LED module

Abstract

The utility model relates to the technical field of LEDs, in particular to an LED module, which comprises a first electric conductor, an LED wafer fixed on the first electric conductor, the LED wafer is electrically connected with a second electric conductor through a gold thread, a light-transmitting body fixed on the first electric conductor and the second electric conductor, and a fixing surface of the light-transmitting body is a fixing surface of the LED wafer on the first electric conductor. The substrate deviates from the fixed surface of the light-transmitting body and is fixed on the first electric conductor and the second electric conductor, a through opening is formed in the substrate, the substrate is divided into at least two independent substrate units by the through opening, and the substrate units are respectively fixed on the first electric conductor and the second electric conductor; according to the LED module, thermal stress generated in the reflow soldering or using process due to the difference of thermal expansion coefficients of different materials is reduced, the independent substrate units can stretch out and draw back relatively freely, stress concentration on an internal structure caused by inconsistent expansion or contraction is avoided, the problems of silver colloid layering, welding spot falling and the like are greatly reduced, and the service life of the LED module is prolonged. And the reliability of the LED module is improved.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to an LED module. Background Technology

[0002] In actual production, reflow soldering is a crucial step in achieving the electrical connection between Chip LEDs and external circuits. However, during reflow soldering, the LED components need to be heated to a high-temperature environment of 180℃-260℃. Due to the significant differences in the coefficients of thermal expansion among the epoxy resin colloid, BT resin (thermosetting resin) substrate, and copper wiring, considerable thermal stress is generated inside the LED component during rapid heating and cooling.

[0003] When the temperature of an LED component changes, the different materials expand or contract at different rates due to differences in their coefficients of thermal expansion. This leads to uneven stress on the silver paste layer. Under long-term, repeated thermal stress, the interfacial adhesion between the silver paste layer and the chip / substrate gradually decreases, eventually causing silver paste delamination. Silver paste delamination disrupts the electrical connection between the chip and the substrate, reduces heat conduction efficiency, and causes localized overheating of the chip, affecting the LED's luminous performance.

[0004] Meanwhile, thermal stress also affects solder joints. During repeated thermal cycles, the solder material fatigues due to thermal expansion and contraction, weakening the bond between the solder joint and the copper wiring, eventually leading to solder joint detachment. Once the solder joint detaches, the electrical connection between the LED and the external circuitry is interrupted, causing the LED to malfunction. Currently, the market urgently needs a new LED module design to effectively address the series of problems caused by thermal stress during the reflow soldering process of Chip LEDs, thereby improving LED performance and reliability. Utility Model Content

[0005] The purpose of this utility model is to provide an LED module that addresses the problem of fatigue caused by thermal expansion and contraction of solder joint materials, which weakens the bond between the solder joint and the copper circuit, leading to solder joint detachment. This improves the service life and stability of the LED module.

[0006] The technical problem solved by this utility model is addressed by the following technical solution: an LED module, comprising:

[0007] First conductor;

[0008] LED chips are fixed on the first conductor;

[0009] The second conductor is connected to the LED chip via a gold wire;

[0010] A light-transmitting body is fixed on the first conductor and the second conductor, and the fixing surface of the light-transmitting body is the fixing surface of the LED chip on the first conductor;

[0011] A substrate, which is fixed on the first conductor and the second conductor and arranged away from the fixing surface of the light-transmitting body;

[0012] The substrate has a through opening that divides it into at least two independent substrate units, which are respectively fixed to the first conductor and the second conductor.

[0013] This utility model also has the following technical features:

[0014] In one embodiment of the present invention, a first overlapping extension is provided at one end of the substrate unit located below the first conductor, and a second overlapping extension is provided at one end of the substrate located below the second conductor. The first overlapping extension is attached to the second overlapping extension, and the first overlapping extension and the second overlapping extension form the through opening with one end of their respective substrate units.

[0015] In one embodiment of the present invention, a first fitting strip is provided on the surface of the first conductor that is attached to the substrate unit, the first fitting strip being arranged along the width direction of the first conductor, and a second fitting strip is provided on the surface of the second conductor that is attached to the substrate unit, the second fitting strip being arranged parallel to the first fitting strip.

