Uniform tin plating device for copper wire tin plating
By designing a combination of liquid level observation window, sealing gasket, pressure control pump and heating structure in the copper wire tin plating device, the problems of uneven tin plating and poor adhesion were solved, and the uniformity and high efficiency of copper wire tin plating were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGXI SHUHONG NEW MATERIAL TECHNOLOGY CO LTD
- Filing Date
- 2025-05-27
- Publication Date
- 2026-04-21
AI Technical Summary
Existing copper wire tinning equipment suffers from uneven tinning, poor adhesion, and copper wire deviation during the tinning process, resulting in low tinning accuracy and efficiency.
A copper wire tin plating device was designed, comprising a tin bath tank, a liquid inlet structure, a tin plating assembly, a centrifugal structure, a lead wire structure, and a heating structure. Through the combination of a liquid level observation window, a sealing gasket, a pressure control pump, a lead wire roller, and a heating structure, uniform coating, stable supply, and precise control of the tin bath are achieved, ensuring the uniformity and adhesion of the copper wire tin plating.
It improves the uniformity and efficiency of tin plating, ensures the uniformity and adhesion of the tin plating layer, reduces production costs, and meets the needs of modern production.
Smart Images
Figure CN224148144U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of tin plating application technology, specifically to a uniform tin plating device for copper wire tin plating. Background Technology
[0002] Tinned copper wire refers to copper wire with a thin layer of tin plated on its surface. Tinned copper wire is relatively soft, has good conductivity, and compared to bare copper wire, it has stronger corrosion resistance and oxidation resistance, which can greatly extend the service life of low-voltage cables. Tinning also prevents the insulating rubber from becoming sticky, the wire core from turning black and brittle, and improves its solderability. Tinned copper wire is mainly used as the conductive core in rubber-insulated mining cables, flexible wires, flexible cables, and marine cables, as well as as the outer shielding braided layer and brush wire of cables.
[0003] The existing uniform tin plating equipment for copper wire tin plating has the following drawbacks:
[0004] 1. Existing uniform tinning equipment for copper wire tinning often results in uneven tinning on the surface of the copper wire during the zinc plating process, and the adhesion of the tin plating is poor.
[0005] 2. Existing uniform tinning devices for copper wire tinning are prone to wire deviation during the wire routing process, resulting in low accuracy and efficiency of tinning. To address this issue, we propose a uniform tinning device for copper wire tinning. Utility Model Content
[0006] The purpose of this invention is to provide a uniform tin plating device for copper wire tin plating, so as to solve the problems mentioned in the background art.
[0007] To achieve the above objectives, this utility model provides the following technical solution: a uniform tin plating device for copper wire tin plating, comprising a tin bath tank, a liquid inlet structure, a tin plating assembly, a centrifugal structure, a lead wire structure, and a heating structure; a liquid level observation window is nested on the front surface of the tin bath tank, allowing operators to directly observe the tin liquid level within the tank without opening the tin bath cover, thereby improving work efficiency and reducing operational risks; simultaneously, real-time liquid level monitoring helps ensure the tin liquid is maintained at an appropriate level, avoiding disruption to the production process due to excessive or insufficient tin liquid; the tin bath tank is fitted with a tin bath cover via hinges, and the tin bath cover is connected by a hinge... The page-mounted design allows for easy opening and closing, enabling operators to easily access the solder bath for maintenance, cleaning, or adding solder when needed. This design not only improves operational convenience but also helps maintain the cleanliness and proper functioning of the solder bath. A tin plating assembly is mounted on the upper surface of the solder bath cover. This assembly, the core of the device, is responsible for evenly coating the copper wire with solder. Its ingenious design ensures optimal results with each plating operation through precise control of the plating speed and amount. Furthermore, the tight connection between the plating assembly and the solder bath cover guarantees the stability of the plating process and effectively prevents solder leakage, thus improving the overall efficiency. The device prioritizes safety and reliability. The tin plating assembly is equipped with a tin plating door, which is hinged to the assembly. This design allows for flexible opening and closing of the door, facilitating necessary adjustments and inspections during the tin plating process. Simultaneously, the closed door maintains a sealed tin