Water-cooling heat dissipation power supply module testing device

Abstract

The utility model relates to the technical field of automation equipment, and discloses a water-cooling heat dissipation power supply module testing device, which comprises a base, an upper cover and a water-cooling plate, wherein the upper cover is arranged on the base through a hinge mechanism in an overturning and covering manner; and the water cooling plate is arranged on one surface facing the base when the upper cover covers the base, and can be in contact with a to-be-tested power supply module when the upper cover covers the base so as to dissipate heat of the power supply module. According to the water-cooling heat dissipation power supply module testing device provided by the utility model, the water-cooling plate is arranged on the upper cover, so that when the upper cover covers the base, the water-cooling plate is in contact with the power supply module to be tested so as to dissipate heat of the power supply module in the testing process and ensure that the heat can be dissipated in time; the problem that the temperature of the power module is too high due to insufficient heat dissipation in the testing process can be effectively solved, and the accuracy of a testing result and the safety of testing operation are improved.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a water-cooled power module testing device. Background Technology

[0002] A power module is a power supply component that can be directly mounted on a printed circuit board. Its characteristic is that it can provide a stable and reliable power supply to application-specific integrated circuits, digital signal processors, microprocessors, memory devices, field-programmable gate arrays, and other various digital or analog loads.

[0003] Due to the numerous advantages inherent in modular structures, modular power supplies have been widely adopted and applied in many communication fields, such as switching equipment, access equipment, mobile communication systems, microwave communication systems, and optical transmission communication. At the same time, they have also demonstrated their unique value in high-tech fields such as automotive electronics and aerospace.

[0004] In the current technological context, when power module testing equipment is used to test power modules, the modules generate heat during operation, especially high-power modules. If heat dissipation is not timely during testing, the module temperature can easily rise sharply. Excessive temperature not only adversely affects the performance of the power module, thus reducing the accuracy of test results, but may also induce safety accidents such as fires, seriously threatening the safety of the testing operation.

[0005] Therefore, in view of the above-mentioned problems in the current technology, it is urgent to carry out necessary improvements and optimizations.

[0006] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0007] This invention provides a water-cooled power module testing device to solve the problems existing in the prior art.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] A water-cooled power module testing device, the device comprising a base, a top cover, and a water-cooling plate; wherein,

[0010] The upper cover is mounted on the base in a hinged manner;

[0011] The water-cooling plate is disposed on the side facing the base when the upper cover is closed on the base, and can contact the power module to be tested when the upper cover is closed on the base to dissipate heat from the power module.

[0012] Furthermore, in the power module testing device for cold heat dissipation, a heat-conducting layer is attached to the surface of the water-cooled plate that contacts the power module.

[0013] Furthermore, the power module testing device for cold heat dissipation also includes a main test board, a slave test board, spring pins, and a probe module.

[0014] The water-cooled plate is provided with a heat dissipation contact portion;

[0015] The test plate is disposed on the side of the water-cooled plate opposite to the top cover; the test plate is provided with a clearance opening for the heat dissipation contact part to extend out.

[0016] The spring pin is disposed on the test plate and can contact the power module to be tested when the upper cover is closed on the base to establish an electrical connection.

[0017] The probe module is mounted on the base; the probe module is provided with a receiving slot for placing the power module, and can contact the power module placed in the receiving slot to establish an electrical connection.

[0018] The main test board is disposed at the bottom of the base and is electrically connected to the probe module and the slave test board, respectively.

[0019] Furthermore, in the cold heat dissipation power module testing device, the probe module is detachably mounted on the base.

[0020] Furthermore, the power module testing device for cold heat dissipation also includes a spring floating mechanism;

[0021] The spring floating mechanism is disposed between the upper cover and the test plate.

[0022] Furthermore, in the power module testing device for cold heat dissipation, the spring floating mechanism includes a floating support base and a floating spring;

[0023] The floating support is disposed on the side facing the base when the upper cover is closed on the base;

[0024] A sliding groove is provided on the floating support base;

[0025] The floating spring is disposed in the chute, with one end abutting against the bottom of the chute and the other end abutting against the water-cooling plate.

