High-power sound box heat dissipation plate structure

Abstract

The utility model discloses a high-power sound box heat dissipation plate structure, which relates to the technical field of sound box power amplifier module heat dissipation, and comprises a power amplifier plate and a heat dissipation plate, fixing columns are arranged at four corners of the upper end of the power amplifier plate, the fixing columns are fixedly connected with the heat dissipation plate through screws, a heat conduction copper pipe is fixed in the middle of the upper end of the power amplifier plate, and the heat conduction copper pipe is fixedly connected with the heat dissipation plate through screws. A connecting mechanism is arranged at the end, close to the power amplifier board, of the heat dissipation board, and the heat conduction copper pipe penetrates through the connecting mechanism and extends into the heat dissipation board. A penetrating air channel is formed in the side face of the heat dissipation plate, and the end of the heat conduction copper pipe is located in the air channel; the utility model discloses a high-power sound box heat dissipation plate structure. The vibration of the heat dissipation plate drives the air channel and the expansion plate to swing, air flow is accelerated, the heat dissipation efficiency is improved, a heat conduction copper pipe is combined with a copper connecting mechanism fixing cover and a connecting cylinder, the heat conduction efficiency is improved, and heat is rapidly dispersed to the heat dissipation plate; through the design of the through holes and the expansion plates, air forms turbulent flow under the vibration effect, and the heat dissipation effect is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for speaker amplifier modules, specifically a heat dissipation plate structure for high-power speakers. Background Technology

[0002] When high-power speakers operate under heavy load for extended periods, the amplifier module generates a significant amount of heat. Poor heat dissipation can lead to performance degradation or even damage to components. Traditional cooling methods primarily rely on heat sinks and fans for forced cooling, but these methods have the following drawbacks:

[0003] Passive heat dissipation is inefficient: relying solely on metal conduction and natural convection results in slow heat dissipation, making it difficult to meet high power requirements.

[0004] Active cooling is noisy: Although forced cooling by a fan can improve efficiency, it will generate additional noise and affect sound quality.

[0005] In existing technologies, some heat dissipation structures use heat pipes to enhance heat conduction, but there are still problems such as limited heat dissipation area and insufficient air flow; therefore, there is an urgent need for an optimized structure that can not only dissipate heat efficiently, but also enhance heat dissipation by utilizing the speaker's own vibration. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides a high-power speaker heat dissipation plate structure, which solves the heat dissipation problem of high-power speaker amplifier modules, improves the heat dissipation efficiency of amplifier modules, improves the airflow efficiency within the heat dissipation space, and thus enhances the heat dissipation effect.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a high-power speaker heat sink structure, comprising an amplifier board and a heat sink, wherein fixed posts are provided at the four corners of the upper end of the amplifier board, and the fixed posts are fixedly connected to the heat sink by screws; a heat-conducting copper pipe is fixed in the middle of the upper end of the amplifier board; a connecting mechanism is provided at one end of the heat sink near the amplifier board, and the heat-conducting copper pipe extends into the interior of the heat sink through the connecting mechanism; a through-flow air duct is provided on the side of the heat sink, and the end of the heat-conducting copper pipe is located in the air duct, so that heat is conducted to the interior of the heat sink through the heat-conducting copper pipe, and the airflow is enhanced by vibration to improve the heat dissipation efficiency.

[0008] Furthermore, the heat sink has perforations, and inclined extension plates are fixed to the upper and lower edges of both sides of the perforations. When vibrating, the extension plates swing up and down to accelerate airflow.

[0009] Furthermore, the connecting mechanism includes a fixed cover and a connecting cylinder. The connecting cylinder is fixed to the upper end of the fixed cover. The heat-conducting copper pipe passes through the fixed cover and the connecting cylinder. Both the fixed cover and the connecting cylinder are made of copper to improve heat conduction efficiency.