plating environment, preventing external interference and improving plating quality and efficiency. One end of the tin plating assembly connects to the tin bath tank via a cleverly designed inlet structure. This inlet structure ensures a smooth and continuous flow of tin from the tank to the assembly, guaranteeing a sufficient supply of tin during plating. Through a reasonable flow channel design, waste and splashing of molten solder during the flow process are effectively avoided, improving the utilization rate of molten solder. At the same time, the tight fit between the inlet structure, the tin plating components, and the molten solder tank enhances the sealing of the entire device, further preventing leakage of molten solder and ensuring the safety and stability of the tin plating process. The front surface of the molten solder tank is equipped with a centrifugal structure. The centrifugal structure has a unique design, and its main function is to promote the circulation of molten solder in the molten solder tank, thereby ensuring uniform temperature of molten solder and effective separation of impurities in molten solder. This design not only improves the stability and uniformity of the tin plating process, but also extends the service life of molten solder and reduces production costs.The centrifugal structure achieves precise control over the flow of molten tin through accurate adjustment of rotation speed and flow direction, ensuring a stable and high-quality supply of molten tin to the tin plating assembly. The tin plating assembly internally houses three lead-wire structures and three heating structures. The lead-wire structures are evenly distributed throughout the assembly, with two heating structures positioned on either side of the central lead-wire structure and one heating structure located near the rear end of the lead-wire structure on the side of the molten tin inlet. The copper wire passes sequentially through the inlet circular hole, three lead-wire rollers, and three heat conduction tubes before exiting through the outlet circular hole, resulting in more uniform tin plating. This design ensures the copper wire is heated evenly during tin plating, improving uniformity and efficiency. The three lead-wire structures ensure stable advancement of the copper wire during tin plating, preventing uneven plating caused by wire movement. The precise placement of the heating structures ensures the copper wire receives sufficient heat during tin plating, further improving quality and efficiency. The combined use of the lead-wire and heating structures allows for comprehensive tin plating of the copper wire, ensuring uniformity and adhesion of the tin layer.
[0008] Preferably, sealing gaskets are installed on the lower surfaces of the tin box cover and the tin plating door. The installation of sealing gaskets not only improves the sealing performance of the tin plating device, but also further ensures the stability and safety of the tin plating process. In addition, the tight fit between the tin box cover and the tin plating door through the sealing gaskets can effectively prevent external air and impurities from entering the interior of the tin plating device, thereby ensuring the purity of the tin plating environment and the quality of tin plating. This design allows the tin plating device to maintain good sealing effect and tin plating performance during long-term use. Moreover, the sealing gaskets are made of PTFE material, which has good corrosion resistance and high temperature resistance, effectively preventing leakage of tin plating liquid, and ensuring that the seal will not fail due to temperature changes during high-temperature tin plating.
[0009] Preferably, the liquid inlet structure is equipped with a pressure control pump. The output end of the pressure control pump is connected to one end of the liquid outlet branch pipe, and the other end of the liquid outlet branch pipe is connected to the tin plating tank. The input end of the pressure control pump is connected to one end of the liquid inlet branch pipe, and the other end of the liquid inlet branch pipe is connected to the tin liquid tank. The setting of the pressure control pump enables the tin plating liquid to be delivered to the tin plating tank at a certain pressure and flow rate, thereby ensuring precise control of the tin plating process. By adjusting the output pressure of the pressure control pump, the flow rate of the tin plating liquid can be precisely controlled. This not only improves the tin plating efficiency but also ensures the uniformity and consistency of the tin plating layer thickness. At the same time, the close cooperation between the pressure control pump, the liquid inlet branch pipe, and the liquid outlet branch pipe ensures the stability and continuity of the tin plating liquid during the delivery process, avoiding leakage and waste of the tin plating liquid, thereby improving the tin plating efficiency. This design not only improves the working efficiency of the tin plating device but also further reduces production costs, meeting the needs of modern production.