[0026] Furthermore, in the power module testing device for cold heat dissipation, the upper cover includes a cover body, a rotating handle, and studs;

[0027] The cover is provided with threaded holes;

[0028] The stud passes through the threaded hole, and its upper end is fixedly connected to the rotating handle, while its lower end is connected to the spring floating mechanism.

[0029] By rotating the rotary handle, the stud can be moved up and down in the threaded hole, thereby driving the spring floating mechanism to move up and down.

[0030] Furthermore, in the power module testing device for cold heat dissipation, a guide pin is provided on the side of the upper cover facing the base when the upper cover is closed on the base;

[0031] The base is provided with a guide pin hole that can cooperate with the guide pin.

[0032] Furthermore, in the power module testing device for cold heat dissipation, the upper cover and the base are locked together by a fastening mechanism.

[0033] Furthermore, in the power module testing device for cold heat dissipation, the fastening mechanism includes a hook and a fastener;

[0034] The hook is provided on the upper cover;

[0035] The fastener is mounted on the base and can be adapted to engage with the hook.

[0036] Compared with the prior art, the present invention has the following beneficial effects:

[0037] This utility model provides a water-cooled power module testing device. By setting a water-cooling plate on the upper cover, the water-cooling plate can contact the power module under test when the upper cover is closed with the base, so as to dissipate heat from the power module during the test process and ensure that the heat can be dissipated in time. This can effectively solve the problem of excessive temperature caused by insufficient heat dissipation of the power module during the test, improve the accuracy of the test results and the safety of the test operation.

[0038] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is one of the (three-dimensional) structural schematic diagrams of a water-cooled power module testing device provided in this embodiment of the present invention;

[0041] Figure 2 This is the second (three-dimensional) structural schematic diagram of a water-cooled power module testing device provided in this embodiment of the present invention;

[0042] Figure 3 This is the third (three-dimensional) structural schematic diagram of a water-cooled power module testing device provided in this embodiment of the present invention;

[0043] Figure 4 This is a front view structural schematic diagram of a water-cooled power module testing device provided in an embodiment of this utility model;

[0044] Figure 5 This is a top view structural schematic diagram of a water-cooled power module testing device provided in an embodiment of this utility model;

[0045] Figure 6 This is a simplified (side view) structural diagram of a water-cooled power module testing device provided in this embodiment of the present invention;

[0046] Figure 7 This is a side sectional view of a water-cooled power module testing device provided in an embodiment of this utility model.

[0047] Figure 8 This is a schematic diagram of the structure of the water-cooled plate provided in an embodiment of this utility model.

[0048] Figure label:

[0049] 1. Base, 2. Top cover, 3. Water-cooled plate, 4. Thermal conductive layer, 5. Main test board, 6. Slave test board, 7. Spring pin, 8. Probe module, 9. Receiving groove, 10. Spring floating mechanism, 11. Floating support seat, 12. Floating spring, 13. Heat dissipation contact part, 14. Slide groove, 15. Guide pin, 16. Guide pin hole, 17. Hook, 18. Buckle, 19. Power module.

[0050] Cover 201, rotating handle 202, stud 203. Detailed Implementation

[0051] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0052] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0053] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0054] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0055] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0056] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0057] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0058] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0059] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0060] In view of the deficiencies in the existing technology, the applicant, based on years of practical experience and professional knowledge in this field, and in conjunction with theoretical application, has actively conducted research and innovation in order to create a technology that can solve the deficiencies in the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0061] Please refer to Figures 1-6 This utility model provides a water-cooled power module testing device, which includes a base 1, an upper cover 2 and a water-cooling plate 3.

[0062] Specifically, the upper cover 2, through a precisely designed hinge mechanism, can be flexibly and stably flipped and placed on the base 1. This design not only facilitates operation but also ensures the overall stability of the device.

