Memory bank heat dissipation waistcoat installation jig

Abstract

The utility model discloses a memory bank heat dissipation waistcoat installation jig, and relates to the technical field of jigs, the memory bank heat dissipation waistcoat installation jig comprises a main body part and a limiting part, the limiting part is located on one side of the main body part, an installation groove and an operation groove which are communicated are formed in the top face of the main body part, and the installation groove is used for being adaptively installed at one end of a memory bank heat dissipation waistcoat; the end, away from the operation groove, of the installation groove penetrates to the side wall of the main body part, an opening faces the limiting part, and an abutting part used for abutting against a memory bank heat dissipation waistcoat is arranged at the top of the limiting part. The operation groove is in a flaring shape in the direction away from the installation groove and penetrates through the side wall of the main body part. The heat dissipation waistcoat has the effect that the installation efficiency between the heat dissipation waistcoat and the memory bank can be improved.

Description

Technical Field

[0001] This application relates to the technical field of fixtures, and in particular to a fixture for mounting heatsinks on memory modules. Background Technology

[0002] With the rapid development of information technology and the continuous improvement of computer performance, the corresponding hardware heat generation is also increasing, especially memory modules, which generate a large amount of heat under high-speed read and write operations. If this heat is not handled in a timely and effective manner, it may cause the memory module's operating temperature to become too high, thereby affecting its stability and lifespan.

[0003] Currently, there are two main categories of heat dissipation measures for memory modules: passive cooling and active cooling. Passive cooling mainly increases heat dissipation efficiency by increasing the area of ​​the heatsink, such as using aluminum or copper heatsinks that are closely attached to the surface of the memory module to form a heatsink, utilizing the good thermal conductivity of metal to conduct heat away. Active cooling, on the other hand, usually involves fans or other power sources, such as turbine coolers, to accelerate the heat dissipation process by forcing airflow.

[0004] Existing heatsinks typically consist of a parallel top plate and a bottom plate, with a connecting strip between them. The connecting strip and the top plate, as well as the bottom plate, are fixed together by snap-fit. The memory module is installed in the cavity between the top and bottom plates and is positioned by the connecting strip. Thermally conductive silicone is used to connect the memory module to the top plate and to the bottom plate, thus conducting heat.

[0005] Currently, in some small and medium-sized factories, the installation of memory modules and heatsinks is mainly done manually. The installation process requires consideration of the adhesiveness of the thermal paste and the precision of the connection, resulting in relatively low overall installation efficiency. Utility Model Content

[0006] In order to improve the installation efficiency between heatsinks and memory modules, this application provides a memory module heatsink mounting fixture.

[0007] This application provides a mounting fixture for a memory module heatsink, employing the following technical solution:

[0008] A memory module heatsink mounting fixture includes a main body and a limiting part, the limiting part being located on one side of the main body, and the top surface of the main body having a connected mounting groove and an operating groove, the mounting groove being used to fit one end of the memory module heatsink.

[0009] The end of the mounting slot away from the operating slot extends through to the side wall of the main body, and the opening faces the limiting part. The top of the limiting part is provided with an abutting part for abutting against the heat sink of the memory module.

[0010] The operating groove is flared outwards away from the mounting groove and extends through the side wall of the main body.

[0011] By adopting the above technical solution, the bottom or top plate of the heatsink can be placed in the mounting slot, and limited by the inner wall of the mounting slot and the abutment part, and then the memory module and the top or bottom plate can be installed, which is convenient. The position of the mounting fixture is not easy to move, making the installation more convenient and efficient. In addition, it is equipped with a flared operating slot, which, together with the space between the two sides of the abutment part and the main body, makes it easy to remove the installed memory module and heatsink together.

[0012] Optionally, the main body includes a first top cover and a first base that are detachably connected, and the mounting groove and the operating groove are formed on the first top cover.

[0013] By adopting the above technical solution, the first top cover and the first base of the main body are detachably connected, which allows for the replacement of different first top covers when different types of memory modules and corresponding heat sinks need to be installed, thus improving applicability.

