Wiring structure and heat storage system

By designing a simplified wiring structure and using interference fit and heat-resistant sealant layer, the problems of complicated wiring structure installation and poor sealing in existing thermal storage systems have been solved, thereby improving the safety and reliability of the system.

CN224153152UActive Publication Date: 2026-04-21CHINA THREE GORGES CORPORATION
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHINA THREE GORGES CORPORATION
Filing Date
2025-05-23
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

The existing thermal storage system has a complicated wiring structure that is difficult to install and maintain, and the sealing effect is poor. This leads to a complex structure that increases production costs and failure rates, affecting the safety and reliability of the system.

Method used

A wiring structure including a wiring body, a housing, a cover plate, a sealing layer, and an insulating filler layer was designed. The sealing and insulation performance are improved by interference fit and heat-resistant sealant layer, simplifying the structure and enhancing reliability.

Benefits of technology

This simplifies the installation of the wiring structure and achieves efficient sealing, improving the safety and reliability of the thermal storage system and reducing the failure rate and maintenance costs.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The embodiment of the utility model provides a wiring structure and a heat storage system. The wiring structure comprises a wiring main body, a shell, a cover plate, a sealing layer and an insulating filling layer, the shell is provided with a containing cavity and comprises two ends which are arranged oppositely in the first direction, openings are formed in the two ends of the shell, the cover plate is connected to the openings, and the sealing layer is connected between the cover plate and the openings and used for sealing the containing cavity; the wiring main body is arranged in the shell in a penetrating mode, and the insulation filling layer is filled in the containing cavity and located between the shell and the wiring main body. In the embodiment of the invention, the shell can play a certain role in protecting the wiring main body, the insulating filling layer can play a role in insulating the wiring main body, the cover plate is connected to the opening of the shell, and the sealing layer between the cover plate and the opening improves the sealing performance in the accommodating cavity. The wiring structure is simple in structure, good in sealing effect and high in safety and reliability.
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Description

Technical Field

[0001] This application belongs to the field of electrical connection technology, specifically relating to a wiring structure and a heat storage system. Background Technology

[0002] The wiring structure in the thermal storage system has advantages such as high conductivity, high temperature resistance, excellent chemical stability and mechanical strength, which can achieve stable power transmission in extreme temperature environments, ensuring the overall thermal storage efficiency of the thermal storage system and reducing energy loss.

[0003] However, the wiring structure in the relevant technology is relatively complex, which not only makes the installation and maintenance process cumbersome, but also results in poor sealing performance. Utility Model Content

[0004] This application aims to provide a wiring structure and a heat storage system to solve the problems of cumbersome installation and maintenance and poor sealing effect of existing wiring structures.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, this application discloses a wiring structure, which includes: a wiring body, a housing, a cover plate, a sealing layer, and an insulating filling layer; wherein...

[0007] The housing is provided with a receiving cavity and includes two ends disposed opposite to each other along a first direction. The two ends of the housing are provided with openings. The cover plate is connected to the openings. The sealing layer is connected between the cover plate and the openings and is used to seal the receiving cavity.

[0008] The wiring body is inserted through the housing, and the insulating filling layer fills the receiving cavity and is located between the housing and the wiring body.

[0009] Optionally, the sealing layer is a heat-resistant sealant layer.

[0010] Optionally, the cover plate is provided with a through hole, and the wiring body passes through the through hole and is interference-fitted with the through hole.

[0011] Optionally, the cover plate includes a body portion and an extension portion, the body portion being connected to the opening, and the extension portion extending from the body portion along the first direction and extending into the receiving cavity.

[0012] Optionally, the extension is provided with a first snap-fit ​​portion, and the housing is provided with a second snap-fit ​​portion. When the cover plate is connected to the housing, the first snap-fit ​​portion and the second snap-fit ​​portion are snap-fitted together.

[0013] Optionally, the cross-section of the wiring body along the second direction is rectangular, and the second direction intersects with the first direction.

[0014] Optionally, the wiring body is configured as a solid structure with a rectangular cross-section.

[0015] Optionally, the wiring body is a high-temperature resistant stainless steel terminal block.

[0016] Optionally, the insulating filler layer is an aluminum-silicon filler layer.

[0017] Optionally, the housing is a ceramic housing.

[0018] Optionally, the shell is a cylindrical structure.

[0019] Optionally, one end of the wiring body is provided with a wiring groove, which is used to interfere with the heating wire.

[0020] Secondly, this application also discloses a heat storage system, including a heating wire and a wiring structure as described in any one of the claims, wherein the wiring body is provided with a wiring groove, the heating wire is at least partially connected in the wiring groove, and the heating wire is interference-fitted with the groove opening of the wiring groove.

[0021] In this embodiment, the housing has a receiving cavity to accommodate the wiring body. The housing provides some protection for the wiring body, and the insulating filler layer between the wiring body and the inner wall of the housing provides insulation, thus preventing electrical faults such as short circuits and leakage. The cover plate is connected to the opening of the housing, and a sealing layer is connected between the cover plate and the opening. This sealing layer seals the receiving cavity, thereby improving the sealing performance within the cavity and effectively preventing the leakage of high-temperature gas. The wiring structure in this embodiment is not only simple in structure but also has good sealing effect and high safety and reliability.

[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0023] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0024] Figure 1 This is a schematic diagram of the wiring structure in one embodiment of this application;

[0025] Figure 2 This is one of the structural schematic diagrams of the cover plate in one embodiment of this application;

[0026] Figure 3This is a second schematic diagram of the cover plate in one embodiment of this application;

[0027] Figure 4 This is a schematic diagram of the wiring structure in another embodiment of this application;

[0028] Figure 5 yes Figure 4 Enlarged schematic diagram of section A in the middle.

