High-temperature-resistant fracture-resistant double-sided circuit board

Abstract

The utility model discloses a high-temperature-resistant fracture-resistant double-sided circuit board, and belongs to the technical field of circuit boards. The device mainly comprises an anti-bending assembly, the anti-bending assembly comprises four sets of main body supporting rods, notch grooves are formed in the two ends of each main body supporting rod, connecting blocks are installed in the notch grooves, and two sets of clamping rods are in threaded connection between the two sets of transversely-arranged connecting blocks; the heat dissipation assembly is provided with a heat conduction flitch plate for conducting heat dissipation on the circuit board body, a sliding sleeve for driving the heat conduction flitch plate to be fixed in a sliding mode and a guide rod for guiding movement of the sliding sleeve, the sliding sleeve is provided with two sets of hooking parts, a rotating shaft is movably arranged between the two sets of hooking parts in a rotating mode, and a protruding part is installed on the rotating shaft; and the mounting assembly is provided with a pressing part for pressing and fixing the heat-conducting flitch plate. According to the high-temperature-resistant and fracture-resistant double-sided circuit board, the position can be flexibly adjusted through the heat dissipation assembly, the heat dissipation part can be accurately positioned, the heat dissipation performance reduction caused by sliding of the heat conduction flitch plate is avoided, and it is guaranteed that the electronic element stably works at the proper temperature.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, specifically to high-temperature resistant and flexurally resistant double-sided circuit boards. Background Technology

[0002] Printed circuit boards (PCBs), also commonly known as printed circuit boards, are important electronic components. They serve as the support for electronic components and the carrier for their electrical connections. Within the industry, they are sometimes referred to as rigid circuit boards (as opposed to flexible circuit boards), single-sided boards, double-sided boards, multilayer boards, etc., based on their characteristics or applications. These names represent different classifications and appellations of printed circuit boards.

[0003] For example, the patent with publication number CN216162921 U discloses a high-temperature resistant and bending-resistant double-sided circuit board, which includes a circuit board body, a circuit board coating, electronic components, a bending-resistant structure and a heat dissipation structure. This can increase the overall strength of the circuit board body, improve the bending resistance of the circuit board, make it more secure to install and use, and allow for quick adjustment of the heat dissipation and heat conduction positions, making it convenient to adjust the heat dissipation of different positions on the circuit board.

[0004] The aforementioned patented thermal conductive plate is designed for movable installation. However, in actual use, the thermal conductive plate needs to be adjusted to a specific position to achieve optimal heat dissipation because different areas of the high-temperature resistant and flexurally resistant double-sided circuit board may experience varying heat generation rates. If the thermal conductive plate cannot be fixed in place, it may slide freely when the equipment vibrates, moves, or is subjected to external forces, resulting in insufficient and ineffective heat conduction and dissipation for the areas requiring cooling. This affects the heat dissipation performance of the circuit board and may consequently impact the performance and lifespan of electronic components. Therefore, it is necessary to provide a high-temperature resistant and flexurally resistant double-sided circuit board to solve these problems.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of this application concept, and therefore may include information that does not constitute prior art. Utility Model Content

[0006] Based on the aforementioned problems in the existing technology, the problem to be solved by this application is to provide a high-temperature resistant and flexurally resistant double-sided circuit board, which solves the problem that since the heat dissipation of different areas of the circuit board may be different, it is necessary to adjust the thermal conductive plate to a specific position to achieve the best heat dissipation effect. If the thermal conductive plate cannot be fixed, it may slide randomly when the equipment is vibrated, moved, or subjected to external interference, resulting in the inability to continuously and effectively conduct and dissipate heat to the parts that need heat dissipation.

[0007] The technical solution adopted by this application to solve its technical problem is as follows: a high-temperature resistant and bending-resistant double-sided circuit board, including a bending-resistant component, which includes four main support rods. The main support rods have notches at both ends, and connecting blocks are installed in the notches. There is a certain gap between two vertically arranged main support rods, and the circuit board body is placed between the two gaps. Two sets of clamping rods are threadedly connected between two horizontally arranged connecting blocks. A heat dissipation component is installed on the connecting blocks. The heat dissipation component has a heat-conducting plate for dissipating heat from the circuit board body, a sliding sleeve for sliding and fixing the heat-conducting plate, and a guide rod for guiding the movement of the sliding sleeve. The sliding sleeve has two sets of hook portions, and a rotating shaft is movably rotated between the two sets of hook portions. A protrusion is installed on the rotating shaft. An installation component is installed on the heat dissipation component, and the installation component has a clamping portion for pressing and fixing the heat-conducting plate.