[0063] Furthermore, when the top cover 2 is fully closed onto the base 1, the water-cooling plate 3 is cleverly positioned on the side of the top cover 2 facing the base 1. At this time, the water-cooling plate 3 can accurately make contact with the power module 19 under test, thereby achieving effective heat dissipation of the power module 19 during the test.

[0064] The innovation of this embodiment lies in the integration of a water-cooling plate 3 into the upper cover 2. When the device is in operation (i.e., when the upper cover 2 is closed on the base 1), the water-cooling plate 3 can immediately and tightly contact the power module 19 under test, quickly dissipating the heat generated during the test. This design not only ensures that the heat generated by the power module 19 during operation can be dissipated in a timely and effective manner, thereby effectively avoiding the problem of overheating due to insufficient heat dissipation, but also significantly improves the accuracy of the test results and the overall safety of the test operation.

[0065] In summary, the water-cooled power module testing device provided by this utility model is not only compact and easy to operate, but also has a significant heat dissipation effect, providing strong technical support and guarantee for the testing of the power module 19.

[0066] It should be noted that this testing device uses an external water circulation system to introduce coolant into the device, specifically into the water-cooled plate 3, utilizing heat exchange principles to quickly absorb the heat generated by the power module 19. Its core function is:

[0067] Dynamic temperature control: Real-time feedback from flow regulating valves and temperature sensors maintains the test environment within a preset temperature range (e.g., 25-40℃), preventing component performance drift or damage caused by high temperatures. Uniform heat dissipation: Water cooling piping design typically employs multi-channel diversion to ensure uniform temperature distribution on the surface of the water cooling plate, reducing the risk of localized overheating.

[0068] Please refer to this carefully again. Figure 2 To gain a deeper understanding of a specific implementation method in this embodiment. In this embodiment, a heat-conducting layer 4 is specially added to the surface of the water-cooled plate 3 that is in direct contact with the power module 19.

[0069] The introduction of this thermal conductive layer 4 aims to further optimize the water cooling effect. The thermal conductive layer 4 is typically made of materials with high thermal conductivity, such as thermally conductive silicone sheets or thermally conductive graphite sheets. These materials can efficiently and rapidly conduct the heat generated by the power module 19 during operation to the water-cooled plate 3. Through the bridging effect of the thermal conductive layer 4, not only is the efficiency of heat transfer from the power module 19 to the water-cooled plate 3 improved, but it also ensures that heat is distributed more evenly and quickly across the entire contact surface of the water-cooled plate 3, thereby greatly enhancing the uniformity and efficiency of heat dissipation.

[0070] Therefore, in this embodiment, by adding a heat-conducting layer 4 to the contact surface between the water-cooled plate 3 and the power module 19, the heat dissipation performance of the power module testing device is further improved, providing a more solid guarantee for the power module to maintain stable temperature and performance during the testing process.

[0071] Please refer to this carefully again. Figure 2 , Figure 6 and in conjunction with references Figure 8 This is to provide a comprehensive understanding of a specific and detailed implementation method in this embodiment. In this embodiment, the device not only includes the previously mentioned key components such as the base 1, the top cover 2, and the water-cooled plate 3, but also introduces additional components such as the main test board 5, the slave test board 6, the spring pin 7, and the probe module 8, to construct a power module testing device with more comprehensive functions and more powerful testing capabilities.

[0072] Specifically, the water-cooled plate 3 has a protruding heat dissipation contact portion 13 on the side that contacts the power module 19 under test. This design aims to enhance the heat exchange efficiency between the water-cooled plate 3 and the power module 19, ensuring that heat can be carried away more quickly and effectively. The thermally conductive layer 4 is disposed on the heat dissipation contact portion 13.

