PCB resin plug hole structure

Abstract

The utility model discloses a PCB board resin plug hole structure, belonging to the PCB printed circuit board technology field, comprising a base material layer and a via hole, the via hole is arranged in the base material layer, the base material layer is internally provided with a plug hole assembly, one side of the plug hole assembly is provided with a copper foil circuit, one side of the copper foil circuit is provided with a bonding pad, and the surface of the base material layer is provided with a solder mask layer. According to the utility model, under the combined action of the plug hole assembly, the mounting groove, the bonding pad and the solder mask layer, the via hole and the copper foil circuit are located at the bottom of the solder mask layer, and when the surface of the bonding pad is welded, the via hole and plug hole resin are protected by the solder mask layer, so that the influence of oil leakage on SMT welding is avoided; the via hole and the copper foil circuit are located in the base material layer and protected by the solder mask layer, the hole plugging resin is prevented from being exposed in oxygen for a long time, the service life of the via hole and the hole plugging resin is prolonged, a PAD is formed through the hole surface covers at the two ends of the fixing ring, the hole surface covers can be connected with bonding pads as shown in Figure 6, and therefore the installation flexibility of the PCB is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to PCB printed circuit board technical field especially relates to a kind of PCB board resin hole filling structure. BACKGROUND

[0002] PCB board is also called PCB printed circuit board, PCB printed circuit board is stacked by multiple copper foil circuits, PCB board surface is provided with multiple through holes for the connection of copper foil circuit between layers, through hole needs to be filled hole when mounting component, prevent PCB from through-hole from tin from through hole penetrates element surface to cause short circuit and false soldering when overwave soldering, can reduce the corrosion risk of through hole when using, guarantee the performance of PCB board;

[0003] The existing PCB board resin hole filling structure, through hole and hole filling resin are exposed on the surface of PCB board, through the way of covering oil to protect through hole, oil is easy to be blown out at covering oil place when welding, leading to poor SMT welding performance, at the same time, because hole filling resin is exposed in oxygen for a long time, it is easy to be oxidized and deteriorated by oxygen in air, so as to lose effect;

[0004] The existing PCB board resin hole filling structure, the connection with pad depends on copper foil circuit, leading to poor installation flexibility of PCB board. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the problems of oil being easy to be blown out at covering oil place when PCB printed circuit board is welded in prior art, hole filling resin being easy to be aged by long-term exposure in oxygen and poor installation flexibility, and provides a kind of PCB board resin hole filling structure.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] A kind of PCB board resin hole filling structure, including substrate layer and via, the via is set up in substrate layer inside, the substrate layer is provided with hole filling assembly, one side of the hole filling assembly is provided with copper foil circuit, one side of the copper foil circuit is provided with pad, the surface of the substrate layer is provided with solder resist layer.

[0008] Preferably, the surface of the substrate layer is inwardly provided with mounting groove matching through hole, copper foil circuit and pad.

[0009] Preferably, the hole filling assembly includes through hole, the through hole is electroplated on the inner wall of via, the outer wall of both ends of the through hole is electroplated with fixing ring, and the through hole is filled with hole filling resin.

[0010] Preferably, both ends of the fixing ring are electroplated with hole face cover, and the surface of the hole face cover can be fixedly connected with copper foil circuit and pad.

[0011] Preferably, the height of the soldering pad is greater than the depth of the mounting groove.

[0012] Preferably, the surface of the solder resist layer is provided with a square hole matching the soldering pad.

[0013] Compared with the prior art, the PCB resin plug hole structure has the following beneficial effects:

[0014] 1. The plug hole assembly, the mounting groove, the soldering pad and the solder resist layer jointly make the through hole and the copper foil circuit located at the bottom of the solder resist layer, so that the through hole and the plug hole resin are protected by the solder resist layer when the surface of the soldering pad is welded, and oil spouting is avoided, SMT welding is not affected, and the service life of the through hole and the plug hole resin is prolonged because the through hole and the copper foil circuit are not exposed.

[0015] 2. The hole surface cover is provided, the hole surface cover forms a PAD at both ends of the fixing ring, the hole surface cover can also be connected to the soldering pad as shown, and the mounting flexibility of the PCB and the utilization rate of the board surface are increased. Figure 6 BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A three-dimensional structure schematic view of the PCB resin plug hole structure is provided for the utility model.

[0017] Figure 2 An internal structure schematic view of the PCB resin plug hole structure is provided for the utility model.

[0018] Figure 3 A structure sectional view of the mounting groove in the PCB resin plug hole structure is provided for the utility model.

[0019] Figure 4 A structure sectional view of another opening mode of the mounting groove in the PCB resin plug hole structure is provided for the utility model.

[0020] Figure 5 A structure assembly view of the plug hole assembly in the PCB resin plug hole structure is provided for the utility model.

[0021] Figure 6 A structure schematic view when the plug hole assembly is directly connected to the soldering pad in the PCB resin plug hole structure is provided for the utility model.

[0022] In the drawing: 1, base material layer; 2, via hole; 3, copper foil circuit; 4, soldering pad; 5, solder resist layer; 6, mounting groove; 7, through hole; 8, fixing ring; 9, plug hole resin; 10, hole surface cover; 11, square hole. DETAILED DESCRIPTION

[0023] ​Clearly and completely describe the technical scheme in the embodiments of the utility model with reference to the drawings in the embodiments of the utility model, obviously, the described embodiment is only a part of the embodiment of the utility model, and is not all the embodiment, based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor belong to the range of protection of the utility model.

