Multifunctional sensor

Abstract

The utility model relates to the technical field of sensors, in particular to a multifunctional sensor, which solves the problem of single function of a flexible sensor in the prior art, and comprises an integrated circuit layer, a pressure and temperature response layer and an electrode response layer which are sequentially arranged from bottom to top, each detection module comprises a flexible piezoelectric film and a temperature sensing chip, the electrode response layer is attached to the flexible piezoelectric film, and the temperature sensing chip is connected with the integrated circuit layer. The beneficial effects are that the flexible piezoelectric film and the temperature sensing chip are arranged in the detection module of the sensor at the same time, the pressure value and the temperature value can be detected at the same time, and the functionality of the sensor is improved. And each detection module is independently arranged, and when one detection module is damaged, the detection module can be independently replaced, so that the maintenance cost of the sensor is reduced.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to a multifunctional sensor. Background Technology

[0002] In recent years, with the discovery of new materials and technological advancements, significant progress and development have been made in the research and development of flexible sensors. These sensors can be applied in fields such as human motion detection, health diagnosis, smart clothing, electronic skin, the automotive industry, human-machine interfaces, and mobile communications, especially in wearable electronic devices, medical devices, and electronic skin. However, in practical applications, due to limitations in materials and spatial structure design, existing flexible pressure sensors, once fabricated, only possess a single function and cannot meet the demands of use.

[0003] For example, patent CN119845479A discloses a flexible piezoelectric sensor array for use on aircraft, including a lower substrate layer, a lower electrode layer, a piezoelectric sensitive layer, an upper electrode layer, an upper substrate layer, and an encapsulation layer; the lower electrode layer is disposed on the lower substrate layer, and the upper surface of the lower electrode layer is attached to the lower surface of the piezoelectric sensitive layer element; the upper electrode layer is disposed on the upper substrate layer, and the lower surface of the upper electrode layer is attached to the upper surface of the piezoelectric sensitive layer element; both the upper and lower electrode layers are used to communicate with external testing equipment to monitor changes in sensor voltage or charge in real time; the encapsulation layer is embedded in the flexible piezoelectric sensor array for sealing and protecting the device.

[0004] The aforementioned flexible piezoelectric sensor array can only detect pressure values ​​through the piezoelectric sensitive layer, meaning the sensor has a single function and poor applicability. Utility Model Content

[0005] This invention proposes a multifunctional sensor, which solves the problem of single-function flexible sensors in the prior art.

[0006] The technical solution of this utility model is implemented as follows:

[0007] The multifunctional sensor comprises, from bottom to top, an integrated circuit layer, a pressure-temperature response layer, and an electrode response layer. The pressure-temperature response layer includes multiple detection modules, each comprising a flexible piezoelectric film and a temperature-sensing chip. The electrode response layer is bonded to the flexible piezoelectric film, and the temperature-sensing chip is connected to the integrated circuit layer. The electrode response layer and the flexible piezoelectric film work together to measure pressure, while the temperature-sensing chip and the integrated circuit layer work together to measure temperature, enabling the sensor to simultaneously measure pressure and temperature, thus enhancing its functionality.

[0008] The pressure-temperature response layer includes an insulating mesh, with a detection module disposed within each mesh opening. The detection modules are separated by the insulating mesh to prevent interference between them, while the insulating mesh provides support, giving the sensor a certain strength and structural integrity.

[0009] The temperature-sensing chip is centrally arranged within the mesh of an insulating grid. The chip is embedded within a flexible piezoelectric film, which provides protection for the chip.

[0010] Each mesh of the insulating mesh is hexagonal. The hexagonal mesh allows the detection modules to be arranged in a staggered manner, enabling a larger number of detection modules to be set up while maintaining the same sensor size, thereby enhancing the sensor's detection sensitivity.

[0011] The surface of the temperature-sensing chip is coated with an insulating film. The insulating film is formed by coating the surface of the temperature-sensing chip with an insulating coating. The insulating film separates the temperature-sensing chip from the flexible piezoelectric film and prevents electrical signal interference between the flexible piezoelectric film and the temperature sensor.

[0012] The integrated circuit layer has multiple wires, each wire connecting to a temperature sensing chip. The temperature sensing chip is connected to a signal processing device via a guide.

[0013] The electrode response layer includes an upper electrode layer and a lower electrode layer. The upper electrode layer is provided with an upper electrode, and the lower electrode layer is provided with a lower electrode. The electrode plates of the upper and lower electrodes correspond to the positions of the detection module, respectively.

[0014] The upper electrode layer has upper electrode holes, which correspond to the positions of the electrode plates of the lower electrode. The upper electrode holes allow the lower electrode to also be exposed to the environment.

