Aluminum alloy radiator for electronic equipment

Abstract

The utility model discloses an aluminum alloy radiator for electronic equipment, and belongs to the technical field of radiators. Comprising a base, a heat absorption mechanism is arranged in the base, a heat dissipation mechanism is mounted on the upper surface of the base, and a mounting mechanism is arranged on the outer surface of the base. According to the aluminum alloy radiator for the electronic equipment, the clamping strips are clamped in the rubber base, so that each independent radiating fin can be detached, dust can be conveniently cleaned, meanwhile, the damaged radiating fins can be conveniently replaced, the radiating fins are uniformly arranged, certain gaps are reserved, and the air channels can prolong the staying time of air on the surfaces of the radiating fins, so that the radiating effect is improved, and the service life of the radiating fins is prolonged. Therefore, the heat dissipation effect is ensured, the heat exchange efficiency is enhanced, overheat protection is carried out on electronic elements such as a power supply of the electronic equipment, the internal temperature of the electronic equipment is reduced, element damage caused by overheat is avoided, the temperature of key components such as the power supply is effectively reduced, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to an aluminum alloy heat sink for electronic devices. Background Technology

[0002] A heat sink is a device used to dissipate heat from heat-generating electronic components in electrical appliances. It is typically made of aluminum alloy, brass, or bronze, and can be in the form of plates, sheets, or multiple fins. This allows the heat generated by the components to be more effectively conducted to the heat sink, and then dissipated into the surrounding air. However, because the heat sink fins are relatively thin, they can be damaged during movement. Furthermore, the numerous fins easily accumulate dust, which obstructs heat dissipation and results in less than ideal cooling performance. Therefore, we propose an aluminum alloy heat sink for electronic devices to address these problems. Utility Model Content

[0003] The purpose of this invention is to provide an aluminum alloy heat sink for electronic devices, which aims to solve the problems of existing heat sink fins being easily damaged and accumulating dust.

[0004] To solve the above-mentioned technical problems, this utility model provides an aluminum alloy heat sink for electronic devices, including a base, a heat absorption mechanism inside the base, a heat dissipation mechanism installed on the upper surface of the base, and an installation mechanism on the outer surface of the base.

[0005] The heat dissipation mechanism includes a slot on the upper surface of the base, a rubber seat is engaged inside the slot, the rubber seat is made of thermally conductive rubber material, a retaining strip is engaged inside the rubber seat, a heat dissipation fin is fixedly connected to the upper surface of the retaining strip, and air ducts are provided on both sides of the outer surface of the heat dissipation fin.

[0006] Preferably, a limiting plate is engaged at the edge of the upper surface of the base, and a first spring is fixedly connected to both sides inside the limiting plate. One end of the first spring is fixedly connected to a limiting post, and a limiting hole is opened on the outer surface of the base near the limiting post.

[0007] Preferably, the cross-sectional shape of the slot and the strip is trapezoidal, the number of slots is multiple, the multiple slots extend parallel to each other, and the multiple heat dissipation fins are connected to the rubber seat one by one by the strips.

[0008] Preferably, the base and heat dissipation fins are made of aluminum alloy.

[0009] Preferably, the heat absorption mechanism includes a first heat-conducting plate fixed to the bottom of the inner side of the base. The first heat-conducting plate is made of thermally conductive silicone grease. A second heat-conducting plate is fixedly connected to the inner side of the base near the first heat-conducting plate. The second heat-conducting plate is made of alumina ceramic material.

[0010] Preferably, the inner bottom wall of the card slot is provided with a heat-conducting groove, which penetrates the base.

[0011] Preferably, the mounting mechanism includes mounting holes at the four corners of the outer surface of the base.