[0008] Furthermore, a handle is fixedly mounted on the rotating shaft.

[0009] Furthermore, a connector is fixedly installed on the sliding sleeve, a support frame is installed between the two sets of connectors, a pad is fixedly installed at the four corners of the support frame, and a support pad is fixedly installed on the four sets of pads.

[0010] Furthermore, the support pad is made of a flexible material.

[0011] Furthermore, the connector has a recessed groove, the mounting assembly includes a fixing part fixedly installed at one end of the inner wall of the recessed groove, the fixing part has a protrusion, the clamping part is threadedly connected to the protrusion, and corner plates are fixedly installed on both sides of the heat-conducting plate.

[0012] Furthermore, the thermally conductive plate has heat dissipation fins.

[0013] The beneficial effects of this application are as follows: The high-temperature resistant and bending-resistant double-sided circuit board provided by this application allows for flexible adjustment of its position via the heat dissipation components, precisely positioning the heat dissipation parts and preventing a decrease in heat dissipation performance due to the sliding of the thermal conductive plate. This ensures that electronic components operate stably at suitable temperatures, extending their performance and lifespan. The mounting components ensure that the thermal conductive plate is securely installed and will not shift even under external forces such as vibration, guaranteeing stable heat dissipation and facilitating circuit board maintenance and repair.

[0014] In addition to the purposes, features, and advantages described above, this application has other purposes, features, and advantages. A further detailed description of this application will be provided below with reference to the figures. Attached Figure Description

[0015] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0016] In the attached diagram:

[0017] Figure 1 This is an overall schematic diagram of the high-temperature resistant and flexurally resistant double-sided circuit board in this application;

[0018] Figure 2 for Figure 1 Exploded view;

[0019] Figure 3 for Figure 1 A schematic diagram of the flexural strength component structure;

[0020] Figure 4 for Figure 2 Enlarged view of point A;

[0021] Figure 5 for Figure 2 Enlarged view of point B;

[0022] The following are the labeling elements in the figure:

[0023] 1. Anti-bending component; 11. Main support rod; 12. Notch; 13. Connecting block; 14. Clamping rod; 15. Circuit board body; 16. Electronic component; 2. Heat dissipation component; 21. Guide rod; 22. Sliding sleeve; 23. Hook; 24. Rotating shaft; 25. Protrusion; 26. Handle; 27. Connector; 28. Recessed groove; 29. ​​Support frame; 210. Pad; 211. Support pad; 212. Thermal conductive plate; 3. Mounting component; 31. Fixing part; 32. Protrusion; 33. Pressing part; 34. Angle plate. Detailed Implementation

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0026] like Figures 1-5As shown, this application provides a high-temperature resistant and flexurally resistant double-sided circuit board, including a flexurally resistant component 1. The flexurally resistant component 1 includes four main support rods 11, and the two main support rods 11 are arranged symmetrically in the upper and lower parts. Notch slots 12 are opened at both ends of the main support rods 11, and connecting blocks 13 are fixedly installed in the notch slots 12. The connecting blocks 13 connect the two vertically arranged main support rods 11, and there is a certain gap between the two vertically arranged main support rods 11. The circuit board body 15 is placed between the two gaps. The outer surface of the circuit board body 15 is provided with a circuit board coating (not shown in the figure), and multiple electronic components 16 are installed at the upper and lower ends of the circuit board body 15.

[0027] Two sets of clamping rods 14 are threaded between the two sets of horizontally arranged connecting blocks 13. The clamping rods 14 are used to restrict the sides of the circuit board body 15. When the circuit board body 15 is subjected to bending force, the main support rod 11 can play a supporting and buffering role, reducing the stress directly borne by the circuit board body 15, thereby improving the bending resistance of the circuit board. At the same time, the connecting blocks 13 connect the vertically arranged main support rods 11, further enhancing the stability of the frame. The clamping rods 14 can apply a certain pressure to make the circuit board body 15 tightly fixed in the bending resistance component 1, preventing the circuit board from moving relative to each other when subjected to external force, thereby further improving the bending resistance effect.

