Combined high-density arrangement LED support

Abstract

The utility model discloses a combined type high-density arrangement LED support which is characterized by comprising a substrate and a plurality of LED paster supports. A plurality of clearance parts are arranged on the substrate; each receding part is connected with four LED patch supports, the multiple receding parts are connected through division bars, the middle division bar in the multiple division bars is a first division bar, the other division bars in the multiple division bars are second division bars, and the width of the first division bar is larger than that of the second division bars; each receding part is connected with four LED patch supports, higher LED chip density can be achieved in a compact arrangement mode, and therefore the utilization rate of the substrate is improved, and concentration of light sources is enhanced; compared with the prior art that the substrate is only provided with one receding part and one receding part is connected with the multiple LED patch supports, the multiple receding parts are arranged, each receding part is connected with the four LED patch supports, the strength is obviously higher, and next-step machining of the substrate is facilitated; in addition, the width of the first division bar is larger than that of the second division bar, so that the structural strength is improved again.

Description

Technical Field

[0001] This utility model belongs to the technical field of LED brackets, specifically a combined high-density LED bracket. Background Technology

[0002] LED brackets are structural components used to support and fix LED chips, and also serve multiple functions such as electrical connection, heat dissipation, and optical optimization. They are an important part of LED packaging and directly affect the performance, reliability, and application effect of LED devices.

[0003] like Figure 1 As shown, in the prior art, the LED bracket includes a substrate and multiple LED chip brackets A3. The substrate A1 is provided with multiple clearance portions A2. The clearance portions A2 are connected to the LED chip brackets A3 by connecting ribs. Each clearance portion A2 is connected to one LED chip bracket A3. There are spacers between the LED chip brackets A3. This type of LED bracket is prone to having too many spacers, which wastes substrate material.

[0004] like Figure 2 As shown, there is another type of LED bracket in the prior art that only includes one clearance part A2. This clearance part A2 includes N LED patch brackets A3, where N is greater than or equal to 10, such as embodiment 3 disclosed in patent document "CN215266347U, a high-density LED bracket". This will result in the substrate strength being too low, and it will be easily damaged in the subsequent injection molding process. Utility Model Content

[0005] The purpose of this invention is to provide a combined high-density LED bracket to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A combined high-density LED bracket includes a substrate and multiple LED patch brackets; multiple clearance portions are arranged on the substrate; each clearance portion is connected to 4 LED patch brackets, and the multiple clearance portions are connected by spacers, the middle spacer of the spacers is the first spacer, and the other spacers are the second spacers, the width of the first spacer is greater than that of the second spacers.

[0008] In a further technical solution, a positioning hole is provided on the first spacer.

[0009] In a further technical solution, a mounting hole 1 is provided at one end of the substrate, and a mounting hole 2 is provided at the other large end of the substrate.

[0010] In a further technical solution, the LED patch brackets are arranged in a linear array.

[0011] In a further technical solution, the length direction of the LED patch bracket is the same as the X-axis of the substrate.

[0012] In a further technical solution, the LED patch brackets are installed in the same direction.

[0013] In a further technical solution, a light guide component is disposed on the substrate, and the light guide component is embedded on the substrate.

[0014] The beneficial effects of this utility model are:

[0015] Compared to a substrate with only one LED chip support connected to each clearance section, this invention connects four LED chip supports to each clearance section. This allows for a higher LED chip density through a compact arrangement, thus improving substrate utilization. For example, assuming a substrate length of 60mm, connecting one LED chip section to each clearance section would only allow for 20 LED chips. The arrangement in this application allows for 32 LED chips, significantly improving the utilization of substrates of the same length, saving materials, and enhancing light concentration. Furthermore, compared to a substrate with only one clearance section connecting multiple LED chip supports, this invention features multiple clearance sections, each connecting four LED chip supports, resulting in significantly greater strength and facilitating further processing of the substrate. Additionally, the width of the first spacer being greater than the width of the second spacer further increases structural strength.

[0016] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0017] Figure 1 Background Art of this Utility Model Figure 1 .

[0018] Figure 2 Background Art of this Utility Model Figure 2 .

[0019] Figure 3 : Overall structural diagram of this utility model.

[0020] Figure 4 Partial structural diagram of this utility model.

[0021] Reference numerals: 1. Substrate; 2. LED patch bracket; 3. Clearance; 4. First spacer; 5. Second spacer; 6. Positioning hole; 7. Mounting hole one; 8. Mounting hole two; Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0023] Please refer to Figure 1-4 ;

[0024] like Figure 1 As shown, in the prior art, the LED bracket includes a substrate and multiple LED chip brackets A3. The substrate A1 is provided with multiple clearance portions A2. The clearance portions A2 are connected to the LED chip brackets A3 by connecting ribs. Each clearance portion A2 is connected to one LED chip bracket A3. There are spacers between the LED chip brackets A3. This type of LED bracket is prone to having too many spacers, which wastes substrate material.

[0025] like Figure 2 As shown, there is another type of LED bracket in the prior art that only includes one clearance part A2. This clearance part A2 includes N LED patch brackets A3, where N is greater than or equal to 10, such as embodiment 3 disclosed in patent document "CN215266347U, a high-density LED bracket". This will result in the substrate strength being too low, and it will be easily damaged in the subsequent injection molding process.

