Heat pipe equipment with condensation section provided with micro-channel heat exchange structure
By incorporating a microchannel heat exchange structure into the heat pipe device, the problem of insufficient heat exchange efficiency in the condensation section is solved, achieving more efficient heat transfer and heat exchange effects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU FENGKAI ELECTRONIC TECH CO LTD
- Filing Date
- 2025-05-22
- Publication Date
- 2026-04-14
AI Technical Summary
The heat exchange efficiency of the condenser section of existing heat pipe equipment is insufficient.
A microchannel heat exchange structure is set in the condensation section, including several heat-releasing pipes. Each heat-releasing pipe is equipped with a microchannel, which extends along the transport direction of the heat-releasing pipe to increase the contact area, accelerate the condensation of steam into a liquid film, and shorten the phase change time and heat transfer path.
It significantly improves the heat exchange efficiency between the heat-exchange pipe and the working fluid, and reduces the temperature difference between the condensation section and the external cooling medium.
Smart Images
Figure CN224121785U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat pipe equipment technology, and in particular to a heat pipe equipment with a microchannel heat exchange structure in the condensation section. Background Technology
[0002] A heat pipe device is a device that utilizes heat pipe technology to achieve efficient heat transfer or dissipation. A heat pipe itself is a passive heat transfer element based on the principle of phase change heat transfer, capable of rapidly transferring large amounts of heat with minimal temperature difference. It is widely used in scenarios requiring efficient thermal management. Heat pipe devices are primarily used for heat dissipation in electronic devices, such as CPU / GPU coolers, laptops, and 5G base stations, to prevent performance degradation due to high temperatures. In the aerospace field, heat pipe devices can be used for temperature equalization in satellites and spacecraft (e.g., preventing overheating on the sun-facing side and undercooling on the shaded side). In the industrial and energy sectors, heat pipe devices can be used in waste heat recovery systems, nuclear reactor cooling, solar collectors, and lithium battery thermal management. In the building sector, heat pipe devices can be used as heat exchange components in ground source heat pumps and high-efficiency air conditioning systems.
[0003] Existing heat pipe systems typically consist of an evaporator section, a condenser section, and a reflux structure. For split-type heat pipe systems, the reflux structure uses riser and downcomer pipes to connect the condenser section (condenser) and the evaporator section (evaporator). The working liquid vapor is transported through the riser pipe to the higher-level condenser section, and the condensed working liquid is then transported through the downcomer pipe to the lower-level evaporator, thus achieving phase change circulation within the pipe. However, the heat exchange efficiency of the condenser section in these existing heat pipe systems is insufficient. Utility Model Content
[0004] Therefore, it is necessary to address the technical problem of insufficient heat exchange efficiency in the condenser section of existing heat pipe devices by providing a heat pipe device with a microchannel heat exchange structure in the condenser section.
[0005] A heat pipe device with a microchannel heat exchange structure in its condensing section includes a condensing section, a riser pipe, a downcomer pipe, and an evaporating section. The condensing section is located on the top side of the evaporating section, and the riser pipe and the downcomer pipe are both located between the condensing section and the evaporating section. The two ends of the riser pipe are respectively connected to the output end of the evaporating section and the input end of the condensing section; the two ends of the downcomer pipe are respectively connected to the output end of the condensing section and the input end of the evaporating section.
[0006] The condensation section includes several heat-releasing pipes. The input end of each heat-releasing pipe is connected to the riser pipe, and the output end of each heat-releasing pipe is connected to the downcomer pipe. Each heat-releasing pipe is equipped with a microchannel, which extends along the conveying direction of the heat-releasing pipe and is located inside the heat-releasing pipe.
[0007] In one embodiment, the microchannels described above are configured as a micro heat pipe array extending in parallel.
[0008] In one embodiment, the microchannels described above are configured as a micro heat pipe array with a circular cross-section.
[0009] In one embodiment, the microchannels described above are configured as a micro heat pipe array with a rectangular cross-section.
[0010] In one embodiment, the microchannels described above are configured as an array of micro heat pipes with a cross-section arranged in a regular polygon.
[0011] In one embodiment, the microchannel described above includes a plurality of micro heat pipes.
[0012] In one embodiment, the aforementioned micro heat pipes are configured as straight, parallel channels.
[0013] In one embodiment, the aforementioned micro heat pipes are configured as serpentine, curved channels.
