Coated glass conducting layer low-melting-point coating busbar and coated glass

Abstract

According to the coated glass conductive layer low-melting-point coating busbar and the coated glass provided by the utility model, the low-melting-point coating busbars which are directly adhered through the middle conductive adhesive are designed at the two ends of the coated glass conductive layer, so that the coated glass can be correspondingly heated, and when another glass is clamped, the coated glass can be vacuumized and then enters a high-pressure kettle to be subjected to heat preservation at 120-140 DEG C; the low-melting-point coating on the surface of the busbar is fully melted and is completely, automatically and tightly welded with the coated glass conductive layer in contact with the low-melting-point coating; or when corresponding to the display glass, when the power supply is switched on for the first time, because the contact local resistance of the busbar and the conductive layer of the coated glass is relatively large, the local sparking condition occurs, so that the coating on the surface of the busbar stably exceeds the melting point of the busbar, the automatic welding is realized, and the stable and reliable electrical connection effect can be completely achieved after the first time of power-on is completed. The design is simple in operation, more reliable, lower in cost and suitable for direct electrical connection of the conducting layer of the I TO coated glass with large-scale automatic production requirements.

Description

Technical Field

[0001] This utility model relates to the field of coated glass technology, and in particular to a low-melting-point coating busbar for conductive layer of coated glass and coated glass. Background Technology

[0002] The existing automotive coated glass structure generally has a conductive silver paste layer about 10mm wide printed on the conductive coating layer at both ends of the coated glass as a bus. The silver paste bus is tightly bonded to the conductive coating layer of the glass to achieve an electrical connection. Then, another layer of tin-plated copper foil bus with conductive adhesive is pasted on the surface of the silver paste bus. The power is connected through the lead wire of the tin-plated copper foil bus.

[0003] The conductive silver paste used is difficult to print on curved surfaces of automotive windshields. In addition, it requires a power supply to be connected through a tin-plated copper foil busbar with conductive adhesive attached to the top layer. The reliability of the electrical connection is generally difficult to guarantee. This process is costly, inefficient, and has poor reliability and durability. Currently, it is only used in a small number of high-end automotive glass manufacturers in high-end models, which greatly limits the practical application of automotive coated electric heated windshields and has been difficult to promote and use for many years. Utility Model Content

[0004] In view of this, the present invention provides a low-melting-point coated busbar for conductive layer of coated glass and coated glass, and designs a low-melting-point coated busbar to solve the existing technical problems.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A low-melting-point coating busbar for a coated glass conductive layer includes a coated glass conductive layer and low-melting-point coating busbars disposed at both ends of the coated glass conductive layer. The low-melting-point coating busbars include a copper foil substrate layer, a thin low-melting-point coating coated on the upper side of the copper foil substrate layer, a thick low-melting-point coating coated on the lower side of the copper foil substrate layer, and a conductive tape disposed at the center of the thick low-melting-point coating. The width of the conductive tape is smaller than the width of the low-melting-point coating busbars. The low-melting-point coating busbars are adhered to both ends of the coated glass conductive layer with the conductive tape attached to one side.

[0007] Furthermore, the thin low-melting-point coating is made of the same material as the thick low-melting-point coating, with a melting point of 100℃-135℃.

[0008] Furthermore, the copper foil substrate layer has a thickness of 0.04-0.1 mm and a width of 6-20 mm, the thin low-melting-point coating has a thickness of 1-3 μm, the thick low-melting-point coating has a thickness of 10-20 μm, the conductive tape has a width of 2-3 mm, and the conductive tape has a thickness of 0.01-0.02 mm.

[0009] Furthermore, it also includes a conductive tape covering and sealing the upper side of the low-melting-point coating busbar, wherein the width of the conductive tape is greater than the width of the low-melting-point coating busbar, and the conductive tape completely covers and seals the low-melting-point coating busbar after being installed.

[0010] Furthermore, the width of the conductive tape covering the surface is at least 2 mm wider than the width of the low-melting-point coating busbar.

