LED display structure with efficient heat dissipation function

Abstract

The utility model relates to the technical field of LED display structures, in particular to an efficient heat dissipation LED display structure which comprises a base material layer, a chip layer, an optical adjustment layer and a packaging protection layer, the base material layer is arranged at the bottommost layer, the chip layer is arranged at the upper end of the base material layer, the optical adjustment layer is arranged at the upper end of the chip layer, and the packaging protection layer is arranged at the lower end of the optical adjustment layer. The packaging protection layer is arranged at the upper end of the optical adjustment layer; the chip layer and the base material layer are connected in a bonding mode, and a gap position between the chip layer and the base material layer is filled with a reflective glue filling layer; the optical adjustment layer is attached to the surface of the chip layer; and the packaging protection layer is cured on the surface of the optical adjustment layer.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED display structure technical field especially, and it is a kind of LED display structure of high efficiency heat dissipation. BACKGROUND

[0002] In recent years, with the rapid development of LED display technology, its application in the field of consumer electronics, outdoor advertising, vehicle-mounted display is increasingly widespread, however, the existing LED display structure still has many technical bottlenecks, for example, the traditional substrate layer is mostly ordinary metal substrate or resin material, and the heat conduction performance is poor, so that the heat generated by LED chip during work cannot be efficiently conducted, and long-term high-temperature operation is easy to cause light decay, color deviation and other problems, which seriously affects the display life and stability, in addition, the connection between chip layer and substrate layer mostly depends on traditional welding process, and thermal resistance is easy to form in interface gap, which further aggravates the heat dissipation difficulty.

[0003] For example, the Chinese patent with the authorization announcement number CN216527848U discloses LED display structure and LED display, which comprises a first transparent substrate and a light-emitting unit, the light-emitting unit is arranged on one side of the first transparent substrate, the light-emitting unit comprises a transparent conductive layer, an LED module and a control driving module, the transparent conductive layer is printed on the first transparent substrate, the LED module is electrically connected to the transparent conductive layer, and the control driving module is electrically connected with the transparent conductive layer and used for controlling the display of the LED module.

[0004] Although the patent solves the problem of viewing experience, it still has the above-mentioned problem of poor heat dissipation performance. INVENTION CONTENTS

[0005] In view of the above situation, in order to overcome the defects of the prior art, the purpose of the utility model is to provide a kind of LED display structure of high efficiency heat dissipation, and it is realized by the following technical scheme:

[0006] A kind of LED display structure of high efficiency heat dissipation, comprising:

[0007] substrate layer, chip layer, optical adjustment layer, encapsulation protection layer, the substrate layer is arranged in the bottom layer, the chip layer is arranged on the upper end of substrate layer, the optical adjustment layer is arranged on the upper end of chip layer, and the encapsulation protection layer is arranged on the upper end of optical adjustment layer;

[0008] The chip layer and the substrate layer are connected by bonding, and the gap position between the chip layer and the substrate layer is filled with a reflective glue filling layer;

[0009] The optical adjustment layer is arranged on the surface of the chip layer;

[0010] The encapsulation protection layer is cured on the surface of the optical adjustment layer.

[0011] Further, the substrate layer comprises an aluminum nitride ceramic substrate as a base of the substrate layer, and a copper foil layer bonded to a surface of the aluminum nitride ceramic substrate.

[0012] Further, the optical adjustment layer comprises a first sub-layer, a second sub-layer and a third sub-layer, the first sub-layer comprises a transparent conductive film, the transparent conductive film is hot-pressed on a surface of the chip layer, the second sub-layer comprises a quantum dot fluorescent film, the quantum dot fluorescent film is bonded to a surface of the transparent conductive film, and the third sub-layer comprises an anti-glare coating layer, the anti-glare coating layer is attached to a surface of the quantum dot fluorescent film.

[0013] Further, the packaging protection layer comprises an organic silicone resin layer, and a graphene heat sink is embedded in the organic silicone resin layer.

[0014] Further, the upper layer of the packaging protection layer is further provided with a surface protection layer, and the surface protection layer comprises a film layer, and the film layer is sealed to a surface of the packaging protection layer.

[0015] In summary, the utility model has the following beneficial effects:

[0016] ①The substrate layer of the utility model adopts the bonding of the aluminum nitride ceramic substrate and the copper foil layer, has high thermal conductivity and circuit integration capacity, quickly leads out the heat of the chip, the reflective glue filling layer fills the gap between the chip and the substrate through the glue dispensing process, reduces the interface thermal resistance, the graphene heat sink is embedded in the packaging protection layer, forms the vertical heat dissipation double path of the "substrate-graphene", and the heat dissipation efficiency is obviously improved;

[0017] ②The optical adjustment layer of the utility model is composed of a transparent conductive film, a quantum dot fluorescent film and an anti-glare coating layer, the quantum dot technology expands the color gamut, the anti-glare coating layer improves the display contrast under strong light environment, the transparent conductive film ensures the uniform distribution of current, and the display effect of high brightness and high color restoration is realized;

[0018] ③The utility model has reliable packaging protection capacity, the organic silicone resin layer has excellent elastic modulus, can absorb mechanical impact, protects the brittle quantum dot film, and the surface protection layer is further sealed by the film to further enhance the dustproof, waterproof and anti-scratching performance, and is suitable for complex application environment. BRIEF DESCRIPTION OF DRAWINGS

[0019] The drawings described herein are used to provide further understanding of the utility model and form part of the application, but do not constitute improper limitation on the utility model, and in the drawings:

[0020] Figure 1 It is the structure schematic diagram of the utility model.

