Water cup with refrigeration function

Abstract

The utility model discloses a cup with refrigeration function, which comprises an inner cup and an outer cup, the cup wall of the outer cup comprises a plurality of semiconductor chilling plates, the plurality of semiconductor chilling plates are annularly arranged and enclose to form an accommodating cavity, the inner cup is inserted into the accommodating cavity, each semiconductor chilling plate comprises a first substrate, a second substrate and a PN junction for refrigeration, and the PN junction is arranged on the first substrate. The first substrate and the second substrate are arranged in a spaced mode, the PN junction is arranged between the first substrate and the second substrate, a supporting block is connected between the first substrate and the second substrate, the second substrate can be used for refrigerating the inner cup, and the second substrate supports the first substrate through the supporting block. According to the cup provided by the utility model, the total refrigeration area and the heat dissipation area of all the semiconductor refrigeration sheets are larger while the semiconductor refrigeration sheets are used for refrigeration, so that the arrangement of a heat dissipation fan can be omitted, silence during refrigeration is ensured, the electric energy is saved, and the energy efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of water cup technology, and in particular to a water cup with a cooling function. Background Technology

[0002] Currently, some water cups on the market are equipped with thermoelectric coolers to provide cooling and heating functions. However, because existing thermoelectric coolers are easily damaged under pressure, a cavity is typically created at the bottom of the cup to protect them. The thermoelectric cooler is then placed against the upper wall of this cavity, allowing it to float. However, this design results in a relatively small cooling and heat dissipation area for the thermoelectric cooler. Existing water cups require an additional cooling fan within the cavity to meet the cooling needs of the thermoelectric cooler. This cooling fan operation can generate noise and consume additional power. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a water cup with a cooling function. While utilizing semiconductor cooling chips for cooling, the total cooling and heat dissipation areas of all semiconductor cooling chips are larger, eliminating the need for a cooling fan, ensuring quiet operation during cooling, saving energy, and improving energy efficiency.

[0004] A water cup with a cooling function according to an embodiment of the present invention includes an inner cup and an outer cup. The outer cup wall includes a plurality of semiconductor cooling chips, which are arranged in a ring and surround to form a receiving cavity. The inner cup is inserted into the receiving cavity. Each semiconductor cooling chip includes a first substrate, a second substrate, and a PN junction for cooling. The first substrate and the second substrate are spaced apart. The PN junction is disposed between the first substrate and the second substrate. A support block is connected between the first substrate and the second substrate. The second substrate can be used to cool the inner cup. The second substrate supports the first substrate through the support block.

[0005] A water cup with a cooling function according to an embodiment of the present invention has at least the following beneficial effects: In the water cup with a cooling function provided by the present invention, by adding a support block between the first substrate and the second substrate of the semiconductor cooling chip, the semiconductor cooling chip can withstand greater pressure. Thus, the outer cup wall can be composed of at least a portion of multiple semiconductor cooling chips. Therefore, compared with the prior art method of setting the semiconductor cooling chip in the cavity at the bottom of the water cup, in the water cup provided by the present invention, the semiconductor cooling chip can be used as the outer cup wall. The second substrate of all semiconductor cooling chips can be used to cool the inner cup during the cooling process, greatly increasing the cooling area. At the same time, the first substrate of all semiconductor cooling chips can be used for heat dissipation during the cooling process, with a large heat dissipation area. Moreover, the first substrate is located at the cup wall position of the water cup, making it easier for the first substrate to dissipate heat. This makes the heat dissipation efficiency of the first substrate sufficient to meet the heat dissipation requirements of the semiconductor cooling chip during cooling, thereby eliminating the need for a cooling fan, ensuring quiet operation during cooling, saving energy, and improving energy efficiency.

[0006] According to some embodiments of the present invention, the PN junction includes a P-type semiconductor and an N-type semiconductor, and the P-type semiconductor and the N-type semiconductor are arranged side by side with at least one of the support blocks.

[0007] According to some embodiments of the present invention, in each of the semiconductor cooling chips, at least two of the PN junctions are arranged in a row at axial intervals along the receiving cavity.

[0008] According to some embodiments of the present invention, the first substrate of all the semiconductor cooling chips is connected to form an annular shell, and the annular shell serves as the outer wall of the outer cup.

[0009] According to some embodiments of the present invention, the outer cup includes a heat dissipation outer cylinder, and all of the semiconductor cooling chips are mounted on the inner wall of the heat dissipation outer cylinder.