[0012] Preferably, a second spring is fixedly connected to both sides of the inner wall of the base, a connecting plate is fixedly connected to one end of the second spring, a fixing seat is sleeved on the outer surface of the connecting plate, the fixing seat is fixedly connected to the electronic device, and a through groove is opened in the middle of the outer surface of the fixing seat.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. The clip of this utility model is attached to the inside of the rubber base, so that each individual heat dissipation fin can be removed, which is convenient for cleaning dust and replacing damaged heat dissipation fins. Multiple heat dissipation fins are evenly arranged and have a certain gap. The air duct can extend the time that air stays on the surface of the heat dissipation fins to ensure its heat dissipation effect, thereby increasing the heat dissipation capacity and enhancing the heat exchange efficiency. This provides overheat protection for electronic components such as power supplies of electronic devices, reduces the internal temperature of electronic devices, and avoids component damage caused by overheating. Thus, it effectively reduces the temperature of key components such as power supplies and improves the heat dissipation efficiency.

[0015] 2. The base and heat dissipation fins of this utility model are made of aluminum alloy, which can withstand certain mechanical stress and impact, protecting internal power supplies and other electronic components. At the same time, the aluminum alloy can also prevent electromagnetic interference and radiation, protecting the normal operation of electronic equipment. The first and second heat-conducting plates work together to better dissipate the heat generated by the operation of electronic equipment. Pressing the connecting plate and placing the base between the two sets of fixed seats, the connecting plate is inserted into the interior of the fixed seats under the action of the second spring, which improves the convenience of heat sink assembly and disassembly. It works in conjunction with the mounting holes, providing two installation methods and improving the applicability of the heat sink. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main structure of an aluminum alloy heat sink for electronic devices provided by this utility model;

[0017] Figure 2 This is a cross-sectional planar structural diagram of an aluminum alloy heat sink for electronic devices provided by this utility model;

[0018] Figure 3 This is a schematic diagram of the heat dissipation mechanism of an aluminum alloy heat sink for electronic devices provided by this utility model;

[0019] Figure 4 This is a schematic diagram of the heat dissipation fin structure of an aluminum alloy heat sink for electronic devices provided by this utility model;

[0020] Figure 5 This is a schematic diagram of the heat absorption mechanism of an aluminum alloy heat sink for electronic devices provided by this utility model;

[0021] Figure 6 This is a schematic diagram of the mounting mechanism for an aluminum alloy heat sink used in electronic devices, provided by this utility model.

[0022] In the diagram: 1. Base; 2. Heat absorption mechanism; 201. First heat-conducting plate; 202. Second heat-conducting plate; 203. Heat-conducting groove; 3. Heat dissipation mechanism; 301. Slot; 302. Rubber seat; 303. Locking strip; 304. Heat dissipation fins; 305. Air duct; 306. Limiting plate; 307. First spring; 308. Limiting post; 309. Limiting hole; 4. Mounting mechanism; 401. Mounting hole; 402. Second spring; 403. Connecting plate; 404. Fixing seat; 405. Through groove. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and claims. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0024] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0025] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example

[0026] This utility model provides an aluminum alloy heat sink for electronic devices. Please refer to [link / reference]. Figures 1-6 The system includes a base 1, an internal heat-absorbing mechanism 2, a heat-dissipating mechanism 3 mounted on the upper surface of the base 1, and an external mounting mechanism 4. The heat-dissipating mechanism 3 includes a slot 301 on the upper surface of the base 1, a rubber seat 302 made of thermally conductive rubber, a retaining strip 303, and heat dissipation fins 304 fixedly connected to the upper surface of the retaining strip 303. Air ducts 305 are provided on both sides of the outer surface of the heat dissipation fins 304. A limiting plate 306 is attached to the edge of the upper surface of the base 1, and first springs 307 are fixedly connected to both sides of the limiting plate 306. One end of each first spring 307 is fixedly connected to a limiting post 308, and a limiting hole 309 is provided on the outer surface of the base 1 near the limiting post 308.

[0027] Both the slot 301 and the strip 303 have trapezoidal cross-sectional shapes. There are multiple slots 301 that extend parallel to each other. Multiple heat dissipation fins 304 are connected to the rubber seat 302 one by one through the strip 303.

[0028] The base 1 and the heat dissipation fins 304 are made of aluminum alloy.

[0029] The heat absorption mechanism 2 includes a first heat-conducting plate 201 fixed to the bottom of the inner side of the base 1. The first heat-conducting plate 201 is made of thermally conductive silicone grease. A second heat-conducting plate 202 is fixedly connected to the inner side of the base 1 near the first heat-conducting plate 201. The second heat-conducting plate 202 is made of alumina ceramic material.