[0014] In one embodiment, the aforementioned micro heat pipes are configured as a fractal tree structure to optimize fluid distribution.
[0015] In one embodiment, each of the micro heat pipes described above is configured as a fluid channel with a circular cross-section.
[0016] In one embodiment, each of the micro heat pipes described above is configured as a fluid channel with a rectangular cross-section.
[0017] In one embodiment, each of the micro heat pipes described above is configured as a fluid channel with a trapezoidal cross-section.
[0018] In one embodiment, each of the micro heat pipes described above is configured as a fluid channel with a V-shaped cross-section.
[0019] In one embodiment, the inner wall of the condensation section is provided with a hydrophilic coating, which is disposed on the inner wall surface of the condensation section facing the downcomer, relative to the microchannel.
[0020] In one embodiment, the inner wall of the condensation section is provided with a hydrophobic coating, which is applied to the inner wall surface of each micro heat pipe.
[0021] In one embodiment, the aforementioned condensation section further includes a frame and heat-dissipating fins. The heat-dissipating fins and heat-dissipating pipes are both installed inside the frame. Several heat-dissipating pipes are disposed through the heat-dissipating fins, and the input and output ends of each heat-dissipating pipe extend from the bottom wall of the frame to the outside of the frame. The input end of each heat-dissipating pipe is connected to a riser pipe, and the output end of each heat-dissipating pipe is connected to a downcomer pipe.
[0022] In one embodiment, the riser is provided with a liquid distribution pipe, which is located between the riser and the input end of the condensation section, and is connected to the input ends of the riser and several heat dissipation pipes respectively.
[0023] In one embodiment, the downcomer is provided with a liquid collecting pipe, which is located between the downcomer and the output end of the condensation section, and is connected to the output ends of the downcomer and several heat dissipation pipes respectively.
[0024] The aforementioned heat pipe device with a microchannel heat exchange structure in the condensing section allows the working fluid to absorb heat and evaporate into vapor in the evaporating section, which is then transported to the condensing section via a riser pipe. The working fluid as a whole releases heat and condenses in the condensing section, then flows back to the evaporating section via a downcomer pipe, thus completing the heat transfer between the condensing and evaporating sections. Specifically, the condensing section includes several heat-releasing pipes. The inlet end of each heat-releasing pipe is connected to the riser pipe, and the outlet end of each heat-releasing pipe is connected to the downcomer pipe, allowing the working fluid to circulate and release heat through these pipes. Each heat-releasing pipe is equipped with a microchannel that extends along the transport direction of the heat-releasing pipe and is located inside the pipe. This significantly increases the contact area between each heat-releasing pipe and the working fluid, accelerates vapor condensation into a liquid film, shortens the phase change time, shortens the heat transfer path, and reduces the temperature difference between the condensing section and the external cooling medium, thereby improving the heat exchange efficiency between the heat-releasing pipe and the working fluid. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of a heat pipe device with a microchannel heat exchange structure in the condensation section, as shown in one embodiment.
[0026] Figure 2 This is an exploded structural diagram of a heat pipe device with a microchannel heat exchange structure in the condensation section, as shown in one embodiment.
[0027] Figure 3 This is a schematic diagram of a heat pipe device with a microchannel heat exchange structure in the condensation section, as shown in one embodiment.
[0028] Figure 4 for Figure 3 A schematic cross-sectional view of part AA in the illustrated embodiment;
[0029] Figure 5 for Figure 4 An enlarged structural schematic diagram of part M in the illustrated embodiment;
[0030] Figure 6 This is a schematic diagram of the heat dissipation pipe in one embodiment;
[0031] Figure 7 This is a schematic diagram of the cross-sectional structure of a microchannel in one embodiment;
[0032] Figure 8 This is a schematic diagram of the cross-sectional structure of a microchannel in one embodiment;
[0033] Figure 9 This is a schematic diagram of the cross-sectional structure of a microchannel in one embodiment. Detailed Implementation
[0034] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.
