Vapor chamber and electronic equipment

Abstract

The embodiment of the utility model provides a vapor chamber and electronic equipment, and relates to the field of electronic equipment. The vapor chamber comprises a first plate body and a second plate body, the first plate body is provided with a first surface and a second surface which are opposite, the first surface is used for being attached to a heating piece, and the second plate body is connected with the second surface. A first cavity is formed in the first plate body, a second cavity is formed between the second plate body and the second surface, a heat-conducting medium is arranged in the first cavity, the second cavity is a vacuum cavity, and the orthographic projection of the second cavity on the first surface covers the orthographic projection of the heating element on the first surface. The first cavity of the vapor chamber can dissipate heat of the heating element, and the second cavity can isolate part of heat generated by the heating element in the thickness direction of the vapor chamber, so that the local temperature of the vapor chamber at the second plate body is reduced, the situation that the local temperature of the shell of the electronic equipment is too high is avoided, and the use experience of a user is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of electronic devices, and in particular to a vapor chamber and an electronic device. BACKGROUND

[0002] With the increase of charging power, the improvement of screen resolution and the increase of game load of electronic devices such as smart phones, the heat generation of electronic devices is increasing. In order to improve the heat dissipation performance of electronic devices, a vapor chamber is generally used for heat dissipation in electronic devices.

[0003] In the related art, the side of the vapor chamber away from the heat generating element is provided with a graphite layer for improving the heat dissipation efficiency of the vapor chamber. However, the local temperature of the vapor chamber is increased by the heat generating element, and the heat generated by the heat generating element is conducted to the shell of the electronic device through the graphite layer, resulting in a local temperature of the shell of the electronic device being too high, which affects the user experience. UTILITY MODEL CONTENT

[0004] In view of this, the present disclosure provides a vapor chamber which can avoid the local temperature of the vapor chamber being too high.

[0005] Specifically, the technical solutions include the following:

[0006] In a first aspect, the present disclosure provides a vapor chamber, comprising a first plate body and a second plate body, the first plate body has opposite first and second surfaces, the first surface is used for abutting with a heat generating element, and the second plate body is connected with the second surface;

[0007] The first plate body has a first cavity inside, a second cavity is formed between the second plate body and the second surface, the first cavity has a heat conducting medium inside, the second cavity is a vacuum cavity, and the second cavity has a projection on the first surface covering a projection of the heat generating element on the first surface.

[0008] Optionally, a plurality of support columns are arranged in the second cavity, and the two ends of the support columns are respectively connected with the two surfaces of the second cavity opposite in the thickness direction of the second plate body.

[0009] Optionally, the projection of the second plate body on the second surface overlaps with the edge of the second surface.

[0010] Optionally, the vacuum degree of the second cavity at room temperature is 2kPa-4kPa.

[0011] Optionally, the vapor chamber further comprises a heat conducting layer, the heat conducting layer is arranged in a stack with the second surface of the first plate body, and the heat conducting layer and the second plate body do not overlap with each other on the second surface.

[0012] Optionally, one side of the second plate body away from the first plate body is coplanar with one side of the heat conduction layer away from the first plate body.

[0013] Optionally, the first plate body has a third cavity inside, the third cavity is arranged in a stack with the first cavity, and the third cavity has a heat conduction medium inside.

[0014] Optionally, the second surface is provided with a groove, the second plate body is located in the groove, and the second cavity is formed between the second plate body and the groove bottom.

[0015] Optionally, one side of the second cavity close to the first plate body is provided with a heat insulation member.

[0016] Optionally, the heat insulation member is foam or aerogel.

[0017] Optionally, the distance between one side of the second plate body away from the first plate body and the first surface is 0.4mm-0.5mm.

[0018] In a second aspect, the embodiments of the present disclosure further provide an electronic device, which comprises the vapor chamber in any of the first aspect.

[0019] The technical scheme provided by the embodiments of the present disclosure has at least the following beneficial effects:

[0020] In the vapor chamber provided by the embodiments of the present disclosure, the first cavity of the first plate body is provided with a heat conduction medium, which can dissipate heat of the heat generating member, the second surface of the first plate body away from the heat generating member forms a vacuum second cavity, and the position of the second cavity is opposite to the heat generating member. The second cavity can isolate part of the heat generated by the heat generating member in the thickness direction of the vapor chamber, thereby reducing the local temperature of the vapor chamber at the second plate body, avoiding the local temperature of the shell of the electronic device being too high, and improving the user experience. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.

[0022] Figure 1 A sectional view of a vapor chamber provided by the embodiments of the present disclosure;

[0023] Figure 2 A sectional view of another vapor chamber provided by the embodiments of the present disclosure;

[0024] Figure 3A sectional view of a wick plate according to another embodiment of the present disclosure is provided.

