Vacuum adsorption workbench for die bonder

Abstract

The utility model discloses a vacuum adsorption workbench for a die bonder, and relates to the technical field of die bonder workbenches. The workbench comprises a workbench main body, an adsorption device and a negative pressure generation device; the adsorption device comprises an adsorption base, a connecting pipe, a negative pressure integration box and a plurality of adsorption heads used for adsorbing the driving substrate, the adsorption base is provided with a plurality of mounting holes penetrating through the adsorption base in the vertical direction, and the surface of the adsorption base is flush with the table top of the workbench body; the number of the connecting pipes is matched with that of the adsorption heads, the adsorption heads are communicated with one end of the negative pressure integration box through the connecting pipes, the other end of the negative pressure integration box is connected with the negative pressure generation device, and the negative pressure generation device is used for generating negative pressure; and the adsorption head is mounted in at least one mounting hole. The vacuum adsorption workbench for the die bonder can adapt to driving substrates of different sizes, so that the compatibility of the workbench is improved, and die bonding of the driving substrates of different sizes is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to die bonder workstation technical field especially relates to a vacuum adsorption workstation for die bonder. BACKGROUND

[0002] In the manufacturing process of Mini LED display screen, die bonding is one of the key processes, and the core step is to transfer tens of thousands of Mini LED chips to the predetermined pad position of the driving substrate (such as PCB board, glass substrate, etc.) with high precision. In order to ensure the transfer precision, the driving substrate must be kept absolutely stationary during die bonding, and any slight displacement or vibration may cause chip alignment deviation, thereby affecting the brightness and color uniformity of the display screen.

[0003] At present, the industry generally uses vacuum adsorption technology to fix the driving substrate, and its working principle is to generate negative pressure on the surface of the workbench by a vacuum pump or a vacuum generator, so that the substrate is adsorbed on the table. However, this technology has the following significant problems in practical application: the suction hole or suction nozzle array of the traditional vacuum adsorption workbench is usually designed according to a single substrate size, and it is difficult to flexibly adjust the adsorption range, resulting in poor adaptability and difficulty in compatible with driving substrates of different sizes. SUMMARY

[0004] In view of the above shortcomings of the prior art, the purpose of the utility model is to provide a vacuum adsorption workbench for die bonder, which can adapt to driving substrates of different sizes, thereby improving the compatibility of the workbench and realizing die bonding of driving substrates of different sizes.

[0005] In order to solve the above technical problems, the utility model provides a vacuum adsorption workbench for die bonder, which comprises a workbench main body, an adsorption device and a negative pressure generating device, the adsorption device and the negative pressure generating device are installed in the interior of the workbench main body;

[0006] The adsorption device comprises an adsorption seat, a connecting pipe, a negative pressure integrated box and a plurality of adsorption heads for adsorbing driving substrates, the adsorption seat is provided with a plurality of mounting holes penetrating the adsorption seat in the vertical direction, the surface of the adsorption seat is flush with the table surface of the workbench main body;

[0007] The number of connecting pipes matches the number of adsorption heads, the adsorption heads are communicated through the connecting pipes and one end of the negative pressure integrated box, the other end of the negative pressure integrated box is connected with the negative pressure generating device, and the negative pressure generating device is used for generating negative pressure;

[0008] At least one of the mounting holes is provided with the adsorption head.

[0009] As an improvement of the above technical solution, the number of the mounting holes is more than the number of the adsorption heads, and the adsorption heads are selectively mounted in part of the mounting holes.

[0010] As an improvement of the above technical solution, the adsorption device further comprises a connecting pipe joint and an annular sealing ring, the connecting pipe joint is used for being connected with the inner wall of one end of the adsorption head and being screwed with the adsorption head, and the outer wall is screwed with the mounting hole.

[0011] The annular sealing ring is sleeved on the outside of the adsorption head, the inner diameter of the annular sealing ring is less than or equal to the outer diameter of the adsorption head, and the outer diameter of the annular sealing ring is greater than or equal to the diameter of the mounting hole.

[0012] The outer diameter of the annular sealing ring gradually decreases along the direction close to the suction port of the adsorption head.

[0013] As an improvement of the above technical solution, the adsorption device further comprises an elastic gasket, the elastic gasket is mounted on the surface of the adsorption seat, a plurality of through holes are arranged on the elastic gasket, and the positions of the through holes correspond to the positions of the mounting holes one by one.