[0014] Optionally, the limiting part includes a second top cover and a second base that are detachably connected, the second base and the first base being integrally formed.

[0015] By adopting the above technical solution, the second base and the second top cover of the limiting part are also detachably connected, which allows for the replacement of different second top covers when different types of memory modules and corresponding heat sinks need to be installed, thus improving applicability.

[0016] Optionally, the limiting part includes a second top cover and a second base that are detachably connected, with one side of the second top cover and the main body being detachably connected.

[0017] By adopting the above technical solution, the second base and the second top cover of the limiting part are also detachably connected, which allows for the replacement of different second top covers when different types of memory modules and corresponding heat sinks need to be installed, thus improving applicability; and the limiting part can be detachably separated from the main body, which can reduce the overall production difficulty of the fixture, and can be directly replaced when some parts of the structure are damaged, thereby reducing production costs.

[0018] Optionally, the abutment portion has an elastic compaction portion on the surface facing the mounting groove.

[0019] By adopting the above technical solution and setting an elastic compaction part, the top or bottom plate of the heat sink can be clamped and fixed by the compaction part and the inner wall of the mounting groove, which further improves the positioning effect, and the elastic clamping force can also reduce the damage to the heat sink.

[0020] Optionally, a compaction part is slidably disposed on the surface of the abutment part facing the mounting groove, and an elastic element is disposed between the compaction part and the abutment part, the elastic element applying a force to the compaction part in the direction of the operating groove.

[0021] By adopting the above technical solution, a movable compaction part is set up. The compaction part and the inner wall of the mounting groove play a role in clamping and fixing the top or bottom plate of the heat sink, which further improves the positioning effect. The elastic clamping force can also reduce damage to the heat sink. The compaction part has a larger range of motion, which can be used directly when installing heat sinks with similar width differences without the need to replace or replace parts.

[0022] Optionally, a movable part is slidably connected to the abutting part, the elastic element is disposed between the movable part and the compacting part, and an operating rod is rotatably connected to the surface of the movable part away from the mounting groove. The end of the operating rod away from the movable part passes through the abutting part and is threadedly connected to the abutting part.

[0023] By adopting the above technical solution, the distance between the compaction part and the main body can be adjusted by rotating the operating lever, which further improves the applicability. It can also adjust the clamping force of the elastic element and adjust the clamping force on the heat dissipation jacket.

[0024] Optionally, a guide surface is provided on the surface of the compaction part facing the mounting groove, and the guide surface gradually approaches the main body part in the direction of approaching the limiting part.

[0025] By adopting the above technical solution and setting a guide surface, it is easy to place the top and bottom plates of the heat sink, and it is also easy to remove the installed heat sink from the installation slot.

[0026] In summary, this application includes at least one of the following beneficial effects:

[0027] 1. The heat sink can be placed into the mounting slot, and its position is not easily moved by the inner wall of the mounting slot and the abutment part, which facilitates the installation. The operation slot and the space between the two sides of the abutment part and the main body are provided to facilitate the removal of the installed heat sink.

[0028] 2. The first top cover and the first base of the main body are detachably connected, which allows for the replacement of different first top covers when different types of memory modules and corresponding heat spreaders need to be installed, thus improving applicability;

[0029] 3. The second base and the second top cover of the limiting part are also detachable, which allows for the replacement of different second top covers when different types of memory modules and corresponding heat spreaders need to be installed, thus improving applicability;

[0030] 4. A guide surface is provided on the compaction section surface, which facilitates the placement of the top and bottom plates of the heat sink and also makes it easy to remove the installed heat sink from the mounting slot. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of this application;

[0032] Figure 2 This is a partial structural schematic diagram of Embodiment 2 of this application;

[0033] Figure 3 This is a partial structural schematic diagram of Embodiment 3 of this application;

[0034] Figure 4 This is a cross-sectional structural diagram of the limiting part structure shown in Embodiment 3 of this application.