[0030] The inner bottom wall of the slot 301 is provided with a heat conduction groove 203, which penetrates the base 1.

[0031] The mounting mechanism 4 includes mounting holes 401 at the four corners of the outer surface of the base 1.

[0032] A second spring 402 is fixedly connected to both sides of the inner wall of the base 1. A connecting plate 403 is fixedly connected to one end of the second spring 402. A fixing seat 404 is sleeved on the outer surface of the connecting plate 403. The fixing seat 404 is fixedly connected to the electronic device. A through groove 405 is opened in the middle of the outer surface of the fixing seat 404.

[0033] It should be noted that the base 1 is installed at a designated location on the electronic device via the mounting mechanism 4. The heat absorption mechanism 2 absorbs and guides the heat generated by the operation of the electronic device, which is then dissipated through the heat dissipation mechanism 3. The rubber seat 302 is fixed inside the slot 301, and the clip 303 is snapped into the inside of the rubber seat 302, making it easier to install and remove the heat dissipation fins 304. Each individual heat dissipation fin 304 can be removed, making it convenient to clean dust and replace damaged heat dissipation fins 304. The rubber seat 302 is made of thermally conductive rubber material, which ensures thermal conductivity while strengthening the installation stability of the clip 303. Multiple heat dissipation fins 304 are evenly arranged with certain gaps, allowing the large amount of heat generated by the electronic device during operation to be quickly dissipated. The air duct 305 can prolong the time that air stays on the surface of the heat dissipation fins 304 to ensure its heat dissipation effect, thereby increasing the heat dissipation capacity and enhancing the heat exchange efficiency. This provides overheat protection for electronic components such as the power supply of the electronic device, reduces the internal temperature of the electronic device, and avoids component damage caused by overheating, thus effectively reducing the temperature of key components such as the power supply and improving the heat dissipation efficiency.

[0034] Preferably, after the heat dissipation fins 304 are installed, the limiting post 308 is pressed to retract into the inside of the limiting plate 306. Then, the limiting plate 306 is snapped onto the edge of the upper surface of the base 1. Under the action of the first spring 307, the limiting post 308 is snapped into the inside of the limiting hole 309, preventing the heat dissipation fins 304 from disengaging from the slot 301 and further enhancing the installation stability.

[0035] Preferably, the trapezoidal slot 301, rubber seat 302 and locking strip 303 interlock and fit together, making the heat dissipation fins 304 more securely installed and preventing them from wobbling up and down.

[0036] Preferably, the base 1 and the heat dissipation fins 304 are made of aluminum alloy. Aluminum alloy has high strength and good toughness, and can withstand certain mechanical stress and impact, protecting internal power supplies and other electronic components. At the same time, aluminum alloy can play a role in preventing electromagnetic interference and radiation, protecting the normal operation of electronic equipment. It can also quickly and evenly conduct heat to the entire heat dissipation surface to increase the heat radiation efficiency of the entire heat dissipation surface, thus achieving a rapid heat dissipation effect.

[0037] Preferably, the first heat-conducting plate 201 is made of thermally conductive silicone grease, which can guide the heat inside the electronic device while avoiding prolonged hard contact between the base 1 and the electronic device. The second heat-conducting plate 202 is made of alumina ceramic material, which has good thermal conductivity, weather resistance and heat dissipation, high temperature resistance, corrosion resistance and good insulation, and a long service life. The two are used together to enhance the heat absorption effect and can better dissipate the heat generated by the operation of the electronic device.

[0038] Preferably, the heat conduction groove 203 penetrates through the base 1 and communicates with the slot 301, so that the heat conducted by the first heat conduction plate 201 and the second heat conduction plate 202 can be better dissipated to the outside through the heat dissipation fins 304.

[0039] Preferably, four sets of mounting holes 401 are provided at the four corners of the outer surface of the base 1, which cooperate with the external bolts to fix the base 1 to the designated location of the electronic device.