[0029] Reference numerals: 10 - wiring body, 101 - wiring groove, 102 - wiring hole, 20 - housing, 201 - second snap-fit ​​part, 30 - cover plate, 301 - through hole, 31 - main body, 32 - extension part, 321 - first snap-fit ​​part, 40 - sealing layer, 50 - insulating filling layer, X - first direction, Y - second direction. Detailed Implementation

[0030] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0031] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0032] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] With the increasing popularity of energy efficiency and environmental protection, thermal storage systems, as a technology capable of effectively storing and releasing heat energy, are showing broad application prospects in many fields such as industrial waste heat recovery, solar thermal utilization, and building heating. Thermal storage systems store heat energy during periods of energy surplus and release it during peak energy demand periods, thus achieving time-based energy transfer and efficient utilization. This helps balance energy supply and demand, reduce peak energy consumption, and improve the overall stability and economy of the energy system. Among these, high-temperature solid-state electric thermal storage systems utilize electricity to heat solid materials to high temperatures and store the heat energy, releasing it when needed. This system converts electrical energy into heat energy through electric heating elements, storing it in a high-temperature resistant solid thermal storage medium, achieving time-space energy transfer. It boasts advantages such as high efficiency, environmental friendliness, and flexibility, and has broad application prospects in industrial heating, building heating, and power peak shaving.

[0035] In the operation of high-temperature solid-state electric thermal storage systems, the wiring structure, as a key component connecting the thermal storage system to external circuits and realizing power transmission and control, directly affects the safety, reliability, and operating efficiency of the thermal storage system. The wiring structure in high-temperature solid-state electric thermal storage systems, due to its advantages such as high conductivity, high temperature resistance, excellent chemical stability, and mechanical strength, can achieve stable power transmission in extreme temperature environments, ensuring the overall thermal storage efficiency of the system and reducing energy loss. However, the wiring structures in related technologies are complex, leading to cumbersome installation and maintenance processes and poor sealing performance. Specifically, existing thermal storage system wiring structures are often quite complex, typically assembled from multiple components through complex connection methods. These components include conductive bars, insulating sleeves, fixing brackets, and terminals, requiring precise matching and installation, placing extremely high demands on manufacturing processes and assembly precision. The complex structure not only increases the production cost and manufacturing difficulty of the wiring structure but also requires significant manpower and time during installation, maintenance, and repair. For example, during the installation of the wiring structure, professional technicians must follow strict installation procedures to assemble and debug each component sequentially. Any deviation in any step can cause the wiring structure to malfunction. Furthermore, when a fault occurs in the wiring structure, its complexity makes it difficult for maintenance personnel to quickly and accurately locate the fault, requiring significant time for troubleshooting and repair, severely impacting the normal operation of the thermal storage system. In addition, the insulation performance of the wiring structure in current thermal storage systems is generally inadequate. Thermal storage systems typically operate in harsh environments such as high temperature and high humidity, and the wiring structure is affected by various factors such as heat radiation and moisture erosion, leading to aging of the insulation materials and a decline in insulation performance. Simultaneously, due to the complexity of the wiring structure and the numerous connection points between components, these connections are prone to becoming weak points in insulation, easily leading to insulation breakdown and leakage faults during long-term operation. Once an insulation fault occurs, it not only causes the thermal storage system to malfunction but may also trigger electrical fires, electric shocks, and other safety accidents, threatening the safety of people and property.

[0036] For the reasons mentioned above, this application provides a wiring structure that can be used in a high-temperature electric thermal storage system. This wiring structure is simpler in structure, has good sealing performance, and improves insulation performance and reliability, thus ensuring the normal operation of the thermal storage system.

[0037] The wiring structure in the embodiments of this application will be further described in detail below with reference to the accompanying drawings and specific implementation methods. In this embodiment, the first direction is... Figure 1 The direction indicated by the middle arrow X can specifically be the length direction of the wiring structure, and the second direction is... Figure 1 The direction indicated by the middle arrow Y is where the second direction Y intersects with the first direction X.

[0038] like Figure 1 As shown, the wiring structure in this embodiment may specifically include: a wiring body 10, a housing 20, a cover plate 30, a sealing layer 40, and an insulating filling layer 50; wherein, the housing 20 is provided with a receiving cavity and includes two ends disposed opposite to each other along the first direction X, the two ends of the housing 20 are provided with openings, the cover plate 30 is connected to the openings, and the sealing layer 40 is connected between the cover plate 30 and the openings and is used to seal the receiving cavity; the wiring body 10 passes through the housing 20, and the insulating filling layer 50 fills the receiving cavity and is located between the inner wall of the housing 20 and the wiring body 10.