[0035] Explanation of reference numerals in the attached drawings: 1. Main body; 11. First top cover; 12. First base; 13. Mounting groove; 14. Operating groove; 15. Threaded hole; 2. Limiting part; 21. Abutting part; 211. Compacting part; 212. Elastic element; 213. Moving part; 214. Slide groove; 215. Operating rod; 216. Through hole; 217. Guide surface; 22. Second top cover; 23. Second base; 24. Connecting edge. Detailed Implementation

[0036] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0037] Example 1

[0038] This application discloses a memory module heatsink mounting fixture, which is described in the embodiments below. Figure 1 The mounting fixture includes a main body 1 and a limiting part 2. The main body 1 includes a first top cover 11 and a first base 12 that are detachably connected by bolts; the limiting part 2 includes a second top cover 22 and a second base 23 that are detachably connected by bolts, wherein the first base 12 and the second base 23 are two parts integrally formed from the same piece of sheet metal.

[0039] The top surface of the first top cover 11 has an interconnected operating groove 14 and a mounting groove 13. The mounting groove 13 penetrates the end of the first top cover 11 near the limiting part 2 and can fit the top or bottom plate of the heat sink to limit its position. The second top cover 22 is provided with a pressing part 211, which clamps and fixes the heat sink through the inner wall of the mounting groove 13, further achieving the positioning effect. The length of the pressing part 211 is less than the length of the heat sink, allowing the two corners of the heat sink to be suspended, making it easier for the operator to use the operating groove 14 to remove the installed heat sink and memory module. The operating groove 14 is flared away from the mounting groove 13 and penetrates the side wall of the first top cover 11. This reduces the impact on the limiting effect of the mounting groove 13 and makes it easier to insert a finger into the operating groove 14 to remove the heat sink.

[0040] Since the first top cover 11 and the first base 12 are detachably connected, and the second top cover 22 and the second base 23 are also detachably connected, if the heat sinks to be installed are of different specifications, the applicability can be improved by replacing the first top cover 11 and the second top cover 22.

[0041] Reference Figure 1 The second top cover 22 has an integrally formed abutment portion 21, and a compaction portion 211 is bonded and fixed to the surface of the abutment portion 21 facing the mounting groove 13 and has elasticity. A guide surface 217 is formed on the surface of the compaction portion 211 facing the mounting groove 13. The guide surface 217 is an inclined surface or arc-shaped surface that gradually approaches the mounting groove 13 in the direction of approaching the second base 23.

[0042] By providing the elastic compaction part 211, the top or bottom plate of the heat sink can be clamped and fixed by the compaction part 211 and the inner wall of the mounting groove 13, further improving the positioning effect. The elastic clamping force can also reduce damage to the heat sink. The guide surface 217 facilitates the placement of the top and bottom plates of the heat sink and also facilitates the removal of the installed heat sink from the mounting groove 13.

[0043] The implementation principle of the memory module heat sink mounting fixture in this application embodiment is as follows: During installation, the bottom plate of the heat sink with the heat dissipation silicone pad is first placed in the mounting groove 13. A connecting strip is snapped on the bottom plate. The bottom plate of the heat sink is limited by the inner wall of the mounting groove 13 and the compaction part 211.

[0044] Next, install the memory module onto the bottom plate of the heatsink and connect it to the connector strip, then secure it with thermal silicone. Finally, snap the top plate and bottom plate or connector strip of the heatsink into place. At this point, the mounting slot 13 and the pressing part 211 can clamp and press the heatsink tightly, making the connection between the heatsink and the memory module more stable. Finally, remove the installed memory module and heatsink together.

[0045] Example 2

[0046] The difference between Embodiment 2 and Embodiment 1 of this application is that, referring to... Figure 2 The first base 12 and the second base 23 are not integrally formed, but are separate components. The second base 23 and the second top cover 22 are detachably connected by bolts, and the first base 12 and the first top cover 11 are detachably connected by bolts, so as to facilitate the separate production of the main body 1 and the limiting part 2. Damaged parts can be directly replaced, reducing cost losses.