[0035] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0037] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0038] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0039] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0040] Please see Figures 1 to 9 This invention discloses a heat pipe device 1 with a microchannel heat exchange structure in the condensing section. The heat pipe device 1 includes a condensing section 10, a riser pipe 20, a downcomer pipe 30, and an evaporation section (not shown). The condensing section 10 is located on the top side of the evaporation section, and the riser pipe 20 and downcomer pipe 30 are both located between the condensing section 10 and the evaporation section. The two ends of the riser pipe 20 are connected to the output end of the evaporation section and the input end of the condensing section 10, respectively; the two ends of the downcomer pipe 30 are connected to the output end of the condensing section 10 and the input end of the evaporation section, respectively. Based on this structure, the working fluid absorbs heat and evaporates in the evaporation section to form vapor, which is then transported to the condensing section 10 along the riser pipe 20. The entire working fluid releases heat and condenses in the condensing section 10, and flows back to the evaporation section along the downcomer pipe 30, thus completing the heat transfer between the condensing section 10 and the evaporation section. Specifically, the condensation section 10 includes several heat-releasing pipes 11. The input end of each heat-releasing pipe 11 is connected to the riser pipe 20, and the output end of each heat-releasing pipe 11 is connected to the downcomer pipe 30. Thus, the working fluid circulates and releases heat through the several heat-releasing pipes 11. Each heat-releasing pipe 11 is provided with a microchannel 111, which extends along the conveying direction of the heat-releasing pipe and is located inside the heat-releasing pipe 11. This significantly increases the contact area between each heat-releasing pipe 11 and the working fluid, accelerates the condensation of vapor into a liquid film, shortens the phase change time, and shortens the heat transfer path, reducing the temperature difference between the condensation section 10 and the external cooling medium, thereby improving the heat exchange efficiency between the heat-releasing pipe 11 and the working fluid. Furthermore, the microchannels 111 are configured as a parallel array of micro heat pipes a.
[0041] Furthermore, in one embodiment, the microchannel 111 is configured as an array of micro heat pipes a with a circular cross-section; in another embodiment, the microchannel 111 is configured as an array of micro heat pipes a with a rectangular cross-section; in yet another embodiment, the microchannel 111 is configured as an array of micro heat pipes a with a regular polygonal cross-section.
[0042] Furthermore, in one embodiment, the microchannel 111 includes a plurality of micro heat pipes a, which are configured as parallel straight-line extending channels to reduce manufacturing difficulty; in another embodiment, the plurality of micro heat pipes a are configured as serpentine curved channels to extend the flow path and enhance the turbulence of the working fluid; in yet another embodiment, the plurality of micro heat pipes a are configured as a fractal tree structure to optimize fluid distribution.
[0043] Furthermore, in one embodiment, each micro heat pipe a is configured as a fluid channel with a circular cross-section, reducing manufacturing difficulty; in another embodiment, each micro heat pipe a is configured as a fluid channel with a rectangular cross-section, which also reduces manufacturing difficulty and makes it easier to control the spacing between adjacent micro heat pipes a; in another embodiment, each micro heat pipe a is configured as a fluid channel with a trapezoidal cross-section to improve the anti-clogging ability of the micro heat pipe a; in yet another embodiment, each micro heat pipe a is configured as a fluid channel with a V-shaped cross-section to enhance the capillary capacity of the micro heat pipe a.
[0044] Furthermore, a hydrophilic coating (not shown) is provided on the inner wall of the condensing section 10. The hydrophilic coating is disposed on the inner wall surface of the condensing section 10 on the side facing the downcomer 30 relative to the microchannel 111. This helps to avoid accelerating the spread of the liquid film in the condensing section 10 after the main heat release process is completed through the microchannel 111.
[0045] Furthermore, a hydrophobic coating (not shown) is provided on the inner wall of the condensation section 10. The hydrophobic coating is provided on the inner wall surface of each micro heat pipe a, thereby reducing liquid film retention on the inner wall of the microchannel 111 and promoting vapor flow.
[0046] Furthermore, the condensation section 10 also includes a frame 40 and heat-dissipating fins 50. The heat-dissipating fins 50 and heat-dissipating pipes 11 are both installed inside the frame 40. Several heat-dissipating pipes 11 are installed through the heat-dissipating fins 50, and the input and output ends of each heat-dissipating pipe 11 extend from the bottom wall of the frame 40 to the outside of the frame 40. The input end of each heat-dissipating pipe 11 connects to the riser pipe 20, and the output end of each heat-dissipating pipe 11 connects to the downcomer pipe 30. Based on the above structure, the heat-dissipating fins 50 can further enhance the heat exchange between the heat-dissipating pipes 11 and the external cold source, accelerating the condensation of the working liquid.