[0016] In one embodiment of this utility model, a slot is provided on the first conductor, and the LED chip is fixed in the slot.

[0017] In one embodiment of this utility model, a baffle is provided on the first conductor, and the LED chip is fixed to the side of the baffle.

[0018] In one embodiment of the present invention, a boss is provided on the first conductor, and a groove is provided on the boss, and the LED chip is fixed in the groove.

[0019] In one embodiment of this utility model, the slot opening surface is rectangular or circular.

[0020] In one embodiment of this utility model, the groove opening surface is rectangular or circular.

[0021] In one embodiment of this utility model, an extension tube is provided on the second conductor, and one end of the gold wire is welded and fixed inside the cavity of the extension tube.

[0022] In one embodiment of this utility model, the extension tube has an opening at its end, and the gold wire is located inside the opening.

[0023] Compared with existing technologies, the advantages of this invention are as follows: A through-hole is formed in the substrate, dividing it into at least two independent substrate units, each fixed to the first and second conductors respectively. This design effectively reduces thermal stress generated during reflow soldering or use due to differences in the thermal expansion coefficients of different materials. When the LED module experiences temperature changes, the independent substrate units can expand and contract relatively freely, avoiding stress concentration on the internal structure caused by inconsistent expansion or contraction of the substrate as a whole. This greatly reduces problems such as silver paste delamination, solder joint detachment, and open circuits, significantly improving the reliability and lifespan of the LED module.

[0024] Multiple independent substrate units increase the contact area with the external environment, opening up more pathways for heat transfer. The heat generated by the LED chip during operation can be quickly conducted to the substrate units through the first and second conductors and dissipated from the through-hole. Compared with the traditional monolithic substrate design, heat accumulation is effectively suppressed, ensuring that the LED chip operates within a suitable temperature range, which helps maintain the stability of its luminous performance and reduces light decay caused by overheating. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the LED module in one embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the structure of the LED module after it has been removed from the light-transmitting body in one embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the structure of the LED module after it has been removed from the light-transmitting body in another embodiment of the present invention;

[0028] Figure 4 This is a front view of the LED module after it has been removed from the light-transmitting body in one embodiment of the present invention;

[0029] Figure 5 This is a front view of the first conductor and the second conductor in one embodiment of the present invention;

[0030] Figure 6 This is a schematic diagram of the structure of the LED module after it has been removed from the light-transmitting body and the substrate in one embodiment of the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of the first conductor in one embodiment of the present invention;

[0032] Figure 8This is a schematic diagram of the structure of the first conductor in another embodiment of the present invention;

[0033] Figure 9 This is a schematic diagram of the structure of the first conductor in other embodiments of the present invention;

[0034] Figure 10 This is a front view of the first conductor in another embodiment of the present invention;

[0035] Figure 11 This is a schematic diagram of the structure of the second conductor in one embodiment of the present invention;

[0036] Explanation of icon numbers:

[0037] 10. First conductor; 11. Slot; 12. Boss; 121. Groove; 13. Stop bar; 14. First fitting bar;

[0038] 20. LED chips;

[0039] 30. Second conductor; 31. Extension tube; 311. Opening; 32. Second interlocking strip;

[0040] 40. Gold thread;

[0041] 50. Substrate; 501. First overlapping extension; 502. Second overlapping extension; 51. Through opening;

[0042] 60. Transparent body. Detailed Implementation

[0043] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0044] The illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0045] When the temperature of an LED component changes, the different materials expand or contract at different rates due to differences in their coefficients of thermal expansion. This results in uneven stress on the silver paste layer. Under long-term, repeated thermal stress, the interfacial adhesion between the silver paste layer and the chip and substrate gradually decreases, eventually leading to silver paste delamination. Silver paste delamination can damage the electrical connection between the chip and the substrate, reduce heat conduction efficiency, and cause localized overheating of the chip, affecting the light-emitting performance of the LED. To address this, an LED module is proposed, comprising: a first conductor 10; an LED chip 20 fixed to the first conductor 10; a second conductor 30, wherein the LED chip 20 is electrically connected to the second conductor 30 via gold wire 40; a light-transmitting body 60 fixed to the first conductor 10 and the second conductor 30, with the fixing surface of the light-transmitting body 60 being the fixing surface of the LED chip 20 on the first conductor 10; and a substrate 50, facing away from the fixing surface of the light-transmitting body 60, and fixed to the first conductor 10 and the second conductor 30; wherein the substrate 50 has a through-hole 51, which divides the substrate 50 into at least two independent substrate units, and the substrate units are respectively fixed to the first conductor 10 and the second conductor 30.

