Semiconductor refrigeration sensitive component welding device

Abstract

The utility model discloses a semiconductor refrigeration sensitive component welding device which comprises a refrigeration sheet, one end of the refrigeration sheet is movably connected with a pin wire, the lower portion of the refrigeration sheet is movably connected with a U-shaped plate, a bottom plate is arranged below the U-shaped plate, a fixing device is arranged on the side face of the U-shaped plate, and two first electric telescopic rods are symmetrically arranged below the fixing device. A cooling plate is arranged on the side, away from the fixing device, of the U-shaped plate, the lower end of one side of the cooling plate communicates with a connecting pipe, a water pump is arranged on the side face of the connecting pipe, a connecting block is arranged below the water pump, a water tank is arranged below the connecting block, and a conveying pipe communicates between the lower portion of the water pump and the water tank. A rotating column is arranged at the end, away from the U-shaped plate, of the first threaded column, and a limiting plate is movably connected to the end, away from the rotating column, of the first threaded column; when the cold sensitive component welding clamp is used, cold sensitive components with different sizes can be clamped and welded.

Description

Technical Field

[0001] This utility model belongs to the technical field of production equipment for cold-sensitive components, and in particular relates to a welding device for semiconductor cold-sensitive components. Background Technology

[0002] Semiconductor cooling sensitive components include temperature sensors, pressure sensors, humidity sensors, and cooling chips, among other parts. Welding equipment is required when manufacturing the cooling chips.

[0003] Traditional welding equipment struggles to precisely fit products of different sizes when fixing cooling chips and their pin connections, often resulting in unstable fixing. This leads to displacement of the cooling chip or pin connections during welding, severely impacting welding quality. Furthermore, the welded product needs to cool down before it can be easily removed for subsequent processing. Traditional welding equipment cannot cool the welded product in time, leaving the cooling chip at a high temperature for an extended period, hindering quick removal and reducing production efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor cooling sensitive component welding device to solve the problem of difficulty in accurately adapting to products of different sizes.

[0005] This utility model achieves the above-mentioned objective through the following technical solution: It includes a cooling chip, one end of which is movably connected to a pin wiring connection; a U-shaped plate is movably connected below the cooling chip; a base plate is provided below the U-shaped plate; a fixing device is provided on the side of the U-shaped plate; two first electric telescopic rods are symmetrically arranged below the fixing device; a cooling plate is provided on the side of the U-shaped plate away from the fixing device; a connecting pipe is connected to the lower end of one side of the cooling plate; a water pump is provided on the side of the connecting pipe; a connecting block is provided below the water pump; a water tank is provided below the connecting block; a transmission pipe connects the water pump and the water tank; and a U-shaped plate is positioned near the water tank. The system includes a threaded groove, with a first threaded post movably connected inside the groove. A rotating post is located at the end of the first threaded post away from the U-shaped plate. A limiting plate is movably connected at the end of the first threaded post away from the rotating post. Connecting plates are symmetrically arranged on both sides of the upper surface of the base plate away from the cooling plate. A fixing plate is located above the two connecting plates. Two second electric telescopic rods are symmetrically arranged below the fixing plates. A fixing block is located below each of the second electric telescopic rods. A soldering iron plate is located below the two fixing blocks. Several fixing posts are arranged at the end of the base plate away from the fixing device. A fan is located on the side of the fixing posts near the cooling plate.

[0006] Furthermore, a water inlet is provided on the top of the water tank, and a drain outlet is provided on the side of the water tank. When the water inlet and the drain outlet are not in use, they are sealed by movable plugs. A controller is provided on the side of the base plate away from the water tank. Two cylinders are symmetrically arranged below the cooling plate, and the cylinders are fixedly connected to the base plate.

[0007] Furthermore, the fixing device includes a first clamping plate, on both sides of the upper surface of the first clamping plate away from the U-shaped plate, there are second threaded posts, and the first clamping plate is movably connected to a second clamping plate of the same length. Both ends of the second clamping plate have through-holes, and nuts are movably connected above the through-holes, and springs are provided below the through-holes.