[0024] Referring to Figures 1-6 A PCB board resin plug hole structure, including substrate layer 1 and via 2, via 2 is set up in substrate layer 1 inside, substrate layer 1 is provided with plug assembly, one side of plug assembly is provided with copper foil circuit 3, one side of copper foil circuit 3 is provided with solder pad 4, the surface of substrate layer 1 is provided with solder resist layer 5.

[0025] Further, the surface of substrate layer 1 is provided with mounting groove 6 matching the through hole 7, copper foil circuit 3 and solder pad 4, so that the plug assembly can be installed in substrate layer 1 through mounting groove 6.

[0026] It should be noted that: when copper foil circuit 3 needs to be connected to solder pad 4, mounting groove 6 is set as the shape as shown in Figure 3 When it needs to be directly connected to solder pad 4, mounting groove 6 is set as the shape as shown in Figure 4 .

[0027] The further advantage of the above is that when the surface of the solder pad 4 is welded, the through hole 7 and the plug resin 9 are protected by the solder resist layer 5, and the problem of oil bleeding does not occur, which avoids the influence of SMT welding due to oil bleeding, and because the through hole 7 and the copper foil circuit 3 are not exposed, the plug resin 9 is prevented from being exposed to oxygen for a long time, thereby achieving the effect of improving the service life of the through hole 7 and the plug resin 9.

[0028] Further, the plug assembly includes a through hole 7, the through hole 7 is electroplated on the inner wall of the via 2, the outer wall of both ends of the through hole 7 is electroplated with a fixing ring 8, the through hole 7 is filled with a plug resin 9, both ends of the fixing ring 8 are electroplated with a hole face cover 10, and the surface of the hole face cover 10 can be fixedly connected with the copper foil circuit 3 and the solder pad 4.

[0029] The further advantage of the above is that the structural strength of the through hole 7 is increased by the fixing ring 8, and the phenomenon of hole explosion of the through hole 7 is avoided, and the PAD is formed by the hole face cover 10 at both ends of the fixing ring 8, so that the hole face cover 10 can be connected to the solder pad 4 as shown in Figure 6 , thereby increasing the installation flexibility of the PCB board.

[0030] Further, the height of the solder pad 4 is greater than the depth of the mounting groove 6.

[0031] Further, the surface of the solder resist layer 5 is provided with a square hole 11 matching the solder pad 4, so that the solder pad 4 is exposed on the surface of the PCB to connect components.

[0032] The utility model discloses when using, when designing PCB, can be like Figure 3 As shown by the copper foil circuit 3 fixedly connected with the solder pad 4 through the hole 2 surface cover, the solder pad 4 can also be directly fixedly connected with the hole 2 surface cover, thereby increasing the installation flexibility of the PCB and improving the space utilization of the board surface. Figure 6

[0033] According to the PCB design, the mounting groove 6 is formed on the surface of the base material layer 1, and the via 2 is formed at the appropriate position. Then, the through hole 7 and the fixing ring 8 are formed on the inner wall of the via 2 by electroplating. Then, the plug hole resin 9 is filled in the through hole 7 and solidified. After the plug hole resin 9 is solidified, the plug hole resin 9 is ground to the height of the fixing ring 8. The hole cover 10 is electroplated on the surface of the fixing ring 8 and the plug hole resin 9. The PAD is formed by the hole 2 surface cover. Finally, the solder pad 4 is connected according to the designed mode. After installation, the solder resist layer 5 is fixedly connected on the surface of the base material layer 1. The solder resist layer 5 exposes the solder pad 4 through the square hole 11. The components are welded through the solder pad 4.

[0034] When welding the surface of the solder pad 4, the through hole 7 and the plug hole resin 9 are protected by the solder resist layer 5, so that the oil does not appear. The SMT welding is not affected by the oil. When used for a long time, the through hole 7 and the copper foil circuit 3 are not exposed, so that the plug hole resin 9 is not exposed to oxygen for a long time, thereby improving the service life of the through hole 7 and the plug hole resin 9.

[0035] The above is only the preferred embodiment of the utility model, but the protection scope of the utility model is not limited to this. Any skilled person in the art can make equivalent replacement or change according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.​

Claims

1. A PCB board resin plug hole structure comprising a substrate layer (1) and a via (2), characterized in that, The via hole (2) is opened in the substrate layer (1), the substrate layer (1) is provided with a jack assembly, one side of the jack assembly is provided with a copper foil circuit (3), one side of the copper foil circuit (3) is provided with a solder pad (4), and the surface of the substrate layer (1) is provided with a solder resist layer (5).

2. The PCB board resin plug hole structure according to claim 1, wherein: The surface of the substrate layer (1) is inwardly provided with a mounting groove (6) matched with the through hole (7), the copper foil circuit (3) and the solder pad (4).

3. The PCB board resin plug hole structure according to claim 1, wherein: The jack assembly comprises the through hole (7), the through hole (7) is electroplated on the inner wall of the via hole (2), the outer walls at both ends of the through hole (7) are electroplated with fixing rings (8), and the through hole (7) is filled with jack resin (9).

4. The PCB board resin plug hole structure according to claim 3, characterized in that: The fixing rings (8) are electroplated with hole face covers (10) at both ends, and the surfaces of the hole face covers (10) can be fixedly connected with the copper foil circuit (3) and the solder pad (4).

5. The PCB board resin plug hole structure of claim 1, wherein: The height of the solder pad (4) is greater than the depth of the mounting groove (6).

6. The PCB board resin plug hole structure of claim 1, wherein: The surface of the solder resist layer (5) is provided with a square hole (11) matched with the solder pad (4).

Images