Uniform tin plating device for copper wire tin plating

By designing a combination of liquid level observation window, sealing gasket, pressure control pump and heating structure in the copper wire tin plating device, the problems of uneven tin plating and poor adhesion were solved, and the uniformity and high efficiency of copper wire tin plating were achieved.

CN224148144UActive Publication Date: 2026-04-21JIANGXI SHUHONG NEW MATERIAL TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202521060019.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-27
Publication Date
2026-04-21
Estimated Expiration
2035-05-27

AI Technical Summary

Technical Problem

Existing copper wire tinning equipment suffers from uneven tinning, poor adhesion, and copper wire deviation during the tinning process, resulting in low tinning accuracy and efficiency.

Method used

A copper wire tin plating device was designed, comprising a tin bath tank, a liquid inlet structure, a tin plating assembly, a centrifugal structure, a lead wire structure, and a heating structure. Through the combination of a liquid level observation window, a sealing gasket, a pressure control pump, a lead wire roller, and a heating structure, uniform coating, stable supply, and precise control of the tin bath are achieved, ensuring the uniformity and adhesion of the copper wire tin plating.

Benefits of technology

It improves the uniformity and efficiency of tin plating, ensures the uniformity and adhesion of the tin plating layer, reduces production costs, and meets the needs of modern production.

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Abstract

The utility model discloses a uniform tinning device for tinning a copper wire. The uniform tinning device comprises a tin liquid box, a liquid inlet structure, a tinning assembly, a centrifugal structure, a lead structure and a heating structure, a liquid level observation window is installed on the front surface of the tin liquid box in a nested mode, a tin box cover plate is installed on the tin liquid box through a hinge, a tin plating assembly is installed on the upper surface of the tin box cover plate, a tin plating door is installed on the tin plating assembly through a hinge, one end of the tin plating assembly communicates with the tin liquid box through a liquid inlet structure, and a centrifugal structure is installed on the front surface of the tin liquid box. Three lead structures and three heating structures are installed in the tin plating assembly. According to the utility model, the lead structure is matched with the heating structure, so that the copper wire body can be subjected to all-directional tin plating treatment in the tin plating process, and the uniformity and adhesive force of a tin plating layer are ensured.
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