[0026] A combined high-density LED bracket includes a substrate 1 and multiple LED patch brackets 2; multiple clearance portions 3 are arranged on the substrate 1; each clearance portion 3 is connected to 4 LED patch brackets 2, and the multiple clearance portions 3 are connected by spacers in the middle, among which the middle spacer is the first spacer 4, and the other spacers are the second spacers 5, and the width of the first spacer 4 is greater than that of the second spacer 5.

[0027] Specifically, compared to each clearance section 3 connecting only one LED chip support 2, connecting four LED chip supports 2 to each clearance section 3 allows for a higher LED chip density through a compact arrangement, thereby improving the utilization rate of the substrate 1. Assuming the length of the substrate 1 is 60mm, Figure 1 The arrangement shown in the previous application, where each clearance portion 3 connects to one LED patch portion, allows only 20 LEDs to be arranged on the substrate 1. However, the arrangement in this application allows for 32 LEDs to be arranged on the substrate 1, significantly improving the utilization rate of substrates of the same length, saving materials, and enhancing the concentration of the light source. Compared to substrate 1 having only one clearance portion 3 with multiple LED patch supports 2 connected to it, this application has multiple clearance portions 3, each with four LED patch supports 2 connected, which significantly increases strength and facilitates further processing of the substrate 1. Furthermore, the width of the first spacer 4 being greater than the width of the second spacer 5 further increases the structural strength.

[0028] Furthermore, a positioning hole 6 is provided on the first spacer 4. The positioning hole 6 is rectangular, and its four corners are rounded. Specifically, the rounded corners of the rectangular positioning hole 6 effectively avoid structural damage caused by stress concentration at sharp right angles. Sharp right angles are prone to stress concentration under stress, which can lead to breakage or cracking of the substrate 1. Rounded corners can evenly distribute stress, enhancing the fatigue resistance of the overall structure. In addition, the rectangular positioning hole 6 provides clear directionality, ensuring that the LED patch bracket 2 will not rotate or shift during installation, thereby improving assembly accuracy.

[0029] Furthermore, one end of the substrate 1 is provided with a mounting hole 7, and the other end of the substrate 1 is provided with a mounting hole 8, and the number of mounting holes 8 is 2.

[0030] Specifically, when the operator is installing the substrate 1, on the one hand, the number of mounting holes 1 7 and 2 8 can be used to easily determine the orientation of the substrate 1. On the other hand, mounting hole 1 7 is located at one end and there is one of it, while mounting hole 2 8 is located at the other end and there are two of them. The combination of single holes and double holes can enhance the fixing effect.

[0031] In some embodiments, the LED patch holder 2 is arranged in a linear array, so that the LED light source can be evenly arranged on the substrate 1, avoiding the problem of concentrated or uneven light, and providing a more uniform lighting effect.

[0032] Furthermore, the length direction of the LED patch bracket 2 is the same as the X-axis of the substrate 1. Furthermore, the installation direction of the LED patch bracket 2 is the same. When all products are oriented in the same direction, the user does not need to perform reverse actions during the packaging process, which can provide great convenience to the user.

[0033] Example 2:

[0034] In this embodiment, a light guide component (not shown in the figure) is disposed on the substrate 1, and the light guide component is embedded on the substrate 1.

[0035] Specifically, embedding a light guide component on substrate 1 can significantly improve the transmission and distribution efficiency of light, reduce light scattering and loss, thereby providing a more uniform and softer lighting effect. More specifically, after the light guide component is embedded in substrate 1, its structure is more stable and can effectively protect the component from the influence of the external environment. In addition, the embedded light guide design can also simplify the optical design of the product, reduce the need for additional optical components, thereby reducing the overall material and manufacturing costs, while improving the aesthetics and integration of the product, and is widely applicable to high-performance and high-requirement lighting or display scenarios.

[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0037] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. A combined high-density LED arrangement bracket, characterized in that, It includes a substrate (1) and multiple LED chip brackets (2); multiple clearance portions (3) are arranged on the substrate (1); each clearance portion (3) is connected to 4 LED chip brackets (2), the multiple clearance portions (3) are connected by spacers, the middle spacer among the spacers is the first spacer (4), the other spacers among the spacers are the second spacers (5), and the width of the first spacer (4) is greater than that of the second spacer (5).

2. The combined high-density LED bracket according to claim 1, characterized in that, The first spacer (4) has a positioning hole (6).

3. The combined high-density LED bracket according to claim 1, characterized in that, One end of the substrate (1) is provided with a mounting hole 1 (7), and the other end of the substrate (1) is provided with a mounting hole 2 (8).

4. A combined high-density LED bracket according to claim 1, characterized in that, The LED patch brackets (2) are arranged in a linear array.

5. A combined high-density LED bracket according to claim 1, characterized in that, The length direction of the LED patch bracket (2) is the same as the X-axis of the substrate (1).

6. A combined high-density LED bracket according to claim 1, characterized in that, The LED patch brackets (2) are installed in the same direction.

7. A combined high-density LED bracket according to claim 1, characterized in that, A light guide component is disposed on the substrate (1), and the light guide component is embedded on the substrate (1).

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