[0011] In addition, a coated glass is provided, comprising a low-melting-point coating busbar of the coated glass conductive layer as described in any of the above claims, wherein a PVB layer is disposed on the upper side of the low-melting-point coating busbar of the coated glass conductive layer and a glass layer is disposed on the upper side of the PVB layer.

[0012] The beneficial effects of this utility model are as follows:

[0013] This invention features low-melting-point coated busbars at both ends of the conductive layer of coated glass, directly bonded with a central conductive adhesive. For heated coated glass, after vacuuming when clamping other glass, it is placed in an autoclave at 120℃-140℃. During this process, the 100℃-135℃ low-melting-point coating on the busbar surface fully melts and automatically and tightly welds to the conductive layer of the coated glass in contact, resulting in excellent electrical contact. Alternatively, when dealing with display glass, at lower currents (less than 30A), upon initial power-on, the high local resistance between the busbar and the conductive layer of the coated glass causes localized "arcing," which stabilizes the busbar surface coating above its melting point of 100℃-135℃, achieving automatic welding. After the initial power-on, a stable and reliable electrical connection is achieved. This design is simple to operate, more reliable, and lower in cost, making it suitable for direct electrical connections of the conductive layer of ITO coated glass required for large-scale automated production.

[0014] In addition, when the current is large (greater than 30A) when the corresponding display glass is used, a conductive tape is also provided on the low melting point coating bus to ensure that the low melting point coating, which melts rapidly when the local current is too large for a short time, will not overflow the copper bus coverage area. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the cross-section of the low-melting-point coating busbar of the conductive layer of the coated glass in this utility model;

[0016] Figure 2This is a schematic diagram of the cross-section of the coated glass in this utility model.

[0017] The annotations in the attached figures are explained as follows:

[0018] 10. Coated glass conductive layer, 20. Low melting point coated busbar, 21. Copper foil substrate layer, 22. Thin low melting point coating, 23. Thick low melting point coating, 24. Conductive tape, 30. Covering conductive tape, 40. PVB layer, 50. Detailed Implementation

[0019] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0020] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. This disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0021] To facilitate operation and meet the requirements of large-scale automated production, the specific details of this utility model are as follows.

[0022] Combination Figure 1 As shown, an embodiment of this utility model is a low-melting-point coating busbar for a coated glass conductive layer, including a coated glass conductive layer 10. Importantly, it also includes low-melting-point coating busbars 20 disposed at both ends of the coated glass conductive layer 10. The low-melting-point coating busbar 20 includes a copper foil substrate layer 21, a thin low-melting-point coating 22 coated on the upper side of the copper foil substrate layer 21, a thick low-melting-point coating 23 coated on the lower side of the copper foil substrate layer 21, and a conductive tape 24 disposed at the center of the thick low-melting-point coating 23. The width of the conductive tape 24 is smaller than the width of the low-melting-point coating busbar 20. The low-melting-point coating busbar 20 is attached to both ends of the coated glass conductive layer 10 with the side containing the conductive tape 24.

[0023] The thin low-melting-point coating 22 and the thick low-melting-point coating 23 are made of the same material and are coated on both sides of the copper foil substrate layer 21. The melting point is 100℃-135℃. They are generally low-melting-point tin-bismuth alloy coatings or similar alloy coatings.

[0024] More specifically, the copper foil substrate layer 21 has a thickness of 0.04-0.1 mm and a width of 6-20 mm, the thin low-melting-point coating 22 has a thickness of 1-3 μm, the thick low-melting-point coating 23 has a thickness of 10-20 μm, the conductive tape 24 has a width of 2-3 mm and a thickness of 0.01-0.02 mm.

[0025] The main feature of this invention is that low-melting-point coated busbars 20 are designed at both ends of the conductive layer 10 of the coated glass, directly bonded by a central conductive adhesive 24. For heated coated glass, after vacuuming when clamping other glass, it can be placed in an autoclave at 120℃-140℃. During this process, the 100℃-135℃ low-melting-point coating on the busbar surface fully melts and automatically and tightly welds to the conductive layer 10 of the coated glass in contact, resulting in excellent electrical contact. Alternatively, when dealing with display glass, if the current is low (less than 30A), upon initial power-on, the local resistance between the busbar and the conductive layer of the coated glass is relatively high, causing localized "arcing." This allows the coating on the busbar surface to stabilize above its melting point of 100℃-135℃, achieving automatic welding. After the initial power-on, a stable and reliable electrical connection is achieved. This design is simple to operate, more reliable, and lower in cost, making it suitable for direct electrical connection of the conductive layer 20 of ITO coated glass required for large-scale automated production.

