Integrated circuit detection device

Abstract

The utility model discloses an integrated circuit detection device, and belongs to the technical field of integrated circuits. The clamping assembly comprises a vertical plate, two U-shaped blocks distributed up and down are arranged above the vertical plate, a telescopic assembly is arranged on the U-shaped block located on the upper portion and used for driving the U-shaped block located on the upper portion to move in the vertical direction, sliding blocks are arranged on the two sides of the two U-shaped blocks in a sliding and sleeving mode, locking bolts are arranged on the sliding blocks, and the locking bolts are connected with the telescopic assembly. A connecting plate is arranged between the two sliding blocks located on the same U-shaped block, a rectangular groove is formed in the middle of the connecting plate, a plurality of screws are arranged in the rectangular groove, each screw is provided with two locking nuts, the connecting plate is located between the two locking nuts, and an insulating ejector pin is arranged at one end of each screw. The technical scheme is used for solving the problem that when a detection device in the prior art carries out detection, the clamping mode of the integrated circuit board is insufficient, and the integrated circuit board is prone to being damaged.

Description

Technical Field

[0001] This utility model belongs to the field of integrated circuit technology, and specifically relates to an integrated circuit testing device. Background Technology

[0002] The necessity of integrated circuit testing (full inspection or spot inspection) lies in its ability to effectively ensure product quality and reliability, improve product yield, reduce production costs, meet market demands, support R&D improvements, cope with complex manufacturing processes, adapt to rapidly changing market environments, and optimize supply chain management, thereby enhancing the company's market competitiveness.

[0003] Therefore, many testing devices have emerged in the prior art, such as an integrated circuit testing device with patent number CN202222157415.2, which includes a testing frame and a testing platform. The testing platform is fixed to the bottom of the testing frame. Clamping plates are provided on both the left and right sides of the upper end of the testing platform. Buffer pads are connected to the inner sides of the clamping plates. Spring telescopic rods are connected between the outer ends of the clamping plates and the inner side of the testing frame. A testing instrument is fixed to the left side of the testing frame, and a testing pen is connected to the outside of the testing instrument via a spring cable.

[0004] While existing inspection devices can test the electrical performance of integrated circuits using a testing probe, they have the following drawbacks in practical use: They involve placing the integrated circuit board on a testing table and clamping it with a clamping plate. Since integrated circuit boards are thin and relatively brittle, this clamping method easily leads to bending and damage. Furthermore, the back of the integrated circuit board may contain a small number of electronic components. If the board is placed on the testing table, the force applied by the testing probe can easily crush and damage the electronic components on the back of the integrated circuit. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide an integrated circuit testing device to solve the problem that the clamping method of the integrated circuit board in the existing testing device is insufficient and easily leads to damage to the integrated circuit board.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An integrated circuit testing device includes a base plate, on which a clamping mechanism and a testing mechanism are provided. The clamping mechanism includes symmetrically arranged clamping assemblies, each comprising a vertical plate. Two U-shaped blocks, arranged vertically, are positioned above the vertical plate. The lower U-shaped block is connected to the vertical plate. A telescopic assembly is provided on the upper U-shaped block to move it vertically. Slider blocks are slidably fitted onto both sides of the two U-shaped blocks, each slider having a locking bolt. A connecting plate is provided between two sliders on the same U-shaped block. A rectangular groove is provided in the center of the connecting plate, containing several screws. Each screw has two locking nuts. The connecting plate is located between the two locking nuts. Insulating pins are provided at one end of each screw, and the insulating pins at the screw ends on the two connecting plates are arranged opposite each other.

[0008] Furthermore, the telescopic assembly includes fixed blocks disposed on both sides of the closed ends of the two U-shaped blocks. A sliding rod is provided inside the fixed block. One end of the sliding rod is connected to the fixed block disposed on the lower U-shaped block. The fixed block disposed on the upper U-shaped block is slidably connected to the sliding rod. A compression spring is provided between the end of the sliding rod and the upper fixed block. The compression spring is sleeved on the sliding rod, and both ends of the compression spring are respectively connected to the end of the screw and the fixed block.

[0009] Furthermore, a contact plate is provided in the middle of the closed end of the upper U-shaped block, and a telescopic rod is provided below the contact plate. The telescopic rod is fixed to the base plate, and the output end of the telescopic rod is set towards the contact plate.