[0039] Both ends of the wiring body 10 are exposed outside the housing 20. The two ends of the wiring body 10 are used to connect to a power source and a heating wire, respectively. When one end of the wiring body 10 is connected to a power source, it can supply power to the heating wire, allowing the heating wire to convert electrical energy into heat energy for storage. It should be noted that in the selection of the material for the wiring body 10, the conductor performance should be ensured first, selecting a low-resistance material to reduce heat generation; secondly, since the wiring body 10 operates in a high-temperature and somewhat corrosive environment, it should have a certain degree of corrosion resistance to adapt to the complex chemical environment of the high-temperature electric heat storage system. For example, the wiring body 10 can be made of copper, copper alloy, stainless steel, etc., and technicians can flexibly choose according to actual needs. The material of the wiring body 10 is not specifically limited in this application. Specifically, the wiring body 10 and the cable can be connected by crimping, welding, bolting, etc., and the choice can be flexible according to the specifications of the external circuit cable and the structure of the wiring body in practical applications. For example, in this embodiment, the wiring body 10 and the cable are connected by bolts. Figure 1 As shown, one end of the wiring body 10 is provided with a wiring hole 102. The wiring hole 102 is used for passing cables and fasteners. In practical applications, cables can be passed through the wiring hole 102 and locked with fasteners to achieve a reliable electrical connection between the wiring body 10 and the cable. The distance between the wiring hole 102 and the edge of the wiring body 10 is 15-35mm, which ensures that the connection strength and electrical safety requirements are met, guaranteeing a reliable connection between the wiring body 10 and the cable. It is understandable that the edge of the wiring body 10 may develop micro-cracks due to the processing technology. Since the wiring hole 102 needs to connect with the cable, stress concentration will occur. Stress concentration will exacerbate the expansion of cracks, and in severe cases, the cracks will open to the wiring hole, affecting the reliability of the connection between the cable and the wiring body 10. By reasonably designing the distance between the wiring hole 102 and the edge of the wiring body 10, the risk of cracking of the wiring hole 102 can be reduced, ensuring the connection between the cable and the wiring body 10, thereby ensuring the reliability of the power supply to the heat storage system.

[0040] The other end of the wiring body 10 is used to connect to the heating wire. The heating wire and the wiring body 10 can be connected by welding or crimping. Crimping is more convenient for installation and disassembly, facilitating maintenance, but care must be taken to ensure the crimping quality to avoid loose connections. Welding offers lower contact resistance and better vibration resistance, resulting in a more reliable connection. However, with welding, the heating wire and wiring body are not detachable, making later maintenance and repair inconvenient. Furthermore, the wiring body 10 can also be provided with a wiring groove 101 to increase the contact area with the heating wire; this application does not specifically limit this feature.

[0041] The housing 20 is an insulating housing, disposed on the outer periphery of the wiring body 10, thereby providing electrical and structural protection for the wiring body 10 and preventing it from being corroded by complex environments such as high temperature, high humidity, and corrosive environments. The cross-section of the housing 20 can be any shape, such as circular, rectangular, or triangular. Preferably, the cross-section of the housing 20 is circular, meaning the housing 20 has an overall cylindrical structure with a hollow interior to allow passage through the wiring body 10. Furthermore, the housing 20 also has an internal cavity for accommodating insulating media, heat-insulating media, etc. Exemplarily, in this embodiment, the cavity is filled with an insulating filler layer 50, which further enhances the insulation performance of the wiring structure. The outer wall of the housing 20 is in direct contact with the insulation layer of the heat storage system, thereby providing insulation protection for the wiring body 10 and ensuring its electrical safety. In practical applications, the material selection for the housing 20 must meet requirements for high temperature resistance, insulation, sealing, mechanical strength, and explosion-proof properties. Specifically, the shell 20 can be made of high-temperature resistant materials, such as stainless steel (e.g., 304, 316, 310s, 347H), ceramics (e.g., oxides, nitrides, carbides, etc.), or composite materials (e.g., glass fiber reinforced resin), to withstand high-temperature environments. In the structural design of the shell 20, the outer surface should be kept as smooth as possible to reduce heat concentration in localized areas, improve temperature uniformity, and reduce stress concentration, thereby ensuring its structural strength.

[0042] An insulating filling layer 50 is also provided inside the housing 20, surrounding the wiring body 10. It is important to note that when the insulating filling layer 50 is provided between the housing 20 and the wiring body 10, it should be ensured that the housing 20 and the wiring body 10 are completely separated by the insulating filling layer 50. This ensures that the insulating filling layer 50 provides further insulation to the wiring body 10, guaranteeing its insulation performance and electrical safety. Through the cooperation of the insulating filling layer 50 and the insulating housing 20, a double protective barrier is formed for the wiring body 10, thereby blocking current leakage and ensuring that the wiring body 10 maintains stable dielectric properties at high temperatures, ensuring the safe and reliable operation of the heat storage system. The insulating filling layer 50 effectively isolates the wiring body 10 from the housing 20, improving the safety of the heat storage system. Furthermore, the insulating filling layer 50 reduces the heat transfer rate, protecting the wiring body 10 inside the housing 20 from high temperatures. The insulating filling layer 50 can be detachably connected between the housing 20 and the wiring body 10, facilitating installation, maintenance, and replacement. In terms of material selection, inorganic insulating materials such as alumina ceramic fiber, mica tape / mica board, and glass fiber reinforced resin can be chosen; organic insulating materials such as polyimide (PI), silicone rubber, and fluoroplastics (such as PTFE) can be selected; or composite insulating materials such as nanocomposite materials and aerogel composite materials can be selected. It should be noted that the above-mentioned insulating materials all possess high chemical stability and high-temperature resistance, thus making them suitable for high-temperature electric thermal storage systems and ensuring reliability and safety under long-term use conditions. Preferably, the insulating filler layer 50 is an aluminum-silicon filler layer.

