Heat conduction piece for hot melt glue machine

By introducing heat-conducting components into the hot melt glue machine and utilizing heat-conducting pipe assemblies and heat exchange fin structures, the problem of uneven temperature between the upper and lower layers inside the hot melt glue box is solved, achieving faster heat transfer and higher heating efficiency.

CN224142702UActive Publication Date: 2026-04-21QUANZHOU XINWEI HOT MELT MASCH EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
QUANZHOU XINWEI HOT MELT MASCH EQUIP CO LTD
Filing Date
2025-05-16
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

The existing hot melt glue machine has a slow heat transfer rate inside the hot melt glue tank, and the heat source is concentrated in the lower layer of the tank, resulting in uneven glue temperature between the upper and lower layers, which affects the efficiency of the equipment.

Method used

The system employs heat-conducting components, including heat pipe assemblies, a base, a heat-conducting liquid, and a heat exchange mechanism. Heat is transferred through the heat pipe assemblies, and heat exchange fins are installed on the outer surface to increase the contact area and balance the temperature of the upper and lower layers of adhesive liquid inside the chamber.

Benefits of technology

It improves the heating efficiency of the adhesive liquid in the hot melt adhesive tank, shortens the time required for the adhesive liquid to be fully heated, and enhances the working efficiency of the equipment.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN224142702U_ABST
    Figure CN224142702U_ABST
Patent Text Reader

Abstract

The utility model discloses a heat conduction piece for a hot melt glue machine. The heat conduction piece comprises a glue box heat conduction mechanism, through the arrangement of the glue box heat conduction mechanism, when the hot melt glue box heats the internal glue solution, as a heat source is concentrated on the lower layer of the box body, the heat of the lower layer of the box body can be quickly transferred to the upper layer by virtue of the heat conduction pipe group, so that the temperature of the glue solution on the upper layer and the lower layer in the box body is balanced, and the time required for completely heating the glue solution is effectively shortened; the heat exchange mechanism is arranged on the outer surface of the heat conduction pipe set, the contact area between the heat conduction pipe set and the glue solution is increased through heat exchange fins of a heat exchange sleeve, and therefore the heat exchange efficiency is improved, and the heat transfer effect of the heat conduction pipe set is guaranteed.
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Description

Technical Field

[0001] This utility model relates to the field of hot melt adhesive machine technology, specifically a heat-conducting component for a hot melt adhesive machine. Background Technology

[0002] Hot melt adhesive machines are a type of mechanical equipment widely used in modern industrial production lines. With the continuous development of various industries, their application scope is becoming wider and wider. Their main function is to melt solid hot melt adhesive into hot melt adhesive liquid and pump it into the dispensing device, thereby realizing the bonding process of materials.

[0003] Existing patent application number: 202221626132.1 A large-capacity hot melt glue machine includes a hot melt glue machine body, a storage platform fixedly installed on one side of the inner wall of the hot melt glue machine body, a glue storage tank fixedly installed on the top of the storage platform, an extraction platform fixedly installed on the side of the inner wall of the hot melt glue machine body away from the storage platform, an extraction pump fixedly installed on the top of the extraction platform, lifting grooves are provided on both sides of the inner wall of the glue storage tank, lifting blocks are slidably connected inside the two lifting grooves, a sealing plate is fixedly installed between the two lifting blocks, and a turntable is rotatably connected to the top of the inner wall of the glue storage tank.

[0004] The aforementioned patent describes a hot melt adhesive machine. In use, the hot melt adhesive machine stores hot melt adhesive in a hot melt adhesive tank. An electric heater is installed at the bottom inside the hot melt adhesive tank to heat the hot melt adhesive and keep it liquefied. However, in actual use, the heat transfer speed inside the hot melt adhesive tank is slow, and the heat source is concentrated in the lower layer of the tank. There is a lack of heat-conducting components to balance the temperature of the adhesive in the upper and lower layers of the tank. The time required for the adhesive to be fully heated is long, which affects the efficiency of the equipment. Therefore, we propose a heat-conducting component for hot melt adhesive machines to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a heat-conducting component for a hot melt adhesive machine to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a heat-conducting component for a hot melt glue machine, comprising a glue box heat-conducting mechanism, wherein the glue box heat-conducting mechanism comprises a heat-conducting pipe assembly, a base, a heat-conducting liquid, and a heat exchange mechanism, wherein the bottom end of the heat-conducting pipe assembly is installed and connected to the base, the inside of the tube of the heat-conducting pipe assembly is sealed and filled with heat-conducting liquid, and a heat exchange mechanism is provided on the outer surface of the heat-conducting pipe assembly.

