Device for welding cold plate and chip
The device, which uses a support plate, a pressure plate, and a high-temperature magnet, enables the synchronous welding of chips and cold plates, solving the problems of chip welding pollution and low efficiency in existing technologies. It achieves a high-efficiency, pollution-free welding process and ensures the uniformity of the weld layer and the cooling effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MILLI ELECTROMECHANICAL (SUZHOU) CO LTD
- Filing Date
- 2025-04-27
- Publication Date
- 2026-04-21
AI Technical Summary
In existing technologies, chip soldering to a cold plate is prone to contamination and is inefficient.
The device employs a support plate, a pressure plate, a first magnet, and a second magnet. It uses magnetic force to stabilize the relative position of the chip and the cold plate, achieving synchronous welding. The high-temperature magnet maintains stability in a high-temperature environment. The combination of clamps and clamping posts ensures chip positioning. A stripping plate is used to separate the support plate and the pressure plate.
It reduces contamination during the welding process, improves welding efficiency, and ensures uniform weld layer thickness, reducing thermal resistance and improving cooling efficiency.
Smart Images
Figure CN224143690U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip heat dissipation, and in particular to a device for welding cold plates and chips. Background Technology
[0002] To maintain stable chip operation, a cold plate is needed to dissipate heat from the chip.
[0003] Existing methods typically involve manually soldering each chip onto a cold plate one by one, which can easily lead to chip contamination and has low soldering efficiency. Utility Model Content
[0004] In view of the above-mentioned problems in the prior art, the purpose of this utility model is to provide a device for welding cold plates and chips, which can reduce pollution and achieve high welding efficiency.
[0005] To address the aforementioned problems, this utility model provides an apparatus for welding cold plates to chips, the apparatus comprising:
[0006] A support plate, the upper surface of which is used to connect to the lower surface of the cold plate, and the lower surface of the support plate having a first mounting hole;
[0007] A pressure plate is movably pressed against the upper surface of the support plate. The lower surface of the pressure plate is used to connect the upper surfaces of the plurality of chips. A second mounting hole is formed on the upper surface of the pressure plate.
[0008] A first magnet is disposed within the first mounting hole;
[0009] The second magnet is disposed within the second mounting hole.
[0010] Furthermore, the first magnet protrudes from the upper surface of the support plate by a first predetermined length, and the second magnet protrudes from the lower surface of the pressure plate by a second predetermined length. The first magnet and the second magnet enable the support plate to be at a predetermined distance from the pressure plate. The predetermined distance corresponds to the thickness of the cold plate, the thickness of the chip, and the predetermined thickness of the welding layer. The welding material used to connect the chip and the cold plate is used to weld the chip to form the welding layer.
[0011] Furthermore, both the first magnet and the second magnet are high-temperature magnets.
[0012] Furthermore, the high-temperature magnet is a neodymium magnet.
[0013] Furthermore, both the first magnet and the second magnet are formed in a columnar shape, and the first magnet is threadedly connected to the support plate or the second magnet is threadedly connected to the pressure plate.
[0014] Furthermore, the device also includes:
[0015] A first clamping piece is disposed on the lower surface of the pressure plate and is used to clamp the first side of the chip.
[0016] The second clamping piece is disposed on the lower surface of the pressure plate and spaced apart from the first clamping piece. The second clamping piece is used to clamp the second side of the chip, and the first side and the second side are disposed opposite to each other.
[0017] Furthermore, the first clip includes a first elastic clip, and / or the second clip includes a second elastic clip.
[0018] Furthermore, the device also includes:
[0019] The first clamping post is disposed on the lower surface of the pressure plate and is used to clamp the first side of the chip.
[0020] The second clamping post is disposed on the lower surface of the pressure plate and is used to clamp the second side of the chip.
[0021] Furthermore, the device also includes:
[0022] A stripping plate, wherein multiple stripping columns protruding from its upper surface are formed on the stripping plate.
[0023] The support plate has a discharge hole that can accommodate the discharge column. When the discharge column of the discharge plate passes through the discharge hole of the support plate, the top of the discharge column can press against the lower surface of the pressure plate, so that the support plate and the pressure plate are separated.
[0024] Furthermore, positioning holes are formed on the support plate, and the device further includes:
[0025] A positioning post is disposed on the lower surface of the pressure plate and can extend into the positioning hole.