[0025] Figure 4 A sectional view of a wick plate according to another embodiment of the present disclosure is provided.

[0026] The reference signs in the drawings respectively represent:

[0027] 1 - first plate body; 2 - second plate body; 3 - heating element; 4 - heat-conducting layer;

[0028] 101 - first surface; 102 - second surface; 103 - first cavity; 104 - capillary structure; 105 - third cavity; 106 - groove;

[0029] 201 - second cavity; 202 - support column; 203 - heat insulation element.

[0030] The specific embodiments of the present disclosure have been shown by the above drawings, and will be described in more detail hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the present disclosure by any means, but to illustrate the concept of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present disclosure will be described clearly and completely below in combination with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of, rather than all of, the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without any creative work fall within the scope of protection of the present disclosure.

[0032] The present disclosure provides a wick plate, Figure 1 A schematic diagram of a wick plate according to an embodiment of the present disclosure is provided. As shown in the figure, Figure 1 The wick plate includes a first plate body 1 and a second plate body 2. The first plate body 1 has opposite first and second surfaces 101 and 102. The first surface 101 is used to be attached to a heating element 3. The second plate body 2 is connected to the second surface 102. The first plate body 1 has a first cavity 103 inside. A second cavity 201 is formed between the second plate body 2 and the second surface 102. The first cavity 103 contains a heat-conducting medium. The second cavity 201 is a vacuum cavity. The orthographic projection of the second cavity 201 on the first surface 101 covers the orthographic projection of the heating element 3 on the first surface 101.

[0033] The heat plate provided by the embodiments of the present disclosure has the first plate body 1 having the first cavity 103, and the second cavity 201 is formed between the second plate body 2 and the second surface 102 of the first plate body 1. The heat-conducting medium is arranged in the first cavity 103, and the heat-conducting medium can dissipate heat of the heat-generating component 3. The second cavity 201 is opposite to the heat-generating component 3, and the second cavity 201 is a vacuum cavity. The second cavity 201 can isolate part of the heat generated by the heat-generating component 3 in the thickness direction of the heat plate, thereby reducing the local temperature of the heat plate at the second plate body 2, so as to avoid that the local high temperature of the heat plate causes the local temperature of the shell of the electronic device to be too high, thereby improving the user experience.

[0034] In order to make the technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be further described in detail below with reference to the drawings.

[0035] As shown in Figure 1 The heat plate provided by the embodiments of the present disclosure includes the first plate body 1 and the second plate body 2. The first plate body 1 has the opposite first surface 101 and the second surface 102. The first surface 101 is used to be attached to the heat-generating component 3. The second plate body 2 is located on one side of the second surface 102 of the first plate body 1. The second plate body 2 is arranged in a stack with the first plate body 1. The second plate body 2 is connected to the second surface 102. The second cavity 201 is formed between the second plate body 2 and the second surface 102. The first plate body 1 has the first cavity 103 inside. The heat-conducting medium is arranged in the first cavity 103. The first cavity 103 is used to dissipate heat of the heat-generating component 3. The second cavity 201 is a vacuum cavity. The orthographic projection of the second cavity 201 on the first surface 101 covers the orthographic projection of the heat-generating component 3 on the first surface 101. Since the second plate body 2 is close to the heat-generating component 3, the heat conducted to the area close to the heat-generating component 3 of the first plate body 1 and the second plate body 2 is more. The second cavity 201 can isolate part of the heat transferred to the second plate body 2, thereby reducing the temperature of the second plate body 2 to prevent the local temperature of the heat plate from being too high.

[0036] In some embodiments of the present disclosure, as shown in Figure 1 A plurality of support columns 202 are arranged in the second cavity 201. The two ends of the support column 202 are connected to the two opposite surfaces in the second cavity 201 along the thickness direction of the second plate body 2. The support column 202 is used to support the second cavity 201 to avoid the second plate body 2 from being deformed due to the action of atmospheric pressure. The plurality of support columns 202 can be arranged at equal intervals. The support column 202 is made of metal and has high strength to stably support the second cavity 201.

[0037] Optionally, as shown in Figure 1As shown, the second cavity 201 is provided with a heat insulation member 203 close to one side of the first plate body 1. The heat insulation member 203 is used to further isolate the heat conducted from the second surface 102 of the first plate body 1 to the second plate body 2, and the heat insulation member 203 can isolate the support column 202 from the first plate body, reducing the heat conducted from the support column 202 to the second plate body 2. Specifically, one end of each support column 202 close to the second surface 102 can be connected to the heat insulation member 203.

[0038] Exemplarily, the heat insulation member 203 is a foam or aerogel.

