Composite substrate packaging structure of LED SMD lamp bead

By setting positioning grooves and positioning plates on the LED substrate and using clamping components to fix the chip board, the problem of poor packaging stability is solved, and stable packaging of the chip board is achieved.

CN224111585UActive Publication Date: 2026-04-10SHENZHEN CHENGSHUO OPTOELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN CHENGSHUO OPTOELECTRONICS CO LTD
Filing Date
2025-06-03
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

The existing LED substrate packaging structure has poor stability, which leads to unstable solder joints and makes it easy for cold solder joints to occur.

Method used

The chip board is positioned using positioning slots and positioning plates, and the chip board is pressed and fixed by a clamping assembly to enhance packaging stability.

Benefits of technology

This improves the packaging stability of the chip board and prevents the occurrence of cold solder joints.

✦ Generated by Eureka AI based on patent content.

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Abstract

The composite substrate packaging structure comprises a composite substrate body, an LED patch lamp bead assembly and a pressing assembly, a plurality of placing grooves are formed in the upper end of the composite substrate body, and positioning grooves are formed in the upper sides of the opposite inner walls of the placing grooves; the LED patch lamp bead assembly comprises a chip board arranged in the containing groove, a lamp bead body arranged in the middle of the upper end of the chip board and a positioning board fixed to the upper side of the opposite outer wall of the chip board, and the positioning board is connected with the positioning groove in a clamped mode. The pressing assembly comprises a rotating shaft vertically arranged at the upper end of the composite substrate body and located on the outer side of the positioning groove, and a rotating plate vertically arranged at the upper end of the rotating shaft. According to the composite substrate packaging structure of the LED SMD lamp bead, the chip board is positioned and placed through the positioning groove and the positioning plate, and the chip board is pressed and fixed through the pressing assembly, so that the packaging stability of the chip board is enhanced, and the phenomenon of pseudo soldering of the chip board caused by unstable welding of a welding spot after the chip board is packaged is prevented.
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Description

TECHNICAL FIELD

[0001] The utility model relates to LED packaging substrate technical field, concretely is a kind of composite substrate packaging structure of LED SMD lamp bead. BACKGROUND

[0002] LED (Light Emitting Diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. LED packaging has special requirements for packaging materials, because LED packaging not only requires protecting the lampwick, but also needs to be light-transmitting.

[0003] The existing LED substrate has poor packaging stability when packaging, which leads to unstable welding of the welding points after packaging, and is prone to false welding. Therefore, we propose a composite substrate packaging structure of LED SMD lamp bead. SUMMARY

[0004] This section aims to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the utility model name to avoid obscuring the purpose of this section, the abstract of the specification and the utility model name. Such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In view of the above and / or existing problems in LED packaging substrate, the utility model is proposed.

[0006] Therefore, the purpose of the utility model is to provide a composite substrate packaging structure of LED SMD lamp bead. The chip board is positioned and placed by the positioning groove and positioning plate, and the chip board is fixed by the pressing assembly. The packaging stability of the chip board is enhanced, and the phenomenon of false welding of the chip board after packaging is prevented.

[0007] To solve the above technical problems, according to one aspect of the utility model, the utility model provides the following technical scheme:

[0008] A composite substrate packaging structure of LED SMD lamp bead comprises:

[0009] A composite substrate body has a plurality of placement grooves at its upper end, and a positioning groove is formed on the opposite inner wall of the placement groove;

[0010] An LED SMD lamp bead assembly comprises a chip board arranged in the placement groove, a lamp bead body arranged at the middle of the upper end of the chip board, and a positioning plate fixed to the opposite outer wall of the chip board. The positioning plate is connected with the positioning groove.

[0011] The pressing assembly comprises a rotating shaft vertically arranged on the upper end of the composite substrate body outside the positioning groove, a rotating plate vertically arranged on the upper end of the rotating shaft, a threaded rod vertically and threadedly arranged on the rotating plate, and a pressing plate arranged on the lower end of the threaded rod.

[0012] As a preferred scheme of the composite substrate packaging structure of the LED patch lamp bead, the upper end of the composite substrate body is provided with a circular ring plate on the outer wall of the rotating shaft, the outer wall of the circular ring plate is fixedly provided with a connecting rod, the inside of the connecting rod is provided with an elastic piece, the inside of the elastic piece is fixedly provided with a fixed block, the outer wall of the fixed block is fixedly provided with a pull rod in the middle, the outer wall of the rotating shaft is provided with a channel, and the fixed block is clamped in the channel.

[0013] As a preferred scheme of the composite substrate packaging structure of the LED patch lamp bead, the elastic piece is a spring or an elastic sleeve.

[0014] As a preferred scheme of the composite substrate packaging structure of the LED patch lamp bead, the upper end of the rotating plate is provided with a bolt, and the bolt penetrates through the rotating plate to the rotating shaft.