[0014] As an improvement of the above technical solution, the thickness of the elastic gasket 26 is 0.2mm-2mm.

[0015] As an improvement of the above technical solution, a plurality of mounting holes are arranged in a matrix on the adsorption seat, and the number of the mounting holes is 3-10 times the number of the adsorption heads.

[0016] As an improvement of the above technical solution, the adsorption device further comprises a support plate, one end of the support plate is connected with the adsorption seat, and the other end is connected with the negative pressure integrated box.

[0017] As an improvement of the above technical solution, the negative pressure generating device comprises a negative pressure channel, an airflow channel and a gas compressor, the negative pressure channel is located directly below the negative pressure integrated box, one end of the negative pressure channel is connected with the negative pressure integrated box, the other end of the negative pressure channel is connected with the negative pressure generating end of the airflow channel, the negative pressure channel and the airflow channel are arranged vertically, the output end of the gas compressor is connected with the input end of the airflow channel, and the gas compressor is used for introducing compressed air into the airflow channel.

[0018] As an improvement of the above technical solution, the negative pressure generating device further comprises a noise reduction cover, the air inlet of the noise reduction cover is connected with the output end of the airflow channel, and the air outlet of the noise reduction cover is located outside the workbench main body.

[0019] The inner diameter of the noise reduction cover gradually increases from the air inlet of the noise reduction cover to the air outlet of the noise reduction cover.

[0020] As an improvement of the above technical solution, the diameter of the air outlet of the noise reduction cover is 2-5 times the diameter of the air inlet of the noise reduction cover.

[0021] As an improvement of the above technical solution, the negative pressure generating device further comprises a solenoid valve, which is arranged at one end of the negative pressure channel close to the negative pressure integrated box.

[0022] As an improvement of the above technical solution, the workbench body is provided with a numerical control mainboard and a laser detection device for detecting whether the driving substrate is placed on the surface of the adsorption seat, and the laser detection device and the solenoid valve are electrically connected or signal connected with the numerical control mainboard.

[0023] The utility model discloses, have the following beneficial effect: the utility model discloses by making adsorption head selectively install in the mounting hole of part, can dynamically adjust the installation position of adsorption head, make the adsorption area formed by multiple adsorption heads can adapt to different size driving substrate (such as PCB board, glass substrate etc.), make the vacuum adsorption workbench for die bonder of this embodiment can be compatible with multiple size substrate, and further improve the adaptability of workbench, thereby can realize the die bonding of different size driving substrate. And the vacuum adsorption workbench for die bonder of this embodiment adopts the mode of multiple adsorption heads to adsorb driving substrate, can reach better adsorption effect, avoids the vacuum leakage when adsorbing. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is the structural schematic diagram of the vacuum adsorption workbench for die bonder in an embodiment of the utility model;

[0025] Figure 2 It is Figure 1 The cooperation schematic diagram of adsorption device and negative pressure generating device in the vacuum adsorption workbench for die bonder in the embodiment shown in the figure;

[0026] Figure 3 It is Figure 2 The enlarged view of S in the vacuum adsorption workbench for die bonder shown in the figure;

[0027] Figure 4 It is Figure 1 The structural schematic diagram of negative pressure generating device in the vacuum adsorption workbench for die bonder in the embodiment shown in the figure;

[0028] In the diagram: 1. Workbench body; 2. Adsorption device; 3. Negative pressure generating device; 4. CNC main board; 5. Laser detection equipment; 6. Adsorption seat; 7. Connecting pipe; 8. Negative pressure integrated box; 9. Adsorption head; 10. Support plate; 11. Elastic gasket; 22. Connecting pipe joint; 23. Annular sealing ring; 24. Negative pressure channel; 35. Airflow channel; 36. Gas compressor; 37. Noise reduction cover; 38. Solenoid valve; 29. ​​Mounting hole; 20. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings. This utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0030] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] like Figures 1 to 4 As shown, this embodiment discloses a vacuum adsorption worktable for a die bonder, including a worktable body 1, an adsorption device 2, and a negative pressure generating device 3. The adsorption device 2 and the negative pressure generating device 3 are both installed inside the worktable body 1.