[0028] A heat dissipation assembly 2 is connected between two sets of horizontally arranged connecting blocks 13. The heat dissipation assembly 2 includes a guide rod 21 connected between the two sets of horizontally arranged connecting blocks 13, and a sliding sleeve 22 is slidably installed on the guide rod 21. The sliding sleeve 22 has two sets of hook parts 23, and a rotating shaft 24 is movably rotated between the two sets of hook parts 23. A protrusion 25 is fixedly installed on the rotating shaft 24, and a handle 26 is also fixedly installed on the rotating shaft 24, so that the operator can hold the handle 26 to drive the rotating shaft 24 to rotate, so that the protrusion 25 is tightly attached to the surface of the guide rod 21. As the friction between the protrusion 25 and the guide rod 21 increases, the sliding sleeve 22 is prevented from continuing to slide on the guide rod 21, and the sliding sleeve 22 can be fixed at any position on the guide rod 21.

[0029] Furthermore, a connector 27 is fixedly installed on the sliding sleeve 22, and a support frame 29 is fixedly installed between the two sets of connectors 27. At the same time, a pad 210 is fixedly installed at the four corners of the support frame 29. A support pad 211 is fixedly installed on the four sets of pads 210. The support pad 211 is made of flexible material, and a heat-conducting plate 212 is placed on the four sets of support pads 211. The heat-conducting plate 212 has heat dissipation fins (not shown in the figure).

[0030] When the electronic component 16 on the circuit board generates heat, the heat is transferred through the circuit board to the thermally conductive plate 212, which is in contact with the surface of the circuit board. Because the thermally conductive plate 212 has excellent thermal conductivity, it can quickly absorb heat and conduct it to the heat sink fins. The heat sink fins have a large surface area, increasing the contact area with the air, and dissipating heat into the surrounding environment through heat conduction and convection. This achieves heat dissipation for the circuit board, ensuring that the electronic component 16 on the circuit board operates within a suitable temperature range and preventing performance degradation or damage due to overheating.

[0031] To ensure the installation stability of the heat dissipation component 2, a recessed groove 28 is provided on the connector 27, and an installation component 3 is installed on the inner wall of the recessed groove 28. The installation component 3 includes a fixing part 31 fixedly installed on one end of the inner wall of the recessed groove 28. The fixing part 31 has a protrusion 32, and a clamping part 33 is threadedly connected to the protrusion 32. Meanwhile, corner plates 34 are fixedly installed on both sides of the heat-conducting plate 212.

[0032] When the heat-conducting plate 212 is placed on the four sets of pads 210, the bottom surface of the heat-conducting plate 212 is flush with the top surface of the support frame 29. Then, by sliding the heat-conducting plate 212, the corner plate 34 is aligned with one end of the pressing part 33. At this time, the heat-conducting plate 212 is pressed down to squeeze the support pad 211, and the pressing part 33 is tightened to fix the heat-conducting plate 212 on the support frame 29.

[0033] In summary, the anti-bending component 1 consists of four main support rods 11, symmetrically distributed vertically. These rods are connected by connecting blocks 13 within end notches 12, forming a stable frame structure. The circuit board body 15 is placed within the gaps of the frame. Two sets of clamping rods 14 between the transverse connecting blocks 13 restrict the sides of the circuit board body 15. When the circuit board body 15 is subjected to bending force, the main support rods 11 provide support and buffering, reducing the direct stress on the circuit board body 15. The connecting blocks 13 further enhance the stability of the frame, while the pressure applied by the clamping rods 14 firmly fixes the circuit board body 15 within the anti-bending component 1, preventing relative movement under external forces and effectively improving the circuit board's anti-bending performance.

[0034] The guide rod 21 of the heat dissipation component 2 is connected between two sets of horizontally arranged connecting blocks 13. The sliding sleeve 22 can slide on the guide rod 21. The operator holds the handle 26 to drive the rotating shaft 24 to rotate, so that the protrusion 25 fixed on the rotating shaft 24 is tightly attached to the surface of the guide rod 21, increasing the friction force, and thus fixing the sliding sleeve 22 at any desired position on the guide rod 21 to adapt to the heat dissipation of different areas of the circuit board.