[0043] Two cover plates 30 are provided, namely an upper cover plate 30 and a lower cover plate 30. The upper cover plate 30 and the lower cover plate 30 serve as sealing components, respectively connected to the openings at the upper and lower ends of the receiving cavity. The cover plates 30 and the sealing layer 40 can prevent the insulation filling layer 50 from leaking out, and at the same time prevent heat from overflowing from the heat storage system through this wiring structure, thus ensuring the heat storage performance of the heat storage system. The sealing layer 40 can be formed of rubber, foam, or sealant, and this application does not specifically limit it. Furthermore, the cover plate 30 can be configured as a layered structure, including a main body layer, an insulation layer, and a heat dissipation layer. Specifically, the main body layer can be made of high-temperature resistant metal (such as 316L stainless steel) or composite material (such as ceramic fiber reinforced resin), with a thickness ≥3mm to ensure mechanical strength. The surface of the main body layer can be coated with a nano-ceramic insulating coating (thickness 50-100μm) to improve the withstand voltage rating to above 10kV. On the side away from the sealing layer 40, the cover plate 30 can also be provided with heat dissipation ribs to increase the heat dissipation area. The cover plate 30 can work together with the housing 20 and the insulating filling layer 50 to enhance the insulation performance of the wiring structure.

[0044] It should be noted that in high-temperature electric thermal storage systems, the wiring structure must ensure sealing performance to prevent electrical faults, avoid media leakage, and improve system efficiency. Electric thermal storage systems typically operate in complex environments. If the wiring structure is not sealed, the wiring body 10 inside the housing 20 is susceptible to corrosion from moisture, dust, etc., leading to decreased insulation performance and causing faults such as short circuits and leakage. Furthermore, poor sealing of the housing 20 may cause oxidation and corrosion of internal metal components, affecting conductivity and even causing equipment damage. Moreover, since electric thermal storage systems may involve high-temperature liquids or gases, sealing the wiring structure prevents media leakage to electrical components, causing short circuits or equipment damage. Ensuring the sealing performance of the wiring structure also prevents heat loss from the electric thermal storage system, thereby improving system thermal efficiency.

[0045] In this embodiment, a sealing layer 40 is further provided between the cover plate 30 and the opening. The sealing layer 40 forms a sealing surface through direct contact with the mating surface of the opening. The sealing performance of the inside of the housing 20 is ensured by contact pressure between the cover plate 30 and the housing 20. Optionally, the sealing layer 40 can be sealed with a gasket, such as a rubber, metal, or composite material gasket, which is compressed and deformed by bolt preload to fill the gap; or it can be sealed with an O-ring, such as a circular cross-section rubber ring, with a groove cut on the end face of the housing opening, and the rubber ring is filled into the groove through compression deformation; preferably, the sealing layer 40 uses a planar sealant, that is, the sealing layer 40 is formed by curing a liquid sealant to create an elastic sealing layer. This method is suitable for precision mating surfaces and provides a better sealing effect.

[0046] In this embodiment, the housing 20 has a receiving cavity to accommodate the wiring body 10. The housing 20 provides a certain degree of protection for the wiring body 10. The insulating filler layer 50 between the wiring body 10 and the inner wall of the housing 20 provides insulation for the wiring body 10, thereby preventing electrical faults such as short circuits and leakage. The cover plate 30 is connected to the opening of the housing 20. Since a sealing layer 40 is also connected between the cover plate 30 and the opening, the sealing layer 40 can seal the receiving cavity, thereby improving the sealing performance inside the receiving cavity and effectively preventing the leakage of high-temperature gas inside the receiving cavity. The wiring structure in this embodiment is not only simple in structure, but also has good sealing effect and high safety and reliability.

[0047] In some alternative embodiments, the sealing layer 40 is a heat-resistant sealant layer.

[0048] It should be understood that, since the heat storage system operates in a high-temperature environment, the wiring structure is also affected by heat radiation. Specifically, when the sealing layer 40 is exposed to high temperatures for an extended period, its material may age, affecting the reliability of the wiring structure. Therefore, the selection of the sealing layer 40 is crucial for the stable operation of the wiring structure and even the heat storage system. In this embodiment, the sealing layer 40 is made of heat-resistant sealant. On one hand, this heat-resistant sealing layer 40 can maintain stable sealing performance under prolonged high-temperature conditions, avoiding the carbonization, cracking, or failure of traditional sealing materials such as rubber and silicone at high temperatures. On the other hand, since the heat storage system often uses corrosive media, the heat-resistant sealant has high chemical stability, thereby reducing the risk of corrosion. In practical applications, the sealing layer 40 can be formed by curing liquid heat-resistant sealant. Heating can accelerate the movement of sealant molecules, promoting the curing reaction and thus accelerating curing, thereby improving assembly efficiency. Furthermore, the amount of curing agent can be appropriately increased in the sealant to further increase the curing speed.

[0049] Optionally, the cover plate 30 is provided with a through hole 301, through which the wiring body 10 passes and is interference-fitted with the through hole 301.

[0050] like Figure 2 and 3 As shown, the through hole 301 extends through the cover plate 30 along its height direction. The shape of the through hole 301 is adapted to the cross-sectional shape of the wiring body 10, and the size of the through hole 301 is smaller than the cross-sectional size of the wiring body 10. In this way, the wiring body 10 can pass through the through hole 301 by interference fit, thereby eliminating the gap between the outer periphery of the wiring body 10 and the inner wall of the through hole 301. This prevents the gap between the wiring body 10 and the through hole 301 from affecting the sealing performance of the wiring structure. It can not only effectively block dust, moisture and corrosive media from entering the equipment through the gap between the wiring body 10 and the cover plate 30, but also prevent the heat of the heat storage system from being exposed through the gap, causing a decrease in heat storage performance. Furthermore, this interference fit design creates a mechanical interlock between the wiring body 10 and the through hole 301 of the cover plate 30, effectively preventing axial or radial displacement of the wiring body 10 under vibration or external impact, significantly improving the overall structural stability. This also simplifies the installation process, eliminating the need for additional fasteners (such as bolts and nuts); simply pressing the wiring body 10 into the through hole 301 completes the assembly of the wiring body 10 and the cover plate 30, saving assembly time and production costs. This physical fixing method of interference fit avoids the problem of increased contact resistance caused by aging or loosening of the adhesive, ensuring the reliability of the current transmission path, reducing the risk of fire caused by overheating, and reducing the number of additional structural components required for wiring fixation, thus reducing the size of the wiring structure and making it suitable for heat storage systems with high space requirements.