[0040] Preferably, the mounting base 404 is fixed inside the electronic device, near the power supply. The connecting plate 403 is pressed down to retract into the base 1. Then, the base 1 is placed between the two sets of mounting bases 404. Under the action of the second spring 402, the connecting plate 403 is inserted into the interior of the mounting base 404, making the heat sink installation more convenient. The connecting plate 403 can be pressed down and retracted through the through slot 405, making the heat sink disassembly more convenient and improving the ease of disassembly and assembly. The two installation methods improve the applicability of the heat sink.

[0041] In summary, the base 1 is installed inside the electronic device via the mounting mechanism 4. The first heat-conducting plate 201 and the second heat-conducting plate 202 conduct the heat generated by the operation of the electronic device. The heat is then transferred to the heat dissipation mechanism 3 through the heat-conducting groove 203. Multiple heat dissipation fins 304 are evenly arranged with certain gaps. The air duct 305 can prolong the time that air stays on the surface of the heat dissipation fins 304, thereby increasing the heat dissipation capacity and providing overheat protection for electronic components such as the power supply of the electronic device. At the same time, the base 1 and the heat dissipation fins 304 are made of aluminum alloy, which can withstand certain mechanical stress and impact, providing physical protection for the internal electronic components such as the power supply of the electronic device. In addition, the aluminum alloy material can also play a role in preventing electromagnetic interference and radiation, protecting the normal operation of the electronic device.

[0042] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. An aluminum alloy heat sink for electronic devices, characterized in that, Includes a base (1), the base (1) is provided with a heat absorption mechanism (2) inside, a heat dissipation mechanism (3) is installed on the upper surface of the base (1), and an installation mechanism (4) is provided on the outer surface of the base (1). The heat dissipation mechanism (3) includes a slot (301) on the upper surface of the base (1). A rubber seat (302) is snapped into the inside of the slot (301). The rubber seat (302) is made of thermally conductive rubber material. A clip (303) is snapped into the inside of the rubber seat (302). A heat dissipation fin (304) is fixedly connected to the upper surface of the clip (303). Air ducts (305) are provided on both sides of the outer surface of the heat dissipation fin (304).

2. The aluminum alloy heat sink for electronic devices as described in claim 1, characterized in that, A limiting plate (306) is snapped onto the edge of the upper surface of the base (1). A first spring (307) is fixedly connected to both sides inside the limiting plate (306). A limiting post (308) is fixedly connected to one end of the first spring (307). A limiting hole (309) is opened on the outer surface of the base (1) near the limiting post (308).

3. The aluminum alloy heat sink for electronic devices as described in claim 1, characterized in that, The cross-sectional shape of the slot (301) and the strip (303) is trapezoidal. There are multiple slots (301), which extend parallel to each other. The multiple heat dissipation fins (304) are connected to the rubber seat (302) one by one through the strip (303).

4. An aluminum alloy heat sink for electronic devices as described in claim 1, characterized in that, The base (1) and heat dissipation fins (304) are made of aluminum alloy.

5. An aluminum alloy heat sink for electronic devices as described in claim 1, characterized in that, The heat absorption mechanism (2) includes a first heat-conducting plate (201) fixed to the bottom of the inner side of the base (1). The first heat-conducting plate (201) is made of thermally conductive silicone grease. A second heat-conducting plate (202) is fixedly connected to the inner side of the base (1) near the first heat-conducting plate (201). The second heat-conducting plate (202) is made of alumina ceramic material.

6. An aluminum alloy heat sink for electronic devices as described in claim 1, characterized in that, The inner bottom wall of the slot (301) is provided with a heat conduction groove (203), which penetrates the base (1).

7. An aluminum alloy heat sink for electronic devices as described in claim 1, characterized in that, The mounting mechanism (4) includes mounting holes (401) at the four corners of the outer surface of the base (1).

8. An aluminum alloy heat sink for electronic devices as described in claim 1, characterized in that, The base (1) has a second spring (402) fixedly connected to both sides of the inner wall. A connecting plate (403) is fixedly connected to one end of the second spring (402). A fixing seat (404) is sleeved on the outer surface of the connecting plate (403). The fixing seat (404) is fixedly connected to the electronic device. A through groove (405) is opened in the middle of the outer surface of the fixing seat (404).

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