[0039] In some embodiments of the present disclosure, as shown in Figure 1 The second plate body 2 overlaps the edge of the second surface 102 in the orthographic projection of the second surface 102. The second plate body 2 completely covers the second surface 102 of the first plate body 1, so that the second plate body 2 can completely isolate the second surface 102, and the second cavity 201 has a larger area, so that the heat of the first plate body 1 can be isolated in the thickness direction, which is conducive to reducing the temperature of the side of the electronic device close to the second plate body 2.

[0040] Exemplarily, the vacuum degree of the second cavity 201 at room temperature is 2kPa-4kPa. Here, the room temperature refers to a range of 18℃-28℃. Preferably, the vacuum degree of the second cavity 201 at 25℃ is 3kPa.

[0041] Figure 2 Another cross-sectional view of the heat spreading plate provided by the embodiments of the present disclosure is shown in FIG. 4. In some embodiments of the present disclosure, as shown in Figure 2 The heat spreading plate further includes a heat conduction layer 4, which is stacked with the second surface 102 of the first plate body 1, and the heat conduction layer 4 and the second plate body 2 do not overlap each other on the second surface 102. The area of the second surface 102 opposite to the heat generating member 3 is insulated by the second cavity 201, and the other areas of the second surface 102 are heat-conducted by the heat conduction layer 4. The second cavity 201 can prevent the heat spreading plate from having a local temperature too high, and the heat conduction layer 4 can make the heat dissipate more from the area far away from the heat generating member 3, which is conducive to improving the heat dissipation performance of the heat spreading plate.

[0042] Exemplarily, the material of the heat conduction layer 4 is graphite, and the thickness of the heat conduction layer 4 is 0.1mm-0.2mm.

[0043] Figure 3 Another cross-sectional view of the heat spreading plate provided by the embodiments of the present disclosure is shown in FIG. 4. In some embodiments of the present disclosure, as shown in Figure 3As shown, the side of the second plate body 2 away from the first plate body 1 is coplanar with the side of the heat conduction layer 4 away from the first plate body 1. The side of the second plate body 2 away from the first plate body 1 can form a flat surface with the heat conduction layer 4, so as to facilitate the arrangement of other components in the electronic device. Moreover, the heat conduction layer 4 has a large thickness, so that more heat can be dissipated from the area other than the second plate body 2, avoiding the temperature of the area corresponding to the second plate body 2 where the heat-generating element 3 is located from being too high, and improving the heat dissipation performance of the vapor chamber.

[0044] Figure 4 Another cross-sectional view of a vapor chamber is provided in some embodiments of the present disclosure. As shown in FIG. 1B, Figure 4 the first plate body 1 has a third cavity 105 inside, and the third cavity 105 is arranged in a stack with the first cavity 103. The heat conduction medium in the first plate body 1 near the area where the heat-generating element 3 is located will change from a liquid state to a gaseous state under the temperature action of the heat-generating element 3, and will flow in the first cavity 103 and the third cavity 105, respectively. The heat conduction medium will change from a gaseous state to a liquid state again after moving away from the heat-generating element 3, so as to perform cyclic heat dissipation on the heat-generating element 3. Since there are two cavities arranged in a stack in the first plate body 2, the heat-generating element 3 can have better heat dissipation effect.

[0045] It should be noted that the heat-generating element 3 mentioned in the embodiments of the present disclosure can be a heat-generating device inside an electronic device, such as a chip, a battery, or a circuit board.

[0046] In some embodiments of the present disclosure, as shown in FIG. 2, Figure 4 the second surface 102 is provided with a groove 106, the second plate body 2 is located in the groove 106, and a second cavity 201 is formed between the second plate body 2 and the bottom of the groove 106. In the case where the first plate body 1 is provided with the first cavity 103 and the third cavity 105, the second plate body 2 located in the groove 106 can reduce the overall thickness of the vapor chamber and reduce the space occupied by the vapor chamber. Moreover, the second cavity 201 located in the groove 106 can isolate the heat generated by the heat-generating element 3 in the thickness direction, without significantly affecting the heat dissipation effect of the vapor chamber.

[0047] It should be noted that the second plate body 2 is bonded to the end edge of the groove 106, the surface of the second plate body 2 located in the groove 106 away from the first plate body 1 is coplanar with the second surface 102, that is, the surface of the second plate body 2 away from the first plate body 1 forms a flat surface with the second surface 102, so as to facilitate the arrangement of other components in the electronic device.

[0048] Optionally, a plurality of support columns are arranged in the first cavity 103 and the second cavity 105 respectively, opposite ends of the support columns are connected with opposite inner walls of the first cavity 103 along the thickness direction of the vapor chamber respectively, and opposite ends of the support columns are connected with opposite inner walls of the second cavity 105 along the thickness direction of the vapor chamber respectively, the plurality of support columns are arranged at equal intervals, and the plurality of support columns are used to manufacture the first cavity 103 and the second cavity 105, so as to avoid deformation or collapse of the first cavity 103 and the second cavity 105.