[0033] The adsorption device 2 includes an adsorption seat 21, a connecting pipe 22, a negative pressure integrated box 23, and a plurality of adsorption heads 24 for adsorbing the driving substrate. The adsorption seat 21 is provided with a plurality of mounting holes 211 that penetrate the adsorption seat 21 in the vertical direction. The surface of the adsorption seat 21 is flush with the table surface of the workbench body 1.

[0034] The number of the connecting pipes 22 matches the number of the adsorption heads 24, the adsorption heads 24 are communicated with one end of the negative pressure integrated box 23 through the connecting pipes 22, the other end of the negative pressure integrated box 23 is connected with the negative pressure generating device 3, and the negative pressure generating device 3 is used for generating negative pressure.

[0035] At least one of the mounting holes is mounted with the adsorption head.

[0036] Preferably, the number of the mounting holes 211 is more than the number of the adsorption heads 24, and the adsorption heads 24 are selectively mounted in part of the mounting holes 211.

[0037] According to the embodiment, the adsorption heads 24 are selectively mounted in part of the mounting holes 211, the mounting positions of the adsorption heads 24 can be dynamically adjusted, the adsorption area formed by the adsorption heads 24 can be adapted to driving substrates (such as PCBs, glass substrates, etc.) of different sizes, the vacuum adsorption workbench for die bonding machines can be compatible with substrates of different sizes, the adaptability of the workbench is improved, and thus the die bonding on driving substrates of different sizes can be realized.

[0038] Preferably, the mounting holes 211 are arranged in a matrix arrangement on the adsorption seat 21, and the adsorption heads 24 can be mounted in the mounting holes 211 with proper number and positions according to the size of the driving substrate.

[0039] Preferably, the adsorption heads 24 are provided with at least four adsorption heads, which can uniformly adsorb the driving substrate and achieve better adsorption effect. In some embodiments, the adsorption heads 24 can be provided with one, two, four, six, eight or ten adsorption heads, but are not limited thereto.

[0040] In an embodiment, the adsorption device 2 further comprises a connecting pipe joint 27 and a ring-shaped sealing ring 28, the connecting pipe joint 27 is used for threadedly connecting the inner wall of one end connected with the adsorption head 24 and the adsorption head 24, and threadedly connecting the outer wall and the mounting hole 211, which can ensure the air tightness between the adsorption head 24 and the connecting pipe joint 27, prevent vacuum leakage, and selectively mount the adsorption head 24 in part of the mounting holes 211 by threadedly connecting the outer wall of the connecting pipe joint 27 and the mounting hole 211, which can realize the quick mounting and dismounting of the adsorption head 24.

[0041] The annular sealing ring 28 is sleeved outside the adsorption head 24, the inner diameter of the annular sealing ring 28 is less than the outer diameter of the adsorption head 24, and the outer diameter of the annular sealing ring 28 is greater than the diameter of the mounting hole 211; by arranging the annular sealing ring 28 between the adsorption head 24 and the mounting hole 211 and limiting the size of the annular sealing ring 28, a good sealing effect can be achieved, the adsorption effect is better, and air leakage is avoided.

[0042] More preferably, the inner wall of the annular sealing ring 28 and the outer wall of the adsorption head 24 are in interference fit, the interference amount is controlled to be 0.1-0.3 mm, the annular sealing ring 28 is tightly held on the adsorption head 24, and radial air leakage is avoided.

[0043] More preferably, the outer wall of the annular sealing ring 28 and the mounting hole 211 are also in interference fit, and the interference amount is recommended to be 0.2-0.5 mm; after the annular sealing ring 28 is pressed, it expands outward to fully fill the gap between the inner wall of the mounting hole 211, and an excellent sealing effect can be achieved.

[0044] In an embodiment, the outer diameter of one end of the annular sealing ring 28 close to the suction port of the adsorption head 24 gradually decreases in the direction close to the suction port of the adsorption head 24, facilitating the installation of the adsorption head 24 with the annular sealing ring 28 into the mounting hole 211.

[0045] In an embodiment, the adsorption device 2 further comprises an elastic gasket 26, the elastic gasket 26 is installed on the surface of the adsorption seat 21, a plurality of through holes are arranged on the elastic gasket 26, and the positions of the through holes correspond one by one to the positions of the mounting holes 211.

