Thermal simulation test auxiliary cooling device and thermal simulation device
By introducing a cooling chamber and liquid inlet/outlet interfaces into the thermal simulation test apparatus, the problem of insufficient cooling rate in dynamic CCT tests was solved, enabling rapid cooling and accurate measurement of high-temperature samples.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-08
- Publication Date
- 2026-04-14
AI Technical Summary
In existing technologies, dynamic CCT tests cannot achieve rapid cooling through blowing or spraying water, resulting in insufficient cooling rate and affecting the accuracy of metal phase transformation measurements.
A thermal simulation test auxiliary cooling device was designed, including a cooling chamber and a sample mounting section. The cooling medium is introduced into the container space and contacts the sample through the liquid inlet and outlet interface to improve the cooling rate and avoid the expansion data error caused by external water cooling or air cooling.
This effectively improves the cooling rate of high-temperature samples, reduces measurement errors caused by external cooling methods, and ensures the accuracy of metal phase transformation measurements.
Smart Images
Figure CN224122520U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of bar testing technology, and in particular to an auxiliary cooling device and a thermal simulation device for thermal simulation testing. Background Technology
[0002] For materials and thermal processing, physical simulation typically uses small-sized specimens and thermal simulation devices to reproduce the physical processes of heating and cooling during the preparation or thermal processing of materials.
[0003] Dynamic CCT testing requires measuring the phase transformation of the metal during the cooling process after deformation. Due to the use of contact strain gauges, cooling can only be achieved through conduction, not by blowing air or spraying water to cool the sample. To meet the need for rapid cooling, the sample has evolved from a small cylinder to a dumbbell-shaped reduced-diameter metal rod with a clamping end. When further increasing the cooling rate is required, it can only be achieved by improving the sample and developing an auxiliary cooling device for conduction cooling. Utility Model Content
[0004] This disclosure aims to address at least one of the technical problems existing in the prior art or related technologies.
[0005] Therefore, in a first aspect of this disclosure, an auxiliary cooling device for thermal simulation testing is provided, comprising a device body and a cooling chamber, wherein the cooling chamber is connected to the device body, the cooling chamber includes a chamber body and a sample mounting part, and the chamber body is provided with an accommodating space, wherein...
[0006] The sample mounting section is provided with a sample mounting port, through which the sample is introduced into the accommodating space; the chamber is provided with at least one liquid inlet / outlet interface, which is connected to the accommodating space.
[0007] In one feasible implementation, the chamber is threadedly connected to the sample mounting portion.
[0008] In one feasible implementation, a sealing element is provided on the side of the chamber connected to the sample mounting part, and the sealing element is used to seal the accommodating space after the sample is introduced into the accommodating space.
[0009] In one feasible implementation, the accommodating space includes a first accommodating part and a second accommodating part that are connected to each other. The diameter of the first accommodating part is smaller than that of the second accommodating part. The sample is installed in the second accommodating part, and the liquid inlet / outlet interface is connected to the first accommodating part.
[0010] In one feasible implementation, multiple liquid inlet / outlet ports are provided, and the multiple liquid inlet / outlet ports are spaced apart along the extension direction of the accommodating space.
[0011] In one feasible implementation, the liquid inlet / outlet interface includes a liquid inlet interface and a liquid outlet interface, the liquid inlet interface being connected to the side of the accommodating space away from the sample mounting part, and the liquid outlet interface being disposed on the side wall of the chamber.
[0012] In one feasible embodiment, the sample mounting part is configured as a polygonal cover, and the sample mounting opening is configured as a through hole opened on the polygonal cover.
[0013] In one feasible implementation, the device body is further provided with a clamping part, and the cross-section of the clamping part and the cabin body is T-shaped.
[0014] In one feasible implementation, the system further includes a heat exchange tube, which is partially or entirely disposed within the accommodating space, and the liquid inlet / outlet interface is connected to the accommodating space and / or the interior of the heat exchange tube.
[0015] A second aspect of this disclosure provides a thermal simulation apparatus, including the aforementioned thermal simulation test auxiliary cooling device.
[0016] Compared with the prior art, this disclosure has at least the following beneficial effects: The device body of this disclosure serves as the installation unit for each component. A cooling chamber is provided on the device body, and a accommodating space is provided inside the cooling chamber for accommodating the sample and the cooling medium. The sample is introduced into the accommodating space through the sample mounting port on the sample mounting part to fix the sample, while the cooling medium enters the accommodating space where the sample is mounted through the liquid inlet and outlet ports on the chamber. The contact between the cooling medium in the accommodating space and the sample can effectively improve the cooling rate of the high-temperature sample that needs to be measured on the surface, and effectively avoid the measurement error of the expansion data caused by external water cooling or air cooling. Attached Figure Description
[0017] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.