[0010] According to some embodiments of the present invention, a main control board is included, which is disposed between the inner cup and the outer cup. The main control board is electrically connected to a temperature detection element, which is used to detect the temperature of the liquid in the inner cup. The main control board is electrically connected to the semiconductor cooling chip.

[0011] According to some embodiments of the present invention, an installation cavity is provided between the bottom of the inner cup and the outer cup, the main control board is disposed in the installation cavity, a battery is disposed in the installation cavity, and the battery is electrically connected to the main control board.

[0012] According to some embodiments of the present invention, at least a portion of the circuits on the first substrate are electrically connected to form a control circuit, and the control circuit is electrically connected to a temperature detection element, which is used to detect the temperature of the liquid inside the inner cup.

[0013] According to some embodiments of the present invention, there is a mounting cavity between the bottom of the inner cup and the outer cup, and a battery is disposed in the mounting cavity, the battery being electrically connected to the control circuit.

[0014] According to some embodiments of the present invention, the main control board is electrically connected to a display device, which is used to display the temperature detected by the temperature detection element.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a cross-sectional view of a water cup with a cooling function according to an embodiment of the present utility model;

[0018] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0019] Figure 3 for Figure 1 An axial cross-sectional view of a water cup with a cooling function is shown.

[0020] Figure 4 for Figure 1 An external schematic diagram of a water cup with a cooling function is shown.

[0021] Figure label:

[0022] Inner cup 100, outer cup 200, semiconductor cooling chip 210, first substrate 211, second substrate 212, PN junction 213, P-type semiconductor 2131, N-type semiconductor 2132, support block 2133, heat dissipation outer cylinder 220, mounting cavity 240, battery 300, main control board 400. Detailed Implementation

[0023] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0024] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0026] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0027] Reference Figures 1 to 3 According to an embodiment of the present invention, a water cup with a cooling function includes an inner cup 100 and an outer cup 200. The outer cup 200 has a wall including a plurality of semiconductor cooling chips 210. The plurality of semiconductor cooling chips 210 are arranged in a ring and surround to form a receiving cavity. The inner cup 100 is inserted into the receiving cavity. Each semiconductor cooling chip 210 includes a first substrate 211, a second substrate 212 and a PN junction 213 for cooling. The first substrate 211 and the second substrate 212 are spaced apart. The PN junction 213 is disposed between the first substrate 211 and the second substrate 212. A support block 2133 is connected between the first substrate 211 and the second substrate 212. The second substrate 212 can be used to cool the inner cup 100. The second substrate 212 supports the first substrate 211 through the support block 2133.

[0028] In the water cup with cooling function provided by this utility model, by adding a support block 2133 between the first substrate 211 and the second substrate 212 of the semiconductor cooling chip 210, the semiconductor cooling chip 210 can withstand greater pressure and has a certain degree of drop and impact resistance. Therefore, the cup wall of the outer cup 200 can be partially or entirely composed of multiple semiconductor cooling chips 210, which also meets the normal use requirements and drop resistance requirements of the water cup. Thus, compared with the prior art method where the semiconductor cooling chip 210 is disposed in the cavity at the bottom of the water cup, in the water cup provided by this utility model, the semiconductor cooling chip 210 can... Using the second substrate 212 of all the thermoelectric coolers 210 as the cup wall of the outer cup 200, the inner cup 100 can be cooled during the cooling process, significantly increasing the cooling area. Simultaneously, the first substrate 211 of all the thermoelectric coolers 210 can be used for heat dissipation during cooling, providing a larger heat dissipation area. Furthermore, the first substrate 211 is located on the cup wall, making it easier to dissipate heat. This ensures that the heat dissipation efficiency of the first substrate 211 is sufficient to meet the heat dissipation requirements of the thermoelectric coolers 210 during cooling, thus eliminating the need for a cooling fan, ensuring quiet operation, saving energy, and improving energy efficiency. In addition, the thermoelectric coolers 210 can be used as the cup wall of the outer cup 200, which helps control the overall size of the outer cup 200. Combined with the fact that the space for a cooling fan can be eliminated from the cup, the overall volume of the cup can be made smaller without changing its volume.