[0026] Due to the above technical solution, this utility model has the following beneficial effects:
[0027] The apparatus for welding chips to a cold plate according to this utility model includes a support plate, a pressure plate, a first magnet, and a second magnet. The cold plate is placed on the support plate, and welding material (solder, etc.) is applied to the mounting area on the surface of the cold plate. Multiple chips are placed on the pressure plate, and the pressure plate is gradually moved closer to the support plate. The first magnet on the support plate attracts the second magnet on the pressure plate, stabilizing the relative position of the support plate and the pressure plate. This allows the chips to contact the welding material on the cold plate, and the welding material is then heated, thus enabling multiple chips to be simultaneously welded to the cold plate. The welding process avoids human contact, reducing contamination, and achieves high welding efficiency by simultaneously welding multiple chips to the cold plate. Furthermore, the maintenance of the first and second magnets is relatively simple. Attached Figure Description
[0028] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.
[0029] Figure 1 This is a structural diagram of a welding device, a chip, and a cold plate according to an embodiment of the present invention;
[0030] Figure 2 This is a structural diagram of a support plate, a cold plate, and a first magnet according to an embodiment of the present invention;
[0031] Figure 3 This is a structural diagram of a pressure plate, a second magnet, a first clamping piece, a second clamping piece, a first clamping post, a second clamping post, and a positioning post according to an embodiment of the present utility model;
[0032] Figure 4 This is a structural diagram of the stripping plate, support plate and pressure plate in a first state according to an embodiment of the present utility model;
[0033] Figure 5 This is a structural diagram of the stripping plate, support plate and pressure plate in a second state according to an embodiment of the present invention;
[0034] Figure 6 This is a structural diagram of the stripping plate, support plate and pressure plate in a third state according to an embodiment of the present invention.
[0035] Figure label:
[0036] 100, Support plate; 110, Positioning hole; 120, Stripping hole; 200, Pressure plate; 310, Chip; 320, Cold plate; 410, First magnet; 420, Second magnet; 500, Positioning post; 610, First clamping post; 620, First clamping piece; 700, Stripping plate; 710, Stripping post. Detailed Implementation
[0037] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.
[0038] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.
[0039] The apparatus for welding cold plate 320 and chip 310 according to an embodiment of the present invention will be described below.
[0040] like Figures 1 to 6 As shown, the device for welding cold plate 320 and chip 310 according to an embodiment of the present invention includes a support plate 100, a pressure plate 200, a first magnet 410 and a second magnet 420.
[0041] First, the support plate 100 will be described. The upper surface of the support plate 100 is used to connect to the lower surface of the cold plate 320. A first mounting hole is formed on the lower surface of the support plate 100.
[0042] like Figure 1 and Figure 2 As shown, a cold plate 320 is supported on the support plate 100, and the cold plate 320 has three mounting areas, which can accommodate three chips 310. Two first mounting holes are formed at both ends of the support plate 100 along its length.
[0043] It should be noted that the number of chips 310 is not limited above; it can be four, five, etc., and these should all be understood within the scope of this utility model.
[0044] Next, the pressure plate 200 will be described. The pressure plate 200 is movably pressed onto the upper surface of the support plate 100, and the lower surface of the pressure plate 200 is used to connect the upper surfaces of the plurality of chips 310. A second mounting hole is formed on the upper surface of the pressure plate 200.
[0045] like Figure 1 and Figure 3 As shown, three chips 310 are connected to the lower surface of the pressure plate 200, and the three chips 310 correspond one-to-one with the three mounting areas. Two second mounting holes corresponding to the first mounting holes are formed at both ends of the length direction of the pressure plate 200.
[0046] Finally, the first magnet 410 and the second magnet 420 are described. The first magnet 410 is disposed within the first mounting hole. The second magnet 420 is disposed within the second mounting hole.
[0047] The first magnet 410 is installed in the first mounting hole, and the second magnet 420 is installed in the second mounting hole. When the support plate 100 approaches the pressure plate 200, the first magnet 410 and the second magnet 420 attract each other, thereby stabilizing the relative position of the support plate 100 and the pressure plate 200 and facilitating welding.
[0048] The above-described apparatus for welding the cold plate 320 and the chip 310 includes a support plate 100, a pressure plate 200, a first magnet, and a second magnet. The cold plate 320 can be placed on the support plate 100, and welding material (solder, etc.) can be applied to the mounting area on the surface of the cold plate 320. Multiple chips 310 are placed on the pressure plate 200. The pressure plate 200 is gradually moved closer to the support plate 100. The first magnet on the support plate 100 attracts the second magnet on the pressure plate 200, stabilizing the relative position of the support plate 100 and the pressure plate 200. This allows the chip 310 to contact the welding material on the cold plate 320, and the welding material is then heated, thus enabling multiple chips 310 to be simultaneously welded to the cold plate 320. The welding process avoids human contact, reducing contamination, and achieves high welding efficiency by simultaneously welding multiple chips 310 to the cold plate 320. Furthermore, the maintenance of the first and second magnets is relatively simple.