[0021] In the figure, 1, substrate layer; 101, aluminum nitride ceramic substrate; 102, copper foil layer; 2, chip layer; 3, optical adjustment layer; 301, transparent conductive film; 302, quantum dot fluorescent film; 303, anti-glare coating; 4, encapsulation protection layer; 401, organic silicone resin layer; 402, graphene heat sink; 5, surface protection layer; 501, film layer. DETAILED DESCRIPTION

[0022] The foregoing and other technical contents, features and effects of the present application will be described in detail below with reference to the accompanying drawings. Figure 1 The detailed description of the embodiments will be clearly presented. The structural contents mentioned in the following embodiments are all referred to the drawings.

[0023] The exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0024] An efficient heat dissipation LED display structure comprises:

[0025] The substrate layer 1, the chip layer 2, the optical adjustment layer 3 and the encapsulation protection layer 4 are arranged in the bottom layer, the top end of the substrate layer 1, the top end of the chip layer 2 and the top end of the optical adjustment layer 3, respectively.

[0026] The substrate layer 1 comprises an aluminum nitride ceramic substrate 101 and a copper foil layer 102. The aluminum nitride ceramic substrate 101 is used as the base of the substrate layer 1, and its thickness is 0.5 mm. The copper foil layer 102 is bonded to the surface of the aluminum nitride ceramic substrate 101 by direct copper bonding process, and the copper foil layer 102 is formed into a driving circuit pattern by photoetching and etching.

[0027] The chip layer 2 is connected to the substrate layer 1 by bonding. The electrode pads in the chip layer 2 are welded to the driving circuit pattern on the copper foil. The current is transmitted to the chip layer 2 through the copper foil. At the same time, the heat generated by the chip layer 2 can be quickly conducted to the aluminum nitride ceramic substrate 101.

[0028] Further, the gap position between the chip layer 2 and the substrate layer 1 is filled with a reflective glue filling layer. The reflective glue filling layer is cured by dispensing process. The heat generated by the chip layer 2 can be quickly conducted, the heat dissipation efficiency is improved, and the thermal resistance is reduced.

[0029] The optical adjustment layer 3 is attached to the surface of the chip layer 2, and the optical adjustment layer 3 comprises a first sub-layer, a second sub-layer and a third sub-layer; the first sub-layer comprises a transparent conductive film 301, the transparent conductive film 301 is hot-pressed on the surface of the chip layer 2, and is used for ensuring uniform conductive performance between units; the second sub-layer comprises a quantum dot fluorescent film 302, the quantum dot fluorescent film 302 is adhered to the surface of the transparent conductive film 301, and is used for color conversion; and the third sub-layer comprises an anti-glare coating 303, the anti-glare coating 303 is attached to the surface of the quantum dot fluorescent film 302, and is used for resisting environmental light interference.

[0030] The packaging protection layer 4 is solidified on the surface of the optical adjustment layer 3, and the packaging protection layer 4 comprises an organic silicon resin layer 401; the elastic modulus of the organic silicon resin layer 401 is good, and the organic silicon resin layer 401 can absorb mechanical impact and protect the brittle quantum dot film; and the organic silicon resin layer 401 is internally embedded with a graphene heat sink 402; the graphene heat sink 402 vertically conducts heat generated by the chip layer 2 during work to the surface protection layer 5, and forms a “substrate-graphene” double-path heat dissipation.

[0031] The upper layer of the packaging protection layer 4 is further provided with the surface protection layer 5, and the surface protection layer 5 comprises a film layer 501; the material of the film layer 501 can be sealed on the surface of the packaging protection layer 4.

[0032] The above is a further detailed description of the utility model in combination with the specific implementation, and the specific implementation of the utility model cannot be limited to this; for the person skilled in the art and the related technical field, the expansion, operation method and data replacement made on the basis of the technical scheme idea of the utility model should be within the protection scope of the utility model.

Claims

1. A high-efficiency heat-dissipation LED display structure, characterized in that, Include: The substrate layer (1), chip layer (2), optical adjustment layer (3), packaging protection layer (4), the substrate layer (1) is arranged in the bottom layer, the chip layer (2) is arranged on the upper end of the substrate layer (1), the optical adjustment layer (3) is arranged on the upper end of the chip layer (2), the packaging protection layer (4) is arranged on the upper end of the optical adjustment layer (3); The chip layer (2) and the substrate layer (1) are connected by bonding, and the gap position between the chip layer (2) and the substrate layer (1) is filled with a reflective glue filling layer; The optical adjustment layer (3) is arranged on the surface of the chip layer (2); The packaging protection layer (4) is cured on the surface of the optical adjustment layer (3). 2.The LED display structure of claim 1, wherein: The substrate layer (1) includes an aluminum nitride ceramic substrate (101) and a copper foil layer (102), the aluminum nitride ceramic substrate (101) is used as the base of the substrate layer (1), and the copper foil layer (102) is bonded to the surface of the aluminum nitride ceramic substrate (101). 3.The LED display structure of claim 1, wherein: The optical adjustment layer (3) includes a first sublayer, a second sublayer and a third sublayer, the first sublayer includes a transparent conductive film (301), the transparent conductive film (301) is hot-pressed on the surface of the chip layer (2), the second sublayer includes a quantum dot fluorescent film (302), the quantum dot fluorescent film (302) is adhered to the surface of the transparent conductive film (301), and the third sublayer includes an anti-glare coating (303), the anti-glare coating (303) is attached to the surface of the quantum dot fluorescent film (302). 4.The LED display structure of claim 1, wherein: The packaging protection layer (4) includes an organic silicone resin layer (401), and the inside of the organic silicone resin layer (401) is embedded with a graphene heat sink (402).

5. The LED display structure of claim 4, wherein: The upper layer of the packaging protection layer (4) is further provided with a surface protection layer (5), and the surface protection layer (5) includes a film layer (501), and the film layer (501) is sealed on the surface of the packaging protection layer (4).

Images