[0029] It is understood that when the thermoelectric cooler 210 is supplied with a current opposite to that used during cooling, the first substrate 211 of the thermoelectric cooler 210 can be used to heat the inner cup 100, while the second substrate 212 cools it. Therefore, the water cup provided by this invention can also utilize the thermoelectric cooler 210 to heat the inner cup 100. In specific implementation, by controlling the heating or cooling of the thermoelectric cooler 210, constant temperature control of the liquid inside the inner cup 100 can be achieved, allowing the liquid inside the inner cup 100 to change from a higher or lower temperature to a suitable drinking temperature. For example, in winter, through the cooling or heating of the thermoelectric cooler 210, hot water exceeding 60 degrees Celsius or cold water below 10 degrees Celsius inside the inner cup 100 can be changed to warm water of about 30 degrees Celsius. In summer, through the cooling of the thermoelectric cooler 210, hot water exceeding 60 degrees Celsius or room temperature water inside the inner cup 100 can be changed to cold water of about 10 degrees Celsius.

[0030] Reference Figure 1 and Figure 2According to some embodiments of this utility model, the PN junction 213 includes a P-type semiconductor 2131 and an N-type semiconductor 2132, which are arranged side-by-side with at least one support block 2133. With this arrangement, when the thermoelectric cooler 210 is subjected to pressure, each PN junction 213 can be supported by the support block 2133, effectively preventing damage to the PN junction 213 under pressure. This further improves the overall pressure-bearing capacity of the thermoelectric cooler 210, enabling it to withstand the gripping pressure of a hand during normal use of a water cup, and also to withstand the impact force generated when the water cup is dropped from a certain height. Furthermore, during the production of the thermoelectric cooler 210, the P-type semiconductor 2131, N-type semiconductor 2132, and support block 2133 of the PN junction 213 can be assembled together, making assembly more convenient and simpler. In practice, the pressure-bearing capacity of the semiconductor cooling chip 210 can be increased or decreased by increasing or decreasing the number of support blocks 2133.

[0031] Reference Figure 1 and Figure 2 In some embodiments, a support block 2133 is disposed side by side between the P-type semiconductor 2131 and the N-type semiconductor 2132 of the PN junction 213.

[0032] Of course, in other embodiments, the P-type semiconductor 2131 and N-type semiconductor 2132 of the PN junction 213 can also be arranged side by side between the two support blocks 2133.

[0033] Reference Figure 3 According to some embodiments of the present invention, in each semiconductor cooling chip 210, at least two PN junctions 213 are arranged in a row at intervals along the axial direction of the receiving cavity. In addition, the PN junctions 213 themselves are arranged side by side with the support block 2133, thereby enabling the semiconductor cooling chip 210 to withstand external pressure evenly.

[0034] According to some embodiments of this utility model, all the first substrates 211 of the semiconductor cooling chips 210 are connected to form an annular shell, which serves as the outer wall of the outer cup 200. With this configuration, the annular shell formed by connecting all the first substrates 211 can be directly used as the outer wall of the outer cup 200. In specific implementations, the first substrates 211 are flexible, or adjacent first substrates 211 are connected by a flexible member, thereby giving the annular shell a certain degree of flexibility.

[0035] According to some embodiments of this utility model, at least a portion of the circuits on the first substrate 211 are electrically connected to form a control circuit. The control circuit is electrically connected to a temperature detection element, which is used to detect the temperature of the liquid inside the inner cup 100. Thus, while the first substrate 211 is connected to form an annular shell, the control circuit can also be optionally placed on the annular shell, so that the annular shell forms a control board, eliminating the need for an additional control board.

[0036] Reference Figure 3 According to some embodiments of this utility model, there is an installation cavity 240 between the bottom of the inner cup 100 and the outer cup 200. A battery 300 is installed in the installation cavity 240 and is electrically connected to the control circuit. Thus, the water cup is powered by a battery 300 that is independent of the power grid, making it convenient to use the cooling and heating functions of the water cup when going out.

[0037] Reference Figure 1 and Figure 3 Of course, in other embodiments, the outer cup 200 includes a heat dissipation outer cylinder 220, and all the thermoelectric coolers 210 are mounted on the inner wall of the heat dissipation outer cylinder 220. In this case, the cup wall of the outer cup 200 can be composed of the heat dissipation outer cylinder 220 and the thermoelectric coolers 210. Since the thermoelectric coolers 210 can withstand a certain pressure, the thickness of the heat dissipation outer cylinder 220 can be thinner, which can also meet the impact resistance requirements of the cup. With the above configuration, each thermoelectric cooler 210 can be set independently, without the need for the first substrate 211 to be connected into an integral annular shell. The heat dissipation outer cylinder 220 is made of a material with good heat dissipation performance to avoid affecting the heat dissipation of the first substrate 211. In addition, the heat dissipation outer cylinder 220 can also be provided with a hollowed-out pattern for heat dissipation.

