utility model embodiment is shown.
[0037] Explanation of reference signs:
[0038] 1, heat dissipation base plate; 2, optical fiber groove; 3, pump source heat dissipation plate; 4, pump source; 5, heat insulation plate; 6, fan;
[0039] 101, A face; 102, B face; 103, edge; 104, heat dissipation fin; 105, installation groove;
[0040] 301, heat sink plate; 302, transverse fin; 303, mounting hole. DETAILED DESCRIPTION
[0041] In order for those skilled in the art to better understand the technical scheme of the utility model, the utility model will be further described in detail below with reference to the drawings.
[0042] Referring to Figures 1 to 5 as shown in the figure.
[0043] The embodiment discloses a heat dissipation structure of a high-power laser system, which comprises:
[0044] The heat dissipation substrate 1 is made of an aluminum alloy material, and is divided into an A surface 101 and a B surface 102.
[0045] The pump source 4 is integrated on the B surface 102 of the heat dissipation substrate 1, and the pump source 4 is connected with the heat dissipation substrate 1 through the pump source heat dissipation plate 3.
[0046] The optical fiber is integrated on the A surface 101 of the heat dissipation substrate 1.
[0047] The B surface 102 of the heat dissipation substrate 1 is provided with heat dissipation fins 104, and the A surface 101 of the heat dissipation substrate 1 is processed with an optical fiber groove 2, and the optical fiber is located in the optical fiber groove 2.
[0048] Specifically, the embodiment discloses a heat dissipation structure of a high-power laser system, which takes the heat dissipation substrate 1 as the main body, and sets the optical fiber and the pump source 4 on the A surface 101 and the B surface 102 of the heat dissipation substrate 1 respectively; wherein the B surface 102 of the heat dissipation substrate 1 of the embodiment is provided with the heat dissipation fins 104, and the A surface 101 is provided with the optical fiber groove 2 in order to integrate the optical fiber, the optical fiber groove 2 of the embodiment can further increase the contact area of the optical fiber and the heat dissipation substrate 1, so as to improve the efficiency and capacity of heat conduction; secondly, the pump source 4 is integrated on the B surface 102 of the heat dissipation substrate 1 through the pump source heat dissipation plate 3, so as to form a whole of the pump source system and the heat dissipation system, and space is saved.
[0049] Preferably, the edge 103 of the B surface 102 of the heat dissipation substrate 1 of the embodiment is reserved as a mounting area.
[0050] The middle area of the B surface 102 of the heat dissipation substrate 1 is provided with the heat dissipation fins 104.
[0051] The mounting position of the pump source 4 and the pump source heat dissipation plate 3 is provided with a mounting groove 105, and the mounting groove 105 is formed by the adjacent heat dissipation fins 104.
[0052] Firstly, the embodiment further limits the structure of the B face 102 of the heat dissipation substrate 1, the position of the edge 103 of which is reserved as an overall mounting area, the middle area of the heat dissipation substrate 1 is provided with a plurality of heat dissipation fins 104 of a certain length, the heat dissipation fins 104 are reserved with heat dissipation channels between each other, and since the pump source 4 and the pump source heat dissipation plate 3 are integrated on this face, a corresponding mounting groove 105 needs to be reserved, specifically according to the mounting position of the pump source heat dissipation plate 3 and the pump source 4, the position is not provided with the heat dissipation fin 104, so as to construct a mounting groove 105 of a corresponding size through the heat dissipation fin 104 and the heat dissipation substrate 1, for mounting the pump source heat dissipation plate 3 or the pump source 4.
[0053] Preferably, the A face 101 of the heat dissipation substrate 1 of the embodiment is processed with an optical fiber groove 2 near the center; the optical fiber groove 2 is configured as a winding structure from outside to inside, and the optical fiber is arranged in the optical fiber groove 2 along the slotting track of the optical fiber groove 2.
[0054] Among them, the slotting depth and slotting diameter of the optical fiber groove 2 of the embodiment are matched with the optical fiber diameter d.
[0055] The middle area of the A face of the heat dissipation substrate 1 of the embodiment is processed with the optical fiber groove 2 according to the diameter of the optical fiber, the specific slotting size of the optical fiber groove 2 is as described above, and the specific arrangement form of the optical fiber groove 2 is a winding slotting mode of inwards by turns, and the optical fiber can be wound to the inner end of the optical fiber groove 2 from one end of the optical fiber groove 2 along the track of the optical fiber groove 2 by turns, so the total length of the optical fiber groove 2 of the embodiment needs to be designed according to the total length of the optical fiber.
[0056] Preferably, the bottom of the pump source heat dissipation plate 3 of the embodiment is symmetrically provided with a heat insulation plate 5, and the heat insulation plate 5 is configured as a long strip structure that can be embedded into the corresponding mounting groove 105; the pump source heat dissipation plate 3 is connected with the heat dissipation substrate 1 through the two heat insulation plates 5. By arranging the heat insulation plate 5 between the pump source heat dissipation plate 3 and the heat dissipation substrate 1, the pump source heat dissipation plate 3 and the heat dissipation substrate 1 are separated by the heat insulation plate 5, so as to avoid direct contact between the pump source heat dissipation plate 3 and the heat dissipation substrate 1 to directly generate heat conduction.