[0015] As a preferred scheme of the composite substrate packaging structure of the LED patch lamp bead, the lower end of the pressing plate is fixedly provided with a protective pad, and the material of the protective pad is rubber.

[0016] As a preferred scheme of the composite substrate packaging structure of the LED patch lamp bead, the upper end of the positioning plate is provided with a clamping groove in the middle, and the lower end of the pressing plate is fixedly provided with a clamping block in the middle, and the clamping block is clamped with the clamping groove.

[0017] Compared with the prior art, the composite substrate packaging structure of the LED patch lamp bead has the beneficial effects that the chip plate is positioned and placed through the positioning groove and the positioning plate, and the chip plate is pressed and fixed through the pressing assembly, so that the packaging stability of the chip plate is enhanced, and the phenomenon of virtual welding of the chip plate after packaging due to unstable welding of the welding point is prevented. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the present application will be described in detail below in combination with the drawings and detailed embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor. Among them:

[0019] Fig. 1It is a kind of LED patch lamp pearl's composite substrate packaging structure three-dimensional structure schematic diagram of the utility model;

[0020] Fig. 2 It is a kind of LED patch lamp pearl's composite substrate packaging structure partial three-dimensional structure schematic diagram of the utility model;

[0021] Fig. 3 It is a kind of LED patch lamp pearl's composite substrate packaging structure pivot sectional three-dimensional structure schematic diagram of the utility model;

[0022] In the drawing: 100, composite substrate body;101, placement groove;102, positioning groove;200, LED patch lamp pearl assembly;210, chip board;220, lamp pearl body;230, positioning plate;231, clamping groove;300, compression assembly;310, pivot;311, circular ring;312, connecting rod;313, elastic piece;314, fixed block;315, pull rod;320, rotating plate;321, bolt;330, threaded rod;340, compression plate;341, clamping block. DETAILED DESCRIPTION

[0023] In order to make the above-mentioned purpose, features and advantages of the utility model more obvious and easy to understand, the specific embodiments of the utility model will be described in detail below with reference to the drawings.

[0024] Secondly, the utility model is described in detail in combination with the schematic diagram, and in the detailed description of the utility model embodiment, for the convenience of description, the sectional view of the device structure will be partially enlarged without the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the utility model herein. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in actual production.

[0025] In order to make the purpose, technical scheme and advantages of the utility model more clear, the specific embodiments of the utility model will be described in further detail below with reference to the drawings.

[0026] The utility model provides a kind of composite substrate packaging structure of LED patch lamp pearl, positioning groove and positioning plate are positioned to chip board by being set, chip board is fixed by being pressed tightly by being set compression assembly, to enhance the packaging stability of chip board, prevent the phenomenon that it appears virtual welding due to unstable welding of solder point after chip board packaging.

[0027] Figs. 1-3 It is shown that the structure schematic diagram of one embodiment of the utility model LED patch lamp pearl's composite substrate packaging structure, please refer to Figs. 1-3 The main part of the composite substrate packaging structure of the LED patch lamp pearl of the embodiment includes composite substrate body 100, LED patch lamp pearl assembly 200 and compression assembly 300.

[0028] A plurality of placement grooves 101 are formed on the upper end of the composite substrate body 100, and positioning grooves 102 are formed on the opposite inner walls of the upper end of the placement grooves 101.

[0029] The LED patch lamp bead assembly 200 comprises a chip plate 210 arranged in the placement groove 101, a lamp bead body 220 arranged at the middle of the upper end of the chip plate 210, and a positioning plate 230 fixed on the opposite outer walls of the upper end of the chip plate 210, and the positioning plate 230 is clamped with the positioning groove 102.