[0049] In some embodiments of this utility model, the first magnet 410 protrudes from the upper surface of the support plate 100 by a first predetermined length, and the second magnet 420 protrudes from the lower surface of the pressure plate 200 by a second predetermined length. The first magnet 410 and the second magnet 420 enable the support plate 100 to be at a predetermined distance from the pressure plate 200. The predetermined distance corresponds to the thickness of the cold plate 320, the thickness of the chip 310, and the predetermined thickness of the welding layer. The welding material forms the welding layer after welding.
[0050] Before welding, the first magnet and the second magnet do not necessarily need to be in contact. The relative positions of the pressure plate 200 and the support plate 100 can be stabilized by relying on magnetic force.
[0051] After the welding materials are used for welding, a welding layer of predetermined thickness needs to be formed between the chip 310 and the cold plate 320 to achieve better welding between the chip 310 and the cold plate 320 and reduce thermal resistance. After welding, the first magnet and the second magnet are in contact and abut against each other. By adjusting the first predetermined length of the first magnet 410 and the second predetermined length of the second magnet, a predetermined distance can be made between the support plate 100 and the pressure plate 200. This predetermined distance is relative to the thickness of the cold plate 320, the thickness of the chip 310, and the predetermined thickness of the welding layer, so that the welding layer forms a predetermined thickness, thereby making the welding layer uniformly distributed and having low thermal resistance, improving cooling efficiency, and avoiding the problem of high thermal resistance and poor soldering between the chip 310 and the cold plate 320 caused by the unstable thickness of the welding layer due to other welding methods.
[0052] In some embodiments of this utility model, both the first magnet 410 and the second magnet 420 are high-temperature magnets.
[0053] During the welding process, a large amount of heat is generated. The high-temperature magnet enables the first and second magnets to still attract each other despite the high temperature environment, thereby increasing the positional stability of the welding process of the support weld and pressure plate 200.
[0054] Furthermore, the high-temperature magnet is a neodymium magnet.
[0055] Neodymium magnets have high magnetic properties, can generate sufficient magnetic force in a small volume, and have good high temperature resistance, which well meets the application requirements.
[0056] In some embodiments of this utility model, the first magnet 410 and the second magnet 420 are both formed in a columnar shape, and the first magnet 410 is threadedly connected to the support plate 100 or the second magnet 420 is threadedly connected to the pressure plate 200.
[0057] The first magnet 410 and the support plate 100 are threadedly connected, or the second magnet 420 and the pressure plate 200 are threadedly connected. By rotating the first magnet and the second magnet, the first predetermined length and the second predetermined length can be easily adjusted, thereby changing the predetermined distance between the pressure plate 200 and the support plate 100. This can meet the needs of welding layers of different thicknesses, avoid the need to replace different magnets for different predetermined thicknesses of welding layers, improve applicability, and save costs.
[0058] In some embodiments of this utility model, the device further includes a first clamping piece 620 and a second clamping piece. The first clamping piece 620 is disposed on the lower surface of the pressure plate 200 and is used to clamp a first side of the chip 310. The second clamping piece is disposed on the lower surface of the pressure plate 200 and spaced apart from the first clamping piece, and is used to clamp a second side of the chip 310. The first side and the second side are disposed opposite to each other.
[0059] like Figure 3 As shown, three first clamping pieces 620 clamp the first side of the three chips 310, and three second clamping pieces clamp the second side of the three chips 310, which can stabilize the relative position of the chips 310 and the pressure plate 200 and prevent the chips 310 from falling off during the flipping and moving of the pressure plate 200.
[0060] Furthermore, the first clip 620 includes a first elastic clip, and / or the second clip includes a second elastic clip.
[0061] The first clip 620 includes a first elastic clip, and / or the second clip includes a second elastic clip, which facilitates the placement and removal of the chip 310.
[0062] Furthermore, the device also includes a first clamping post 610 and a second clamping post. The first clamping post 610 is disposed on the lower surface of the pressure plate 200 and is used to clamp a first side of the chip 310. The second clamping post is disposed on the lower surface of the pressure plate 200 and is used to clamp a second side of the chip 310.
[0063] like Figure 2 As shown, three sets of first clamping posts 610 (each set of first clamping posts 610 includes two first clamping posts 610) clamp the first side of the chip 310, and three sets of second clamping posts (each set of second clamping posts includes two second clamping posts) clamp the second side of the chip 310. The first clamping posts 610 and the second clamping posts can position the chip 310, preventing horizontal movement. Combined with the first elastic clip and / or the second elastic clip, precise horizontal positioning of the chip 310 can be achieved while simultaneously providing elastic clamping.