[0073] Meanwhile, the test board 6 is cleverly positioned on the side of the water-cooled plate 3 facing away from the top cover 2, and it has a clearance opening to allow the heat dissipation contact part 13 to extend smoothly and form a tight heat exchange contact with the power module 19. The test board 6 is also equipped with spring pins 7, which can automatically contact the power module 19 under test when the top cover 2 is closed with the base 1, quickly establishing a stable electrical connection and providing the necessary signal and data transmission channels for subsequent testing.

[0074] Furthermore, the probe module 8 is carefully positioned on the base 1, and its interior has a dedicated receiving slot 9 for placing the power module 19. When the power module 19 is correctly placed into the receiving slot 9, the probes on the probe module 8 automatically make contact with the corresponding contact points of the power module 19, achieving electrical connection. This design not only simplifies the preparation work before testing but also ensures the stability and reliability of the electrical connection during testing.

[0075] Finally, the main test board 5 is securely mounted at the bottom of the base 1 and electrically connected to the probe module 8 and the slave test board 6 via circuits and wires. The main test board 5 serves as the control and data processing center of the entire testing device, responsible for receiving test signals and data from the probe module 8 and the slave test board 6, performing corresponding processing and analysis, and ultimately obtaining the test results.

[0076] In summary, this embodiment, by introducing new components such as the main test board 5, the slave test board 6, the spring pin 7, and the probe module 8, and combining them with the heat dissipation contact part 13 of the water-cooled plate 3, constructs a powerful power module testing device with excellent testing capabilities, providing a more comprehensive, accurate, and reliable guarantee for the testing of power modules.

[0077] In a particularly flexible and practical embodiment of this invention, a detachable connection structure is specially designed between the probe module 8 and the base 1. This design allows the probe module 8 to be easily detached from the base 1 and easily replaced with a probe module adapted to new testing requirements when product switching or testing different types of power modules is needed.

[0078] Specifically, the connection between the probe module 8 and the base 1 may employ one or more combinations of various detachable connection methods, such as screw fixing, snap locking, or magnetic adsorption. These connection methods not only ensure the stability and reliability of the probe module 8 during testing but also provide it with flexibility and convenience during product switching.

[0079] This design allows users to quickly replace the appropriate probe module 8 according to actual testing needs and the type of power module 19 under test, greatly improving the versatility and adaptability of the testing device. At the same time, it saves users the cost and time of replacing the entire testing device, further enhancing the efficiency and economic benefits of testing work.

[0080] In summary, this embodiment provides users with a more flexible, convenient, and economical power module testing solution by designing a detachable connection structure between the probe module 8 and the base 1.

[0081] Please refer to this again. Figure 6 This allows for a more detailed understanding of the design and function of the spring floating mechanism 10 in this embodiment. Figure 6 In the illustrated embodiment, the spring-floating mechanism 10 is cleverly positioned between the upper cover 2 and the test plate 6. This design not only enhances the flexibility and adaptability of the entire testing device but also further improves the accuracy and stability of the test.

[0082] The main functions of the spring floating mechanism 10 include:

[0083] Floating Compensation: Due to various factors (such as manufacturing tolerances, assembly errors, or thermal expansion during testing), the contact surfaces between the test board 6 and the power supply module under test may not be perfectly flat or aligned. The spring floating mechanism 10 provides a small floating range to automatically compensate for these minor unevenness or misalignment, ensuring that the probes can stably and accurately contact the test points of the power supply module under test.

[0084] Pressure control: The spring-floating mechanism 10 can also apply appropriate pressure to the probe through its spring characteristics. This pressure control helps ensure good electrical contact between the probe and the test point, while avoiding excessive pressure that could damage the test point or wear the probe.

[0085] Shock absorption: During testing, the testing device may be subjected to impacts or vibrations due to various reasons (such as mechanical vibration, airflow disturbance, etc.). The spring floating mechanism 10 can act as an effective shock absorption layer, absorbing and dispersing these impacts and vibrations, thereby protecting the probe and the power supply module under test from damage.

