Adsorption table tray for warping of advanced board-level packaging large board

Abstract

The utility model discloses an adsorption table tray for advanced board-level packaging large board warping, which belongs to the technical field of chip packaging, the integral structure of the adsorption table tray is composed of a tray body and a base, a vacuum area is partitioned by partition strips on the bottom surface of the tray body, an air inlet of the base is connected with a vacuum pump, five paths of vacuum do not interfere with each other and are opened simultaneously, and the vacuum degree is high. The suction force of each subarea can be controlled through the design of the vacuum subareas, then the suction force of each part of the substrate is controlled so as to deal with various warping conditions, the plane contact design is further adopted, each substrate is directly attached to the top face of the disc body, the attaching area is increased, and the attaching effect is improved. And suction nozzles are arranged at the four corners and the center position of each adsorption unit, uniform adsorption is achieved, the situation of uneven adsorption is avoided, a deflation groove is omitted, and the situation that vacuum is released from the deflation groove when stress is released in the product cutting process is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of chip packaging technology, specifically relating to an adsorption platform for advanced board-level packaging large board warping. Background Technology

[0002] Advanced packaging refers to a semiconductor packaging method that improves chip performance through new interconnect and integration technologies. During dicing, the chip and substrate must be separated as a whole along a preset path. During the dicing process, a vacuum adsorption platform must be used to stabilize the substrate to prevent displacement and edge chipping.

[0003] However, existing adsorption platforms have the following problems:

[0004] 1. The adsorption area at the four corners of each adsorption unit on the tray is small, making it unable to adsorb large plates with high thickness and warping.

[0005] 2. The entire surface of the tray has venting grooves, which prevents the vacuum from being locked.

[0006] 3. Uneven adsorption causes some products to be easily drawn into a concave shape. Utility Model Content

[0007] To address the problems mentioned in the background art, this utility model provides an adsorption platform for advanced board-level packaging large board warping, which solves the problems of small adsorption area at the four corners of each adsorption unit of the platform, the inability to lock the vacuum due to the venting grooves on the entire surface of the platform, and uneven adsorption.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] An adsorption platform for large board warpage in advanced board-level packaging, comprising:

[0010] The base has five air inlet holes, four of which are edge vacuum inlets and one is a central vacuum inlet. The four edge vacuum inlets are arranged in a rectangular array on the base, and the central vacuum inlet is located at the intersection of the diagonals of the rectangle formed by the four edge vacuum inlets. The vacuum pump is connected to one end of the base with the edge vacuum inlets and the central vacuum inlet.

[0011] Disk body; The disk body is in a lid-like structure. The disk body includes a rectangular plate body and an annular side wall extending downward along the four peripheral edges of the rectangular plate body. The disk body is fixedly connected to the base to form a total chamber. Multiple partition strips are provided on the bottom surface of the rectangular plate body, and the bottom surface of the partition strips is in pressing contact with the base. The multiple partition strips cooperate with the annular side wall to divide the total chamber into five mutually independent sub-chambers. An air inlet through hole is provided in one sub-chamber. Among them, the sub-chamber formed by the partition strip and the annular side wall, which includes an edge vacuum air inlet hole, is the outer chamber, and the sub-chamber formed by being surrounded by the partition strips, which includes a central air inlet hole, is the inner chamber. A "field" - shaped groove is provided on the top surface of the rectangular plate body, and the groove divides the top surface of the rectangular plate body into a rectangular ring surface and four rectangular mounting surfaces;

[0012] Multiple groups of substrate suction nozzles; Five groups of substrate suction nozzles are provided on one rectangular mounting surface. Among them, four groups of substrate suction nozzles are respectively arranged at the four corners of the rectangular mounting surface, and one group of substrate suction nozzles is arranged at the intersection of the diagonals of the rectangular mounting surface. One group of substrate suction nozzles close to the intersection of the diagonals of the rectangular plate body on one rectangular mounting surface connects the top surface of the rectangular plate body and the inner chamber, and the remaining substrate suction nozzles connect the top surface of the rectangular plate body and an inner chamber.