[0064] In some embodiments of this utility model, the device further includes a stripping plate 700. A plurality of stripping posts 710 protruding from the upper surface of the stripping plate 700 are formed thereon. A stripping hole 120 is formed on the support plate 100, capable of housing the stripping posts 710. When the stripping posts 710 of the stripping plate 700 pass through the stripping hole 120 of the support plate 100, the top end of the stripping post 710 can press against the lower surface of the pressure plate 200, thereby separating the support plate 100 and the pressure plate 200.
[0065] After chip 310 is soldered onto cold plate 320 using soldering material, firstly, as Figure 4 As shown, a stripper plate 700 is placed below the support plate 100 and the pressure plate 200. Next, as... Figure 5 As shown, the stripping column 710 of the stripping plate 700 is inserted into the stripping hole 120 of the support plate 100. Then, as... Figure 6The stripping column 710 of the stripping plate presses against the pressure plate 200, and the support plate 100 is manually pressed down to separate the support plate 100 and the pressure plate 200, making it easier to remove the cold plate 320 with the chip 310.
[0066] In some embodiments of this utility model, a positioning hole 110 is formed on the support plate 100, and the device further includes a positioning post 500. The positioning post 500 is disposed on the lower surface of the pressure plate 200, and the positioning post 500 can extend into the positioning hole 110.
[0067] like Figure 2 and Figure 3 As shown, as the pressure plate 200 approaches the pressure plate 200, the positioning post 500 located on the pressure plate 200 gradually extends into the positioning hole 110 of the support plate 100, which can easily align the chip 310 with the mounting area of the cold plate 320.
[0068] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. An apparatus for cold plate to die bonding, characterized by, The device includes: A support plate, the upper surface of which is used to connect to the lower surface of the cold plate, and the lower surface of the support plate having a first mounting hole; A pressure plate is movably pressed against the upper surface of the support plate. The lower surface of the pressure plate is used to connect the upper surfaces of the plurality of chips. A second mounting hole is formed on the upper surface of the pressure plate. A first magnet is disposed within the first mounting hole; The second magnet is disposed within the second mounting hole.
2. The apparatus for cold plate to die bonding of claim 1, wherein, The first magnet protrudes from the upper surface of the support plate by a first predetermined length, and the second magnet protrudes from the lower surface of the pressure plate by a second predetermined length. The first magnet and the second magnet enable the support plate to be at a predetermined distance from the pressure plate. The predetermined distance corresponds to the thickness of the cold plate, the thickness of the chip, and the predetermined thickness of the welding layer. The welding material used to connect the chip and the cold plate is used to weld the chip to form the welding layer.
3. The apparatus for cold plate to die bonding of claim 1, wherein, Both the first magnet and the second magnet are high-temperature magnets.
4. The apparatus for cold plate to die bonding of claim 3, wherein, The high-temperature magnet is a neodymium magnet.
5. The apparatus for cold plate to die bonding of claim 2, wherein, Both the first magnet and the second magnet are formed in a columnar shape, and the first magnet is threadedly connected to the support plate or the second magnet is threadedly connected to the pressure plate.
6. The apparatus for cold plate to die bonding of claim 1, wherein, The device further includes: A first clamping piece is disposed on the lower surface of the pressure plate and is used to clamp the first side of the chip. The second clamping piece is disposed on the lower surface of the pressure plate and spaced apart from the first clamping piece. The second clamping piece is used to clamp the second side of the chip, and the first side and the second side are disposed opposite to each other.
7. The apparatus for cold plate to die bonding of claim 6, wherein, The first clip includes a first elastic clip, and / or the second clip includes a second elastic clip.
8. The apparatus for cold plate to die bonding of claim 6, wherein, The device further includes: The first clamping post is disposed on the lower surface of the pressure plate and is used to clamp the first side of the chip. The second clamping post is disposed on the lower surface of the pressure plate and is used to clamp the second side of the chip.
9. The apparatus for cold plate to die bonding of claim 1, wherein, The device further includes: A stripping plate, wherein multiple stripping columns protruding from its upper surface are formed on the stripping plate. The support plate has a discharge hole that can accommodate the discharge column. When the discharge column of the discharge plate passes through the discharge hole of the support plate, the top of the discharge column can press against the lower surface of the pressure plate, so that the support plate and the pressure plate are separated.
10. The apparatus for cold plate to die bonding of claim 1, wherein, The support plate has positioning holes, and the device further includes: A positioning post is disposed on the lower surface of the pressure plate and can extend into the positioning hole.