Double-layer circuit single-side welding high-thermal-conductivity aluminum substrate

Abstract

A double-layer circuit single-side welding high thermal conductivity aluminum substrate comprises an aluminum sheet, a first insulating layer, a second insulating layer, circuit layers, a through hole, solder paste and a solder mask layer, the first insulating layer is arranged on the aluminum sheet, the circuit layers are arranged on the first insulating layer and the second insulating layer, the through hole penetrates through the first insulating layer, the second insulating layer and the circuit layers, the solder paste is arranged in the through hole, and the solder mask layer is arranged on the solder mask layer. The solder mask layer is arranged above the circuit layer. Wherein the circuit layer comprises a first circuit layer, a second circuit layer and a third circuit layer. Compared with the prior art, a traditional copper plating structure is omitted, the production period is shortened, and the production cost is reduced; the high heat conduction effect is achieved through the mode that solder paste is transmitted to the aluminum sheet through the insulating layer.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic technical field, concretely relates to a double -deck circuit single -sided welding high thermal conductivity aluminum substrate. BACKGROUND

[0002] With electronic equipment constantly developing towards high performance, miniaturization, the integration and power density of electronic components increase greatly, and the heat generated in unit volume rises sharply. The traditional single -layer circuit board can not satisfy the high -density wiring requirement and the heat dissipation capacity is limited, difficult to satisfy the heat dissipation demand of high -power device, and it is easy to cause device temperature to be too high, and then influence its performance, reliability and service life. Double -deck aluminum substrate is born with its good heat dissipation performance, and can effectively solve the high -power electronic device high -density wiring and heat dissipation problem. The existing double -deck aluminum substrate basically adopts the process of copper -clad plate drilling, copper plating, circuit production, pressing, and its process is complex, cost is high, and period is long, and it is difficult to adapt to market demand.

[0003] In order to solve the above problems, we have made a series of improvements. INVENTION CONTENTS

[0004] The utility model is provided with a double -deck circuit single -sided welding high thermal conductivity aluminum substrate to overcome the above -mentioned shortcomings and deficiencies of prior art.

[0005] A double -deck circuit single -sided welding high thermal conductivity aluminum substrate, comprising: aluminum sheet, first insulating layer, second insulating layer, circuit layer, via, tin paste and solder resist, the first insulating layer is equipped on the aluminum sheet, the first insulating layer and the second insulating layer are equipped with circuit layer, the via is through the first insulating layer, the second insulating layer and the circuit layer, the tin paste is located in the via, the solder resist is located above the circuit layer;

[0006] Wherein, the circuit layer includes: first circuit layer, second circuit layer and third circuit layer, the upper structure of the first circuit layer is equipped with solder resist, the upper structure of the first circuit layer is connected with tin paste, the lower structure of the first circuit layer is connected with the first insulating layer on one side, the upper structure of the second circuit layer is covered with solder resist, the lower structure of the second circuit layer is connected with the first insulating layer on one side, the upper structure of the third circuit layer is covered with solder resist, and the lower structure of the third circuit layer is connected with tin paste.

[0007] The utility model has the advantages of:

[0008] Compared with the traditional technology, the utility model omits the traditional copper plating structure, shortens the production cycle and cost, realizes high thermal conductivity effect through the mode that the insulating layer and tin paste are transferred to the aluminum sheet. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1The utility model discloses a structure schematic view.

[0010] Reference signs:

[0011] Aluminum sheet 100, first insulating layer 200, second insulating layer 300, circuit layer 400, via hole 500, tin paste 600 and solder resist layer 700.

[0012] First circuit layer 410, second circuit layer 420 and third circuit layer 430. DETAILED DESCRIPTION

[0013] The utility model will be further explained in connection with specific implementation examples. It should be understood that the following examples are only for explaining the utility model and are not used for limiting the range of the utility model.

[0014] Example 1

[0015] Figure 1 The utility model discloses a structure schematic view.

