CVD deposition production structure applied to liquid crystal panel
By using several spaced connecting pieces during the CVD deposition process of liquid crystal panels, the problem of arc damage was solved, the coating quality and equipment lifespan were improved, and maintenance costs were reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TAI HONG PRECISION MASCH CO LTD
- Filing Date
- 2025-05-16
- Publication Date
- 2026-04-21
AI Technical Summary
During the CVD deposition process of LCD panels, high-power processes are prone to arcing, which leads to vacuum chamber contamination and increased defect rates, affecting production efficiency and equipment lifespan.
By using several spaced connecting plates, the voltage of the lower electrode is evenly transmitted to the grounding plate, reducing the leakage load of a single connecting plate. The even spacing of the connecting plates also enables uniform charge conduction, improving deposition quality and equipment lifespan.
It effectively reduces the probability of arc damage, improves the stability of coating quality, extends equipment maintenance cycle, reduces maintenance costs, and extends equipment lifespan.
Smart Images
Figure CN224148166U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of liquid crystal panel production technology, specifically to a CVD deposition production structure applied to liquid crystal panels. Background Technology
[0002] In the vapor deposition process of LCD panels, the configuration of the upper and lower electrodes is a critical step that directly affects the deposition quality and electrical performance.
[0003] Taking the above electrode as an example, silicon oxide electrodes are usually used to ensure that the film layer is dense, the adhesion is strong, and the process control is precise.
[0004] Taking the following electrodes as an example, their functions are mainly reflected in the following aspects:
[0005] In terms of providing an electric field, the main function of the lower electrode is to provide the necessary electric field for the liquid crystal material. The presence of the electric field allows the liquid crystal molecules to rearrange under its influence, thereby enabling the switching and adjustment of the liquid crystal display. This is the foundation upon which a liquid crystal display (LCD) can function.
[0006] As a conductor of current, the lower electrode effectively conducts electricity. It not only provides power to the LCD panel but also ensures that the current is distributed across the entire panel, avoiding problems such as localized overheating or uneven current distribution.
[0007] Regarding thermal management, during the operation of an LCD panel, heat is generated when current passes through the lower electrode. The material and design of the lower electrode need to take thermal management into account to prevent overheating from damaging the liquid crystal material and other components.
[0008] It is evident that the lower electrode has a significant impact on the CVD deposition process of LCD panels. Furthermore, as LCD panel production becomes increasingly large-scale, the power of existing mainstream CVD physical vapor deposition processes for LCD semiconductor equipment is increasing to meet the production requirements of next-generation panels, exceeding 30KW. This high-power process leads to occasional arcing damage to the lower electrode, causing vacuum chamber contamination, resulting in high process defect rates. Production must be immediately halted, the chamber opened for replacement of both upper and lower electrodes, and routine maintenance (PM) is required. This arcing damage not only results in several days of lost production capacity but also necessitates the replacement of critical components and accessories, causing substantial losses. Utility Model Content
[0009] The purpose of this invention is to provide a CVD deposition production structure for LCD panels, which features high coating quality stability, low cost, and long equipment lifespan.
[0010] This utility model can be achieved through the following technical solutions:
[0011] This utility model discloses a CVD deposition production structure for liquid crystal panels, including a lower electrode that forms an electric field. The electric field space of the lower electrode forms a process cavity for the deposition substrate. It also includes several grounding plates distributed along the contour of the lower electrode. Several connecting plates are arranged at intervals between the grounding plates and the lower electrode. The voltage of the lower electrode is uniformly transmitted to the grounding plates through the connecting plates to achieve voltage release.
[0012] In this invention, by adding several connecting pieces, the number of connecting pieces is increased, reducing the leakage load on a single connecting piece. The reduced load on a single grounding piece lowers the probability of arcing damage during the process. Simultaneously, the uniform spacing of the connecting pieces achieves an equipotential design on the outside of the heater, increasing the contact area and allowing for more uniform charge dispersion and conduction, improving deposition quality, stabilizing coating efficiency, effectively increasing product yield, extending routine maintenance intervals, and reducing maintenance costs.
[0013] Furthermore, the connecting piece is vertically or inclinedly positioned between the lower electrode and the grounding piece. By designing the connecting piece, it can be detached from the electrode and grounding piece to form a structural support, effectively protecting the lower electrode, ensuring the uniformity of the electric field, and thus guaranteeing the uniformity of the coating quality.
[0014] Furthermore, the connecting piece can be of type >, type <, type 7, or type Z. Through the structural design of this connecting piece, while forming a good protective space, the height between the lower electrode and the contact piece can be adjusted according to different height requirements by the bending angle of the connecting piece, thus exhibiting good environmental adaptability.
[0015] Furthermore, the plane of the process cavity is axially symmetrical, and the connecting pieces on opposite sides have opposite bending shapes, which ensures the uniformity of the electric field and effectively guarantees the uniformity of the coating quality.