[0018] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of exemplary embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:
[0020] Figure 1 This is a front view structural diagram of the present disclosure;
[0021] Figure 2 This is a schematic diagram of the structure of the present disclosure and the sample assembly;
[0022] Figure 3 This is a schematic diagram of the structure of the heavy-duty fixture disclosed herein;
[0023] Figure 4 This is a schematic diagram of the structure of the device body and the cooling chamber disclosed herein;
[0024] Figure 5 This is a schematic diagram of the sample mounting section of this disclosure.
[0025] in, Figures 1 to 5 The correspondence between the reference numerals and component names in the attached drawings is as follows:
[0026] 100-sample;
[0027] 1-Purpose device body; 11-Clamping part; 2-Cooling chamber; 21-Chamber body; 22-Sample mounting part; 23-Accommodation space; 231-First accommodation part; 232-Second accommodation part; 24-Sample mounting port; 3-Liquid inlet / outlet interface; 4-Sealing element; 5-Heat exchange tube. Detailed Implementation
[0028] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.
[0029] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.
[0030] Currently, dynamic CCT testing requires measuring the phase transformation of metals during the cooling process after deformation. Due to the use of contact strain gauges, cooling can only be achieved through conduction, not by blowing air or spraying water to cool the sample. To address the need for rapid cooling, the sample has evolved from a small cylinder with a diameter of φ8*12mm to a dumbbell-shaped reduced-diameter metal rod with a clamping end. When further increasing the cooling rate is required, it can only be achieved by improving the sample and developing an auxiliary cooling device for conduction cooling.
[0031] Based on this, the present disclosure provides an auxiliary cooling device for thermal simulation testing. The device body serves as the mounting unit for each component. A cooling chamber is provided on the device body, and a accommodating space is provided inside the cooling chamber for accommodating the sample and the cooling medium. The sample is introduced into the accommodating space through the sample mounting port on the sample mounting part to fix the sample, while the cooling medium enters the accommodating space containing the sample through the liquid inlet and outlet ports on the chamber body. The contact between the cooling medium in the accommodating space and the sample can effectively improve the cooling rate of the high-temperature sample that requires surface measurement, and effectively avoid the measurement error of expansion data caused by external water cooling or air cooling.
[0032] The auxiliary cooling device for thermal simulation experiments will be described in detail below through specific embodiments:
[0033] Reference Figures 1 to 5 As shown, the first aspect of this disclosure provides an auxiliary cooling device for thermal simulation testing, including a device body 1 and a cooling chamber 2. The cooling chamber 2 is connected to the device body 1 and includes a chamber 21 and a sample mounting part 22. The chamber 21 has a receiving space 23, and the sample mounting part 22 has a sample mounting port 24. The sample 100 is introduced into the receiving space 23 through the sample mounting port 24. The chamber 21 has at least one liquid inlet / outlet port 3, which is connected to the receiving space 23. The sample 100 in this disclosure is exemplified by a dumbbell-shaped sample 100 with a reduced diameter and a hole drilled at the clamping end. The outer diameter of the clamping end is 10 mm, and the wall thickness is 1.5 mm.
[0034] The device body disclosed herein serves as the mounting unit for each component. A cooling chamber is provided on the device body, and a accommodating space is provided inside the cooling chamber for accommodating the sample and the cooling medium. The sample is introduced into the accommodating space through the sample mounting port on the sample mounting part to fix the sample, while the cooling medium enters the accommodating space containing the sample through the liquid inlet and outlet ports on the chamber body. The contact between the cooling medium in the accommodating space and the sample can effectively improve the cooling rate of the high-temperature sample that requires surface measurement, and effectively avoid the measurement error of expansion data caused by external water cooling or air cooling.