[0051] Furthermore, this interference fit structure facilitates disassembly, allowing for quick separation of the wiring body 10 and cover plate 30 using specialized tools (such as press-fit / disassembly jigs) during wiring structure maintenance. This eliminates the need for destructive removal between the wiring body 10 and cover plate 30, improving maintenance efficiency and reducing costs. In practical applications, to further ensure the sealing of the wiring structure, after the cover plate 30 and wiring body 10 are interference-fitted, sealant can be applied around the through hole 301. The sealant's fluidity fills any gaps between the through hole 301 wall and the wiring body 10. If the through hole 301 wall is in close contact with the wiring body 10, this sealant structure can be omitted, simplifying the assembly process.

[0052] Exemplary, in some embodiments of this application, the cross-section of the wiring body 10 is rectangular, correspondingly, as... Figure 3 As shown, the through hole 301 on the cover plate 30 is a rectangular hole adapted to the wiring body 10. The length and width of this rectangular hole are both smaller than the length and width of the wiring body 10, ensuring that all four circumferential sides of the wiring body 10 are interference-fitted with the inner wall of the through hole 301 on the cover plate 30. This eliminates the gap between the wiring body 10 and the through hole 301, ensuring the sealing performance of the cover plate 30 and the wiring body 10 after assembly. In practical applications, the housing 20 needs to be filled with an insulating filler layer 50. When assembling the cover plate 30 and the wiring body 10, the lower cover plate can be connected to both ends of the housing 20 first. Then, the insulating filler layer 50 is filled into the receiving cavity of the housing 20. Next, the upper cover plate is connected to the housing 20. Finally, the wiring body 10 is pressed into one of the upper and lower cover plates and passes through the receiving cavity of the housing 20 until it passes through the other of the upper and lower cover plates, with both ends exposed outside the housing 20.

[0053] like Figure 3 As shown, in some optional embodiments, the cross-section of the wiring body 10 along the second direction Y is rectangular, thereby improving the heat dissipation capacity of the wiring body 10.

[0054] Specifically, the wiring body 10 is configured as a solid structure with a rectangular cross-section. This type of rectangular solid structure typically possesses high mechanical strength and structural stability, can withstand significant external forces, and is suitable for various vibration or impact environments, making it suitable for the complex operating environment of high-temperature electric thermal storage systems. Furthermore, since the wiring body 10 supplies power to the heating wire, the current flowing through it when energized causes an increase in its temperature, leading to increased resistance and further increasing energy loss. Additionally, excessively high temperatures can affect the insulation performance of the outer casing 20, potentially causing a short circuit. With a rectangular cross-section along the second direction Y, the wiring body 10's heat dissipation capacity is improved, maximizing energy transmission efficiency and preventing short circuits, electric shocks, and other safety accidents caused by insulation failure, thus ensuring the safety of personnel and equipment. This regular rectangular shape also offers high dimensional accuracy, reduces processing difficulty, and facilitates large-scale production, thereby lowering production costs.

[0055] In some optional embodiments of this application, the wiring body 10 is a high-temperature resistant stainless steel terminal block, which can ensure the stability and safety of the wiring body 10 when the wiring structure is in a high-temperature environment for a long time.

[0056] For example, the wiring body 10 can be made of 310S stainless steel. This type of stainless steel can be used for a long time at high temperatures of 800℃ to 1100℃, has good chemical stability, and is not easily deformed or oxidized at high temperatures, thus ensuring the stability of the resistance of the wiring body 10 and improving the efficiency of power utilization. The wiring body 10 can also be made of 309S stainless steel. This type of stainless steel has excellent strength and acid resistance under high temperature conditions, good stability when exposed to high temperature environments for a long time, and its heat resistance temperature can reach 1050℃, and it can be repeatedly heated at 980℃. In addition, the wiring body 10 can also be made of other high-temperature resistant stainless steels, such as 321H stainless steel, 409 stainless steel, 316Ti stainless steel, 304H stainless steel, etc. This application does not specify the specific specifications of the high-temperature resistant stainless steel. In practical applications, the selection can be made by comprehensively considering factors such as the usage environment, processing performance, and cost. Preferably, in this embodiment, the wiring body 10 is made of 310S stainless steel. Because of its high nickel (Ni) and chromium (Cr) content, it can maintain good corrosion resistance and acid and alkali resistance while having excellent high temperature resistance, making it suitable for high temperature electric heat storage systems.

[0057] Alternatively, the wiring body 10 can also be made of conductive materials such as copper or aluminum. The copper and aluminum materials must meet current-carrying requirements. Surface treatments such as tin plating or silver plating can improve its corrosion resistance and conductivity. When designing the dimensions of the wiring body 10, the rectangular cross-sectional area should be determined based on the current and voltage level to ensure safe current carrying capacity and insulation distance. It should be understood that in high-temperature electric thermal storage systems, the wiring body 10 needs to be selected based on parameters such as current, voltage, and temperature to meet the corresponding system operation requirements. For example, high-power heating elements may require wiring bodies 10 with high current carrying capacity, while high-temperature environments require the wiring body 10 to be made of materials with high-temperature resistance, such as ceramics or special plastics. In practical applications, the material of the wiring body 10 is not limited to that exemplified in the embodiments of this application; those skilled in the art can choose flexibly, and this application does not impose specific limitations on it.