[0016] Furthermore, the plane of the process cavity is centrally symmetrical, and its connecting pieces are uniformly spaced and bent in the same direction, which fully ensures the uniformity of the electric field and improves the uniformity of the coating quality.
[0017] Furthermore, the lower electrode is a metal electrode, which can be an aluminum electrode, a copper electrode, a nickel alloy electrode, or an aluminum alloy electrode, possessing both good conductivity and a long service life.
[0018] Furthermore, the grounding plate and connecting plate are metal plates, which are aluminum plates, copper plates or aluminum alloy plates, and have good conductivity, good mechanical strength and long service life.
[0019] Furthermore, the deposition substrate can be a glass substrate, plastic substrate, metal substrate, silicon substrate, ceramic substrate, or composite substrate to meet the application requirements of different similar substrates.
[0020] Furthermore, the connection between the connecting piece and the lower electrode and the grounding piece can be either an integrated connection or a detachable connection, which can be flexibly selected as needed to meet assembly requirements and improve ease of use.
[0021] Furthermore, different grounding plates can be connected end-to-end or not connected to each other, with gaps forming between the unconnected grounding plates, providing high installation flexibility.
[0022] Furthermore, the spacing between the connecting pieces is 2-20cm, which can be flexibly controlled according to the voltage level. If the voltage is too high, the spacing between the connecting pieces is reduced to ensure that there are a sufficient number of connecting pieces to meet the needs of high voltage release.
[0023] This utility model discloses a CVD deposition production structure for liquid crystal panels, which has the following beneficial effects:
[0024] First, the coating quality stability is high. By adopting the production structure of this utility model, the use of several spaced grounding plates effectively avoids the phenomenon of electric arc damage caused by the inability of static electricity to be released in time due to the use of a single connecting plate at the end in the existing technology, which leads to voltage accumulation and the occurrence of electric arc damage under high voltage conditions. This avoids the impact of electric arc damage on the CVD deposition process and effectively improves the coating uniformity.
[0025] Secondly, the cost is low. By adopting the production structure of this utility model, the probability of electric arc damage is significantly reduced, and production downtime for maintenance is avoided. This effectively extends the equipment maintenance cycle, avoids material loss caused by electric arc damage, and effectively reduces maintenance costs and material costs.
[0026] Third, the equipment has a long service life. By adopting the production structure of this utility model, the safety hazards caused by voltage accumulation are effectively prevented. In addition, the number of connecting pieces is large, so even if any connecting piece is normally worn, it will not cause a voltage release effect, thus fully extending the service life of the equipment. Attached Figure Description
[0027] Appendix Figure 1 This is a schematic diagram of a CVD deposition production structure for liquid crystal panels according to the present invention;
[0028] Appendix Figure 2 Figure 2-20 shows a CVD deposition production structure for liquid crystal panels that adopts the present invention;
[0029] Figure 3 Figure 2-20 shows a CVD deposition production structure for liquid crystal panels that is not adopted in the prior art;
[0030] The markings in the attached diagram include: 100, lower electrode; 101, lower electrode mounting base; 200, connecting piece; 300, grounding piece; 301, grounding piece fixing base. Detailed Implementation
[0031] To enable those skilled in the art to better understand the technical solution of this utility model, the product of this utility model will be further described in detail below with reference to the embodiments and accompanying drawings.
[0032] like Figure 1 As shown, this utility model discloses a CVD deposition production structure for liquid crystal panels, including a lower electrode 100 that forms an electric field. The electric field space of the lower electrode 100 forms a process cavity for the deposition substrate. It also includes a plurality of grounding plates 300 distributed along the contour of the lower electrode. A plurality of connecting plates 200 are provided between the grounding plates 300 and the lower electrode 100 at intervals. The static electricity of the lower electrode 100 is uniformly transferred to the grounding plates 300 through the connecting plates 200 to achieve voltage release.
[0033] In this invention, the connecting piece is vertically or inclinedly disposed between the lower electrode and the contacting piece. Although... Figure 1 The image shows a tilted setup, but this does not limit other possible connection methods.
[0034] In this utility model, the connecting piece is of type >, type <, type 7, or type Z. Although Figure 1 It adopts a > or < structure, but this is not a restriction on other possible structures.
[0035] In this earlier utility model, the plane of the process cavity is axially symmetrical, and the connecting pieces on opposite sides have opposite bending shapes. For example... Figure 1 As shown, the process cavity has a rectangular plane, with the long or short sides grouped together and facing each other, and the connecting pieces are bent in opposite shapes.
[0036] In this invention, the plane of the process cavity is centrally symmetrical, and its connecting pieces are uniformly spaced and bent in the same direction. Although Figure 1 The display shows a rectangular plane, but there are no restrictions on the centrally symmetric plane.