[0010] Furthermore: a horizontal plate is fixed inside the heat sink, and the heat-conducting copper pipe passes through the horizontal plate. The horizontal plate and the heat sink are integrally formed to create a flow channel to enhance air convection.

[0011] Furthermore: a heat-receiving plate is fixed to the upper end of the heat sink, and a heat dissipation strip is fixed to the upper end of the heat-receiving plate. The heat dissipation strip is distributed crosswise with the heat sink to increase the heat dissipation area.

[0012] Furthermore, the air duct is located between the two perforations, which disperses the airflow and further improves heat dissipation efficiency.

[0013] This invention provides a heat dissipation plate structure for a high-power speaker. Compared with the prior art, it has the following advantages:

[0014] The high-power speaker heat sink structure uses the vibration of the heat sink to drive the air duct and expansion plate to swing, accelerating airflow and improving heat dissipation efficiency. The heat-conducting copper pipe is combined with the copper connecting mechanism fixing cover and connecting cylinder to improve heat conduction efficiency, allowing heat to be quickly dispersed to the heat sink. The design of the perforation and expansion plate causes the air to form turbulence under the action of vibration, enhancing the heat dissipation effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the heat-conducting copper pipe and heat sink of this utility model;

[0017] Figure 3 This is a schematic diagram of the connection mechanism of this utility model;

[0018] Figure 4 This is a schematic diagram of a partial cross-section of the heat sink of this utility model;

[0019] Figure 5 for Figure 2 Enlarged structural diagram at point A;

[0020] Figure 6 for Figure 4 Enlarged structural diagram at point B.

[0021] In the diagram: 1. Amplifier board; 2. Heat sink; 3. Perforation; 4. Expansion board; 5. Mounting post; 6. Heat-conducting copper pipe; 7. Mounting cover; 8. Connecting cylinder; 9. Air duct; 10. Horizontal plate; 11. Heated plate; 12. Heat sink strip. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-6 This utility model provides a technical solution: a high-power speaker heat sink structure; specifically composed of an amplifier board 1 and a heat sink 2. Fixing posts 5 are fixed at the four corners of the upper end of the amplifier board 1, and the fixing posts 5 are fixedly connected to the heat sink 2 by screws. The heat generated by the amplifier board 1 is conducted to the heat sink 2, and heat is dissipated through the contact between the heat sink 2 and the air. This is existing technology and will not be described in detail here. A heat-conducting copper pipe 6 is fixed in the middle of the upper end of the amplifier board 1. A connecting mechanism is provided at one end of the heat sink 2 near the amplifier board 1. The heat-conducting copper pipe 6 passes through the connecting mechanism and extends into the heat sink 2. An air duct 9 is provided on the side of the heat sink 2, penetrating the heat sink 2. Furthermore, the end of the heat-conducting copper pipe 6 is located in the air duct 9 inside the heat sink 2. In this way, the heat generated by the power amplifier board 1 is conducted to the heat sink 2 through the heat-conducting copper pipe 6. During the conduction process, the heat-conducting copper pipe 6 contacts the connecting mechanism for heat transfer. The contact between the connecting mechanism and the heat sink 2 increases the heat dissipation area. At the same time, when the speaker vibrates during operation, the vibration is transmitted to the power amplifier board 1 and the heat sink 2 through the speaker shell and the connecting parts. When the heat sink 2 vibrates, it causes the air duct 9 to shake, which in turn causes airflow in the surrounding space of the air duct 9. This allows the heat inside the heat sink 2 to flow, making the heat on the heat sink 2 dissipate faster and improving the overall heat dissipation efficiency.

[0024] A perforation 3 is provided on the heat sink 2. An expansion plate 4 is fixed to the upper and lower edges on both sides of the perforation 3. The expansion plate 4 is set at an angle. When the heat sink 2 vibrates with the overall speaker, the expansion plate 4 can move up, down, left and right, thereby making the internal air flow faster and improving the heat dissipation efficiency. The air duct 9 is set between the two perforations 3, so that the air flows in a dispersed manner inside, further improving the heat dissipation efficiency.