[0010] Preferably, the tin plating assembly is equipped with a tin plating box. Five circular inlet holes are formed on one side wall of the tin plating box, and five circular outlet holes are formed on the other side wall. The diameters of the inlet and outlet holes are the same. This arrangement of five inlet and five outlet holes is designed to meet the tin plating requirements of multi-strand copper wires, ensuring that each copper wire can pass through the tin plating box uniformly and efficiently for tin plating. Each inlet hole corresponds to one outlet hole, ensuring sufficient contact between the copper wire and the tin plating solution, thereby improving the tin plating quality and efficiency. Simultaneously, the identical diameter of the inlet and outlet holes ensures the consistency of the copper wire diameter before and after tin plating, avoiding problems such as copper wire damage or uneven tin plating caused by differences in hole diameter. Furthermore, the reasonable structural design of the tin plating box allows the tin plating solution to evenly cover the copper wire, further ensuring the uniformity and thickness consistency of the tin plating layer. This design of the tin plating assembly not only improves the practicality and flexibility of the tin plating device but also meets the tin plating requirements of copper wires of different specifications, providing strong support for modern production.
[0011] Preferably, the lead wire structure is equipped with a U-shaped frame, and a lead wire roller is mounted on the U-shaped frame via a rotating shaft. Five lead wire grooves are evenly distributed on the lead wire roller, with each groove directly opposite the inlet and outlet circular holes. This arrangement ensures that the copper wire is accurately guided into the inlet circular hole, smoothly passes through the tin plating bath for tin plating, and is then exited through the outlet circular hole. The precise alignment of each lead wire groove with its corresponding inlet and outlet circular holes further ensures the accurate tin plating path of the copper wire and guarantees sufficient contact between the copper wire and the tin plating solution, thereby improving the accuracy and efficiency of tin plating. Simultaneously, the rotating shaft design of the U-shaped frame allows the lead wire roller to rotate flexibly, reducing friction between the copper wire and the lead wire structure and effectively protecting the surface quality of the copper wire. This lead wire structure design not only improves the automation level of the tin plating device but also provides a more convenient and efficient tin plating solution for modern production.
[0012] Preferably, the centrifugal structure is equipped with a centrifuge. The rotation of the centrifuge generates centrifugal force, promoting the flow of molten tin within the pipe and further improving the uniformity of tin plating. The centrifuge is fixed to the front surface of the molten tin tank, and the output end of the molten tin tank is connected to the centrifugal pipe, which is installed on the molten tin tank. The tight connection between the centrifuge and the molten tin tank ensures a stable and continuous supply of molten tin to the centrifugal pipe, providing sufficient molten tin resources for the copper wire tin plating process. The centrifugal pipe is equipped with a centrifugal vent, which helps to balance the air pressure within the centrifugal pipe during centrifugal operation and prevents air leakage. Excessive pressure can cause molten tin to splash out or affect the centrifugal effect. Simultaneously, the centrifugal vent promotes the discharge of gas from the molten tin, further improving the uniformity and quality of tin plating. The vent is located inside the molten tin tank, allowing for better control of the gas discharge direction and flow rate, ensuring that gas discharge does not interfere with the tin plating process. It also helps maintain pressure balance within the molten tin tank, further guaranteeing the stability and uniformity of the tin plating process. The entire centrifugal structure design fully considers various factors in the tin plating process, aiming to improve the uniformity and efficiency of tin plating, providing an effective solution for tin plating copper wire.
[0013] Preferably, the heating structure is equipped with a fixing frame, which is designed to be stably installed on the heating structure. Its main function is to support and fix the heating element, ensuring that the heating element can heat the molten tin evenly and stably. With the stable support of the fixing frame, the heating structure can more effectively exert its heating function, providing a stable temperature environment for the tinning process of copper wire, thereby further ensuring the uniformity and quality of tinning. Five heat conduction cylinders are installed equidistantly on the fixing frame. The equidistant installation of the five heat conduction cylinders ensures the uniformity and efficiency of heating, avoiding tinning quality problems caused by uneven heating of the copper wire. Spring heating wires are sleeved on the heat conduction cylinders. The design of the spring heating wires can effectively heat the heat conduction cylinders, thereby evenly transferring heat to the copper wire, ensuring that the copper wire can obtain uniform heat distribution during the tinning process. The elastic design of the spring heating wires also allows them to adapt to copper wires of different diameters, improving the applicability and flexibility of the device. Through precise control of the heating structure, precise temperature control of the copper wire tinning process can be achieved, thereby further improving the uniformity and quality of tinning.