[0049] Optionally, the distance between the side of the second plate body 2 away from the first plate body 1 and the first surface 101 is 0.4mm-0.5mm.

[0050] In addition, the electronic device provided by the embodiment of the present disclosure is also provided.

[0051] In the electronic device provided by the embodiment of the present disclosure, the first plate body 1 of the vapor chamber has the first cavity 103, the second plate body 2 and the second surface 102 of the first plate body 1 form the second cavity 201, the first cavity 103 is provided with a heat-conducting medium, and the heat-conducting medium can dissipate heat of the heat-generating component 3. The second cavity 201 is opposite to the heat-generating component 3, the second cavity 201 is a vacuum cavity, and the second cavity 201 can isolate part of the heat generated by the heat-generating component 3 in the thickness direction of the vapor chamber, so as to reduce the local temperature of the vapor chamber at the second plate body 2, so as to avoid that the local high-temperature vapor chamber causes the local temperature of the shell of the electronic device to be too high, thereby improving the user experience.

[0052] It should be noted that the electronic device mentioned in the embodiment of the present disclosure includes a circuit board, a chip and a battery, and the vapor chamber is used to dissipate heat of the circuit board, the chip or the battery. The electronic device can be, but is not limited to, a remote controller, a tablet computer, an MP3 player (Moving Picture Experts Group Audio Layer III), an MP4 player (Moving Picture Experts Group Audio Layer IV), a notebook computer. The electronic device can also be referred to as a user equipment, a portable terminal, a laptop terminal or other names.

[0053] It should be noted that, in the present disclosure, “several”, “at least one” means one or more, “several”, “at least two” means two or more. “And / or” describes the association relationship of the associated objects, which means that there can be three kinds of relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone. The character “ / ” generally represents an “or” relationship between the front and rear associated objects.

[0054] In the description of the disclosure, it needs to be explained that, unless explicitly specified and limited, the terms "mount", "connect", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection; it can be direct connection, or indirect connection through intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the disclosure can be understood according to the specific circumstances.

[0055] In the disclosure, unless explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0056] In the description of the disclosure, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the disclosure.

[0057] In the description of the present application, the description of the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the described embodiments or examples are included in at least one embodiment or example of the present disclosure.

[0058] The above only describes the embodiments of the present disclosure, and does not limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A vapor chamber, characterized by, The heat spreading plate comprises a first plate body (1) and a second plate body (2), the first plate body (1) has opposite first and second surfaces (101, 102), the first surface (101) is used for being attached to a heat generating element (3), and the second plate body (2) is connected to the second surface (102); The first plate body (1) has a first cavity (103) inside, a second cavity (201) is formed between the second plate body (2) and the second surface (102), the first cavity (103) contains a heat conducting medium, the second cavity (201) is a vacuum cavity, and a normal projection of the second cavity (201) on the first surface (101) covers a normal projection of the heat generating element (3) on the first surface (101).

2. The vapor chamber of claim 1, wherein A plurality of support columns (202) are arranged in the second cavity (201), and two ends of each support column (202) are connected to opposite surfaces of the second cavity (201) in the thickness direction of the second plate body (2).

3. The vapor chamber of claim 1, wherein A normal projection of the second plate body (2) on the second surface (102) overlaps an edge of the second surface (102).

4. The vapor chamber of claim 1, wherein The vacuum degree of the second cavity (201) at room temperature is 2 kPa to 4 kPa.

5. The vapor chamber of claim 1, wherein A heat conducting layer (4) is further arranged, the heat conducting layer (4) is stacked with the second surface (102) of the first plate body (1), and the heat conducting layer (4) and the second plate body (2) do not overlap each other on the second surface (102).

6. The vapor chamber of claim 5, wherein A surface of the second plate body (2) away from the first plate body (1) is coplanar with a surface of the heat conducting layer (4) away from the first plate body (1).

7. The vapor chamber of claim 1, wherein The first plate body (1) has a third cavity (105) inside, the third cavity (105) is stacked with the first cavity (103), and the third cavity (105) contains a heat conducting medium.

8. The vapor chamber of claim 7, wherein The second surface (102) is provided with a groove (106), the second plate body (2) is arranged in the groove (106), and the second cavity (201) is formed between the second plate body (2) and the bottom of the groove (106).

9. The vapor chamber of any one of claims 1-8, wherein, A heat insulation element (203) is arranged on a surface of the second cavity (201) close to the first plate body (1).

10. The vapor chamber of claim 9, wherein The heat insulation element (203) is foam or aerogel.

11. The vapor chamber of claim 1, wherein The distance between a surface of the second plate body (2) away from the first plate body (1) and the first surface (101) is 0.4 mm to 0.5 mm.

12. An electronic device, comprising: The electronic device comprises the heat spreading plate according to any one of claims 1 to 11.

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