[0016] As Figure 1 Indicated, a double-layer circuit single-sided welding high thermal conductivity aluminum substrate includes: aluminum sheet 100, first insulating layer 200, second insulating layer 300, circuit layer 400, via hole 500, tin paste 600 and solder resist layer 700, is equipped with first insulating layer 200 on aluminum sheet 100, is equipped with circuit layer 400 on first insulating layer 200 and second insulating layer 300, via hole 500 penetrates first insulating layer 200, second insulating layer 300 and circuit layer 400, tin paste 600 is located in via hole 500, and solder resist layer 700 is located above circuit layer 400.

[0017] Among them, circuit layer 400 includes: first circuit layer 410, second circuit layer 420 and third circuit layer 430, is equipped with solder resist layer 700 above the upper layer structure of first circuit layer 410, the upper layer structure of first circuit layer 410 is connected with tin paste 600, the lower layer structure of first circuit layer 410 one side is connected with first insulating layer 200, the upper layer structure of second circuit layer 420 is covered by solder resist layer 700, the lower layer structure of second circuit layer 420 one side is connected with first insulating layer 200, the upper layer structure of third circuit layer 430 is covered by solder resist layer 700, and the lower layer structure of third circuit layer 430 is connected with tin paste 600.

[0018] The utility model discloses an innovative point is reflected in, utilize the electrical isolation characteristic that keeps with insulating layer 700 and resistance welding layer 700, and line layer 400, aluminium sheet 100 and tin cream 600 have good conductivity. This structural design makes first line layer 410 can form electrical path with aluminium sheet 100 through the tin cream connection point of accurate positioning, and then realizes reliable electrical interconnection with third line layer 430. This innovative structure successfully realized the perfect combination of double -deck circuit layout and single -sided component welding. Its order is: tin cream 600 connects the upper layer structure of first line layer 410 and aluminium sheet 100, aluminium sheet 100 passes through tin cream 600 and the lower layer structure of third line layer 430, the lower layer structure of first line layer 410, all structures of second line layer 420 and the upper layer structure of third line layer 430 are insulated by resistance welding layer 700 and first insulating layer 200, second insulating layer 300. Therefore, even if omitting the covering link, only need to make full use of the tin cream that must be done originally, can realize the conduction of partial line.

[0019] In the heat management aspect, the utility model does not reduce the high thermal conductivity because of such structure. The utility model constructs double heat dissipation channel: on one hand, the heat generated by component passes through the RCC insulating material of high thermal conductivity: first insulating layer 200, second insulating layer 300 to aluminium base plate transmission, on the other hand, tin cream connection point forms the fast channel of heat direct to aluminium base plate by its excellent thermal conductivity. This multi-path heat dissipation structure significantly improves the overall heat dissipation efficiency, effectively solves the heat management problem of high-power electronic equipment.

[0020] Compared with the traditional technology, the utility model omits the traditional copper plating structure, shortens the production cycle and cost, realizes high thermal conductivity effect through the way of insulating layer and tin cream transmission to aluminium sheet.

[0021] The specific implementation of the utility model has been described above, but the utility model is not limited thereto, as long as the purpose of the utility model is not deviated, the utility model can also have various changes.

Claims

1. A double-layered circuit single-sided soldered high thermal conductivity aluminum substrate, characterized by, The application relates to an aluminum sheet (100), a first insulating layer (200), a second insulating layer (300), a circuit layer (400), a through hole (500), tin paste (600) and a solder resist layer (700), wherein the aluminum sheet (100) is provided with the first insulating layer (200), the first insulating layer (200) and the second insulating layer (300) are provided with the circuit layer (400), the through hole (500) penetrates the first insulating layer (200), the second insulating layer (300) and the circuit layer (400), the tin paste (600) is arranged in the through hole (500), and the solder resist layer (700) is arranged above the circuit layer (400). The circuit layer (400) comprises a first circuit layer (410), a second circuit layer (420) and a third circuit layer (430), the upper structure of the first circuit layer (410) is provided with the solder resist layer (700), the upper structure of the first circuit layer (410) is connected with the tin paste (600), one side of the lower structure of the first circuit layer (410) is connected with the first insulating layer (200), the upper structure of the second circuit layer (420) is covered by the solder resist layer (700), one side of the lower structure of the second circuit layer (420) is connected with the first insulating layer (200), the upper structure of the third circuit layer (430) is covered by the solder resist layer (700), and the lower structure of the third circuit layer (430) is connected with the tin paste (600). ​

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