[0010] Furthermore, a groove is provided on the closed end of the upper U-shaped block, and a baffle is provided in the groove. The baffle is slidably connected in the groove, and one end of the baffle is fixed to the lower U-shaped block.

[0011] Furthermore, the end of the slide rod connected to the U-shaped block has an external thread on its surface, and an adjusting nut is provided on the external thread.

[0012] Furthermore, the detection mechanism is either a visual detection mechanism or a probe detection mechanism.

[0013] The beneficial effects of this utility model are as follows:

[0014] In this technical solution, an insulating pin clamps the blank areas on both the front and back of the integrated circuit. This clamping method allows the electronic components on the integrated circuit to be suspended in the air, thus preventing damage from compression. Furthermore, clamping both the front and back sides reduces the risk of bending of the integrated circuit under stress, and provides good clamping stability. Under external pressure, the integrated circuit will not slide down (unlike when clamped from the side), ensuring effective testing. Moreover, the sliding block and locking nut allow the insulating pin to be moved to the blank area of ​​the integrated circuit, ensuring both clamping and protection. This method is suitable for clamping integrated circuits of different models and structures.

[0015] Other advantages, objectives, and features of this invention will be set forth in the following description and will be apparent to those skilled in the art to some extent, or may be learned by practice of this invention. The objectives and other advantages of this invention can be realized and obtained through the following description. Attached Figure Description

[0016] To make the objectives, technical solutions, and beneficial effects of this utility model clearer, the following drawings are provided for illustration:

[0017] Figure 1 This is a three-dimensional schematic diagram of the integrated circuit testing device of this utility model;

[0018] Figure 2 This is a three-dimensional schematic diagram of the clamping mechanism in the integrated circuit testing device of this utility model;

[0019] Figure 3 This is a three-dimensional schematic diagram of the clamping mechanism in the integrated circuit testing device of this utility model from another perspective.

[0020] The following labels are shown in the attached diagram:

[0021] 1. Base plate; 2. Clamping mechanism; 210. U-shaped block; 211. Slider; 212. Connecting plate; 213. Rectangular groove; 214. Locking bolt; 215. Screw; 216. Insulating pin; 217. Locking nut; 218. Fixing block; 219. Slide rod; 220. Adjusting nut; 221. Compression spring; 222. Contact plate; 223. Telescopic rod; 224. Slide groove; 225. Baffle; 226. Vertical plate; 3. Detection mechanism; 31. Mounting bracket; 32. Detection needle. Detailed Implementation

[0022] like Figures 1-3As shown, an integrated circuit testing device includes a base plate 1, on which a clamping mechanism 2 and a testing mechanism 3 are provided. The clamping mechanism 2 includes two symmetrically arranged clamping assemblies. One clamping assembly includes a vertical plate 226, the lower end of which is fixed to the base plate 1. Two vertically distributed U-shaped blocks 210 are positioned above the vertical plate 226. The lower U-shaped block 210 is fixedly connected to the upper end of the vertical plate 226. A telescopic assembly is provided on the upper U-shaped block 210 to drive it to move vertically. Sliding blocks 211 are slidably fitted on both sides of the two U-shaped blocks 210. Locking bolts 214 are provided on the sliding blocks 211. 14 is threaded onto slider 211. A connecting plate 212 is provided between two sliders 211 located on the same U-shaped block 210. A rectangular groove 213 is provided in the middle of the connecting plate 212. Several screws 215 are provided in the rectangular groove 213 (in this specific embodiment, there are two screws 215 on one U-shaped block 210). Each screw 215 is provided with two locking nuts 217. The connecting plate 212 is located between the two locking nuts 217. An insulating pin 216 is provided at one end of each screw 215. The pins 216 can be rubber rods or plastic rods, etc., to avoid affecting the power-on detection of the integrated circuit. The insulating pins 216 at the ends of the screws 215 on the two connecting plates 212 are arranged opposite to each other.

[0023] The working principle of the above technical solution is as follows:

[0024] During testing, the integrated circuit is first placed between two symmetrically arranged clamping components, with the edge of the integrated circuit positioned at the insulating pin 216. Then, by adjusting the position of the slider 211 on the U-shaped block 210 and the position of the screw 215 on the connecting plate 212, the spatial position of the insulating pin 216 can be adjusted so that the insulating pin 216 is located in the blank area of ​​the integrated circuit (i.e., avoiding the electronic components placed on it). Then, by using the telescopic component to move the upper U-shaped block 210 downward, the integrated circuit can be clamped and fixed by the insulating pin 216, thereby enabling subsequent testing.