[0014] Compared with the prior art, the beneficial effects of this utility model are:
[0015] 1. The tin plating assembly of this utility model has three lead wire structures and three heating structures installed inside. The lead wire structures are evenly distributed inside the tin plating assembly, and two heating structures are set on both sides of the middle lead wire structure. One heating structure is set near the rear end of the lead wire structure on the side of the liquid inlet structure. The copper wire body passes through the inlet circular hole, three lead wire rollers, and three heat conduction tubes in sequence and then exits from the outlet circular hole, making the tin plating more uniform. This design allows the copper wire body to be heated evenly during the tin plating process, improving the uniformity and efficiency of tin plating. The setting of three lead wire structures ensures that the copper wire body can move stably during the tin plating process, avoiding the problem of uneven tin plating caused by the shaking of the copper wire body. The precise layout of the heating structures allows the copper wire body to receive sufficient heat during the tin plating process, further improving the tin plating quality and efficiency. The cooperation of the lead wire structure and the heating structure allows the copper wire body to receive all-round tin plating treatment during the tin plating process, ensuring the uniformity and adhesion of the tin plating layer.
[0016] 2. The lead wire structure of this utility model is equipped with a U-shaped frame, and a lead wire roller is mounted on the U-shaped frame via a rotating shaft. Five lead wire grooves are evenly distributed on the lead wire roller, and these grooves are directly opposite the inlet and outlet circular holes. This arrangement ensures that the copper wire can be accurately guided into the inlet circular hole, smoothly pass through the tin plating box for tin plating, and then exit through the outlet circular hole. The precise alignment of each lead wire groove with its corresponding inlet and outlet circular holes not only further ensures the accuracy of the tin plating path but also guarantees sufficient contact between the copper wire and the tin plating solution, thereby improving the accuracy and efficiency of tin plating. Simultaneously, the rotating shaft design of the U-shaped frame allows the lead wire roller to rotate flexibly, reducing friction between the copper wire and the lead wire structure and effectively protecting the surface quality of the copper wire. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0018] Figure 2 This is a schematic diagram of the internal structure of the present invention;
[0019] Figure 3 This is a schematic diagram of the heating structure of this utility model;
[0020] Figure 4 This is a cross-sectional view of the present invention;
[0021] In the diagram: 1. Solder bath tank; 2. Liquid level observation window; 3. Solder bath cover; 4. Liquid inlet structure; 41. Liquid outlet branch pipe; 42. Pressure control pump; 43. Liquid inlet branch pipe; 5. Solder plating assembly; 51. Solder plating tank; 52. Circular inlet hole; 53. Circular outlet hole; 6. Solder plating door; 7. Centrifugal structure; 71. Centrifugal pipe; 72. Centrifugal vent; 73. Centrifuge; 8. Lead wire structure; 9. Heating structure; 91. Fixing frame; 92. Heat conduction cylinder; 93. Spring heating wire. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Example 1
[0024] like Figure 1-4As shown, one embodiment of this utility model is a uniform tin plating device for copper wire tin plating, comprising a tin bath tank 1, a liquid inlet structure 4, a tin plating assembly 5, a centrifugal structure 7, a lead wire structure 8, and a heating structure 9. A liquid level observation window 2 is nested on the front surface of the tin bath tank 1. The installation of the liquid level observation window 2 allows the operator to directly observe the tin liquid level in the tin bath tank 1 without opening the tin bath cover 3, thereby improving work efficiency and reducing operational risks. Simultaneously, real-time liquid level monitoring helps ensure that the tin liquid is maintained at an appropriate level, avoiding disruption to the production process due to excessive or insufficient tin liquid. The tin bath tank 1 is fitted with a tin bath cover 3 via hinges. The page-mounted design facilitates easy opening and closing, allowing operators to easily access the interior of the solder bath 1 for maintenance, cleaning, or adding solder when needed. This design not only improves operational convenience but also helps maintain the cleanliness and normal operation of the solder bath 1. A tin plating assembly 5 is installed on the upper surface of the solder bath cover 3. This assembly is the core component of the device, responsible for evenly coating the copper wire with solder. Its ingenious design ensures ideal results with each plating operation through precise control of the plating speed and amount. Furthermore, the tight connection between the tin plating assembly 5 and the solder bath cover 3 not only guarantees the stability of the plating process but also effectively prevents solder leakage, improving the overall performance of the device. To ensure safety and reliability, the tin plating assembly 5 is fitted with a tin plating door 6 via hinges. This design allows the tin plating door 6 to be opened and closed flexibly, facilitating necessary adjustments or inspections by operators during the tin plating process. Simultaneously, the closed state of the tin plating door 6 maintains a sealed tin plating