[0047] Furthermore, both sides of the second top cover 22 are integrally formed or fixed with connecting edges 24. The main body 1 and the limiting part 2 are detachably connected by bolts passing through the connecting edges 24 and threadedly connecting the first top cover 11. In other embodiments of this application, one or more shims of a defined thickness can be added between the connecting edges 24 and the first top cover 11 to achieve fine adjustment of the position between the limiting part 2 and the main body 1, further improving applicability.

[0048] Example 3

[0049] The difference between Embodiment 3 and Embodiment 2 of this application is that, referring to... Figure 3 and Figure 4 A sliding groove 214 is provided on the surface of the abutment part 21 facing the mounting groove 13. A moving part 213 is slidably connected in the sliding groove 214. A guide rod is fixed on the surface of the moving part 213 facing the mounting groove 13. The guide rod is a telescopic rod and an elastic element 212 is sleeved on the outside. Specifically, the elastic element 212 is a spring. The end of the elastic element 212 away from the moving part 213 is fixedly connected to the compaction part 211.

[0050] The end of the movable part 213 away from the compaction part 211 is rotatably connected to an operating rod 215 via a small bearing. The end of the operating rod 215 away from the movable part 213 passes through a through hole 216 in the abutment part 21 and is fixed to a hand-rotating part. The operating rod 215 and the through hole 216 are threaded together. Rotating the hand-rotating part can adjust the position of the movable part 213, thereby adjusting the position of the compaction part 211 and the spring force, allowing the compaction part 211 to move a wider range. When using mounting fixtures on heat dissipation jackets with only slightly different widths, it is not necessary to replace the first top cover 11 or the second top cover 22, further improving applicability.

[0051] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A memory module cooling vest mounting jig, characterized by, It includes a main body (1) and a limiting part (2). The limiting part (2) is located on one side of the main body (1). The top surface of the main body (1) is provided with a connected mounting groove (13) and an operating groove (14). The mounting groove (13) is used to fit one end of the heat sink of the memory module. The end of the mounting slot (13) away from the operating slot (14) extends through to the side wall of the main body (1) and the opening faces the limiting part (2). The top of the limiting part (2) is provided with an abutting part (21) for abutting against the heat sink of the memory module. The operating groove (14) is flared outwards in the direction away from the mounting groove (13) and penetrates the side wall of the main body (1).

2. The memory module cooling vest mounting jig of claim 1, wherein, The main body (1) includes a first top cover (11) and a first base (12) that are detachably connected, and the mounting groove (13) and the operation groove (14) are formed on the first top cover (11).

3. The memory module cooling vest mounting jig of claim 2, wherein, The limiting part (2) includes a second top cover (22) and a second base (23) that can be detachably connected, and the second base (23) and the first base (12) are integrally formed.

4. The memory module cooling vest mounting fixture of claim 2, wherein, The limiting part (2) includes a second top cover (22) and a second base (23) that are detachably connected, and one side of the second top cover (22) is detachably connected to the main body (1).

5. The memory module cooling vest mounting fixture of claim 1, wherein, The abutment portion (21) has an elastic compaction portion (211) on its surface facing the mounting groove (13).

6. The memory module cooling vest mounting fixture of claim 1, wherein, A compaction part (211) is slidably disposed on the surface of the abutment part (21) facing the mounting groove (13). An elastic element (212) is disposed between the compaction part (211) and the abutment part (21), and the elastic element (212) applies a force to the compaction part (211) in the direction of the operating groove (14).

7. The memory module cooling vest mounting fixture of claim 6, wherein, A movable part (213) is slidably connected to the abutment part (21). The elastic element (212) is disposed between the movable part (213) and the compaction part (211). An operating rod (215) is rotatably connected to the surface of the movable part (213) away from the mounting groove (13). One end of the operating rod (215) away from the movable part (213) passes through the abutment part (21) and is threadedly connected to the abutment part (21).

8. The memory module cooling vest mounting jig of claim 5 or 6, wherein, The compaction part (211) has a guide surface (217) on its surface facing the mounting groove (13), and the guide surface (217) gradually approaches the main body part (1) in the direction of approaching the limiting part (2).

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