[0025] The advantage of this setup is that the insulating pins 216 clamp the blank areas on the front and back of the integrated circuit. This clamping method allows the electronic components on the integrated circuit to be suspended in the air, thus preventing them from being squeezed and damaged. At the same time, by clamping the front and back, it is less likely to cause the integrated circuit to bend under force, and the clamping stability is good. When subjected to external pressure, the integrated circuit will not slide down (side clamping will cause it to slide down), ensuring the detection effect.

[0026] Furthermore, the spatial position of the insulating pin 216 can be changed by the action of the slider 211 and the locking nut 217, thereby ensuring that the insulating pin 216 moves to the blank area of ​​the integrated circuit, thus ensuring the clamping and protection effect, which means it can be used to clamp integrated circuits of different models and structures.

[0027] In one feasible embodiment, the telescopic assembly includes a fixing block 218 disposed on both sides of the closed end of two U-shaped blocks 210. The fixing block 218 has a slide rod 219 inside. One end of the slide rod 219 is connected to the fixing block 218 disposed on the lower U-shaped block 210. The fixing block 218 disposed on the upper U-shaped block 210 is slidably connected to the slide rod 219. A compression spring 221 is disposed between the end of the slide rod 219 and the upper fixing block 218. The compression spring 221 is sleeved on the slide rod 219, and the two ends of the compression spring 221 are respectively connected to the end of the screw 215 and the fixing block 218.

[0028] It is easy to understand that the clamping force provided by the spring can drive the U-shaped block 210 set at the top to move down, thereby achieving the clamping effect on the integrated circuit. At the same time, the advantage of setting two sliding rods 219 is that it prevents the U-shaped block 210 from rotating. This method has a simple structure, and the clamping and removal of the integrated circuit is also relatively simple.

[0029] In one feasible embodiment, a contact plate 222 is provided at the center of the closed end of the upper U-shaped block 210, and a telescopic rod 223 is provided below the contact plate 222. The telescopic rod 223 is fixed to the base plate 1, and the output end of the telescopic rod 223 is set towards the contact plate 222. The extension of the telescopic rod 223 can drive the upper U-shaped block 210 to press the clamping spring 221 upward, thereby separating the insulating pin 216 and realizing the operation of quickly removing the integrated circuit. At the same time, when clamping, only the telescopic rod 223 (electric push rod) needs to retract, so that the upper U-shaped block 210 loses the force of the telescopic rod 223. Under the action of the clamping spring 221, it can move downward to clamp. It should be noted that the advantage of using spring clamping is that the applied force has a certain buffer and is not easy to damage the integrated circuit. If the telescopic rod 223 is used to directly drive the downward clamping, the movement error of the telescopic rod 223 needs to be very precise, otherwise the pressure on the integrated circuit will be too large, resulting in damage.

[0030] In one feasible embodiment, a groove 224 is provided on the closed end of the upper U-shaped block 210, and a baffle 225 is provided in the groove 224. The baffle 225 is slidably connected in the groove 224, and one end of the baffle 225 is fixed to the lower U-shaped block 210. The baffle 225 can further improve the stability and accuracy of the movement of the upper slider 211, and at the same time, it can block the edge of the integrated circuit and avoid the problem of placing it outside the U-shaped block 210.

[0031] In one feasible embodiment, the end of the slide bar 219 connected to the U-shaped block 210 has an external thread on its surface, and an adjusting nut 220 is provided on the external thread. It is easy to understand that two adjusting nuts 220 can be provided, and the fixing block 218 is located between the two adjusting nuts 220. This will not be elaborated further here.

[0032] By adjusting the nut 220 to change the length of the slide bar 219 above the lower U-shaped block 210, the deformation of the compression spring 221 changes, thereby altering the clamping torque. For example, since the downward movement of the upper U-shaped block 210 is blocked by the end of the telescopic rod 223, when the adjusting nut 220 rotates, the slide bar 219 compresses the compression spring 221 downward. At this time, the elastic potential energy of the compression spring 221 increases. When the telescopic rod 223 is no longer in effect, since the downward distance of the U-shaped block 210 remains constant (i.e., when the insulating pin 216 contacts the integrated circuit, the U-shaped block 210 stops moving downward), the pressure applied by the compression spring 221 increases, thereby increasing the clamping torque. This method can specifically change the clamping pressure according to the different thicknesses and models of integrated circuits, which will not be elaborated further here.