[0007] Preferably, the inner wall of the heat-conducting pipe assembly is provided with channels at equal intervals, and the heat-conducting liquid is filled into the channels.

[0008] Preferably, the heat exchange mechanism includes a heat exchange sleeve, mounting holes, and heat exchange fins. The heat exchange sleeve has mounting holes that extend vertically, and the number of mounting holes is the same as the number of tubes in the heat-conducting pipe assembly. The heat exchange sleeve is fitted onto the surface of the heat-conducting pipe assembly through the mounting holes, and heat exchange fins are integrally formed on the outer wall of the heat exchange sleeve.

[0009] Preferably, the inner wall of the mounting hole is lined with a silicone grease pad.

[0010] Preferably, the heat exchange fins are vertically arranged and arranged in a ring on the outer wall of the heat exchange jacket.

[0011] Preferably, the heat exchange mechanism is provided in two sets, one of which is located at the bottom hot end of the heat pipe group, and the other is located at the top cold end of the heat pipe group.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This invention incorporates a heat-conducting mechanism for the glue tank. When the hot melt glue tank heats the internal glue, the heat source is concentrated in the lower layer of the tank. With the help of the heat-conducting pipe assembly, the heat from the lower layer of the tank can be transferred to the upper layer more quickly, thereby balancing the temperature of the glue in the upper and lower layers of the tank. This effectively reduces the time required for the glue to be fully heated, thus improving the working efficiency of the equipment.

[0014] This invention improves heat exchange efficiency and ensures the heat transfer effect of the heat pipe assembly by setting a heat exchange mechanism on the outer surface of the heat pipe assembly. The heat exchange fins of the heat exchange jacket increase the contact area with the adhesive liquid, thereby improving the heat exchange efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the cross-sectional structure of the heat pipe assembly in this utility model;

[0017] Figure 3 This is a schematic diagram of the heat exchange mechanism in this utility model.

[0018] In the figure: heat conduction mechanism-1, heat conduction pipe assembly-11, channel-11a, base-12, heat conduction fluid-13, heat exchange mechanism-14, heat exchange jacket-141, mounting hole-142, heat exchange fins-143. Detailed Implementation

[0019] To further explain the technical solution of this utility model, a detailed description is provided below through specific embodiments.

[0020] Please see Figure 1-2This utility model provides a heat-conducting component for a hot melt glue machine, including a glue box heat-conducting mechanism 1. The glue box heat-conducting mechanism 1 includes a heat-conducting pipe assembly 11, a base 12, a heat-conducting liquid 13, and a heat exchange mechanism 14. The bottom end of the heat-conducting pipe assembly 11 is installed and connected to the base 12. The inside of the tube of the heat-conducting pipe assembly 11 is sealed and filled with the heat-conducting liquid 13. The heat-conducting liquid 13 serves as a highly efficient heat transfer medium, which can improve the heat transfer efficiency of the heat-conducting pipe assembly 11. Channels 11a are evenly distributed on the inner wall of the tube of the heat-conducting pipe assembly 11. The heat-conducting liquid 13 fills into the inside of the channels 11a. The channels 11a can increase the contact area between the heat-conducting pipe assembly 11 and the heat-conducting liquid 13, thereby improving the heat transfer effect. The heat exchange mechanism 14 is provided on the outer surface of the heat-conducting pipe assembly 11.

[0021] Specifically, by setting up a heat conduction mechanism 1 for the glue box, the base 12 is first installed inside the hot melt glue box to complete the assembly of the heat conduction mechanism 1 and the glue box. When the hot melt glue box heats the glue liquid inside, since the heat source is concentrated in the lower layer of the box, the heat conduction pipe group 11 can transfer the heat from the lower layer of the box to the upper layer more quickly, so as to balance the temperature of the glue liquid in the upper and lower layers of the box, effectively reducing the time required for the glue liquid to be fully heated, thereby improving the working efficiency of the equipment.

