Silicon wafer chamfering grinding wheel

Abstract

The utility model discloses a silicon wafer chamfer grinding wheel which comprises an intelligent wheel, a hydraulic rod, a limiting plate, a guide rail plate and a grinding wheel body, the hydraulic rod is arranged on the limiting plate, the telescopic end of the hydraulic rod is connected with an installation hoop frame, a motor is arranged on the inner side of the installation hoop frame, and an output shaft of the motor is connected with the grinding wheel body. And intelligent wheels are arranged on the two sides of the limiting plate through connecting rods. The grinding wheel is simple in structural design, the hydraulic rod is arranged at the top of the grinding wheel body, the height of the grinding wheel body can be adjusted, the grinding process can be accurately controlled conveniently, the limiting plate is arranged on the outer side of the hydraulic rod, the intelligent wheels are arranged on the two sides of the limiting plate through the connecting rods, and the grinding wheel body is conveniently driven to move longitudinally and automatically through the intelligent wheels. The running wheels are convenient to control, the moving and grinding efficiency is high, a silicon wafer containing groove is formed in the middle of the top end of the guide rail plate, a plurality of silicon wafers can be conveniently placed through the silicon wafer containing groove, and runways are arranged on the two sides of the top of the guide rail plate.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer chamfering grinding wheels, specifically a silicon wafer chamfering grinding wheel. Background Technology

[0002] A silicon wafer chamfering grinding wheel is used to polish the chamfered edges of silicon wafers. Currently, 156,000 transistors can be integrated onto a silicon wafer the size of a grain of rice. What exquisite engineering! This is the result of collaborative efforts across multiple disciplines, another milestone in scientific and technological progress. Microelectronics technology is quietly entering aerospace, industry, agriculture, and defense, and is also quietly entering every household. The immense "magic" of the tiny silicon wafer is something our predecessors could never have imagined.

[0003] For example, the authorized patent with publication number CN209266428U (Polycrystalline Silicon Wafer Polishing Device): The polycrystalline silicon wafer polishing device includes a texturing device, a cleaning device, and a ventilation device, with the texturing device and the cleaning device connected together; the ventilation device includes a ventilation pipe, a ventilation pump, and a signal acquisition system; the ventilation pump and the signal acquisition system are installed in the ventilation pipe, and the exhaust end of the ventilation device is connected to the cleaning chamber of the cleaning device. This polycrystalline silicon wafer polishing device can promptly discharge and treat fluorides, thereby ensuring that the polycrystalline silicon wafer polishing process can be carried out accurately, safely, and environmentally friendly.

[0004] Currently, most grinding wheels are moved and controlled manually or by screw drive. Manual control is not only labor-intensive but also not stable or precise. Screw drive, while stable, has limitations, is inefficient, cumbersome, and takes up a lot of space. Utility Model Content

[0005] The purpose of this utility model is to provide a silicon wafer chamfering grinding wheel to solve the problems mentioned in the background art, which mostly use manual or screw drive to control the movement of grinding wheels. The manual control process is not only labor-intensive, but also not stable and precise enough. Although the screw drive control method is stable, the movement process has limitations, low efficiency, is cumbersome to use, and takes up a lot of operating space.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a silicon wafer chamfering grinding wheel, comprising an intelligent wheel, a hydraulic rod, a limiting plate, a guide rail plate, and a grinding wheel body. The limiting plate is provided with a hydraulic rod, the telescopic end of which is connected to a mounting bracket. The inner side of the mounting bracket is provided with a motor, the output shaft of which is connected to the grinding wheel body. Both sides of the limiting plate are provided with intelligent wheels via connecting rods.

[0007] In a further embodiment, the smart wheel has a wheel frame on its outer side and a smart drive module on its inner side.

[0008] In a further embodiment, a guide rail plate is also included, wherein a silicon wafer placement groove and a raceway are respectively provided at the top center and on both sides of the guide rail plate.

[0009] In a further embodiment, the smart wheel rolls on a track, and a silicon wafer is placed in the silicon wafer placement slot.

[0010] In a further embodiment, there are multiple silicon wafers, and the chamfered surfaces of the ports of the multiple silicon wafers are arranged facing upwards.

[0011] In a further embodiment, a protective cover is provided on the outer side of the grinding wheel body, and two hydraulic rods are provided, with the cylinder ends of the two hydraulic rods connected to the limiting plate.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. The utility model has a simple structural design. A hydraulic rod is provided on the top of the grinding wheel body, which can be adjusted in height to facilitate precise control of the grinding process. A limiting plate is provided on the outside of the hydraulic rod, and intelligent wheels are provided on both sides of the limiting plate through connecting rods. These wheels can easily drive the grinding wheel body to move automatically longitudinally. The running wheel control is relatively convenient, and the moving grinding efficiency is high.

