High-thermal-conductivity aluminum substrate

Abstract

The high-thermal-conductivity aluminum substrate comprises a solder mask layer, a circuit layer, an insulating layer and a three-dimensional heat dissipation structure, the solder mask layer is connected with the upper portion of the circuit layer, the circuit layer is connected with the upper portion of the insulating layer, and the three-dimensional heat dissipation structure is connected with the back face of the insulating layer. The three-dimensional heat dissipation structure comprises an aluminum sheet and a groove. Compared with the prior art, under the condition that the size of the aluminum substrate is not changed, the groove structure is manufactured on the back face, the back area is increased, and therefore the rapid heat dissipation effect is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic technical field, concretely relates to high thermal conductivity aluminum substrate. BACKGROUND

[0002] With the development of electronic products to high density, integrated direction, the heat dissipation problem of circuit substrate has become the key bottleneck restricting the performance and life of components. Traditional FR-4, CEM3 etc. substrate because of low thermal conductivity (about 0.3 W / m·K), it is difficult to meet the heat dissipation demand of high-power devices (such as LED, power semiconductor), it is easy to lead to component high-temperature failure. Aluminum substrate relies on filling high thermal conductivity particles to improve the performance of insulating layer, but high filling is easy to lead to adhesion and insulation decline.

[0003] Traditional aluminum substrate relies on filling high thermal conductivity particles to improve the performance of insulating layer, but high filling is easy to lead to adhesion and insulation decline.

[0004] In order to solve the above problems, we have made a series of improvements. INVENTION CONTENTS

[0005] The utility model is provided with high thermal conductivity aluminum substrate to overcome the above-mentioned shortcomings and deficiencies of prior art.

[0006] High thermal conductivity aluminum substrate, including: solder resist layer, circuit layer, insulating layer and three-dimensional heat dissipation structure, the solder resist layer is connected with the upper portion of circuit layer, the circuit layer is connected with the upper portion of insulating layer, the three-dimensional heat dissipation structure is connected with the back of insulating layer;

[0007] Wherein: the three-dimensional heat dissipation structure includes: aluminum sheet and groove, the aluminum sheet is connected with the insulating layer, the groove is arranged on the outer surface of aluminum sheet, and the groove is a three-dimensional structure.

[0008] The utility model has the advantages of:

[0009] Compared with the prior art, the utility model makes groove structure on the back under the condition that the size of aluminum substrate is unchanged, increases the area of the back, and achieves the effect of rapid heat dissipation. DRAWING DESCRIPTION

[0010] Figure 1 It is the structure diagram of the utility model.

[0011] REFERENCE NUMERALS

[0012] Solder resist layer 100, circuit layer 200, insulating layer 300, three-dimensional heat dissipation structure 400, aluminum sheet 410 and groove 420. DETAILED DESCRIPTION

[0013] The utility model makes further explanation in connection with specific embodiment. It is understood that the following examples are used for explaining the utility model but not for limiting the range of the utility model.

[0014] Embodiment 1

[0015] Figure 1 It is the structural schematic drawing of the utility model.

[0016] As Figure 1 Indicated, high thermal conductivity aluminum substrate includes: solder resist layer 100, circuit layer 200, insulating layer 300 and three-dimensional heat dissipation structure 400, solder resist layer 100 is connected with the upper portion of circuit layer 200, circuit layer 200 is connected with the upper portion of insulating layer 300, three-dimensional heat dissipation structure 400 is connected with the back of insulating layer 300;

[0017] Among them: three-dimensional heat dissipation structure 400 includes: aluminum sheet 410 and groove 420, aluminum sheet 410 is connected with insulating layer 300, groove 420 is arranged on the outer surface of aluminum sheet 410, and groove 420 is three-dimensional structure.

[0018] The principle of the utility model: 1.0-2.0mm thickness's copper-clad aluminum substrate's making, blanking copper-clad aluminum substrate→ cleaning→ pressing film→ exposure→ development→ etching→ film removal→ cleaning→ printing solder resist→ forming. According to the material specification of need blanking, make the surface clean, press a layer of photosensitive film, pass through the pattern transfer of exposure, then develop etching makes the circuit, carries out film removal cleaning printing solder resist layer 100 ink, finally makes the appearance, and the punch shape, the type of fishing, laser appearance can all. Then make three-dimensional heat dissipation structure 400 on the back of aluminum sheet 410. Etching or the way of CNC processing is made groove 420 on the back of aluminum substrate. The utility model under the condition of the size of aluminum substrate is unchangeable, makes groove structure on the back, increases the area of back, to reach the effect of quick heat dissipation.

[0019] The principle is: increase the area to improve the physical principle of heat dissipation efficiency, based on the basic law of heat transfer: heat transfer rate is proportional to the contact area. When the heat dissipation area increases, the heat that can be transferred per unit time also increases. And the trench structure indeed realizes the increase of the area: after the plane structure is changed into the trench structure, two side wall areas of each trench are increased. It is very obvious that compared with the traditional structure, the trench structure increases the heat dissipation area. The reason why the utility model adopts the trench structure to expand the heat dissipation area is that the channel formed by the trench can guide the air flow, form a micro "chimney effect", promote natural convection and improve the heat exchange efficiency. The parallel arranged trenches can form a directional air flow channel. Compared with other possible structures, the trench structure can maintain sufficient mechanical strength and rigidity of the aluminum substrate while increasing the surface area, so as to avoid the structure weakness caused by excessive thinning. Moreover, the trench structure can be realized by conventional etching or CNC machining mode, and the process is mature and reliable, the production efficiency is high, and the cost is relatively low. Compared with the complex three-dimensional structure, the trench is easier to batch accurate manufacturing.

[0020] The specific embodiments of the utility model are described above, but the utility model is not limited to this, as long as it does not deviate from the purpose of the utility model, the utility model can also have various changes.

Claims

1. A high thermal conductivity aluminum substrate, characterized by, The application relates to a printed circuit board, which comprises a solder resist layer (100), a circuit layer (200), an insulating layer (300) and a three-dimensional heat dissipation structure (400), wherein the solder resist layer (100) is connected to the upper part of the circuit layer (200), the circuit layer (200) is connected to the upper part of the insulating layer (300), and the three-dimensional heat dissipation structure (400) is connected to the back of the insulating layer (300). The three-dimensional heat dissipation structure (400) comprises an aluminum sheet (410) and grooves (420), the aluminum sheet (410) is connected to the insulating layer (300), the grooves (420) are arranged on the outer surface of the aluminum sheet (410), and the grooves (420) are three-dimensional structures. ​

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