[0046] In one embodiment, see Figure 5 The first conductor 10 and the second conductor 30 are as shown in the figure, and copper is used as the conductive material.

[0047] In one embodiment, see Figure 1 The light-transmitting body 60 is made of epoxy resin, and the substrate 50 is made of BT resin. A through-hole 51 is opened on the substrate 50, so that the substrate 50 is divided into two independent units. After the light-transmitting body 60 and the substrate 50 are fixed on the first conductor 10 and the second conductor 30, due to the difference in thermal shrinkage between the light-transmitting body 60 and the substrate 50, the through-hole 51 allows the light-transmitting body 60 to expand freely under thermal expansion, avoiding stress concentration caused by inconsistent expansion or contraction of the substrate as a whole. This reduces the occurrence of problems such as silver paste delamination, solder joint detachment and open circuit on the LED chip 20, and significantly improves the reliability and service life of the LED module.

[0048] In one embodiment, see Figure 3 and Figure 4To achieve reliable support and installation between the two sets of substrate units, a first overlapping extension 501 is provided at one end of the substrate unit located below the first conductor 10, and a second overlapping extension 502 is provided at one end of the substrate unit located below the second conductor 30. The first overlapping extension 501 is attached to the second overlapping extension 502, and the first overlapping extension 501 and the second overlapping extension 502 form the through opening 51 with one end of their respective substrate units.

[0049] In some embodiments, a groove and a slider are provided between the two sets of substrate units. The groove and slider are arranged along the length direction of the substrate unit, and the two sets of substrate units can be matched by the groove and slider.

[0050] In some embodiments, the through opening 51 can be understood as the substrate 50 being two independent entities with a gap between them, and the end faces of the two independent entities being able to abut against each other, as long as the light-transmitting body 60 can expand freely under thermal expansion.

[0051] In one embodiment, see Figure 4 and Figure 5 To ensure the reliability of the connection between the first conductor 10 and the second conductor 30 and their respective substrate units, a first fitting strip 14 is provided on the surface of the first conductor 10 that is in contact with the substrate unit. The first fitting strip 14 is arranged along the width direction of the first conductor 10. A second fitting strip 32 is provided on the surface of the second conductor 30 that is in contact with the substrate unit. The second fitting strip 32 is arranged parallel to the first fitting strip 14.

[0052] In one embodiment, the cross-sections of the first mating strip 14 and the second mating strip 32 can be rectangular, triangular, semi-circular, or semi-circular, with a semi-circular shape being preferred, to ensure the reliability of the mating of the first conductor 10 and the second conductor 30 with their respective substrate units.

[0053] In one embodiment, see Figure 8 To ensure the reliability of the connection between the LED chip 20 and the first conductor 10, and to reduce the possibility of the LED chip 20 falling off as the light-transmitting body 60 expands due to heat, a slot 11 is provided on the first conductor 10, and the LED chip 20 is fixed in the slot 11.

[0054] In one embodiment, the slot opening of the card slot 11 is rectangular or circular, and the LED chip 20 is fixed in the slot opening of the card slot 11 by conductive silver paste. The depth of the card slot 11 should be controlled within 10% of the length of the LED chip 20 to avoid affecting the optical performance of the LED chip 20.

[0055] In another embodiment, see Figure 10 The first conductor 10 is provided with a baffle 13, and the LED chip 20 is fixed to the side of the baffle 13. The baffle 13 can be used to abut one side of the LED chip 20 and to reliably position the LED chip 20, thus avoiding poor electrical contact caused by the delamination of the silver paste on the LED chip 20.

[0056] In yet another embodiment, see [reference] Figure 7 To avoid affecting the optical performance of the LED chip 20, a boss 12 is provided on the first conductor 10, and a groove 121 is provided on the boss 12, and the LED chip 20 is fixed in the groove 121.