[0086] In summary, by setting a spring floating mechanism 10 between the upper cover 2 and the test plate 6, the testing device of this embodiment not only improves the accuracy and stability of the test, but also enhances its flexibility and adaptability, enabling it to better cope with various testing needs and challenges.

[0087] Please refer to this again. Figure 6 and in conjunction with references Figure 7 In one embodiment of this example, a deeper understanding of the structure and working principle of the spring floating mechanism 10 is achieved.

[0088] In this specific embodiment, the spring floating mechanism 10 mainly consists of a floating support 11 and a floating spring 12. The floating support 11 is carefully designed and installed on the side of the upper cover 2 facing the base 1. When the upper cover 2 is closed onto the base 1, the floating support 11 is also positioned and ready to perform its supporting and floating functions.

[0089] A groove 14 is cleverly designed into the floating support 11. This groove not only provides space for the installation and movement of the floating spring 12, but also ensures that the floating spring 12 can freely extend and retract within a certain range. This design allows the floating spring 12 to flexibly respond to various minute displacements and deformations, thereby achieving floating support for the water-cooled plate 3 and the test plate 6.

[0090] One end of the floating spring 12 is in close contact with the bottom of the slide 14, while the other end is in contact with the water-cooled plate 3. When the test plate 6 is subjected to pressure or undergoes a slight displacement, the floating spring 12 can utilize its own elastic properties to provide floating support and cushioning for the water-cooled plate 3 and the test plate 6. This floating support not only helps maintain stable contact between the probe and the test point of the power module 19 under test, but also effectively reduces errors caused by mechanical vibration or impact.

[0091] It is worth noting that the water-cooled plate 3 not only serves a heat dissipation function but also acts as one of the support points for the floating spring 12, participating in the construction of the floating support system. This design not only improves the integration and compactness of the testing device but also further enhances its heat dissipation and floating support performance.

[0092] In summary, by cleverly combining the floating support 11, the floating spring 12, and the water-cooled plate 3, the spring floating mechanism 10 of this embodiment provides a highly efficient, stable, and flexible floating support system for the testing device. This system not only improves the accuracy and stability of the test but also provides strong support for coping with various complex testing environments.

[0093] Please refer to this again. Figures 1-7 In one embodiment of this example, the special design of the upper cover 2 is explained in detail, particularly how the position of the spring floating mechanism 10 is adjusted by rotating the handle 202 and the stud 203.

[0094] As an important component of the testing device, the upper cover 2 is not only responsible for sealing and protecting the testing area, but also achieves precise adjustment of the spring floating mechanism 10 through its ingenious design. The upper cover 2 mainly consists of three parts: the cover body 201, the rotating handle 202, and the stud 203.

[0095] The cover 201 is the main body of the upper cover 2. It is designed with threaded holes, which provide a basis for the installation and fixation of the studs 203. The design of the threaded holes allows the studs 203 to move up and down on the cover 201, which is the key to adjusting the position of the spring floating mechanism 10.

[0096] The rotating handle 202 is fixedly connected to the upper end of the stud 203, providing the user with an easy-to-operate handle. The user can simply rotate the rotating handle 202 to move the stud 203 up and down in the threaded hole of the cover 201 through the transmission principle of the thread.

[0097] The lower end of the stud 203 is connected to the spring floating mechanism 10. Thus, when the stud 203 moves up and down in the threaded hole, it drives the spring floating mechanism 10, the connected water-cooled plate 3, and the test plate 6 to move up and down together. This design allows users to precisely adjust the distance between the water-cooled plate 3, the test plate 6, and the power module 19 under test, according to actual needs, thereby ensuring that the probe can stably and accurately contact the test point.

[0098] Furthermore, this design, which adjusts the position of the spring floating mechanism 10 by rotating the handle 202 and the stud 203, also offers advantages such as ease of operation, precise adjustment, labor-saving operation, and compact structure. It not only improves the flexibility and adaptability of the testing device but also provides users with an intuitive and user-friendly operating interface.