[0046] By arranging the elastic gasket 26 on the surface of the adsorption seat 21, the adsorption device 2 and the driving substrate can be in close contact when the driving substrate is adsorbed, the adsorption effect is better, vacuum leakage is avoided, and the elastic gasket 26 can also play a buffering role to avoid damage to the driving substrate.

[0047] In an embodiment, the thickness of the elastic gasket 26 is 0.2-2 mm, within this thickness range, the adsorption device 2 can achieve a better adsorption effect, and the driving substrate can be protected during adsorption to avoid damage to the driving substrate.

[0048] In an embodiment, a plurality of mounting holes are arranged in a matrix on the adsorption seat; the number of the mounting holes is 3-10 times the number of the adsorption heads. The compatibility of the vacuum adsorption workbench for the die bonder can be effectively improved, the adsorption area formed thereby can adapt to driving substrates of various sizes, and die bonding on driving substrates of different sizes can be realized.

[0049] In an embodiment, the adsorption device 2 further comprises a support plate 25, one end of the support plate 25 is connected with the adsorption seat 21, and the other end is connected with the negative pressure integrated box 23. The support plate 25 can support the adsorption seat 21, and install the adsorption seat 21 above the negative pressure integrated box 23, so that a certain interval is provided between the adsorption seat 21 and the negative pressure integrated box 23, which is used for installing and accommodating the connecting pipe 22.

[0050] In an embodiment, the negative pressure generating device 3 comprises a negative pressure channel 31, an airflow channel 32, and a gas compressor 33. The negative pressure channel 31 is located directly below the negative pressure integrated box 23. One end of the negative pressure channel 31 is connected with the negative pressure integrated box 23, and the other end is connected with the negative pressure generating end of the airflow channel 32. The negative pressure channel 31 and the airflow channel 32 are arranged vertically. The output end of the gas compressor 33 is connected with the input end of the airflow channel 32. The gas compressor 33 is used to introduce compressed air into the airflow channel 32, so that the negative pressure channel 31 generates negative pressure.

[0051] In an embodiment, the negative pressure generating device 3 further comprises a noise reduction cover 34. The air inlet of the noise reduction cover 34 is connected with the output end of the airflow channel 32, and the air outlet of the noise reduction cover 34 is located outside the workbench main body 1.

[0052] The inner diameter of the noise reduction cover 34 gradually increases from the air inlet to the air outlet.

[0053] Since the gas compressor 33 introduces compressed air into the airflow channel 32, the airflow is directly ejected at high speed, which produces a large noise and easily generates turbulence, affecting the working environment. By arranging the noise reduction cover 34 at the output end of the airflow channel 32, when the high-speed airflow enters the noise reduction cover 34 from the narrow airflow channel 32, the airflow speed gradually decreases due to the gradually increasing inner diameter, and the pressure energy is partially converted into static pressure, reducing turbulence and vortex, thereby reducing high-frequency noise and achieving the effect of noise reduction.

[0054] In an embodiment, the diameter of the air outlet of the noise reduction cover 34 is 2-5 times the diameter of the air inlet of the noise reduction cover 34, which can achieve a better noise reduction effect.

[0055] In an embodiment, the negative pressure generating device 3 further comprises an electromagnetic valve 35, which is arranged at one end of the negative pressure channel 31 close to the negative pressure integrated box 23. The compressed air produced by the gas compressor 33 generates negative pressure through the cooperation of the negative pressure channel 31 and the airflow channel 32, and the electromagnetic valve controls the on-off of the air pressure to provide negative pressure for the negative pressure integrated box 23.

[0056] In an embodiment, the workbench body 1 is provided with a numerical control mainboard 4 and a laser detection device 5 for detecting whether the surface of the adsorption seat 21 is placed with the driving substrate, the laser detection device 5 and the electromagnetic valve 35 are electrically connected or signal connected with the numerical control mainboard 4. When the laser detection device 5 detects that the surface of the adsorption seat 21 is placed with the driving substrate, a signal is transmitted to the numerical control mainboard 4, the numerical control mainboard 4 controls the electromagnetic valve 35 to be electrified, the negative pressure channel 31 and the negative pressure integrated box 23 are communicated, the negative pressure integrated box 23 is formed with negative pressure, and the adsorption head 24 adsorbs the driving substrate.