[0047] Furthermore, the riser pipe 20 is provided with a liquid distribution pipe 21, which is located between the riser pipe 20 and the input end of the condensation section 10. The liquid distribution pipe 21 is connected to the input ends of the riser pipe 20 and several heat release pipes 11, thereby enabling the working fluid to be fed into several heat release pipes 11 as a whole.
[0048] Furthermore, the downcomer 30 is provided with a liquid collecting pipe 31, which is located between the downcomer 30 and the output end of the condensation section 10. The liquid collecting pipe 31 is connected to the output ends of the downcomer 30 and several heat-releasing pipes 11, thereby enabling the working fluid condensate to flow out of several heat-releasing pipes 11.
[0049] In summary, the heat pipe device with a microchannel heat exchange structure in the condensing section disclosed in this utility model allows the working fluid to absorb heat and evaporate into vapor in the evaporating section, which is then transported to the condensing section along the riser pipe. The entire working fluid releases heat and condenses in the condensing section, then flows back to the evaporating section along the downcomer pipe, thus completing the heat transfer between the condensing and evaporating sections. Specifically, the condensing section includes several heat-releasing pipes. The input end of each heat-releasing pipe is connected to the riser pipe, and the output end of each heat-releasing pipe is connected to the downcomer pipe, thereby allowing the working liquid to circulate and release heat through these pipes. Each heat-releasing pipe is equipped with a microchannel that extends along the transport direction of the heat-releasing pipe and is located inside the pipe. This significantly increases the contact area between each heat-releasing pipe and the working fluid, accelerates the condensation of vapor into a liquid film, shortens the phase change time, shortens the heat transfer path, and reduces the temperature difference between the condensing section and the external cooling medium, thereby improving the heat exchange efficiency between the heat-releasing pipe and the working fluid.
[0050] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0051] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A heat pipe device with a microchannel heat exchange structure in the condensation section, characterized in that, include: The system comprises a condensing section, a riser pipe, a downcomer pipe, and an evaporating section. The condensing section is located on top of the evaporating section, and both the riser pipe and the downcomer pipe are located between the condensing section and the evaporating section. The two ends of the riser pipe are connected to the output end of the evaporating section and the input end of the condensing section, respectively. The two ends of the downcomer pipe are connected to the output end of the condensing section and the input end of the evaporating section, respectively. The condensation section includes several heat-releasing pipes. The input end of each heat-releasing pipe is connected to the riser pipe, and the output end of each heat-releasing pipe is connected to the downcomer pipe. Each heat-releasing pipe is equipped with a microchannel, which extends along the conveying direction of the heat-releasing pipe and is located inside the heat-releasing pipe.
2. The heat pipe device with a microchannel heat exchange structure in the condensation section according to claim 1, characterized in that, The microchannels are configured as a parallel-extended array of micro heat pipes.
3. The heat pipe device with a microchannel heat exchange structure in the condensation section according to claim 2, characterized in that, Microchannels consist of several micro heat pipes.
4. The heat pipe device with a microchannel heat exchange structure in the condensation section according to claim 3, characterized in that, Several micro heat pipes are configured as straight, parallel channels.
5. The heat pipe device with a microchannel heat exchange structure in the condensation section according to claim 3, characterized in that, Several micro heat pipes are configured as serpentine curved channels.
6. The heat pipe device with a microchannel heat exchange structure in the condensation section according to claim 3, characterized in that, Several micro heat pipes are configured in a fractal tree structure.
7. The heat pipe device with a microchannel heat exchange structure in the condensation section according to claim 1, characterized in that, The inner wall of the condensing section is provided with a hydrophilic coating, which is located on the inner wall surface of the condensing section facing the downcomer, relative to the microchannel.
8. The heat pipe device with a microchannel heat exchange structure in the condensation section according to claim 3, characterized in that, The inner wall of the condensation section is provided with a hydrophobic coating, which is applied to the inner wall surface of each micro heat pipe.
9. The heat pipe device with a microchannel heat exchange structure in the condensation section according to claim 1, characterized in that, The riser pipe is equipped with a liquid distribution pipe, which is located between the riser pipe and the input end of the condensation section, and is connected to the input ends of the riser pipe and several heat dissipation pipes respectively.
10. The heat pipe device with a microchannel heat exchange structure in the condensation section according to claim 1, characterized in that, The downcomer is equipped with a liquid collecting pipe, which is located between the downcomer and the output end of the condensation section, and is connected to the output ends of the downcomer and several heat dissipation pipes.