environment, preventing external factors from interfering with the tin plating process, thereby improving tin plating quality and efficiency. One end of the tin plating assembly 5 is connected to the tin bath tank 1 via a liquid inlet structure 4. The ingeniously designed liquid inlet structure 4 ensures a smooth and continuous flow of tin liquid from the tin bath tank 1 into the tin plating assembly 5. This connection design not only guarantees a sufficient supply of tin liquid during the tin plating process... Furthermore, through a reasonable flow channel design, waste and splashing of molten tin during the flow process are effectively avoided, improving the utilization rate of molten tin. At the same time, the tight fit between the liquid inlet structure 4, the tin plating component 5, and the molten tin tank 1 enhances the sealing of the entire device, further preventing leakage of molten tin and ensuring the safety and stability of the tin plating process. The front surface of the molten tin tank 1 is equipped with a centrifugal structure 7. The centrifugal structure 7 has a unique design, and its main function is to promote the circulation of molten tin in the molten tin tank 1, thereby ensuring uniform temperature of molten tin and effective separation of impurities in molten tin. This design not only improves the stability and uniformity of the tin plating process, but also extends the service life of molten tin and reduces production costs.The centrifugal structure 7 achieves precise control of the molten tin flow by accurately regulating the rotation speed and flow direction, ensuring a stable and high-quality molten tin supply to the tin plating assembly 5. The tin plating assembly 5 is internally equipped with three lead wire structures 8 and three heating structures 9. The lead wire structures 8 are evenly distributed inside the tin plating assembly 5, and two heating structures 9 are located on either side of the middle lead wire structure 8. One heating structure 9 is located near the rear end of the lead wire structure 8 on the side of the liquid inlet structure 4. The copper wire body passes sequentially through the inlet circular hole 52, three lead wire rollers, and three heat conduction tubes 92 before exiting through the outlet circular hole 53, thus facilitating the plating process. The tin plating is more uniform. This design allows the copper wire to be heated evenly during the tin plating process, improving the uniformity and efficiency of the plating. The three lead structures 8 ensure the copper wire moves stably during tin plating, avoiding uneven plating caused by the copper wire shaking. The precise layout of the heating structure 9 ensures the copper wire receives sufficient heat during tin plating, further improving the quality and efficiency of the plating. The cooperation between the lead structures 8 and the heating structure 9 allows the copper wire to receive comprehensive tin plating, ensuring the uniformity and adhesion of the tin layer.
[0025] Example 2
[0026] like Figure 1 As shown, the present invention proposes a uniform tinning device for copper wire tinning. Compared with Embodiment 1, this embodiment further includes: sealing gaskets installed on the lower surfaces of the tin box cover plate 3 and the tinning door 6. The sealing gaskets not only improve the sealing performance of the tinning device, but also further ensure the stability and safety of the tinning process. In addition, the tight fit between the tin box cover plate 3 and the tinning door 6 through the sealing gaskets can effectively prevent external air and impurities from entering the interior of the tinning device, thereby ensuring the purity of the tinning environment and the tinning quality. This design allows the tinning device to maintain good sealing effect and tinning performance during long-term use. Moreover, the sealing gaskets are made of PTFE material, which has good corrosion resistance and high temperature resistance, effectively preventing leakage of tinning liquid, and ensuring that the seal will not fail due to temperature changes during high-temperature tinning.
[0027] In this embodiment, as Figure 2 and Figure 4As shown, a pressure control pump 42 is installed on the liquid inlet structure 4. The output end of the pressure control pump 42 is connected to one end of the liquid outlet branch pipe 41, and the other end of the liquid outlet branch pipe 41 is connected to the tin plating tank 51. The input end of the pressure control pump 42 is connected to one end of the liquid inlet branch pipe 43, and the other end of the liquid inlet branch pipe 43 is connected to the tin liquid tank 1. The installation of the pressure control pump 42 enables the tin plating liquid to be transported to the tin plating tank 51 at a certain pressure and flow rate, thereby ensuring precise control of the tin plating process. By adjusting the output pressure of the pressure control pump 42, the flow rate of the tin plating liquid can be precisely controlled, which not only improves the tin plating efficiency but also ensures the uniformity and consistency of the tin plating layer thickness. At the same time, the close cooperation between the pressure control pump 42, the liquid inlet branch pipe 43, and the liquid outlet branch pipe 41 ensures the stability and continuity of the tin plating liquid during the transportation process, avoids leakage and waste of the tin plating liquid, and thus improves the tin plating efficiency. This design not only improves the working efficiency of the tin plating device but also further reduces production costs, meeting the needs of modern production.