[0057] The technical principles of the utility model are described above in combination with specific embodiments. These descriptions are only for explaining the principles of the utility model, and cannot be interpreted as limiting the protection scope of the utility model in any way. Based on the explanations herein, other specific embodiments of the utility model can be conceived by those skilled in the art without creative labor, and these embodiments will all fall within the protection scope of the utility model.

Claims

1. A vacuum chuck table for a die bonder, characterized by, The workbench body, the adsorption device and the negative pressure generating device are all installed inside the workbench body; The adsorption device includes an adsorption seat, a connecting pipe, a negative pressure integrated box and a plurality of adsorption heads for adsorbing driving substrates, the adsorption seat is provided with a plurality of mounting holes penetrating the adsorption seat in the vertical direction, and the surface of the adsorption seat is flush with the tabletop of the workbench body; The adsorption heads are communicated with one end of the connecting pipe and the negative pressure integrated box, the other end of the negative pressure integrated box is connected with the negative pressure generating device, and the negative pressure generating device is used for generating negative pressure; At least one of the mounting holes is provided with the adsorption head.

2. The vacuum chuck table for a die bonder as set forth in claim 1, wherein The adsorption device further includes a connecting pipe joint and an annular sealing ring, the connecting pipe joint is used for threadedly connecting the inner wall of one end of the adsorption head and the adsorption head, and the outer wall is threadedly connected with the mounting hole; The annular sealing ring is sleeved on the outside of the adsorption head, the inner diameter of the annular sealing ring is less than or equal to the outer diameter of the adsorption head, and the outer diameter of the annular sealing ring is greater than or equal to the diameter of the mounting hole; The outer diameter of the annular sealing ring gradually decreases along the direction close to the suction port of the adsorption head.

3. The vacuum chuck table for a die bonder as set forth in claim 1, wherein The adsorption device further includes an elastic gasket, the elastic gasket is installed on the surface of the adsorption seat, a plurality of through holes are provided on the elastic gasket, and the positions of the through holes correspond to the positions of the mounting holes one by one; The thickness of the elastic gasket is 0.2mm-2mm.

4. The vacuum chuck table for a die bonder as set forth in claim 1, wherein A plurality of mounting hole matrixes are arranged on the adsorption seat; The number of the mounting holes is 3-10 times the number of the adsorption heads.

5. The vacuum chuck table for a die bonder as set forth in claim 1, wherein The adsorption device further includes a support plate, one end of the support plate is connected with the adsorption seat, and the other end is connected with the negative pressure integrated box.

6. The vacuum chuck table for a die bonder as set forth in claim 1, wherein The negative pressure generating device includes a negative pressure channel, an airflow channel and a gas compressor, the negative pressure channel is located directly below the negative pressure integrated box, one end of the negative pressure channel is connected with the negative pressure integrated box, the other end of the negative pressure channel is connected with the negative pressure generating end of the airflow channel, the negative pressure channel and the airflow channel are arranged vertically, the output end of the gas compressor is connected with the input end of the airflow channel, and the gas compressor is used for introducing compressed air into the airflow channel.

7. The vacuum chuck table for a die bonder as set forth in claim 6, wherein The negative pressure generating device further includes a noise reduction cover, the air inlet of the noise reduction cover is connected with the output end of the airflow channel, and the air outlet of the noise reduction cover is located outside the workbench body; The inner diameter of the noise reduction cover gradually increases from the air inlet to the air outlet of the noise reduction cover.

8. The vacuum chuck table for a die bonder as set forth in claim 7, wherein, The diameter of the air outlet of the noise reduction cover is 2-5 times the diameter of the air inlet of the noise reduction cover.

9. The vacuum chuck table for a die bonder as set forth in claim 6, wherein, The negative pressure generating device further includes a solenoid valve, and the solenoid valve is arranged at one end of the negative pressure channel close to the negative pressure integrated box.

10. The vacuum chuck table for a die bonder as set forth in claim 9, wherein, The workbench body is provided with a numerical control mainboard and a laser detection device for detecting whether the driving substrate is placed on the surface of the adsorption seat, and the laser detection device and the solenoid valve are electrically connected or signal connected with the numerical control mainboard.

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