[0030] The compression assembly 300 comprises a rotating shaft 310 vertically arranged on the upper end of the composite substrate body 100 outside the positioning groove 102, a rotating plate 320 vertically arranged on the upper end of the rotating shaft 310, a threaded rod 330 vertically and screwedly arranged on the rotating plate 320, and a compression plate 340 arranged at the lower end of the threaded rod 330. As a preferred embodiment, a circular ring plate 311 is arranged on the outer wall of the upper end of the composite substrate body 100, a connecting rod 312 is fixed on the outer wall of the circular ring plate 311, an elastic member 313 is arranged in the connecting rod 312, a fixed block 314 is fixed on the inner side of the elastic member 313, a pull rod 315 is fixed on the outer wall of the middle of the fixed block 314, a groove is formed on the outer wall of the rotating shaft 310, and the fixed block 314 is clamped in the groove. The arranged elastic member 313, fixed block 314 and groove can fix the rotating shaft 310, ensure the fixation of the compression assembly 300 after compression, and ensure the stability of the chip plate 210. The upper end of the rotating plate 320 is provided with a bolt 321, the bolt 321 penetrates the rotating plate 320 to the rotating shaft 310, the rotating plate 320 is installed on the upper end of the rotating shaft 310 under the action of the bolt 321, and the operator can take down the rotating plate 320 by taking down the bolt 321 for disassembly and replacement. The lower end of the compression plate 340 is fixed with a protective pad, the material of the protective pad is rubber, the protective pad arranged at the lower end of the compression plate 340 plays a protective role on the positioning plate 230, prevents the compression plate 340 from directly contacting and wearing the positioning plate 230, the upper end of the positioning plate 230 is provided with a clamping groove 231, the lower end of the compression plate 340 is fixed with a clamping block 341, the clamping block 341 is clamped with the clamping groove 231, the clamping block 341 arranged at the lower end of the compression plate 340 and the clamping groove 231 arranged at the upper end of the positioning plate 230 enable the compression plate 340 to clamp and fix the positioning plate 230, further ensuring the stability of the positioning plate 230, and thus ensuring the stability of the chip plate 210.

[0031] Combination Figs. 1-3The composite substrate packaging structure of the LED patch lamp bead of the embodiment is used as follows: the operator positions and places the chip plate 210 with the lamp bead body 220 in the placing groove 101 of the composite substrate body 100 through the positioning plate 230 and the positioning groove 102, then manually rotates the rotating shaft 310 to rotate the pressing plate 340 on the rotating plate 320 to the upper side of the positioning plate 230, then manually rotates the threaded rod 330 to drive the pressing plate 340 to move downward, the pressing plate 340 tightly fixes the positioning plate 230, thereby playing a limiting and fixing role on the chip plate 210, ensuring the packaging stability of the chip plate 210, when the pressing plate 340 is tightly pressed, the clamping block 341 arranged at the lower end of the pressing plate 340 and the clamping groove 231 opened at the upper end of the positioning plate 230 enable the pressing plate 340 to clamp and fix the positioning plate 230, thereby further ensuring the stability of the chip plate 210.

[0032] Although the utility model has been described above with reference to the embodiments, various improvements can be made and equivalent parts can be replaced without departing from the scope of the utility model. In particular, as long as there is no structural conflict, the features in the embodiments disclosed by the utility model can be combined in any way, and the combinations are not exhaustively described in the specification only for the purpose of saving space and resources. Therefore, the utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A composite substrate packaging structure of an LED patch lamp bead, characterized in that, The utility model relates to a composite substrate body (100) is provided with a plurality of placement grooves (101) on the upper end, and the opposite inner wall of the placement groove (101) is provided with a positioning groove (102) on the upper side, and the LED patch lamp bead assembly (200) is arranged in the placement groove (101), and the chip board (210) is arranged on the upper end of the chip board (210), and the lamp bead body (220) is arranged in the middle, and the positioning plate (230) is fixed on the opposite outer wall of the chip board (210) upper side, and the positioning plate (230) is connected with the positioning groove (102), and the compression assembly (300) is arranged on the upper end of the composite substrate body (100) outside the positioning groove (102) vertically, and the rotating plate (320) is arranged on the upper end of the rotating shaft (310) vertically, and the threaded rod (330) is arranged on the rotating plate (320) vertically, and the compression plate (340) is arranged on the lower end of the threaded rod (330). The upper end of the composite substrate body (100) is provided with a circular ring plate (311) on the outer wall of the rotating shaft (310), and the connecting rod (312) is fixed on the outer wall of the circular ring plate (311), and the elastic element (313) is arranged in the connecting rod (312), and the fixed block (314) is fixed on the inner side of the elastic element (313), and the pull rod (315) is fixed on the outer wall of the fixed block (314), and the rotating shaft (310) is provided with a groove on the outer wall, and the fixed block (314) is connected in the groove. The elastic element (313) is a spring or an elastic sleeve. The upper end of the rotating plate (320) is provided with a bolt (321), and the bolt (321) penetrates the rotating plate (320) to the rotating shaft (310). 2.The composite substrate packaging structure of an LED patch lamp bead according to claim 1, wherein, The lower end of the compression plate (340) is fixed with a protective pad, and the material of the protective pad is rubber. 3.The composite substrate packaging structure of an LED patch lamp bead according to claim 2, wherein, The upper end of the positioning plate (230) is provided with a clamping groove (231) in the middle, and the lower end of the compression plate (340) is fixed with a clamping block (341), and the clamping block (341) is connected with the clamping groove (231). 4.The composite substrate packaging structure of an LED patch lamp bead according to claim 1, wherein, ​ 5.The composite substrate packaging structure of an LED patch lamp bead according to claim 1, wherein, ​ 6.The composite substrate package structure of an LED patch lamp bead according to claim 1, wherein, ​