[0015] The upper electrodes are arranged side by side in the horizontal direction on the upper electrode layer, and the lower electrodes are arranged side by side in the vertical direction on the lower electrode layer.

[0016] The upper electrode and upper electrode holes are arranged alternately, so that the electrode plates of the upper electrode do not contact each other.

[0017] The beneficial effects of this utility model are: 1. The sensor's detection module is equipped with both a flexible piezoelectric film and a temperature sensing chip, which can simultaneously detect pressure and temperature values, thereby improving the sensor's functionality.

[0018] 2. Each detection module is set independently, and if one of the detection modules is damaged, it can be replaced individually, reducing the maintenance cost of the sensor.

[0019] 3. The hexagonal mesh allows for staggered arrangement of the detection modules, enabling a larger number of detection modules to be set up when the sensor size is consistent, thereby enhancing the sensor's detection sensitivity. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the multifunctional sensor of this utility model;

[0022] Figure 2 This is a schematic diagram of an explosion involving a multi-functional sensor.

[0023] Figure 3 This is a schematic diagram of the layered structure of a multi-functional sensor.

[0024] Figure 4 This is a schematic diagram of the pressure-temperature response layer structure.

[0025] In the figure: 1. Integrated circuit layer, 2. Pressure and temperature response layer, 21. Insulating mesh, 22. Flexible piezoelectric film, 23. Temperature sensing chip, 3. Electrode response layer, 31. Upper electrode layer, 311. Upper electrode, 312. Upper electrode hole, 32. Lower electrode layer, 321. Lower electrode. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Example 1, such as Figure 1 , Figure 2 , Figure 3As shown, the multifunctional sensor includes, from bottom to top, an integrated circuit layer 1, a pressure-temperature response layer 2, and an electrode response layer 3. The pressure-temperature response layer 2 includes multiple detection modules, each of which includes a flexible piezoelectric film 22 and a temperature sensing chip 23. The electrode response layer 3 is bonded to the flexible piezoelectric film 22, and the temperature sensing chip 23 is connected to the integrated circuit layer 1. The electrode response layer 3 and the flexible piezoelectric film 22 work together to measure pressure values, while the temperature sensing chip 23 and the integrated circuit layer 1 work together to measure temperature values, enabling the sensor to simultaneously measure pressure and temperature, thus improving the sensor's functionality.

[0028] Furthermore, the pressure-temperature response layer 2 includes an insulating mesh, with a detection module disposed within each mesh opening. The detection modules are separated by the insulating mesh, preventing interference between them, while the insulating mesh provides support, giving the sensor a certain strength and stability.

[0029] Furthermore, the temperature sensing chip 23 is centrally arranged within the mesh of the insulating grid. In this embodiment, the temperature sensing chip shown is a thermal resistance type chip. The temperature sensing chip 23 can accurately measure the temperature value. The central arrangement of the temperature sensing chip 23 within the grid allows the flexible piezoelectric film 22 to completely enclose the temperature sensing chip 23. Due to its flexibility, the flexible piezoelectric film 22 can protect the temperature sensing chip 23 from damage caused by pressure.

[0030] Furthermore, such as Figure 4 As shown, each mesh of the insulating mesh is a hexagonal structure. The hexagonal mesh allows the detection modules to be arranged in a staggered manner, enabling a larger number of detection modules to be set up while maintaining a consistent sensor size, thereby enhancing the sensor's detection sensitivity.

[0031] Furthermore, the surface of the temperature sensing chip 23 is coated with an insulating film. The insulating film is formed by coating the surface of the temperature sensing chip 23 with an insulating coating. In this embodiment, the insulating coating is an organosilicon material, a resin material, or a nano-coating. The insulating film separates the temperature sensing chip 23 from the flexible piezoelectric film 22, preventing electrical signal interference between the flexible piezoelectric film 22 and the temperature sensing chip 23.

[0032] Furthermore, multiple wires are provided on the integrated circuit layer 1, each wire being connected to a temperature sensing chip 23. The temperature sensing chip 23 is connected to the signal processing device via a guide.

[0033] During the molding of the pressure-temperature response layer 2, the temperature sensing chip 23 is first welded to the wire, and then the surface of the temperature sensing chip 23 and the wire is coated with insulating material to form an insulating film. Then, the flexible piezoelectric material is cast into the insulating mesh to form an insulating film, and the pressure-temperature response layer 2 is completed.