[0013] Preferably, the partition strip includes an annular strip and a straight strip. The annular strip is in a rhombic annular structure, and the four corners of the annular strip are respectively arranged opposite to the midpoints of the four sides of the annular side wall. The two ends of one straight strip are respectively connected to the midpoint of one side of the annular side wall and one corner of the annular strip.

[0014] Preferably, a circle of corner waste suction nozzles evenly distributed along the four sides of the rectangular plate body is further provided on the rectangular plate body outside the groove. One corner waste suction nozzle connects an inner chamber and the top surface of the rectangular plate body.

[0015] Preferably, multiple first threaded holes are provided on the base, and multiple second threaded holes penetrating the top surface of the disk body and the bottom surface of the annular side wall are provided on the disk body. One first threaded hole and one second threaded hole are fixedly connected by a bolt.

[0016] Preferably, the material of the top surface of the disk body is rubber.

[0017] Compared with the prior art, the beneficial effects of the present utility model are:

[0018] Through the design of vacuum partitioning, the present application can control the suction force of each partition, and further control the suction force of each part of the substrate, so as to cope with various warping situations. The overall structure of the present application consists of a disk body and a base. The vacuum area is partitioned by the partition strips on the bottom surface of the disk body. The air inlet holes of the base are connected to the vacuum pump, and the five-way vacuum does not interfere with each other. When the five-way vacuum is turned on simultaneously, a strong adsorption of large vacuum is achieved. The present application adopts a planar contact design, making each substrate directly adhere to the top surface of the disk body, increasing the adhesion area, and suction nozzles are provided at the four corners and the center position of each adsorption unit to achieve uniform adsorption and avoid uneven adsorption. The present application also cancels the air release groove and uses a design of a "field" - shaped groove配合隔断条 (the description seems a bit unclear here, assuming it means "cooperating with partition strips") to leave a channel for cutting without connecting to the vacuum chamber, reducing the situation where vacuum is released from the air release groove when stress is released during product cutting. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of the top surface of the disk body;

[0020] Figure 2 It is a schematic structural diagram of the bottom surface of the disk body;

[0021] Figure 3 It is a schematic structural diagram of the base;

[0022] The markings in the figure are:

[0023] 1 - rectangular plate body; 2 - groove; 3 - substrate suction nozzle; 4 - second threaded hole; 5 - corner scrap suction nozzle; 6 - partition strip; 7 - annular side wall; 8 - first threaded hole; 9 - base; 10 - edge vacuum air inlet hole; 11 - central vacuum air inlet hole. Detailed Embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Embodiment 1

[0026] As Figure 1 、 Figure 2 and Figure 3 shown, an adsorption table for large - board warping in advanced board - level packaging includes:

[0027] Base 9; there are five air intake through-holes on the base 9, four of which are edge vacuum air intake holes 10 and one is a central vacuum air intake hole 11. The four edge vacuum air intake holes 10 are distributed in a rectangular array on the base 9. The central vacuum air intake hole 11 is arranged at the intersection of the diagonals of the rectangle formed by the four edge vacuum air intake holes 10. The vacuum pumping device is connected to one end of the bottom surface of the base 9 where the edge vacuum air intake holes 10 and the central vacuum air intake hole 11 are located. The vacuum pumping device is a vacuum pump;