[0028] In this embodiment, as Figure 2 As shown, the tin plating assembly 5 is equipped with a tin plating box 51. Five circular inlet holes 52 are formed on one side wall of the tin plating box 51, and five circular outlet holes 53 are formed on the other side wall. The diameters of the inlet holes 52 and outlet holes 53 are the same. The arrangement of these five inlet holes 52 and five outlet holes 53 is designed to meet the tin plating requirements of multi-strand copper wires, ensuring that each copper wire can pass through the tin plating box 51 evenly and efficiently for tin plating. Each inlet hole 52 corresponds to one outlet hole 53, ensuring sufficient contact between the copper wire and the tin plating solution. The tinning process improves the quality and efficiency of tinning. Simultaneously, the identical diameter of the inlet circular hole 52 and outlet circular hole 53 ensures the consistency of the copper wire diameter before and after tinning, avoiding damage or uneven tinning caused by differences in hole diameter. Furthermore, the rational structural design of the tinning box 51 allows the tinning solution to evenly cover the copper wire, further guaranteeing the uniformity and thickness of the tinning layer. This design of the tinning component 5 not only enhances the practicality and flexibility of the tinning device but also meets the tinning requirements of copper wires of different specifications, providing strong support for modern production.
[0029] In this embodiment, as Figure 2As shown, a U-shaped frame is installed on the lead wire structure 8. A lead wire roller is mounted on the U-shaped frame via a rotating shaft, and five lead wire grooves are evenly distributed on the lead wire roller. These grooves are aligned directly with the inlet circular hole 52 and the outlet circular hole 53. This arrangement ensures that the copper wire is accurately guided into the inlet circular hole 52, smoothly passes through the tin plating box 51 for tin plating, and is then exited through the outlet circular hole 53. The precise alignment of each lead wire groove with its corresponding inlet circular hole 52 and outlet circular hole 53 further ensures the accurate tin plating path of the copper wire and guarantees sufficient contact between the copper wire and the tin plating solution, thereby improving the accuracy and efficiency of tin plating. Simultaneously, the rotating shaft design of the U-shaped frame allows the lead wire roller to rotate flexibly, reducing friction between the copper wire and the lead wire structure and effectively protecting the surface quality of the copper wire. This design of the lead wire structure 8 not only improves the automation level of the tin plating device but also provides a more convenient and efficient tin plating solution for modern production.
[0030] In this embodiment, as Figure 2 As shown, a centrifuge 73 is installed on the centrifugal structure 7. The rotation of the centrifuge 73 generates centrifugal force, promoting the flow of molten tin in the pipe and further improving the uniformity of tin plating. The centrifuge 73 is fixed on the front surface of the molten tin tank 1. The output end of the molten tin tank 1 is connected to the centrifugal pipe 71, and the centrifugal pipe 71 is installed on the molten tin tank 1. The tight connection between the centrifuge 73 and the molten tin tank 1 ensures that the molten tin can be stably and continuously supplied to the centrifugal pipe 71, providing sufficient molten tin resources for the tin plating process of copper wire. A centrifugal vent 72 is provided on the centrifugal pipe 71. The centrifugal vent 72 helps to balance the centrifugal pipe 71 when the centrifuge 73 is working. The internal air pressure 72 prevents excessive air pressure from causing molten tin to splash out or affecting the centrifugal effect. At the same time, the centrifugal vent 72 can also promote the discharge of gas in the molten tin, further improving the uniformity and quality of tin plating. The centrifugal vent 72 is located inside the molten tin tank 1. This design can better control the direction and flow of gas discharge, ensuring that gas discharge will not interfere with the tin plating process. It also helps to maintain the pressure balance inside the molten tin tank 1, further ensuring the stability and uniformity of the tin plating process. The design of the entire centrifugal structure 7 fully considers various factors in the tin plating process, aiming to improve the uniformity and efficiency of tin plating, and providing an effective solution for the tin plating of copper wire.