[0008] Furthermore, the second threaded post is movably connected to the circular groove and the inside of the spring, and the second threaded post is movably connected to the inside of the nut, and the two are of the same size and have the same thread. The spring is fixed between the first clamping plate and the second clamping plate.

[0009] Furthermore, the width of the second clamping plate is smaller than the width of the first clamping plate, the second clamping plate is located on the side of the soldering iron plate away from the cooling plate, and the first electric telescopic rod is fixed below the first clamping plate and is fixedly connected to the base plate.

[0010] Furthermore, the soldering iron plate is located above the pin wiring and the cooling chip that need to be soldered, the groove of the U-shaped plate is set above, and the limiting plate is movably connected to the upper surface inside the groove of the U-shaped plate, and the length of the limiting plate is the same as the width of the groove of the U-shaped plate.

[0011] Furthermore, the end of the first threaded post furthest from the rotating post is located inside the U-shaped plate groove, the water tank is fixedly connected to the base plate, the welding iron plate is equipped with a heating wire, and the fixing block is made of high-temperature resistant material.

[0012] Furthermore, the cooling plate includes a plate body, and a plurality of flat-topped conical ventilation openings are evenly arranged on the side of the plate body, and the ventilation openings are inclined.

[0013] Furthermore, the ventilation opening is higher on the side closer to the fan, the opening of the ventilation opening on the side closer to the fan is larger, the opening of the ventilation opening on the side farther from the fan is smaller, and the interior of the plate is hollow.

[0014] Furthermore, the soldering iron plate, the U-shaped plate, and the fixing device are all located between the two connecting plates.

[0015] Beneficial effects: This utility model is reasonably designed and has the following beneficial effects:

[0016] 1. This utility model uses a rotating column to screw the first threaded column into the threaded groove, which pushes the limiting plate and the other side of the U-shaped plate to form a limiting space. This can effectively fix the cooling sensitive components and prevent them from moving during welding. It allows cooling chips of different sizes to be arranged on the U-shaped plate and then limited, which facilitates subsequent welding operations.

[0017] 2. The first and second clamping plates of the fixing device, through the cooperation of the second threaded post, nut and spring, can fix the pins of different sizes to prevent displacement of the pins during the welding process and ensure the welding effect;

[0018] 3. After welding is completed, start the water pump to allow cold water to enter the cooling plate. At the same time, start the fan. Air enters the cooling plate through the vents. Because the vents of the cooling plate are set at an angle and are flat-topped cone-shaped, with the side closer to the fan being the highest point and having a larger opening, and the side farther from the fan having a smaller opening, this design allows the air to flow rapidly due to pressure as it passes from the large opening to the small opening. This allows the air, cooled by the cold water, to be quickly blown onto the surface of the welded cooling sensitive components and the welded area, cooling them down so that they can be quickly removed for subsequent work, improving work efficiency and protecting the cooling sensitive components. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the structure of this utility model from another perspective;

[0021] Figure 3 This is a right view of the present invention;

[0022] Figure 4 This is the front view of the present utility model;

[0023] Figure 5 This is a top view of the present invention;

[0024] Figure 6 This is a perspective view of the U-shaped plate of this utility model;

[0025] Figure 7 This is an exploded view of the fixing device of this utility model;

[0026] Figure 8 This is a right-side cross-sectional view of the cooling plate of this utility model.

[0027] In the diagram: 1-Base plate, 2-U-shaped plate, 3-Fixing device, 4-First electric telescopic rod, 5-Cooling plate, 6-Controller, 7-First threaded post, 8-Limiting plate, 9-Rotating post, 10-Threaded groove, 11-Connecting pipe, 12-Water pump, 13-Transmission pipe, 14-Connecting block, 15-Water tank, 16-Drain outlet, 17-Water inlet, 18-Fixing plate, 19-Connecting plate, 20-Second electric telescopic rod, 21-Fixing block, 22-Soldering iron plate, 23-Cooling element, 24-Pin wiring, 26-Fixing post, 27-Fan;