[0057] Similarly, the groove opening of the groove 121 is rectangular or circular, and the LED chip 20 is fixed in the groove opening of the groove 121 by conductive silver paste. The groove depth of the groove 121 should be controlled within 10% of the length of the LED chip 20 to avoid affecting the optical performance of the LED chip 20.

[0058] In another embodiment, see Figure 9 The first conductor 10 is used to fix the LED chip 20 in a flat position, and the LED chip 20 is fixed in the flat position of the first conductor 10 by conductive silver paste.

[0059] In one embodiment, see Figure 6 and Figure 11 In order to weld and fix the other end of the gold wire 40 to the second conductor 30, an extension tube 31 is provided on the second conductor 30, and one end of the gold wire 40 is welded and fixed in the cavity of the extension tube 31.

[0060] In one embodiment, see Figure 11 The extension tube 31 has an opening 311 at its end, and the gold wire 40 is located inside the opening 311.

[0061] The extension tube 31 provides a dedicated welding and fixing space for the gold wire 40. The tube cavity surrounds and constrains the end of the gold wire 40, significantly increasing the welding area compared to conventional planar welding. This effectively improves the stability of the connection, ensuring that the gold wire 40 and the second conductor 30 are not easily separated even under harsh environments such as complex vibrations and impacts, thus guaranteeing the reliability of the electrical connection. The opening 311 at the end of the extension tube 31 allows for precise positioning of the gold wire 40, reducing the operational difficulty during welding. This enables fast and accurate welding, significantly improving welding efficiency while reducing welding defects caused by positioning deviations.

[0062] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0063] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An LED module, characterized in that, include: First conductor (10); LED chip (20), the LED chip (20) is fixed on the first conductor (10); The second conductor (30) is electrically connected to the LED chip (20) via a gold wire (40); A light-transmitting body (60) is fixed on the first conductor (10) and the second conductor (30), and the fixing surface of the light-transmitting body (60) is the fixing surface of the LED chip (20) on the first conductor (10); A substrate (50) is fixed on the first conductor (10) and the second conductor (30) and is arranged away from the fixed surface of the light-transmitting body (60). The substrate (50) has a through opening (51) that divides the substrate (50) into at least two independent substrate units, and the substrate units are respectively fixed to the first conductor (10) and the second conductor (30).

2. The LED module according to claim 1, characterized in that: A first overlapping extension (501) is provided at one end of the substrate unit located below the first conductor (10), and a second overlapping extension (502) is provided at one end of the substrate unit located below the second conductor (30). The first overlapping extension (501) overlaps the second overlapping extension (502), and the first overlapping extension (501) and the second overlapping extension (502) form the through opening (51) with one end of their respective substrate units.

3. The LED module according to claim 1, characterized in that: A first fitting strip (14) is provided on the bonding surface between the first conductor (10) and the substrate unit. The first fitting strip (14) is arranged along the width direction of the first conductor (10). A second fitting strip (32) is provided on the bonding surface between the second conductor (30) and the substrate unit. The second fitting strip (32) is arranged parallel to the first fitting strip (14).

4. The LED module according to claim 1, characterized in that: The first conductor (10) is provided with a slot (11), and the LED chip (20) is fixed in the slot (11).

5. The LED module according to claim 1, characterized in that: A baffle (13) is provided on the first conductor (10), and the LED chip (20) is fixed to the side of the baffle (13).

6. The LED module according to claim 1, characterized in that: The first conductor (10) is provided with a boss (12), and the boss (12) is provided with a groove (121), and the LED chip (20) is fixed in the groove (121).

7. The LED module according to claim 4, characterized in that: The slot (11) has a rectangular or circular opening.

8. The LED module according to claim 6, characterized in that: The groove (121) has a rectangular or circular opening.

9. The LED module according to claim 1, characterized in that: An extension tube (31) is provided on the second conductor (30), and one end of the gold wire (40) is welded and fixed inside the cavity of the extension tube (31).

10. The LED module according to claim 9, characterized in that: The extension tube (31) has an opening (311) at its end, and the gold wire (40) is located inside the opening (311).

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