[0035] Specifically, the device body 1 and the cooling chamber 2 of this disclosure can be integrally formed or detachably formed. This disclosure specifically chooses an integrally formed design to facilitate the sealing of the accommodating space, and its material can be stainless steel or other metal materials. The sample mounting part 22 can be a cover, and its connection to the chamber body 21 can be a detachable connection such as a threaded connection or a snap-fit connection, or a fixed connection such as welding. This disclosure specifically chooses a threaded connection to facilitate the overall maintenance and repair of the device. It is understood that after the sample 100 enters the accommodating space 23 through the sample mounting part 22, it can be fixed. The fixing method can be that the accommodating space 23 has a snap-fit component adapted to the sample 100, such as a snap ring or a snap groove, or the part of the sample mounting part 22 that contacts the sample 100 can be provided with the aforementioned fixing mechanism. Furthermore, the cooling medium inside the accommodating space 23 will not flow out through the sample mounting port 24 of the sample mounting part 22, for example, by providing a sealing ring or other sealing component at the sample mounting port 24. In this embodiment, the inlet and outlet interfaces 3 are all drilled with a 3mm drill bit, and a metal pagoda is welded to the hole on the outer surface to connect to the external water passage.
[0036] Before conducting the hot compression test on the round bar specimen, the specimen mounting part 22 is fitted onto the clamping end of the specimen 100, and the specimen clamping end is inserted into the bottom of the chamber 21. The specimen is fastened onto the wedge clamp and placed into the wedge groove of the thermal simulation specimen chamber. The device body 1 is placed in the heavy-duty clamp recess. The thermal simulation equipment applies a certain pressure to completely press the side of the specimen clamping end into the bottom of the chamber 21. At this time, the specimen mounting part 22 is fixed to prevent the cooling medium from leaking out.
[0037] In some embodiments, the chamber 21 is threadedly connected to the sample mounting portion 22. In this embodiment, the external thread of the chamber 21 is a tapered 4-point tapered pipe thread to ensure the sealing of the chamber, and the internal thread of the sample mounting portion 22 is a 4-point cylindrical pipe thread. Further, the sample mounting portion 22 is configured as a polygonal cover to facilitate screwing into the chamber 21. The sample mounting opening 24 is a through hole formed in the polygonal cover. Specifically, the polygonal cover is a concave regular hexagonal prism internally threaded cover, with a sample mounting opening 24 at the center of the hexagon slightly larger than the outer diameter of the sample clamping end. Tightening the sample mounting portion 22 to the chamber 21 ensures that the cooling medium remains in contact with the sample 100 clamping end within the accommodating space 23 without flowing out of the heavy-duty fixture for dynamic thermal simulation.
[0038] In some embodiments, a sealing element 4 is provided on the side of the chamber 21 connected to the sample mounting part 22. The sealing element 4 is used to seal the accommodating space 23 after the sample is introduced into the accommodating space 23. In this embodiment, the sealing element 4 can be a sealing O-ring, and its specific material can be a high-temperature resistant fluororubber material to match the operating environment. Specifically, the chamber 21 is a hollow cylinder with external threads. The inside of the cylinder transitions from a necked slope to a step. The sealing element 4 is provided at the slope. The step forms two concentric circles with different diameters. The outer diameter is slightly larger than the outer diameter of the sample clamping end, and the difference between the inner and outer diameters is greater than the wall thickness of the hollow cylinder at the sample clamping end.
[0039] In some embodiments, the accommodating space 23 includes a first accommodating portion 231 and a second accommodating portion 232 that are connected to each other. The diameter of the first accommodating portion 231 is smaller than that of the second accommodating portion 232. The sample 100 is installed in the second accommodating portion 232, and the liquid inlet / outlet port 3 is connected to the first accommodating portion 231.
[0040] In this embodiment, such as Figure 2 As shown, the diameter of the first accommodating part 231 is smaller than that of the second accommodating part 232. The sample 100 is installed in the second accommodating part 232. The inlet / outlet interface 3 is connected to the first accommodating part 231. Specifically, during use, the cooling medium can first flow into the first accommodating part 231 and then gradually flow into the second accommodating part 232 to make uniform contact with the sample 100, avoiding the cooling medium directly hitting the sample 100 and thus achieving a better uniform cooling effect on the sample 100.
[0041] In some embodiments, multiple liquid inlet / outlet interfaces 3 are provided, and the multiple liquid inlet / outlet interfaces 3 are spaced apart along the extension direction of the accommodating space 23.
[0042] In this embodiment, multiple liquid inlet / outlet ports 3 are provided, and these ports 3 are spaced apart along the extension direction of the accommodating space 23. This facilitates cooling of the sample 100 at multiple segments and locations.
[0043] In some embodiments, the liquid inlet / outlet interface 3 includes a liquid inlet interface and a liquid outlet interface. The liquid inlet interface is connected to the side of the accommodating space 23 away from the sample mounting part 22, and the liquid outlet interface is disposed on the side wall of the chamber 21.