[0026] Furthermore, in some embodiments, such as Figure 1 As shown, to prevent the low-melting-point coating from melting too quickly and overflowing the copper busbar coverage area due to excessive current, a conductive adhesive tape 30 is also included, which is applied to the upper side of the low-melting-point coating busbar 20 for sealing. The width of the conductive adhesive tape 30 is greater than the width of the low-melting-point coating busbar 20, and the conductive adhesive tape 30 completely covers and seals the low-melting-point coating busbar 20 after application. More specifically, the width of the conductive adhesive tape 30 is at least 2 mm greater than the width of the low-melting-point coating busbar 20. When the current is high (greater than 30A) when corresponding to display glass, the conductive adhesive tape 30 ensures that the rapidly melting low-melting-point coating will not overflow the copper busbar coverage area when there is a short-term localized excessive current.

[0027] In addition, such as Figure 2 As shown, this utility model also provides a coated glass, including the coated glass conductive layer low melting point coating busbar as described in any of the above claims, with a PVB layer 40 disposed on the upper side of the coated glass conductive layer low melting point coating busbar, and a glass layer 50 disposed on the upper side of the PVB layer 40, thus completing the sandwich design of the coated glass conductive layer low melting point coating busbar, and producing automotive electric heating coated glass or display glass accordingly.

[0028] The above description is merely illustrative of the embodiments of this utility model and is not intended to limit the scope of this utility model. For those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model without creative labor should be included within the protection scope of this utility model.

Claims

1. A low-melting-point coated busbar with a coated glass conductive layer, comprising a coated glass conductive layer (10), characterized in that: It also includes low-melting-point coating busbars (20) disposed at both ends of the coated glass conductive layer (10). The low-melting-point coating busbars (20) include a copper foil substrate layer (21), a thin low-melting-point coating (22) coated on the upper side of the copper foil substrate layer (21), a thick low-melting-point coating (23) coated on the lower side of the copper foil substrate layer (21), and a conductive tape (24) disposed in the center of the thick low-melting-point coating (23). The width of the conductive tape (24) is smaller than the width of the low-melting-point coating busbars (20). The low-melting-point coating busbars (20) are attached to both ends of the coated glass conductive layer (10) with the conductive tape (24) attached to one side.

2. The low melting point coated busbar of claim 1, wherein: The thin low-melting-point coating (22) is made of the same material as the thick low-melting-point coating (23), with a melting point of 100℃-135℃.

3. The low melting point coated busbar of claim 1, wherein: The copper foil substrate layer (21) has a thickness of 0.04-0.1 mm and a width of 6-20 mm, the thin low-melting-point coating (22) has a thickness of 1-3 μm, the thick low-melting-point coating (23) has a thickness of 10-20 μm, the conductive tape (24) has a width of 2-3 mm, and the conductive tape (24) has a thickness of 0.01-0.02 mm.

4. The low melting point coated busbar of claim 1, wherein: It also includes a conductive tape (30) covering and sealing the upper side of the low melting point coating busbar (20), the conductive tape (30) being wider than the width of the low melting point coating busbar (20), and the conductive tape (30) completely covering and sealing the low melting point coating busbar (20) after being installed.

5. The low melting point coated busbar of claim 4, wherein: The width of the conductive tape (30) is at least 2 mm greater than the width of the low melting point coating busbar (20).

6. A coated glass, characterized by: The device includes the low-melting-point coating busbar of the coated glass conductive layer as described in any one of claims 1 to 5, wherein a PVB layer (40) is disposed on the upper side of the low-melting-point coating busbar of the coated glass conductive layer, and a glass layer (50) is disposed on the upper side of the PVB layer (40).

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