[0031] In this embodiment, as Figure 3As shown, the heating structure 9 is equipped with a fixing frame 91. The fixing frame 91 is designed to be stably installed on the heating structure 9. Its main function is to support and fix the heating element, ensuring that the heating element can heat the molten tin evenly and stably. With the stable support of the fixing frame 91, the heating structure 9 can more effectively exert its heating effect, providing a stable temperature environment for the tin plating process of copper wire, thereby further ensuring the uniformity and quality of tin plating. Five heat conduction cylinders 92 are equidistantly installed on the fixing frame 91. The equidistant installation of the five heat conduction cylinders 92 ensures the uniformity and efficiency of heating and avoids... To address the tinning quality issues caused by uneven heating of the copper wire, a spring heating wire 93 is fitted onto the heat conduction cylinder 92. The design of the spring heating wire 93 effectively heats the heat conduction cylinder 92, thereby evenly transferring heat to the copper wire and ensuring uniform heat distribution during the tinning process. Furthermore, the elastic design of the spring heating wire 93 allows it to adapt to copper wires of different diameters, improving the applicability and flexibility of the device. Through precise control of the heating structure 9, precise temperature control of the copper wire tinning process can be achieved, further improving the uniformity and quality of the tinning.
[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A uniform tin plating apparatus for copper wire tin plating, comprising a tin bath (1), a liquid inlet structure (4), a tin plating assembly (5), a centrifugal structure (7), a lead wire structure (8), and a heating structure (9); characterized in that: A liquid level observation window (2) is nested on the front surface of the tin bath (1). A tin bath cover plate (3) is installed on the tin bath (1) via a hinge. A tin plating assembly (5) is installed on the upper surface of the tin bath cover plate (3). A tin plating door (6) is installed on the tin plating assembly (5) via a hinge. One end of the tin plating assembly (5) is connected to the tin bath (1) via a liquid inlet structure (4). A centrifugal structure (7) is installed on the front surface of the tin bath (1). Three lead wire structures (8) and three heating structures (9) are installed inside the tin plating assembly (5).
2. The apparatus for uniform tin plating of copper wire according to claim 1, wherein: A sealing gasket is installed on the lower surface of the tin box cover (3) and the tin-plated door (6), and the sealing gasket is made of PTFE material.
3. The apparatus for uniform tin plating of copper wire according to claim 1, wherein: The liquid inlet structure (4) is equipped with a pressure control pump (42). The output end of the pressure control pump (42) is connected to one end of the liquid outlet branch pipe (41), and the other end of the liquid outlet branch pipe (41) is connected to the tin plating tank (51). The input end of the pressure control pump (42) is connected to one end of the liquid inlet branch pipe (43), and the other end of the liquid inlet branch pipe (43) is connected to the tin liquid tank (1).
4. The apparatus for uniform tin plating of copper wire according to claim 1, wherein: The tin plating assembly (5) is provided with a tin plating box (51). Five inlet circular holes (52) are opened on one side wall of the tin plating box (51), and five outlet circular holes (53) are opened on the other side wall of the tin plating box (51). The diameters of the inlet circular holes (52) and the outlet circular holes (53) are the same.
5. The uniform tin plating apparatus for copper wire tin plating according to claim 1, characterized in that: The lead wire structure (8) is equipped with a U-shaped frame, and the U-shaped frame is equipped with a lead wire roller through a rotating shaft. Five lead wire grooves are evenly opened on the lead wire roller, and the lead wire grooves are arranged opposite to the inlet circular hole (52) and the outlet circular hole (53).
6. The apparatus for uniform tin plating of copper wire according to claim 1, wherein: The centrifugal structure (7) is equipped with a centrifuge (73), which is fixed on the front surface of the tin bath (1). The output end of the tin bath (1) is connected to the centrifugal pipe (71), and the centrifugal pipe (71) is installed on the tin bath (1). The centrifugal pipe (71) is equipped with a centrifugal vent (72), which is located inside the tin bath (1).
7. The apparatus for uniform tin plating of copper wire according to claim 1, wherein: The heating structure (9) is provided with a fixing frame (91), and five heat conduction cylinders (92) are installed at equal intervals on the fixing frame (91), and spring heating wires (93) are sleeved on the heat conduction cylinders (92).