[0037] In this invention, the lower electrode is a metal electrode, which can be an aluminum electrode, a copper electrode, a nickel alloy electrode, or an aluminum alloy electrode; the grounding plate and the connecting plate are metal sheets, which can be aluminum sheets, copper sheets, or aluminum alloy sheets, and have both excellent conductivity and service life.
[0038] In terms of applicability, the deposition substrate can be a glass substrate, a plastic substrate, a metal substrate, a silicon substrate, a ceramic substrate, or a composite substrate.
[0039] Regarding the feasibility of process assembly, the connection between the connecting piece and the lower electrode and grounding piece can be either an integrated connection or a detachable connection.
[0040] In this invention, different grounding plates may be connected end-to-end or not, with gaps forming between the unconnected grounding plates. Specifically, since the grounding plates are electrically conductive to the ground, whether the different grounding plates are connected or have gaps will not affect the grounding effect.
[0041] In this invention, the spacing between the connecting pieces is 2-20cm, which can be flexibly adjusted according to actual needs.
[0042] In this utility model, for ease of assembly, such as Figure 1 As shown, the grounding plate 300 is provided with a grounding plate fixing seat 301; the lower electrode 100 is provided with a lower electrode mounting seat 101 in the shape of an arc-shaped countersunk hole.
[0043] When the structure of this invention is applied to the existing production process of liquid surface panels, comparisons show that, after adopting this structure, plasma leakage below the heater is significantly reduced, and glow discharge is greatly improved. Regarding plasma stability during processing, the production process using this structure is significantly superior to that without it. In terms of maintenance cycle, previously, maintenance requiring cavity opening every 3 months due to arc damage was necessary; after the improvement, cavity opening was performed every 3 months to confirm that no arc damage occurred.
[0044] To effectively verify the technical effects of this utility model, a comparison was made between the production operation curves of the equipment before and after adopting the structure of this utility model. Figure 2-3 As shown. In Figure 2 and Figure 3 In this designation, CLN stands for "clean," referring to processes performed under identical indoor conditions, with the same products and processes. After the modification, the cleaning time for process opening maintenance is reduced by 85 seconds compared to before, resulting in a noticeable step-like decrease in equipment operating pressure. Under the same conditions, this effectively reduces the cleaning time for etching and coating processes. With this new production structure, there is no impact on yield or defect rate, thus effectively reducing costs.
[0045] Furthermore, it should be noted that the CVD deposition production structure for LCD panels is installed in a dedicated process area and has corresponding safety protection measures. The grounding plate will not pose a safety hazard to production staff during the high-voltage discharge process. During maintenance, the power supply to the equipment is disconnected before subsequent maintenance and cleaning procedures can be carried out.
[0046] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0048] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0049] The above embodiments are merely specific examples of this utility model, and their descriptions are quite specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this utility model, and these obvious substitutions all fall within the protection scope of this utility model.
Claims
1. A CVD deposition production structure for liquid crystal panels, comprising a lower electrode forming an electric field, the electric field space of the lower electrode forming a process cavity for the deposition substrate, characterized in that: It also includes several grounding plates distributed along the outline of the lower electrode. Several connecting plates are provided between the grounding plates and the lower electrode at intervals. The voltage of the lower electrode is uniformly transmitted to the grounding plates through the connecting plates to achieve voltage release.
2. The CVD deposition production structure for a liquid crystal panel according to claim 1, wherein: The connecting piece is vertically or inclinedly positioned between the lower electrode and the contact piece.
3. The CVD deposition production structure for a liquid crystal panel according to claim 1, wherein: The connecting piece is of type >, type <, type 7, or type Z.
4. The CVD deposition production structure for a liquid crystal panel according to claim 3, wherein: The plane of the process cavity is axially symmetrical, and the connecting pieces on opposite sides have opposite bending shapes.
5. The CVD deposition production structure for a liquid crystal panel according to claim 3, wherein: The plane of the process cavity is centrally symmetrical, and its connecting pieces are evenly spaced and bent in the same direction.
6. The CVD deposition production structure for a liquid crystal panel according to claim 4 or 5, wherein: The lower electrode is a metal electrode, which can be an aluminum electrode, a copper electrode, a nickel alloy electrode, or an aluminum alloy electrode.
7. The CVD deposition production structure for liquid crystal panels according to claim 6, characterized in that: The grounding plate and connecting plate are metal plates, which are aluminum plates, copper plates or aluminum alloy plates.
8. The CVD deposition production structure for a liquid crystal panel according to claim 7, wherein: The deposition substrate is a glass substrate, a plastic substrate, a metal substrate, a silicon substrate, a ceramic substrate, or a composite substrate.
9. The CVD deposition production structure for a liquid crystal panel according to claim 8, wherein: The connection between the connecting piece and the lower electrode and the grounding piece can be either an integrated connection or a detachable connection.
10. The CVD deposition production structure for a liquid crystal panel according to claim 1, wherein: The spacing between the connecting pieces is 2-20cm.