[0028] 31-First clamping plate, 32-Second threaded post, 33-Second clamping plate, 34-Round groove, 35-Nut, 36-Spring, 51-Plate body, 52-Ventilation opening. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0030] Combination Figures 1 to 8 The semiconductor cooling sensitive component welding device shown includes a cooling chip 23, one end of which is movably connected to a pin connector 24. A U-shaped plate 2 is movably connected below the cooling chip 23. A base plate 1 is located below the U-shaped plate 2. A fixing device 3 is located on the side of the U-shaped plate 2. Two first electric telescopic rods 4 are symmetrically arranged below the fixing device 3. A cooling plate 5 is located on the side of the U-shaped plate 2 away from the fixing device 3. A connecting pipe 11 is connected to the lower end of the side of the cooling plate 5. A water pump 12 is located on the side of the connecting pipe 11. A connecting block 14 is located below the water pump 12. A water tank 15 is located below the connecting block 14. A transmission pipe 13 connects the water pump 12 and the water tank 15. The bottom of the transmission pipe 13 is located at the lower end inside the water tank 15 for easy water pumping. A threaded groove 10 is located at one end of the U-shaped plate 2 near the water tank 15. A first threaded rod with matching threads is movably connected inside the threaded groove 10. The first threaded column 7 has a rotating column 9 at the end away from the U-shaped plate 2. The end of the first threaded column 7 away from the rotating column 9 is movably connected to a limiting plate 8. The upper surface of the base plate 1 has symmetrical connecting plates 19 on both sides at the end away from the cooling plate 5. A fixing plate 18 is provided above the two connecting plates 19. Two second electric telescopic rods 20 are symmetrically provided below the fixing plate 18. A fixing block 21 is provided below each of the second electric telescopic rods 20. A soldering iron plate 22 is provided below the two fixing blocks 21. Several fixing columns 26 are arranged at the end of the base plate 1 away from the fixing device 3. A fan 27 is provided on the side of the fixing column 26 near the cooling plate 5. The water pump, soldering iron plate, electric telescopic rod, and controller in this utility model are existing technologies and are not described in detail. The control connection method of the water pump, soldering iron plate, electric telescopic rod, and controller in this utility model is existing technology and is not described in detail.

[0031] The water tank 15 has a water inlet 17 on top and a drain outlet 16 on the side. When not in use, the water inlet 17 and the drain outlet 16 are sealed by a movable plug. The bottom plate 1 has a controller 6 on the side away from the water tank 15. Two cylinders 28 are symmetrically arranged below the cooling plate 5 and are fixedly connected to the bottom plate 1. The water tank 15 contains cold water, which can be replaced through the drain outlet and the water inlet when the water temperature rises.

[0032] The fixing device 3 includes a first clamping plate 31. The upper surface of the first clamping plate 31 is provided with second threaded posts 32 on both sides of the end away from the U-shaped plate 2. The first clamping plate 31 is movably connected with a second clamping plate 33 of the same length. Both ends of the second clamping plate 33 are provided with circular grooves 34. Nuts 35 are movably connected above the circular grooves 34. Springs 36 are provided below the circular grooves 34.

[0033] The second threaded post 32 is movably connected to the inside of the circular groove 34 and the spring 36. The second threaded post 32 is movably connected to the inside of the nut 35, and the two are of the same size and have matching threads. The spring 36 is fixed between the first clamping plate 31 and the second clamping plate 33. The pin wiring is movably connected between the first clamping plate 31 and the second clamping plate 33.

[0034] The width of the second clamping plate 33 is smaller than that of the first clamping plate 31. The second clamping plate 33 is located on the side of the soldering iron plate 22 away from the cooling plate 5. The first electric telescopic rod 4 is fixed below the first clamping plate 31 and is fixedly connected to the base plate 1.

[0035] The soldering iron plate 22 is located above the pin connection 24 and the cooling chip 23 that need to be soldered. The groove of the U-shaped plate 2 is set above it. The limiting plate 8 is movably connected to the upper surface inside the groove of the U-shaped plate 2, and the length of the limiting plate 8 is the same as the width of the groove of the U-shaped plate 2.