[0028] Disk body; the disk body is in a lid-like structure. The material of the top surface of the disk body is rubber. The disk body includes a rectangular plate body 1 and an annular side wall 7 extending downward along the four peripheral edges of the rectangular plate body 1. There are multiple first threaded holes 8 on the base 9, and there are multiple second threaded holes 4 penetrating through the top surface of the disk body and the bottom surface of the annular side wall 7. One first threaded hole 8 and one second threaded hole 4 are fixedly connected by a bolt to form a total chamber. There are multiple partition strips 6 on the bottom surface of the rectangular plate body 1. The bottom surface of the partition strip 6 is in pressing contact with the base 9. The multiple partition strips 6 and the annular side wall 7 cooperate to divide the total chamber into five independent sub-chambers. Specifically, the partition strip 6 includes an annular strip and a straight strip. The annular strip is in a rhombic ring structure. The four corners of the annular strip are respectively arranged opposite to the midpoints of the four sides of the annular side wall 7. The two ends of one straight strip are respectively connected to the midpoint of one side of the annular side wall 7 and one corner of the annular strip. One air intake through-hole is arranged in one sub-chamber. Among them, the sub-chamber including one edge vacuum air intake hole 10 formed by the partition strip 6 and the annular side wall 7 is the outer chamber, and the sub-chamber including the central air intake hole formed by being surrounded by the partition strip 6 is the inner chamber. There is a "field" - shaped groove 2 on the top surface of the rectangular plate body 1. The groove 2 divides the top surface of the rectangular plate body 1 into a rectangular ring surface and four rectangular mounting surfaces;

[0029] Twenty groups of substrate suction nozzles 3; the size of the substrate suction nozzles 3 is 3mm - 12mm. There are five groups of substrate suction nozzles 3 on one rectangular mounting surface. Among them, four groups of substrate suction nozzles 3 are respectively arranged at the four corners of the rectangular mounting surface, and one group of substrate suction nozzles 3 is arranged at the intersection of the diagonals of the rectangular mounting surface. One group of substrate suction nozzles 3 close to the intersection of the diagonals of the rectangular plate body 1 on one rectangular mounting surface is connected to the top surface of the rectangular plate body 1 and the inner chamber, and the remaining substrate suction nozzles 3 are connected to the top surface of the rectangular plate body 1 and one inner chamber;

[0030] For the warping of the product with a smiling face: the number of each group of substrate suction nozzles 3 at each of the four corners of the entire groove 2 is 3 - 20;

[0031] For the warping of the product with a crying face: each group of substrate suction nozzles 3 located at the center position of each rectangular mounting surface, and each group of substrate suction nozzles 3 connected to the inner chamber, the number of each group is 3 - 50;

[0032] For the warping of the product with a wavy shape: each of the remaining groups of substrate suction nozzles 3 for the smiling face warping and crying face warping mentioned above, the number is 3 - 25;

[0033] Multiple scrap nozzles 5; the multiple scrap nozzles 5 are evenly distributed in a ring along the perimeter of the rectangular plate body 1 outside the groove 2, one scrap nozzle 5 communicates with one inner cavity and the top surface of the rectangular plate body 1, and the size of the scrap nozzle 5 is 2 mm - 4 mm.

[0034] In this embodiment, the size of the table plate is less than 1000X1000 mm and greater than 300x300 mm, such as 496x501 mm, 510x515 mm, and 600x600 mm, etc. The size of the applied product is 0.1 - 4 mm. During use, first, place the substrate with chips on the plate body, align each chip with a rectangular mounting surface, and then start the vacuum pump to adsorb the substrate. When entering the cutting process, the cutting tool can cut along the groove 2. After cutting, the substrate is divided into four rectangular blocks with chips and a scrap in the form of a rectangular ring structure, and the scrap is continuously adsorbed by the scrap nozzle 5.

[0035] Through the design of vacuum zoning in this application, the suction force of each zone can be controlled, and then the suction force of each part of the substrate can be controlled to cope with various warping situations. The overall structure of this application consists of a plate body and a base 9. The vacuum area is partitioned by the bottom partition strip 6 of the plate body. The air inlet of the base 9 is connected to the vacuum pump, and the five-way vacuum does not interfere with each other. When the five-way vacuum is turned on simultaneously, strong adsorption of a large vacuum is achieved. This application adopts a plane contact design, enabling each substrate to directly adhere to the top surface of the plate body, increasing the adhesion area, and suction nozzles are provided at the four corners and the center position of each adsorption unit to achieve uniform adsorption and avoid uneven adsorption. This application also cancels the air release groove and instead uses the design of a "field" - shaped groove 2 in cooperation with the partition strip 6 to leave a channel for cutting without connecting to the vacuum chamber, reducing the situation where vacuum is released from the air release groove when stress is released during the cutting of the product.