[0035] When the electronic component 16 on the circuit board generates heat, the heat is transferred through the circuit board to the thermal conductive plate 212. The thermal conductive plate 212 quickly absorbs the heat due to its good thermal conductivity and conducts it to the heat dissipation fins. The heat dissipation fins conduct heat and heat convection with the air through their large surface area, thereby dissipating heat from the circuit board.

[0036] In addition, to solve the problem of fixing the heat-conducting plate 212, a recessed groove 28 is opened on the connector 27 and an installation component 3 is installed. The fixing part 31 of the installation component 3 is fixed to one end of the inner wall of the recessed groove 28, and its protrusion 32 is threadedly connected to the pressing part 33. The corner plates 34 on both sides of the heat-conducting plate 212 cooperate with it. The heat-conducting plate 212 is placed on the pad 210 so that its bottom surface is flush with the top surface of the support frame 29. The heat-conducting plate 212 is slid so that the corner plates 34 are aligned with the pressing part 33. The heat-conducting plate 212 is pressed down to squeeze the support pad 211 and then the pressing part 33 is tightened to fix the heat-conducting plate 212 firmly on the support frame 29.

[0037] The design of the anti-bending component 1 enhances the bending resistance of the circuit board, making it less prone to damage when subjected to external bending forces, thus improving the reliability of the circuit board in complex environments. The heat dissipation component 2 can be flexibly adjusted to ensure that the thermal conductive plate 212 is precisely positioned in the specific area requiring heat dissipation, effectively avoiding the problem of reduced heat dissipation performance caused by the thermal conductive plate 212 sliding arbitrarily. This ensures that the electronic components 16 on the circuit board can work stably within a suitable temperature range, improving the performance and service life of the electronic components 16.

[0038] The mounting component 3 of the heat dissipation component 2 ensures the stable installation of the heat-conducting plate 212. Even if the equipment is subjected to vibration, movement or other external interference during operation, the heat-conducting plate 212 will not shift, ensuring the stability of the heat dissipation effect. It also facilitates the maintenance and repair of the circuit board, meeting the needs of actual use.

[0039] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A high temperature resistant, flexurally rigid, double sided circuit board, characterized by: include: The anti-bending component (1) includes four main support rods (11). The two ends of the main support rods (11) are provided with notches (12). Connecting blocks (13) are installed in the notches (12). There is a certain gap between the two sets of main support rods (11) arranged vertically. The circuit board body (15) is placed between the two gaps. Two sets of clamping rods (14) are threadedly connected between the two sets of connecting blocks (13) arranged horizontally. Heat dissipation assembly (2), which is mounted on the connecting block (13), the heat dissipation assembly (2) has a heat-conducting plate (212) for dissipating heat from the circuit board body (15), a sliding sleeve (22) for driving the heat-conducting plate (212) to slide and fix, and a guide rod (21) for guiding the movement of the sliding sleeve (22). The sliding sleeve (22) has two sets of hook parts (23), and a rotating shaft (24) is movably rotated between the two sets of hook parts (23). A protrusion (25) is installed on the rotating shaft (24). Mounting assembly (3) is mounted on the heat dissipation assembly (2) and has a clamping part (33) for clamping and fixing the heat-conducting plate (212).

2. The high-temperature-resistant and fold-resistant double-sided circuit board according to claim 1, characterized in that: A handle (26) is fixedly installed on the rotating shaft (24).

3. The high-temperature-resistant, flexible, double-sided circuit board of claim 1, wherein: A connector (27) is fixedly installed on the sliding sleeve (22), and a support frame (29) is installed between the two sets of connectors (27). A pad (210) is fixedly installed at the four corners of the support frame (29), and a support pad (211) is fixedly installed on the four sets of pads (210).

4. The high-temperature-resistant and fold-resistant double-sided circuit board according to claim 3, characterized in that: The support pad (211) is made of flexible material.

5. The high-temperature-resistant, flexible, double-sided circuit board of claim 3, wherein: The connector (27) has a recessed groove (28), the mounting assembly (3) includes a fixing part (31) fixedly installed on one end of the inner wall of the recessed groove (28), the fixing part (31) has a protrusion (32), the clamping part (33) is threadedly connected to the protrusion (32), and corner plates (34) are fixedly installed on both sides of the heat-conducting plate (212).

6. The high-temperature-resistant, flexible, double-sided circuit board of claim 1, wherein: The thermally conductive plate (212) has heat dissipation fins.

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