[0036] The first threaded post 7 is located inside the U-shaped plate 2 groove at the end away from the rotating post 9. The water tank 15 is fixedly connected to the base plate 1. The welding soldering iron plate 22 is equipped with an electric heating wire. The fixing block 21 is made of high temperature resistant material. The cooling plate 23 is movably connected to the upper surface of the U-shaped plate 2 groove.

[0037] The cooling plate 5 includes a plate body 51. Several flat-topped conical vents 52 are evenly arranged on the side of the plate body 51. The vents 52 are inclined. The inclined vents allow air to flow towards the inclined position, that is, towards the cooling sensitive components, which facilitates cooling after welding.

[0038] The vent 52 is higher on the side closest to the fan 27. The round opening of the vent 52 on the side closest to the fan 27 is larger, and the round opening of the vent 52 on the side furthest from the fan 27 is smaller. The interior of the plate 51 is hollow. The flat-topped conical vent allows the air outside to flow quickly due to pressure as it passes from the large opening to the small opening. This allows the air to pass through the cold water inside the plate and be cooled down before being quickly blown onto the surface of the soldered cooling sensitive components, thus cooling the soldering position and the body itself.

[0039] The soldering iron plate 22, the U-shaped plate 2, and the fixing device 3 are all located between the two connecting plates 19.

[0040] Working Principle: In use, this invention first adjusts the position of the limiting plate 8 according to the size of the cooling-sensitive component. The cooling-sensitive component to be soldered is then placed inside the groove of the U-shaped plate, arranged sequentially so that one end of the lead wire to be soldered is below the soldering iron plate 22. Then, the first threaded post 7 is screwed into the threaded groove 10 by rotating the column 9. Continue screwing until the first threaded post 7 moves to the side of the limiting plate 8, placing the limiting plate 8 on the side of the cooling-sensitive component. This creates a limiting space between the limiting plate 8 and the other side of the U-shaped plate, preventing the cooling-sensitive component from moving within this space, facilitating subsequent soldering. The lead wire 24 to be soldered is then placed above the first clamping plate 31. Finally, the controller controls the first electric telescopic rod 4 to... Move the first clamping plate 31 to a suitable height so that the pin connection 24 is moved to the side of the cooling sensitive component that needs to be soldered. Then rotate the nut 35 to cooperate with the second threaded post 32 so that the second clamping plate 33 moves to the upper surface of the pin connection 24 and fixes it. This allows the two clamping plates to fix the pin connection 24 of different sizes, preventing displacement during the soldering process and affecting the soldering effect. Then, start the second electric telescopic rod 20 to lower the soldering iron plate 22 to a suitable position for heating and soldering. After the soldering is completed, start the water pump 12 to allow cold water to enter the cooling plate through the connecting pipe 11 and the transmission pipe 13. Then, start the fan 27 to allow air to enter the ventilation port 52. After cooling, the air flows quickly to the soldering point and surface of the cooling sensitive component to cool it down. After cooling, remove the cooling sensitive component.

[0041] This invention is not limited to the details of the exemplary embodiments described above, and can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0042] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor cooling sensitive component welding apparatus, comprising a cooling chip (23), one end of which is movably connected to a lead wire (24), characterized in that: A U-shaped plate (2) is movably connected below the cooling chip (23). A base plate (1) is provided below the U-shaped plate (2). A fixing device (3) is provided on the side of the U-shaped plate (2). Two first electric telescopic rods (4) are symmetrically provided below the fixing device (3). A cooling plate (5) is provided on the side of the U-shaped plate (2) away from the fixing device (3). A connecting pipe (11) is connected to the lower end of the side of the cooling plate (5). A water pump (12) is provided on the side of the connecting pipe (11). A connecting block (14) is provided below the water pump (12). A water tank (15) is provided below the connecting block (14). A transmission pipe (13) is connected between the water pump (12) and the water tank (15). A threaded groove (10) is provided at one end of the U-shaped plate (2) near the water tank (15). A threaded groove (10) is movably connected inside the threaded groove (10). The first threaded post (7) is matched with the first threaded post (7). The first threaded post (7) is provided with a rotating post (9) at the end away from the U-shaped plate (2). The first threaded post (7) is movably connected to a limiting plate (8) at the end away from the rotating post (9). The upper surface of the base plate (1) is provided with connecting plates (19) on both sides at the end away from the cooling plate (5). The two connecting plates (19) are provided with a fixing plate (18) above them. The fixing plate (18) is provided with two second electric telescopic rods (20) symmetrically below it. The second electric telescopic rods (20) are provided with fixing blocks (21) below them. The two fixing blocks (21) are provided with soldering iron plates (22) below them. The base plate (1) is provided with several fixing posts (26) at the end away from the fixing device (3). The fixing posts (26) are provided with a fan (27) on the side near the cooling plate (5).