[0099] Please refer to this again. Figures 2-3 In one embodiment of this example, the guiding and positioning mechanism between the upper cover 2 and the base 1 is further described.

[0100] In this specific embodiment, when the upper cover 2 is closed onto the base 1, guide pins 15 are specially provided on the side facing the base 1. These guide pins 15 not only guide and position the relative position between the upper cover 2 and the base 1, but also ensure that the upper cover 2 can smoothly and accurately engage with the base 1 during the closing process.

[0101] At the same time, guide pin holes 16 are also provided on the base 1. The shape, size and position of these guide pin holes 16 are matched with the guide pins 15, so that the guide pins 15 can be smoothly inserted into the guide pin holes 16, thereby achieving precise docking between the top cover 2 and the base 1.

[0102] The cooperation between the guide pin 15 and the guide pin hole 16 not only improves the assembly accuracy and stability between the upper cover 2 and the base 1, but also simplifies the assembly process and reduces assembly difficulty. At the same time, this design also helps reduce friction and wear that may occur between the upper cover 2 and the base 1 during the closing process, thereby extending the service life of the testing device.

[0103] Furthermore, the fit between the guide pin 15 and the guide pin hole 16 has a certain degree of tolerance. Even if there are minor assembly errors or deformations between the upper cover 2 and the base 1, the guide pin 15 can be adjusted and compensated for in the guide pin hole 16, thereby ensuring that the upper cover 2 can be smoothly and accurately fitted onto the base 1.

[0104] In summary, by setting a guide pin 15 and a guide pin hole 16 between the upper cover 2 and the base 1, the testing device of this embodiment not only improves the assembly accuracy and stability, but also simplifies the assembly process and reduces the assembly difficulty.

[0105] In this specific embodiment, the closure and fixation between the upper cover 2 and the base 1 are achieved through a fastening mechanism. This fastening mechanism is not only simple and efficient in design and easy to operate, ensuring the stability and reliability of the testing device during the testing process, but also has a moderate locking force, which ensures that the upper cover 2 will not be accidentally opened due to external factors during the testing process, and allows the upper cover 2 to be easily opened for maintenance and replacement of parts when needed.

[0106] Furthermore, the design of the locking mechanism should also take into account the need for easy disassembly and reuse. Therefore, even after multiple opening and closing operations, the locking mechanism can still maintain good working condition, providing users with a convenient and reliable testing device experience.

[0107] In summary, by employing a fastening mechanism to lock the upper cover 2 and the base 1, the testing device of this embodiment not only achieves tight closure and fixation, but also improves the convenience and reliability of operation.

[0108] Please refer to this again. Figures 1-5 Sections 7 and 8, in one embodiment of this example, describe in more detail the specific structure and working principle of the fastening mechanism in this example.

[0109] In this specific embodiment, the fastening mechanism mainly consists of two parts: a hook 17 and a fastener 18. The hook 17 is cleverly positioned on the upper cover 2, while the fastener 18 is correspondingly positioned on the base 1. The two are perfectly matched in design and position to ensure a tight fastening between the upper cover 2 and the base 1.

[0110] The hook 17 typically has a certain degree of elasticity and flexibility, which allows it to automatically find and engage with the buckle 18 when the top cover 2 is closed onto the base 1. Once the hook 17 and buckle 18 are successfully engaged, the top cover 2 is securely locked onto the base 1, forming a stable and reliable testing environment.

[0111] The design of the snap fastener 18 is equally ingenious; it typically has a hook groove or hook surface that matches the shape of the hook 17. This hook groove or hook surface not only ensures that the hook 17 can engage smoothly with it, but also provides sufficient locking force through its robust structure to prevent the cover 2 from accidentally opening during testing.

[0112] In summary, by employing a fastening mechanism composed of hook 17 and buckle 18, the testing device of this embodiment not only achieves tight fastening and stable locking between the upper cover 2 and the base 1, but also improves the convenience and reliability of the test.