[0038] Reference Figure 3 According to some embodiments of this utility model, the water cup also includes a main control board 400, which is disposed between the inner cup 100 and the outer cup 200. The main control board 400 is electrically connected to a temperature detection element (not shown in the figure), which is used to detect the temperature of the liquid in the inner cup 100. The main control board 400 is electrically connected to a semiconductor cooling chip 210. Therefore, the main control board 400 and the semiconductor cooling chip 210 can be manufactured independently, making production simpler and more convenient.

[0039] Reference Figure 3 According to some embodiments of the present invention, an installation cavity 240 is provided between the bottom of the inner cup 100 and the outer cup 200, the main control board 400 is disposed in the installation cavity 240, a battery 300 is disposed in the installation cavity 240, and the battery 300 is electrically connected to the main control board 400.

[0040] According to some embodiments of this utility model, the main control board 400 is electrically connected to a display device (not shown in the figure). The display device is used to display the temperature detected by the temperature sensing element so that the user can view the temperature of the liquid in the water cup. The display device can be a touch screen to control the operation of the water cup; alternatively, control buttons can be provided next to the display device. Furthermore, the main control board 400 can also be electrically connected to a speaker to indicate the temperature of the liquid in the water cup.

[0041] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0042] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A water cup with refrigeration function, characterized in that, include: Inner cup (100); An outer cup (200) has a cup wall comprising a plurality of semiconductor cooling chips (210), which are arranged in a ring and enclose a receiving cavity. An inner cup (100) is inserted into the receiving cavity. Each semiconductor cooling chip (210) includes a first substrate (211), a second substrate (212), and a PN junction (213) for cooling. The first substrate (211) and the second substrate (212) are spaced apart. The PN junction (213) is disposed between the first substrate (211) and the second substrate (212). A support block (2133) is connected between the first substrate (211) and the second substrate (212). The second substrate (212) supports the first substrate (211) through the support block (2133). The second substrate (212) can be used to cool the inner cup (100).

2. The cup with a refrigeration function according to claim 1, characterized in that, The PN junction (213) includes a P-type semiconductor (2131) and an N-type semiconductor (2132), and the P-type semiconductor (2131) and the N-type semiconductor (2132) are arranged side by side with at least one of the support blocks (2133).

3. The cup with a refrigeration function according to claim 2, characterized in that, In each of the semiconductor cooling chips (210), at least two of the PN junctions (213) are arranged in a row at axial intervals along the receiving cavity.

4. The cup with a refrigeration function according to claim 1, characterized in that, The first substrate (211) of all the semiconductor cooling chips (210) are connected to form an annular shell, which serves as the outer wall of the outer cup (200).

5. The cup with a refrigeration function according to claim 1, characterized in that, The outer cup (200) includes a heat dissipation outer cylinder (220), and all of the semiconductor cooling chips (210) are mounted on the inner wall of the heat dissipation outer cylinder (220).

6. The cup with a refrigeration function according to claim 5, characterized in that, Includes a main control board (400), which is disposed between the inner cup (100) and the outer cup (200). The main control board (400) is electrically connected to a temperature detection element, which is used to detect the temperature of the liquid in the inner cup (100). The main control board (400) is electrically connected to the semiconductor cooling chip (210).

7. The cup with a refrigeration function according to claim 6, characterized in that, There is an installation cavity (240) between the bottom of the inner cup (100) and the outer cup (200), the main control board (400) is disposed in the installation cavity (240), a battery (300) is disposed in the installation cavity (240), and the battery (300) is electrically connected to the main control board (400).

8. The cup with a refrigeration function according to claim 4, characterized in that, At least a portion of the circuitry on the first substrate (211) is electrically connected to form a control circuit, which is electrically connected to a temperature sensing element for detecting the temperature of the liquid inside the inner cup (100).

9. The cup with a refrigeration function according to claim 8, characterized in that, There is a mounting cavity (240) between the bottom of the inner cup (100) and the outer cup (200), and a battery (300) is disposed in the mounting cavity (240). The battery (300) is electrically connected to the control circuit.

10. The cup with a refrigeration function according to claim 6, characterized in that, The main control panel (400) is electrically connected with a display device, and the display device is used for displaying the temperature detected by the temperature detection element.

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