2. The semiconductor refrigeration sensitive component welding device according to claim 1, characterized in that: The water tank (15) is provided with a water inlet (17) on the top and a drain outlet (16) on the side of the water tank (15). When the water inlet (17) and the drain outlet (16) are not in use, they are sealed by a movable plug. The bottom plate (1) is provided with a controller (6) on the side away from the water tank (15). Two cylinders (28) are symmetrically provided below the cooling plate (5). The cylinders (28) are fixedly connected to the bottom plate (1).

3. The semiconductor refrigeration sensitive component welding device according to claim 1, characterized in that: The fixing device (3) includes a first clamping plate (31). The upper surface of the first clamping plate (31) is provided with second threaded posts (32) on both sides of the end away from the U-shaped plate (2). The first clamping plate (31) is movably connected with a second clamping plate (33) of the same length. The two ends of the second clamping plate (33) are provided with circular grooves (34). Nuts (35) are movably connected above the circular grooves (34). Springs (36) are provided below the circular grooves (34).

4. The semiconductor refrigeration sensitive component welding device according to claim 3, characterized in that: The second threaded post (32) is movably connected to the inside of the circular groove (34) and the spring (36). The second threaded post (32) is movably connected to the inside of the nut (35) and the two are of the same size and have the same thread. The spring (36) is fixed between the first clamping plate (31) and the second clamping plate (33).

5. The semiconductor device bonding apparatus according to claim 3, wherein: The width of the second clamping plate (33) is smaller than that of the first clamping plate (31). The second clamping plate (33) is located on the side of the soldering iron plate (22) away from the cooling plate (5). The first electric telescopic rod (4) is fixed below the first clamping plate (31) and the first electric telescopic rod (4) is fixedly connected to the base plate (1).

6. The semiconductor device bonding apparatus of claim 1, wherein: The soldering iron plate (22) is located above the pin wiring (24) and the cooling chip (23) that need to be soldered. The groove of the U-shaped plate (2) is set above it. The limiting plate (8) is movably connected to the upper surface inside the groove of the U-shaped plate (2) and the length of the limiting plate (8) is the same as the width of the groove of the U-shaped plate (2).

7. The semiconductor device bonding apparatus of claim 1, wherein: The first threaded column (7) is located at the end away from the rotating column (9) inside the U-shaped plate (2) groove. The water tank (15) is fixedly connected to the base plate (1). The welding soldering iron plate (22) is equipped with a heating wire inside. The fixing block (21) is made of high temperature resistant material.

8. The semiconductor device bonding apparatus of claim 1, wherein: The cooling plate (5) includes a plate body (51), and a number of flat-topped conical vents (52) are evenly arranged on the side of the plate body (51). The vents (52) are inclined.

9. The semiconductor device bonding apparatus of claim 8, wherein: The ventilation opening (52) is higher on the side closer to the fan (27). The opening of the ventilation opening (52) is larger on the side closer to the fan (27), and smaller on the side farther away from the fan (27). The interior of the plate (51) is hollow.

10. The semiconductor device bonding apparatus of claim 8, wherein: The soldering iron plate (22), the U-shaped plate (2) and the fixing device (3) are all located between the two connecting plates (19).

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