[0014] 2. This utility model is equipped with a guide rail plate, and a silicon wafer placement groove is provided at the top center of the guide rail plate. The silicon wafer placement groove facilitates the placement of multiple silicon wafers. Furthermore, there are running tracks on both sides of the top of the guide rail plate, which facilitate movement control with the intelligent wheels. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a silicon wafer chamfering grinding wheel according to the present invention;

[0016] Figure 2 This is a schematic diagram of the grinding wheel mechanism of this utility model;

[0017] Figure 3 This is a top view of the guide rail plate of this utility model;

[0018] Figure 4 This is a structural schematic diagram of part A of this utility model.

[0019] In the diagram: 1. Wheel frame; 2. Intelligent wheel; 3. Hydraulic rod; 4. Limiting plate; 5. Guide rail plate; 6. Silicon wafer; 7. Silicon wafer placement slot; 8. Connecting rod; 9. Mounting hoop; 10. Motor; 11. Grinding wheel body; 12. Track. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Please see Figure 1-4 This utility model provides an embodiment of a silicon wafer chamfering grinding wheel, comprising a smart wheel 2, a hydraulic rod 3, a limiting plate 4, a guide rail plate 5, and a grinding wheel body 11. The limiting plate 4 is provided with a hydraulic rod 3, the telescopic end of which is connected to a mounting bracket 9. A motor 10 is provided on the inner side of the mounting bracket 9, and the output shaft of the motor 10 is connected to the grinding wheel body 11. Smart wheels 2 are provided on both sides of the limiting plate 4 via connecting rods 8. The limiting plate 4 facilitates the installation of the hydraulic rod 3, which is used to adjust the height of the grinding mechanism. The mounting bracket 9 facilitates the installation of the motor 10, which drives the grinding wheel body 11 to rotate. The smart wheels 2 can roll on the track 12.

[0022] The smart wheel 2 has a wheel frame 1 on its outer side and a smart drive module on its inner side. The wheel frame 1 facilitates the installation of the smart wheel 2 and can be intelligently and automatically controlled by the smart drive module. The smart wheel 2 rolls on the track 12 and a silicon wafer 6 is placed in the silicon wafer placement slot 7. There are multiple silicon wafers 6, and the chamfered surfaces of the ends of the multiple silicon wafers 6 are facing upwards. By placing multiple silicon wafers 6, the chamfering and grinding efficiency can be improved.

[0023] It also includes a guide rail plate 5, with a silicon wafer placement slot 7 and a raceway 12 respectively provided at the top center and on both sides of the guide rail plate 5. The silicon wafer placement slot 7 facilitates the placement of multiple silicon wafers 6.

[0024] The outer side of the grinding wheel body 11 is provided with a protective cover. There are two hydraulic rods 3, and the cylinder ends of the two hydraulic rods 3 are connected to the limiting plate 4. The protective cover can provide safety protection for the outer side of the grinding wheel body 11, and the two hydraulic rods 3 can facilitate the height adjustment of the mounting bracket 9.

[0025] Working principle: In use, the hydraulic rod 3 is placed on the limiting plate 4, and the grinding wheel body 11 is raised and lowered by the hydraulic rod 3. Multiple silicon wafers 6 are placed on the silicon wafer placement slot 7. The intelligent wheel 2 moves on the track 12, which drives the grinding wheel body 11 to move automatically longitudinally, so that it can move and grind the chamfer of multiple silicon wafers 6. The connecting rod 8 facilitates the connection between the limiting plate 4 and the wheel frame 1. The mounting bracket 9 facilitates the clamping and fixing of the motor 10. The protective cover can protect the grinding wheel body 11 during grinding.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A silicon wafer chamfering grinding wheel, comprising a smart wheel (2), a hydraulic rod (3), a limiting plate (4), a guide rail plate (5), and a grinding wheel body (11), characterized in that: The limiting plate (4) is provided with a hydraulic rod (3), the telescopic end of the hydraulic rod (3) is connected to the mounting bracket (9), the inner side of the mounting bracket (9) is provided with a motor (10), the output shaft of the motor (10) is connected to the grinding wheel body (11), and both sides of the limiting plate (4) are provided with intelligent wheels (2) through connecting rods (8).

2. The silicon wafer chamfering grinding wheel according to claim 1, characterized in that: The smart wheel (2) has a wheel frame (1) on its outer side and a smart drive module on its inner side.

3. The silicon wafer chamfering grinding wheel according to claim 1, characterized in that: It also includes a guide rail plate (5), which has a silicon wafer placement groove (7) and a raceway (12) at the top center and on both sides.

4. A silicon wafer chamfering grinding wheel according to claim 3, characterized in that: The smart wheel (2) rolls on the track (12), and the silicon wafer (6) is placed in the silicon wafer placement slot (7).

5. A silicon wafer chamfering grinding wheel according to claim 4, characterized in that: The silicon wafers (6) are provided in multiple ways, and the chamfered surfaces of the ports of the multiple silicon wafers (6) are arranged facing upwards.

6. A silicon wafer chamfering grinding wheel according to claim 1, characterized in that: The outer side of the grinding wheel body (11) is provided with a protective cover, and there are two hydraulic rods (3), and the cylinder ends of the two hydraulic rods (3) are connected to the limiting plate (4).

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