[0034] Example 2, based on Example 1, describes a multifunctional sensor where the electrode response layer 3 includes an upper electrode layer 31 and a lower electrode layer 32. The upper electrode layer 31 has an upper electrode 311, and the lower electrode layer 32 has a lower electrode 321. Specifically, both the upper electrode layer 31 and the lower electrode layer 32 include an insulating substrate. Both the upper electrode 311 and the lower electrode 321 include multiple electrode sheets, which are electrically connected to adjacent electrode sheets via conductive sheets. The electrode sheets are embedded on the upper surface of the insulating substrate, meaning the upper surface of the electrode sheets is exposed on the upper surface of the insulating substrate, and the lower surface of the electrode sheets is in contact with the insulating substrate. The insulating substrate isolates the lower surface of the electrode sheets.

[0035] Furthermore, the upper electrode layer 31 is provided with an upper electrode hole 312, which corresponds to the position of the electrode sheet of the lower electrode 321. The upper electrode hole 312 allows the electrode sheet of the lower electrode 321 to be exposed to the environment, thus exposing both the electrode sheets of the upper electrode 311 and the lower electrode 321 to the environment. When a conductive object contacts the surface of the electrode response layer 3, the circuit can be turned on. When the circuit is turned on, the current flows sequentially through the upper electrode layer 31, the conductive object, and the lower electrode layer 32. At this time, it is possible to detect that a conductive object is in contact with the corresponding position of the electrode response layer 3, and to determine the contact position, approximate area, and other information data of the conductive object on the sensor. This data can be coupled with the data obtained from the pressure and temperature response layer 2 during the data processing stage to improve the accuracy of the sensor. The conductive object can be skin, conductive liquid, or conductive solid. At the same time, this layer structure can also infer the material of the conductive object in contact with the electrode response layer 3 by obtaining the resistance value of the material of different conductive circuits.

[0036] Furthermore, the upper electrodes 311 are arranged side-by-side laterally on the upper electrode layer 31, and the lower electrodes 321 are arranged side-by-side longitudinally on the lower electrode layer 32. The upper electrodes 311 and upper electrode holes 312 on the upper electrode layer 31 are arranged alternately, so that the electrode plates of the upper electrodes 311 and the electrode plates of the lower electrodes 312 do not contact each other. In addition, the conductive plates of the upper electrode layer 31 are disposed on the upper surface of the upper insulating substrate, so that there is an insulating substrate between the conductive plates in the upper electrodes 311 and the conductive plates in the lower electrodes 321, that is, the conductive plates in the upper electrodes 311 and the conductive plates in the lower electrodes 321 are insulated from each other, thereby preventing the upper electrodes 311 and the lower electrodes 321 from being connected.

[0037] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-functional sensor characterized by, The integrated circuit layer (1), pressure and temperature response layer (2) and electrode response layer (3) are arranged sequentially from bottom to top. The pressure and temperature response layer (2) includes multiple detection modules. Each detection module includes a flexible piezoelectric film (22) and a temperature sensing chip (23). The electrode response layer (3) is bonded to the flexible piezoelectric film (22), and the temperature sensing chip (23) is connected to the integrated circuit layer (1).

2. The multi-functional sensor according to claim 1, characterized by, The pressure-temperature response layer (2) includes an insulating mesh, with a detection module set in each mesh opening of the insulating mesh.

3. The multi-functional sensor according to claim 2, characterized by, The temperature sensing chip (23) is centrally arranged in the mesh of the insulating grid.

4. The multi-functional sensor according to claim 2 or 3, characterized by, Each mesh of the insulating grid has a hexagonal structure.

5. The multi-functional sensor according to claim 4, characterized by The surface of the temperature sensing chip (23) is coated with an insulating film.

6. The multi-functional sensor according to any one of claims 1, 2, 5, wherein Multiple wires are provided on the integrated circuit layer (1), and each wire is connected to a temperature sensing chip (23).

7. The multi-functional sensor according to claim 6, characterized by The electrode response layer (3) includes an upper electrode layer (31) and a lower electrode layer (32). The upper electrode layer (31) is provided with an upper electrode (311), and the lower electrode layer (32) is provided with a lower electrode (321).

8. The multi-functional sensor according to claim 7, characterized by The upper electrode layer (31) is provided with an upper electrode hole (312), and the upper electrode hole (312) corresponds to the electrode plate position of the lower electrode (321).

9. The multi-functional sensor according to claim 8, characterized by, The upper electrode (311) is arranged side by side in the horizontal direction on the upper electrode layer (31), and the lower electrode (321) is arranged side by side in the vertical direction on the lower electrode layer (32).

10. The multi-functional sensor according to claim 9, characterized by The upper electrode (311) and the upper electrode hole (312) are arranged alternately.

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