[0033] In one feasible embodiment, the detection mechanism 3 is either a visual detection mechanism 3 or a probe detection mechanism 3. In this specific embodiment, a probe detection mechanism 3 is used, including a mounting frame 31 and a detection needle 32 disposed on the mounting frame 31. Of course, the specific structure and principle of the detection needle 32 are existing technologies.

[0034] Specifically, the specific structures and principles of the visual inspection mechanism 3 and the probe inspection mechanism 3 are existing technologies and will not be elaborated upon here. For example, the visual inspection mechanism should include: an image processing module (image acquisition card): responsible for receiving and transmitting image data output from the camera and quickly transferring it to the computer; image processing software: analyzing the acquired images based on complex algorithms, extracting feature information, and making decisions accordingly; an image analysis module (analysis software): further refining the image processing, comparing it with standard values, and thus marking defective parts; a data management module (storage device): used to store the acquired image data and analysis results for subsequent querying and statistics; and a control and execution module (computer): serving as the control center of the entire visual inspection system, responsible for image storage, processing, analysis, and output; the probe inspection mechanism operates based on mechanical contact and electrical signal transmission. First, the integrated circuit under test (IC) is placed on the inspection platform, ensuring its pads or pins are aligned with the probes. As the inspection platform rises, the probes contact the IC's pads, and springs provide appropriate contact pressure to ensure good electrical contact. Electrical signals are transmitted to the printed circuit board (PCB) via probes, and then to the testing equipment via wires. The testing equipment analyzes the received signals to determine whether the IC's electrical performance meets the standards. The entire process achieves efficient IC testing through precise mechanical positioning and stable electrical signal transmission. Of course, this technical solution should also include a control system that coordinates the movement of various components, such as through PLC programming, which is existing technology and will not be elaborated on here.

[0035] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although the utility model has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made to it in form and detail without departing from the scope defined by the claims of this utility model.

Claims

1. An integrated circuit detection apparatus, characterized by comprising: The device includes a base plate, on which a clamping mechanism and a detection mechanism are provided. The clamping mechanism includes symmetrically arranged clamping assemblies, each comprising a vertical plate. Two U-shaped blocks, arranged vertically, are positioned above the vertical plate. The lower U-shaped block is connected to the vertical plate, and the upper U-shaped block has a telescopic assembly for moving the upper U-shaped block vertically. Sliding blocks are slidably fitted onto both sides of the two U-shaped blocks, each with a locking bolt. A connecting plate is positioned between two sliding blocks on the same U-shaped block, with a rectangular groove in the center of the connecting plate containing several screws. Each screw has two locking nuts, and the connecting plate is located between the two locking nuts. Insulating pins are provided at one end of each screw, and the insulating pins at the ends of the screws on the two connecting plates are positioned opposite each other.

2. The integrated circuit detection apparatus of claim 1, wherein: The telescopic assembly includes fixed blocks disposed on both sides of the closed ends of the two U-shaped blocks. A sliding rod is provided inside the fixed block. One end of the sliding rod is connected to a fixed block disposed on the lower U-shaped block. The fixed block disposed on the upper U-shaped block is slidably connected to the sliding rod. A compression spring is provided between the end of the sliding rod and the upper fixed block. The compression spring is sleeved on the sliding rod, and both ends of the compression spring are respectively connected to the end of the screw and the fixed block.

3. The integrated circuit detection apparatus of claim 2, wherein: A contact plate is provided in the middle of the closed end of the U-shaped block located at the top, and a telescopic rod is provided below the contact plate. The telescopic rod is fixed to the base plate, and the output end of the telescopic rod is set towards the contact plate.

4. The integrated circuit detection apparatus of claim 2, wherein: The upper U-shaped block has a groove on its closed end, and a baffle is provided in the groove. The baffle is slidably connected in the groove, and one end of the baffle is fixed to the lower U-shaped block.

5. The integrated circuit detection apparatus of claim 2, wherein: The end of the slide bar that connects to the U-shaped block has an external thread on its surface, and an adjusting nut is provided on the external thread.

6. The integrated circuit detection apparatus of claim 1, wherein: The detection mechanism is either a visual detection mechanism or a probe detection mechanism.

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