[0025] The connecting mechanism includes a fixed cover 7, with a connecting cylinder 8 fixed to the upper end of the fixed cover 7. A heat-conducting copper pipe 6 passes through the fixed cover 7 and the connecting cylinder 8. Both the fixed cover 7 and the connecting cylinder 8 are made of copper, which allows for faster heat transfer when the heat-conducting copper pipe 6 contacts the fixed cover 7 and the connecting cylinder 8. A horizontal plate 10 is fixed inside the heat sink 2, and the heat-conducting copper pipe 6 also passes through the horizontal plate 10. The horizontal plate 10 and the heat sink 2 are integrally formed. The flow channel formed by the horizontal plate 10 and the heat sink 2 is used for the flow of internal hot air, allowing the air to flow while vibrating left, right, back and forth inside the heat sink 2.

[0026] A heat-receiving plate 11 is fixed at the upper end of the heat sink 2, and a heat dissipation strip 12 is fixed at the upper end of the heat-receiving plate 11. The heat dissipation strip 12 and the heat sink 2 are arranged in a cross shape. The heat-receiving plate 11 absorbs the heat in the air and then transfers it to the heat dissipation strip 12. The heat dissipation strip 12 comes into contact with the air and achieves a heat dissipation effect. At this time, the overall heat dissipation area is increased, which can improve the overall heat dissipation efficiency.

Claims

1. A high-power speaker box heat dissipation plate structure, comprising a power amplifier plate (1) and a heat dissipation plate (2), the upper end of the power amplifier plate (1) is provided with a fixing column (5) at the four corners, and the fixing column (5) is fixedly connected with the heat dissipation plate (2) through a screw, characterized in that: A heat-conducting copper pipe (6) is fixed in the middle of the upper end of the power amplifier board (1). A connecting mechanism is provided at one end of the heat sink (2) near the power amplifier board (1). The heat-conducting copper pipe (6) passes through the connecting mechanism and extends into the heat sink (2). A through air duct (9) is opened on the side of the heat sink (2). The end of the heat-conducting copper pipe (6) is located in the air duct (9) so that heat is conducted to the heat sink (2) through the heat-conducting copper pipe (6) and the air flow is enhanced by vibration to improve the heat dissipation efficiency.

2. The heat dissipation plate structure of a high-power speaker box according to claim 1, characterized in that: The heat sink (2) has a perforation (3), and inclined expansion plates (4) are fixed on the upper and lower edges of the perforation (3). When vibrating, the expansion plates (4) swing up and down to accelerate the airflow.

3. The heat dissipation plate structure of a high-power speaker box according to claim 2, characterized in that: The connecting mechanism includes a fixed cover (7) and a connecting cylinder (8). The upper end of the fixed cover (7) is fixed with the connecting cylinder (8). The heat-conducting copper pipe (6) passes through the fixed cover (7) and the connecting cylinder (8). Both the fixed cover (7) and the connecting cylinder (8) are made of copper to improve the heat conduction efficiency.

4. The heat dissipation plate structure of a high-power speaker box according to claim 2, characterized in that: The heat sink (2) has a horizontal plate (10) fixed inside, and the heat-conducting copper pipe (6) passes through the horizontal plate (10). The horizontal plate (10) and the heat sink (2) are integrally formed to form a flow channel to enhance air convection.

5. The heat dissipation plate structure of a high-power speaker box according to claim 2, characterized in that: A heat-receiving plate (11) is fixed to the upper end of the heat sink (2), and a heat dissipation strip (12) is fixed to the upper end of the heat-receiving plate (11). The heat dissipation strip (12) and the heat sink (2) are distributed in a cross pattern to increase the heat dissipation area.

6. The high-power speaker heat dissipation plate structure according to claim 2, characterized in that: The air duct (9) is located between the two perforations (3), which disperses the airflow and further improves the heat dissipation efficiency.

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