[0022] Please see Figure 3 This utility model provides a heat-conducting component for a hot melt adhesive machine. The heat exchange mechanism 14 includes a heat exchange sleeve 141, a mounting hole 142, and heat exchange fins 143. The heat exchange sleeve 141 is provided with a mounting hole 142 that runs vertically through it. The number of mounting holes 142 is the same as the number of tubes in the heat-conducting pipe assembly 11. The heat exchange sleeve 141 is fitted onto the surface of the heat-conducting pipe assembly 11 through the mounting hole 142. A silicone grease pad is laid on the inner wall of the mounting hole 142. The silicone grease pad can fill the gap between the mounting hole 142 and the heat-conducting pipe assembly 11 to improve the heat conduction efficiency. Heat exchange fins 143 are integrally provided on the outer wall of the heat exchange sleeve 141. The heat exchange fins 143 are vertically arranged and arranged in a ring on the outer wall of the heat exchange sleeve 141 to prevent the adhesive from stagnating inside the heat exchange fins 143.

[0023] Specifically, by setting a heat exchange mechanism 14 on the outer surface of the heat pipe assembly 11, the heat pipe assembly 11 increases the contact area with the adhesive through the heat exchange fins 143 of the heat exchange sleeve 141, thereby improving the heat exchange efficiency and ensuring the heat transfer effect of the heat pipe assembly 11.

[0024] To further explain, there are two sets of heat exchange mechanisms 14. One heat exchange mechanism 14 is located at the bottom hot end of the heat pipe assembly 11, and the other heat exchange mechanism 14 is located at the top cold end of the heat pipe assembly 11, so that the heat pipe assembly 11 can better balance the temperature of the adhesive liquid in the upper and lower layers of the box with the help of the heat exchange mechanism 14.

[0025] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat conducting member for a hot melt glue machine, characterized by: The device includes a heat-conducting mechanism (1) for a glue box. The heat-conducting mechanism (1) includes a heat-conducting pipe assembly (11), a base (12), a heat-conducting liquid (13), and a heat exchange mechanism (14). The bottom end of the heat-conducting pipe assembly (11) is installed and connected to the base (12). The inside of the tube of the heat-conducting pipe assembly (11) is sealed and filled with heat-conducting liquid (13). The heat exchange mechanism (14) is provided on the outer surface of the heat-conducting pipe assembly (11).

2. The heat conducting member for a hot melt adhesive machine according to claim 1, wherein: The inner wall of the heat-conducting pipe assembly (11) is provided with channels (11a) distributed at equal intervals, and the heat-conducting liquid (13) is filled into the channel (11a).

3. The heat conducting member for a hot melt adhesive machine according to claim 1, wherein: The heat exchange mechanism (14) includes a heat exchange sleeve (141), a mounting hole (142), and heat exchange fins (143). The heat exchange sleeve (141) has a mounting hole (142) that runs through it from top to bottom. The number of mounting holes (142) is the same as the number of tubes in the heat-conducting tube assembly (11). The heat exchange sleeve (141) is fitted onto the surface of the heat-conducting tube assembly (11) through the mounting hole (142). Heat exchange fins (143) are integrally provided on the outer wall of the heat exchange sleeve (141).

4. The heat conducting member for a hot melt adhesive machine according to claim 3, wherein: The inner wall of the mounting hole (142) is covered with a silicone grease pad.

5. The heat conducting member for a hot melt adhesive machine according to claim 3, wherein: The heat exchange fins (143) are vertically arranged and arranged in a ring on the outer wall of the heat exchange jacket (141).

6. The heat conducting member for a hot melt adhesive machine according to claim 1, wherein: The heat exchange mechanism (14) is provided in two sets. One heat exchange mechanism (14) is located at the bottom hot end of the heat pipe group (11), and the other heat exchange mechanism (14) is located at the top cold end of the heat pipe group (11).

Citation Information

Patent Citations

  • High-capacity hot melt glue machine

    CN217726058U