[0057] Secondly, the pump source 4 is mounted on both sides of the pump source heat dissipation plate 3 of the embodiment, and the pump source heat dissipation plate 3 is provided with a mounting hole 303 at the cooperation position with the pump source 4, and the pump source 4 is assembled and fixed to the mounting hole 303 through a fastener. At the same time, the fan 6 is mounted on one end of the side edge close to the heat dissipation substrate 1 of the pump source heat dissipation plate 3 of the embodiment.
[0058] Referring to Figure 5 As a preferred embodiment, the pump source heat dissipation plate 3 of the embodiment includes a heat dissipation plate 301 connected with the pump source 4; and a plurality of transverse fins 302 formed on the side of the heat dissipation plate 301 away from the corresponding pump source 4;
[0059] The lateral fins 302 of the two heat dissipation plates 301 are arranged opposite to each other, and the bottom of the heat dissipation plate 301 is provided with the heat insulation plate 5.
[0060] The pump source heat dissipation plate 3 of the embodiment is used as the mounting structure and heat dissipation structure of the pump source 4, which is divided into a heat dissipation plate 301 and lateral fins 302, two groups of lateral fins 302 are arranged opposite to each other, and the two heat dissipation plates 301 are respectively located at the outer sides of the whole and are connected with the pump source 4 on the corresponding side, and the heat of the pump source 4 is mainly conducted to the outside through the pump source heat dissipation plate 3 of the embodiment.
[0061] In the above technical scheme, the high-power laser system heat dissipation structure has the following beneficial effects:
[0062] The heat dissipation structure of the embodiment integrates the pump source and the pump source heat dissipation plate 3 through the B face 102 of the heat dissipation base plate 1 made of aluminum alloy, and winds the optical fiber in the mounting groove 105 of the A face 101 to increase the contact area of the optical fiber and the heat dissipation base plate 1, so as to improve the heat dissipation effect, the pump source and the heat dissipation system are assembled together, space is saved, and the heat dissipation fins can meet the overall heat dissipation requirement.
[0063] The above only describes some exemplary embodiments of the utility model by way of illustration, without doubt, for ordinary skilled in the art, under the condition that the spirit and scope of the utility model are not deviated, the described embodiments can be modified in various different ways. Therefore, the above drawings and description are illustrative in nature and should not be understood as limiting the scope of protection of the utility model claims.
Claims
1. A heat dissipation structure for a high power laser system, characterized by, The heat dissipation structure comprises: a heat dissipation substrate (1) made of aluminum alloy, which is divided into an A surface (101) and a B surface (102); a pump source (4) integrated on the B surface (102) of the heat dissipation substrate (1) and connected to the heat dissipation substrate (1) through a pump source heat dissipation plate (3); and an optical fiber integrated on the A surface (101) of the heat dissipation substrate (1); the B surface (102) of the heat dissipation substrate (1) is provided with heat dissipation fins (104), and the A surface (101) of the heat dissipation substrate (1) is processed with an optical fiber groove (2) in which the optical fiber is located.
2. The heat dissipation structure for high power laser system of claim 1, wherein, The edge (103) of the B surface (102) of the heat dissipation substrate (1) is reserved as a mounting area; the middle area of the B surface (102) of the heat dissipation substrate (1) is provided with the heat dissipation fins (104); the mounting positions of the pump source (4) and the pump source heat dissipation plate (3) are provided with mounting grooves (105) formed by adjacent heat dissipation fins (104).
3. The heat sink structure for high power laser systems of claim 2, wherein, The A surface (101) of the heat dissipation substrate (1) is processed with the optical fiber groove (2) near the center; the optical fiber groove (2) is configured as a winding structure from outside to inside, and the optical fiber is arranged in the optical fiber groove (2) along the slotting track of the optical fiber groove (2).
4. The heat sink structure for high power laser systems of claim 3, wherein, The slotting depth and slotting diameter of the optical fiber groove (2) are matched with the diameter d of the optical fiber.
5. The heat sink structure for high power laser systems of claim 2, wherein, The bottom of the pump source heat dissipation plate (3) is symmetrically provided with heat insulation plates (5) configured as long strip structures that can be embedded into the corresponding mounting grooves (105); the pump source heat dissipation plate (3) is connected to the heat dissipation substrate (1) through two heat insulation plates (5).
6. The heat dissipation structure of high power laser system according to claim 5, characterized in that, The pump source (4) is mounted on both sides of the pump source heat dissipation plate (3), and the pump source heat dissipation plate (3) is provided with mounting holes (303) at the matching positions of the pump source (4), and the pump source (4) is assembled and fixed to the mounting holes (303) through fasteners.
7. The heat dissipation structure of high power laser system according to claim 6, characterized in that, The pump source heat dissipation plate (3) is provided with a fan (6) at one end near the edge of the side of the heat dissipation substrate (1).
8. The high-power laser system heat sink structure of any of claims 5-7, wherein, The pump source heat dissipation plate (3) comprises: a heat dissipation plate (301) connected to the pump source (4); and a plurality of transverse fins (302) formed on the side of the heat dissipation plate (301) away from the corresponding pump source (4); the transverse fins (302) of the two heat dissipation plates (301) are arranged opposite to each other, and the bottom of the heat dissipation plate (301) is provided with the heat insulation plate (5).