[0058] In some optional embodiments of this application, the insulating filler layer 50 is an aluminum-silicon filler layer.

[0059] Specifically, the insulating filler layer 50 is an aluminum-silicon oxide filler layer with a granular structure, which is filled and compacted between the insulating shell 20 and the wiring body 10. This filler can have both insulation and heat preservation properties. On the one hand, it can cooperate with the insulating shell 20 to achieve double insulation of the wiring structure, effectively prevent electrical faults, and ensure the electrical stability of the wiring structure. On the other hand, due to its good heat preservation properties, it can reduce the heat loss of the heat storage system, ensure heat storage efficiency, and improve energy utilization.

[0060] In some optional embodiments of this application, the housing 20 is a ceramic housing 20, which has high temperature resistance, good insulation and thermal shock stability.

[0061] Specifically, the shell 20 has a cylindrical structure with a hollow interior. As the outermost layer of the wiring structure, the shell 20 is in direct contact with the insulation layer of the heat storage system. The cylindrical structure ensures circumferential thermal uniformity of the shell 20, while its smooth shape reduces stress concentration. Due to the high temperature and strong electrical characteristics of the heat storage system, the high-temperature resistance of this ceramic shell 20 allows it to maintain structural stability even under prolonged high-temperature conditions, thus ensuring the safety of its internal wiring body 10. Its excellent insulation effectively isolates high-voltage current, preventing the risk of leakage and short circuits in the heat storage system. Furthermore, the ceramic shell 20 has good thermal shock resistance, reducing the risk of cracking due to temperature changes and extending its service life. In practical applications, the ceramic shell 20 can be made of alumina ceramic or silicon nitride ceramic.

[0062] It should be noted that, since heat storage systems typically operate in harsh environments such as high temperature and high humidity, the wiring structure is affected by various factors such as heat radiation and moisture erosion, leading to aging of insulation materials and a decline in insulation performance. This can easily result in insulation breakdown and leakage during long-term operation. Once an insulation failure occurs, not only will the heat storage system malfunction, but it may also cause electrical fires, electric shocks, and other safety accidents. In this embodiment, the combination of the ceramic shell 20 and the aluminosilicate filler layer provides dual insulation protection. The ceramic shell 20 has extremely high insulation resistance, effectively isolating high-voltage current and preventing leakage and short circuits. The aluminosilicate filler, as a non-conductive filler, forms a good insulation barrier, further enhancing the insulation effect. Furthermore, the high-temperature resistance of the ceramic shell 20 and the structural stability of the aluminosilicate filler at high temperatures ensure the overall structural stability of the wiring structure under high-temperature operating conditions.

[0063] like Figure 2 As shown, the cover plate 30 includes a body portion 31 and an extension portion 32. The body portion 31 is connected to the opening, and the extension portion 32 extends from the body portion 31 along the first direction X and extends into the receiving cavity. The extension portion 32 enhances the connection strength between the cover plate 30 and the housing 20 on the one hand, and increases the contact area between the cover plate 30 and the housing 20 on the other hand, thereby improving the sealing effect between the two.

[0064] Specifically, two cover plates 30 are provided, namely an upper cover plate 30 and a lower cover plate 30. The upper cover plate 30 and the lower cover plate 30 have the same structure and are symmetrically connected to the upper and lower openings of the housing 20 to jointly seal the receiving cavity of the housing 20. Along the radial direction of the housing 20, the size of the body portion 31 is not less than the maximum size of the housing 20, thereby ensuring that the body portion 31 completely seals the opening of the receiving cavity. The body portion 31 includes two sides facing away from each other along the first direction X, and an extension portion 32 is provided on one of them. The extension portion 32 extends outward from the body portion 31 and protrudes from the body portion 31. The area of ​​the extension portion 32 is approximately the same as the area of ​​the receiving cavity opening of the housing 20, thereby achieving a good fit with the opening. The sealing layer 40 is provided around the outer periphery of the extension portion 32 and is connected between the body portion 31 and the housing 20. In practical applications, the extension 32 can be interference-fitted with the opening of the housing 20, thereby reducing or even eliminating the gap between the cover plate 30 and the inner wall of the housing 20. With the sealing layer 40 provided, the sealing performance of the wiring structure is further enhanced. Furthermore, a heat dissipation rib can be provided on the side of the main body 31 opposite to the extension 32, thereby increasing the heat dissipation area of ​​the cover plate 30 and improving the overall heat dissipation capacity of the wiring structure.

[0065] Optionally, the cover plate 30 is made of high-temperature resistant stainless steel, which can ensure the stability and safety of the cover plate 30 when the wiring structure is in a high-temperature environment for a long time.