Claims

1. An adsorption platform for addressing warpage of large boards in advanced board-level packaging, characterized in that, Comprising: A base (9); there are five air intake through-holes provided on the base (9), four of which are edge vacuum air intake holes (10), and one is a central vacuum air intake hole (11). The four edge vacuum air intake holes (10) are distributed in a rectangular array on the base (9). The central vacuum air intake hole (11) is arranged at the intersection of the diagonals of the rectangle formed by the four edge vacuum air intake holes (10). The vacuum pumping device is connected to one end of the bottom surface of the base (9) where the edge vacuum air intake holes (10) and the central vacuum air intake hole (11) are located; A disc body; the disc body is in a lid-like structure. The disc body includes a rectangular plate body (1) and an annular side wall (7) extending downward along the four peripheral edges of the rectangular plate body (1). The disc body is fixedly connected to the base (9) to form a total chamber. The bottom surface of the rectangular plate body (1) is provided with a plurality of partition strips (6). The bottom surface of the partition strips (6) is in pressing contact with the base (9). The plurality of partition strips (6) and the annular side wall (7) cooperate to divide the total chamber into five mutually independent sub-chambers. One air intake through-hole is arranged in one sub-chamber. Among them, the sub-chamber formed by the partition strip (6) and the annular side wall (7) and including one edge vacuum air intake hole (10) is an outer chamber, and the sub-chamber formed by being surrounded by the partition strip (6) and including the central air intake hole is an inner chamber. The top surface of the rectangular plate body (1) is provided with a "field"-shaped groove (2). The groove (2) divides the top surface of the rectangular plate body (1) into a rectangular ring surface and four rectangular mounting surfaces; Multiple groups of substrate suction nozzles (3); five groups of substrate suction nozzles (3) are provided on one rectangular mounting surface. Among them, four groups of substrate suction nozzles (3) are respectively arranged at the four corners of the rectangular mounting surface, and one group of substrate suction nozzles (3) is arranged at the intersection of the diagonals of the rectangular mounting surface. One group of substrate suction nozzles (3) on the rectangular mounting surface close to the intersection of the diagonals of the rectangular plate body (1) is connected to the top surface of the rectangular plate body (1) and the inner chamber, and the remaining substrate suction nozzles (3) are connected to the top surface of the rectangular plate body (1) and one inner chamber.

2. An adsorption table for advanced board level packaging large board warpage according to claim 1, wherein, The partition strip (6) includes an annular strip and a straight strip. The annular strip is in a rhombic annular structure. The four corners of the annular strip are respectively arranged opposite to the midpoints of the four sides of the annular side wall (7). The two ends of one straight strip are respectively connected to the midpoint of one side of the annular side wall (7) and one corner of the annular strip.

3. An adsorption table for advanced board level packaging large board warpage according to claim 1, wherein, There is also a circle of corner waste suction nozzles (5) evenly distributed along the four sides of the rectangular plate body (1) on the rectangular plate body (1) outside the groove (2). One corner waste suction nozzle (5) is connected to one inner chamber and the top surface of the rectangular plate body (1).

4. An adsorption table for advanced board level packaging large board warpage according to claim 1, wherein, The base (9) is provided with a plurality of first threaded holes (8), and the disc body is provided with a plurality of second threaded holes (4) penetrating through the top surface of the disc body and the bottom surface of the annular side wall (7). One first threaded hole (8) and one second threaded hole (4) are fixedly connected by bolts.

5. An adsorption table for advanced board level packaging large board warpage according to claim 1, wherein, The material of the top surface of the disc body is rubber.

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