[0044] In this embodiment, the liquid inlet is connected to the side of the accommodating space 23 away from the sample mounting part 22, so as to realize that the cooling medium gradually cools the sample 100 from one end to the other end, thereby improving the cooling effect and cooling rate.
[0045] In some embodiments, the device body 1 is further provided with a clamping part 11, and the cross-section of the clamping part 11 and the cabin 21 is T-shaped.
[0046] In this embodiment, the cross-section of the clamping part 11 and the cabin 21 is set to T-shape, specifically a right-handed 90° tilted "T" shape, and the device body 1 is also provided with a clamping part 11 to facilitate placement into the heavy-duty clamping recess.
[0047] In some embodiments, the device further includes a heat exchange tube 5, which is partially or entirely disposed within the accommodating space 23, and the liquid inlet / outlet port 3 is in communication with the accommodating space 23 and / or the interior of the heat exchange tube 5.
[0048] In this embodiment, such as Figure 2 As shown, the heat exchange tube 5 is inserted to the bottom of the sample clamp, thereby enabling comprehensive cooling of the sample 100 inside the accommodating space 23 and increasing the cooling rate. One end of the heat exchange tube 5 is connected to the inlet / outlet interface 3 located in the accommodating space 23. The insertion hole of the heat exchange tube 5 can be drilled with a 4mm drill bit. Since the clamp is always at room temperature during the experiment, the conduit material can be metal or plastic. In embodiments with multiple inlet / outlet interfaces 3, one end of the heat exchange tube 5 is connected to one of the inlet / outlet interfaces 3 located inside the accommodating space 23, and the remaining inlet / outlet interfaces 3 are connected to the side wall of the heat exchange tube 5 via pipes, serving as expansion ports for the input or output of cooling medium.
[0049] A second aspect of this disclosure provides a thermal simulation apparatus, including the aforementioned thermal simulation test auxiliary cooling device.
[0050] In this disclosure, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise expressly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "link" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.
[0051] In the description of this disclosure, it should be understood that the terms "upper," "lower," "left," "right," "front," "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.
[0052] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0053] The above are merely preferred embodiments of this disclosure and are not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.
Claims
1. An auxiliary cooling device for thermal simulation experiments, characterized in that, The device includes a main body and a cooling chamber, the cooling chamber being connected to the main body. The cooling chamber includes a chamber body and a sample mounting section, and the chamber body contains an accommodating space. The sample mounting section is provided with a sample mounting port, through which the sample is introduced into the accommodating space; the chamber is provided with at least one liquid inlet / outlet interface, which is connected to the accommodating space.
2. The auxiliary cooling device for thermal simulation testing according to claim 1, characterized in that, The chamber is threadedly connected to the sample mounting part.
3. The auxiliary cooling device for thermal simulation testing according to claim 1, characterized in that, A sealing element is provided on the side of the chamber that connects to the sample mounting part. The sealing element is used to seal the accommodating space after the sample is introduced into the accommodating space.
4. The auxiliary cooling device for thermal simulation testing according to claim 1, characterized in that, The accommodating space includes a first accommodating part and a second accommodating part that are connected to each other. The diameter of the first accommodating part is smaller than that of the second accommodating part. The sample is installed in the second accommodating part, and the liquid inlet / outlet interface is connected to the first accommodating part.
5. The auxiliary cooling device for thermal simulation testing according to claim 1, characterized in that, The liquid inlet and outlet ports are provided in multiple ways, and the multiple liquid inlet and outlet ports are spaced apart along the extension direction of the accommodating space.
6. The auxiliary cooling device for thermal simulation testing according to claim 1, characterized in that, The liquid inlet and outlet interfaces include a liquid inlet interface and a liquid outlet interface. The liquid inlet interface is connected to the side of the accommodating space away from the sample mounting part, and the liquid outlet interface is disposed on the side wall of the chamber.
7. The auxiliary cooling device for thermal simulation testing according to claim 1, characterized in that, The sample mounting part is configured as a polygonal cover, and the sample mounting opening is configured as a through hole opened on the polygonal cover.
8. The auxiliary cooling device for thermal simulation testing according to claim 1, characterized in that, The device body is also provided with a clamping part, and the cross-section of the clamping part and the cabin body is T-shaped.
9. The auxiliary cooling device for thermal simulation testing according to claim 1, characterized in that, It also includes a heat exchange tube, which is partially or entirely disposed within the accommodating space, and the liquid inlet / outlet interface is connected to the accommodating space and / or the interior of the heat exchange tube.
10. A thermal simulation device, characterized in that, The thermal simulation test auxiliary cooling device includes any one of claims 1 to 9.