[0066] For example, cover plate 30 is made of 310S stainless steel. This type of stainless steel can withstand temperatures above 1000℃, with a continuous operating temperature up to 1200℃. It has good chemical stability and is not easily deformed or oxidized at high temperatures, thus ensuring stable resistance of cover plate 30 and improving energy utilization efficiency. In addition, cover plate 30 can also be made of 309S stainless steel, 316 stainless steel, 321H stainless steel, 316Ti stainless steel, etc., and can be rationally designed according to the ambient temperature of the wiring structure in practical applications. Specifically, cover plate 30 can also be made of 309S stainless steel. This type of stainless steel has excellent strength and acid resistance under high temperature conditions, good stability when exposed to high temperature environments for a long time, and a heat resistance temperature up to 1050℃, and can be repeatedly heated at 980℃. Furthermore, cover plate 30 can also be made of other high-temperature resistant stainless steels, such as 321H stainless steel, 409 stainless steel, 316Ti stainless steel, 304H stainless steel, etc. This application does not specifically limit the specifications of high-temperature resistant stainless steel. In practical applications, the selection can be made by comprehensively considering factors such as the operating environment, processing performance, and cost. Preferably, in this embodiment, the cover plate 30 is made of 310S stainless steel. Because of its high nickel (Ni) and chromium (Cr) content, it can maintain good corrosion resistance and acid and alkali resistance while having excellent high temperature resistance, making it suitable for high temperature electric thermal storage systems.

[0067] like Figure 4 and Figure 5 As shown, another embodiment of the wiring structure of this application is illustrated. A first snap-fit ​​portion 321 is provided on the extension 32 of the cover plate 30, and a second snap-fit ​​portion 201 is provided at the end of the housing 20. When the cover plate 30 is connected to the housing 20, the first snap-fit ​​portion 321 and the second snap-fit ​​portion 201 engage, preventing structural damage caused by the cover plate 30 detaching from the housing 20. This improves the connection stability between the cover plate 30 and the housing 20 and ensures the overall reliability of the wiring structure. It should be noted that since the cover plate 30 in this embodiment is a high-temperature resistant stainless steel cover plate 30, and the housing 20 is a ceramic housing 20, both have high rigidity. Therefore, the dimensions of the first snap-fit ​​portion 321 and the second snap-fit ​​portion 201 in the second direction can be designed to be very small, ensuring only that they can snap into contact. To clearly illustrate their mating relationship... Figure 4 and Figure 5 The dimensions of the first latching part 321 and the second latching part 201 have been enlarged, allowing for flexible design in practical applications.

[0068] Optionally, a wiring groove 101 is provided at one end of the wiring body 10. The wiring groove 101 is used to make an interference fit with the heating wire to improve the connection strength between the wiring body 10 and the heating wire.

[0069] Specifically, the wiring groove 101 has a slot, the size of which is smaller than the diameter of the heating wire. The cross-section of the wiring groove 101 can include one or more of the following: trapezoidal, circular, rectangular, polygonal, etc. Furthermore, along the length of the wiring groove 101, the cross-section of the wiring groove 101 can be the same or different at different positions. This application does not specifically limit the cross-sectional shape of the wiring groove 101. Understandably, by designing the size of the slot to be smaller than the diameter of the heating wire, an interference fit can be achieved between the heating wire and the slot, improving the connection strength between the heating wire and the wiring body 10. Furthermore, the design of the wiring groove 101 can also increase the contact area between the wiring body 10 and the heating wire, thereby reducing contact resistance and power loss. It should be noted that the heating wire is usually cylindrical. When connected to the wiring body 10, it can be regarded as a point contact from the cross-section. When the wiring body 10 is provided with a wiring groove 101, the heating wire is interference-fitted into the wiring groove 101, which can increase the contact area between the heating wire and the wiring groove 101, reduce the current density per unit area, reduce resistance loss, and increase the current path area. This improves conductivity while preventing safety accidents caused by overheating.

[0070] In this embodiment, the wiring body 10 is made of 310S stainless steel. With this material, the wiring groove 101 can be machined using laser cutting, plasma cutting, or machining methods such as milling, planing, and grinding. In practical applications, after the heating wire is pressed into the wiring groove 101, resistance welding or high-frequency induction welding can be used to weld the pressed parts, achieving a reliable connection between the heating wire and the wiring body 10.

[0071] The assembly process of the wiring structure in the embodiments of this application is described below:

[0072] S1: Assembly of housing 20 and lower cover plate 30: Apply heat-resistant sealant to the lower end face of housing 20, press the lower cover plate 30 into the lower end opening of housing 20, so that the extension 32 of the lower cover plate 30 extends into the receiving cavity of housing 20, and the body part 31 of the lower cover plate 30 is connected to the heat-resistant sealant on the lower end face of housing 20, and wait for the heat-resistant sealant to cure.

[0073] S2: Pre-filled filler layer: The aluminum-silicon filler layer is evenly filled into the cavity and compacted by vibration;

[0074] S3: Install the top cover plate 30: Apply heat-resistant sealant to the upper end face of the housing 20, press the top cover plate 30 into the upper opening of the housing 20, so that the extension 32 of the top cover plate 30 extends into the receiving cavity of the housing 20, and the body part 31 of the top cover plate 30 is connected to the heat-resistant sealant on the upper end face of the housing 20, and wait for the heat-resistant sealant to cure.

[0075] S5: Wiring body 10 insertion: Press the wiring body 10 into the through hole 301 on the upper cover plate 30 and the lower cover plate 30 from top to bottom, so that the wiring body 10 is in the target position, while ensuring that the wiring hole 102 and the wiring groove 101 are exposed outside the housing 20.

[0076] S6: Heating wire crimping: Remove impurities from the surface of the heating wire and wiring groove 101 to ensure that the contact surface is clean. Press the heating wire evenly into the wiring groove 101 and form a tight fit with the wiring groove 101. Weld the contact parts to ensure that the weld is free of defects such as incomplete welding or cracks. The contact resistance value must be less than 5% of the unwelded area.