[0113] Although this application frequently uses terms such as top cover, base, and water-cooled plate, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0114] This utility model provides a water-cooled power module testing device. By setting a water-cooling plate on the upper cover, the water-cooling plate can contact the power module under test when the upper cover is closed with the base, so as to dissipate heat from the power module during the test process and ensure that the heat can be dissipated in time. This can effectively solve the problem of excessive temperature caused by insufficient heat dissipation of the power module during the test, and improve the accuracy of the test results and the safety of the test operation.

[0115] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A water-cooled power module testing device, characterized in that, The device includes a base (1), a top cover (2), and a water-cooled plate (3); wherein, The upper cover (2) is mounted on the base (1) in a flip-close manner via a hinge mechanism; The water-cooled plate (3) is disposed on the side facing the base (1) when the upper cover (2) is closed on the base (1), and can contact the power module (19) to be tested when the upper cover (2) is closed on the base (1) to dissipate heat from the power module (19).

2. The water-cooled power module testing device according to claim 1, characterized in that, A heat-conducting layer (4) is attached to the surface of the water-cooled plate (3) that contacts the power module (19).

3. The water-cooled power module testing device according to claim 1, characterized in that, The device also includes a main test board (5), a slave test board (6), a spring pin (7), and a probe module (8); The water-cooled plate (3) is provided with a heat dissipation contact part (13); The test plate (6) is located on the side of the water-cooled plate (3) away from the top cover (2); the test plate (6) is provided with a clearance opening for the heat dissipation contact part (13) to extend out. The spring pin (7) is disposed on the test plate (6) and can contact the power module (19) to be tested when the upper cover (2) is closed on the base (1) to establish an electrical connection; The probe module (8) is disposed on the base (1); the probe module (8) is provided with a receiving slot (9) for placing the power module (19), and can contact the power module (19) placed in the receiving slot (9) to establish an electrical connection. The main test board (5) is located at the bottom of the base (1) and is electrically connected to the probe module (8) and the slave test board (6) respectively.

4. The water-cooled power module testing device according to claim 3, characterized in that, The probe module (8) is detachably mounted on the base (1).

5. The water-cooled power module testing device according to claim 3, characterized in that, The device also includes a spring floating mechanism (10). The spring floating mechanism (10) is disposed between the upper cover (2) and the test plate (6).

6. The water-cooled power module testing device according to claim 5, characterized in that, The spring floating mechanism (10) includes a floating support (11) and a floating spring (12). The floating support (11) is disposed on the side facing the base (1) when the upper cover (2) is closed on the base (1); A groove (14) is provided on the floating support (11); The floating spring (12) is disposed in the groove (14), with one end abutting against the bottom of the groove (14) and the other end abutting against the water-cooled plate (3).

7. The water-cooled power module testing device according to claim 5, characterized in that, The upper cover (2) includes a cover body (201), a rotating handle (202), and a stud (203); The cover (201) is provided with threaded holes; The stud (203) passes through the threaded hole, and its upper end is fixedly connected to the rotating handle (202), and its lower end is connected to the spring floating mechanism (10); By rotating the rotary handle (202), the stud (203) can be moved up and down in the threaded hole, thereby driving the spring floating mechanism (10) to move up and down.

8. The water-cooled power module testing device according to claim 1, characterized in that, When the upper cover (2) is closed onto the base (1), a guide pin (15) is provided on the side facing the base (1). The base (1) is provided with a guide pin hole (16) that can cooperate with the guide pin (15).

9. The water-cooled power module testing device according to claim 1, characterized in that, After the upper cover (2) is closed with the base (1), it is locked by a fastening mechanism.

10. The water-cooled power module testing device according to claim 9, characterized in that, The fastening mechanism includes a hook (17) and a fastener (18); The hook (17) is provided on the upper cover (2); The buckle (18) is disposed on the base (1) and can be adapted to engage with the hook (17).

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