[0077] It should be noted that the above assembly process is for illustrative purposes only and is not a limitation on the assembly steps of the wiring structure. In actual operation, technicians can flexibly design the assembly steps according to the material properties, structural characteristics, assembly conditions, etc. of the components.

[0078] In summary, the wiring structure provided in this application embodiment has at least the following advantages:

[0079] In this embodiment, the housing has a receiving cavity to accommodate the wiring body. The housing provides some protection for the wiring body, and the insulating filler layer between the wiring body and the inner wall of the housing provides insulation, thus preventing electrical faults such as short circuits and leakage. The cover plate is connected to the opening of the housing, and a sealing layer is connected between the cover plate and the opening. This sealing layer seals the receiving cavity, thereby improving the sealing performance within the cavity and effectively preventing the leakage of high-temperature gas. The wiring structure in this embodiment is not only simple in structure but also has good sealing effect and high safety and reliability.

[0080] This application embodiment also provides a heat storage system, including a heating wire and the wiring structure mentioned above, wherein the wiring body 10 is provided with a wiring groove 101, the heating wire is at least partially connected in the wiring groove 101, and the heating wire and the groove opening of the wiring groove 101 are interference fit.

[0081] It should be noted that in this embodiment, the wiring structure is the same as that in any of the above embodiments, and its beneficial effects are similar, so it will not be described in detail here.

[0082] The wiring structure, as the core component of the electrical connection, is responsible for introducing external power into the system and distributing electrical energy to the heating wire. The wiring body 10 connects to the heating wire to form a complete electrical circuit. The heating wire is the direct heat source of the heat storage system. It is interference-fitted with the slot 101 on the wiring body 10 to achieve electrical connection with the wiring structure, allowing current to flow and converting electrical energy into heat energy through the thermal effect of the current. The heat storage system also includes a heat storage body. When current flows through the heating wire, heat can be transferred to the heat storage body through direct contact or radiative heat transfer. The heat storage body is responsible for storing the heat energy generated by the heating wire and releasing the heat to the load (such as heating systems or industrial equipment) when needed through natural convection, forced circulation, or heat conduction. The wiring structure, heating wire, and heat storage body form a closed loop of "electrical energy-thermal energy-heat storage" in the heat storage system. The wiring structure is the hub of electrical energy transmission, the heating wire is the core of heat energy generation, and the heat storage body is the carrier of heat energy storage.

[0083] It should be noted that the material (such as nickel-chromium alloy, iron-chromium-aluminum alloy) and structure (such as spiral or corrugated) of the heating wire directly affect the heating efficiency and service life. The material (such as ceramic or metal oxide) and structure (such as honeycomb or plate-like) of the heat storage medium determine its heat storage density and thermal conductivity, thus affecting the heating efficiency of the heating wire and the overall performance of the system.

[0084] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0085] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A wiring structure, characterized by, The wiring structure includes: a wiring body (10), a housing (20), a cover plate (30), a sealing layer (40), and an insulating filling layer (50); wherein, The housing (20) is provided with a receiving cavity and includes two ends disposed opposite to each other along a first direction (X). The two ends of the housing (20) are provided with openings. The cover plate (30) is connected to the openings. The sealing layer (40) is connected between the cover plate (30) and the openings and is used to seal the receiving cavity. The wiring body (10) passes through the housing (20), and the insulating filling layer (50) fills the receiving cavity and is located between the housing (20) and the wiring body (10).

2. The wiring structure according to claim 1, characterized by The sealing layer (40) is a heat-resistant sealant layer.

3. The wiring structure according to claim 1, wherein The cover plate (30) is provided with a through hole (301), and the wiring body (10) passes through the through hole (301) and is interference-fitted with the through hole (301).

4. The wiring structure according to claim 1, wherein The cover plate (30) includes a body portion (31) and an extension portion (32). The body portion (31) is connected to the opening, and the extension portion (32) extends from the body portion (31) along the first direction (X) and extends into the receiving cavity.

5. The wiring structure according to claim 4, wherein The extension (32) is provided with a first snap-fit ​​part (321), and the housing (20) is provided with a second snap-fit ​​part (201). When the cover plate (30) is connected to the housing (20), the first snap-fit ​​part (321) and the second snap-fit ​​part (201) are snap-fit ​​connected.

6. The wiring structure according to any one of claims 1 to 5, characterized by, The cross-section of the wiring body (10) along the second direction (Y) is rectangular, and the second direction (Y) intersects with the first direction (X).

7. The wiring structure according to claim 6, wherein The wiring body (10) is configured as a solid structure with a rectangular cross-section.

8. The wiring structure according to any one of claims 1 to 5, characterized by The wiring body (10) is a high-temperature resistant stainless steel terminal block.

9. The wiring structure according to any one of claims 1 to 5, characterized by, The insulating filler layer (50) is an aluminum-silicon filler layer.

10. The wiring structure according to any one of claims 1 to 5, characterized by The housing (20) is a ceramic housing (20).

11. The wiring structure according to any one of claims 1 to 5, characterized by The shell (20) has a cylindrical structure.

12. The wiring structure according to any one of claims 1 to 5, characterized by One end of the wiring body (10) is provided with a wiring groove (101), which is used to interfere with the heating wire.

13. A thermal storage system characterized by, The device includes a heating wire and a wiring structure as described in any one of claims 1 to 12, wherein the wiring body (10) is provided with a wiring groove (101), the heating wire is at least partially connected in the wiring groove (101), and the heating wire is interference-fitted with the groove opening of the wiring groove (101).