Circuit board assembly and household appliance

Abstract

The utility model relates to a circuit board assembly, the circuit board assembly (1) comprises a main circuit board (10) and at least one sub-circuit board (20), the sub-circuit board is provided with a connecting part (21), the main circuit board is provided with a matching connecting part (11) used for the insertion of the connecting part, the connecting part comprises an electric contact part (22), and the electric contact part (22) is connected with the sub-circuit board (20). At least one electrical contact (24) is provided on a first surface (23) of the sub-circuit board, said electrical contact being configured to be electrically connected to a mating electrical contact (12) on the main circuit board, and wherein at least one first single-sided electrical contact (24) is provided on the first surface (23) of the sub-circuit board, said first single-sided electrical contact being electrically isolated from an electrical contact located on a second surface (25) of the sub-circuit board, at least one second single-sided electrical contact (26) is provided on the second side of the sub-circuit board, said second single-sided electrical contact being electrically isolated from the electrical contact on the first side of the sub-circuit board. The utility model further relates to a household appliance.

Description

Technical Field

[0001] This utility model relates to a circuit board assembly and a household appliance. Background Technology

[0002] In the prior art, circuit board assemblies consisting of a main circuit board and sub-circuit boards are known. In such circuit board assemblies, the sub-circuit boards can be electrically and mechanically connected to the main circuit board, allowing some circuitry that would otherwise be located on the main circuit board to be transferred to the sub-circuit boards. By transferring some circuit functions from the main circuit board to the sub-circuit boards, the area occupied by the main circuit board can be reduced, and the overall space utilization of the assembly can be optimized. As circuit complexity increases, there may be a large number of interconnection requirements between the main circuit board and the sub-circuit boards. However, the number of available electrical contact points or logic / signal pins between the main circuit board and the sub-circuit boards is constrained by the size of the sub-circuit boards themselves, as well as the size and layout of the main circuit board. This leads to a contradiction between the integration and compactness of the circuit board assembly and the circuit complexity, especially the need to set more electrical contacts or logic pins between the main circuit board and the sub-circuit boards. This contradiction is particularly prominent in applications requiring high-density interconnection.

[0003] Therefore, there is an urgent need for a solution that can integrate more electrical contact points or logic pins in the limited connection area between the main circuit board and the sub-circuit board. Utility Model Content

[0004] The objective of this invention is to provide a circuit board assembly and a household appliance that overcome at least some of the deficiencies in the prior art.

[0005] The first aspect of this utility model relates to a circuit board assembly, the circuit board assembly including a main circuit board and at least one sub-circuit board, the sub-circuit board having a connecting portion, and the main circuit board having a mating connecting portion for insertion of the connecting portion, the connecting portion including an electrical contact portion configured to be electrically connected to a mating electrical contact portion on the main circuit board, at least one first single-sided electrical contact portion being provided on a first surface of the sub-circuit board, the first single-sided electrical contact portion being electrically isolated from electrical contacts located on a second surface of the sub-circuit board, and at least one second single-sided electrical contact portion being provided on the second surface of the sub-circuit board, the second single-sided electrical contact portion being electrically isolated from electrical contacts located on the first surface of the sub-circuit board.

[0006] According to one embodiment of this utility model, the first single-sided electrical contact and the second single-sided electrical contact belong to different networks.

[0007] According to one embodiment of the present invention, at least one first single-sided electrical contact on the first surface of the sub-circuit board and at least one second single-sided electrical contact on the second surface of the sub-circuit board are positioned corresponding to each other.

[0008] According to one embodiment of the present invention, the connecting portion has a partial section in which a first one-sided electrical contact portion on a first surface of a sub-circuit board and a second one-sided electrical contact portion on a second surface of the sub-circuit board are offset from each other.

[0009] According to one embodiment of the present invention, the connecting part includes a connecting tooth, and a connecting tooth is provided with only one first single-sided electrical contact and / or only one second single-sided electrical contact.

[0010] According to one embodiment of the present invention, the mating connection portion includes a connection hole for inserting the connecting tooth, and a first mating electrical contact portion that mates with a first single-sided electrical contact portion and / or a second mating electrical contact portion that mates with a second single-sided electrical contact portion is provided in the region of the connection hole.

[0011] According to one embodiment of the present invention, material removal portions are respectively constructed at both ends of the connecting hole in the surface extension direction of the sub-circuit board to achieve electrical isolation between the first mating electrical contact portion and the second mating electrical contact portion.

[0012] According to one embodiment of the present invention, the material removal part is constructed in the form of one, two or more through holes, and the through holes are connected to the connecting holes.

[0013] According to one embodiment of the present invention, the material removal section is constructed as a groove extending through a plurality of connecting holes.

[0014] According to one embodiment of the present invention, the connecting part includes a connecting piece, on which a plurality of first single-sided electrical contacts and a plurality of second single-sided electrical contacts are provided.

[0015] According to one embodiment of the present invention, the mating connection portion includes a connecting groove for inserting the connecting piece, and a plurality of first mating electrical contacts that are matched with the plurality of first single-sided electrical contacts and a plurality of second mating electrical contacts that are matched with the plurality of second single-sided electrical contacts are provided in the region of the connecting groove.

[0016] According to one embodiment of the present invention, the first mating electrical contact and the second mating electrical contact are electrically isolated by the mating connection portion itself.

[0017] According to one embodiment of the present invention, the electrical contact portion and the mating electrical contact portion are formed of conductive material, and the conductive materials on the electrical contact portion and the mating electrical contact portion are welded to each other, wherein the conductive material is electroplated on the main circuit board, or the mating electrical contact portion is formed only by the conductive layer metal of the main circuit board itself.

[0018] According to one embodiment of the present invention, an edge connector is constructed on the free edge of the sub-circuit board, the edge connector including rows of gold fingers, and the edge connector is configured to connect with a mating plug connector.

[0019] According to one embodiment of the present invention, the edge connector includes at least one first single-sided gold finger on a first surface of a sub-circuit board, the first single-sided gold finger being electrically isolated from gold fingers on a second surface of the sub-circuit board, and the edge connector includes at least one second single-sided gold finger on the second surface of the sub-circuit board, the second single-sided gold finger being electrically isolated from gold fingers on the sub-circuit board.

[0020] The second aspect of this utility model relates to a household appliance, which includes a circuit board assembly according to the first aspect of this utility model.

[0021] Other features of this invention are derived from the accompanying drawings and the detailed description. All features and combinations thereof mentioned above in the specification, as well as features and combinations thereof mentioned below in the detailed description and / or shown separately in the drawings, can be used not only in the corresponding combinations given, but also in other combinations, or in their individual states. Attached Figure Description

[0022] Figure 1 A circuit board assembly according to one embodiment of the present invention is schematically shown;

[0023] Figure 2 schematically shown Figure 1 Exploded view of the circuit board assembly;

[0024] Figure 3 A schematic cross-sectional view of the electrical contact area of ​​a circuit board, as known in the prior art, is shown.

[0025] Figure 4 A schematic cross-sectional view of the electrical contact area of ​​a sub-circuit board of a circuit board assembly according to one embodiment of the present invention is shown.

[0026] Figure 5 A schematic cross-sectional view of the electrical contact area of ​​a sub-circuit board of a circuit board assembly according to another embodiment of the present invention is shown.

[0027] Figure 6 A schematic cross-sectional view showing the electrical contact area of ​​a sub-circuit board of a circuit board assembly according to another embodiment of the present invention;

[0028] Figure 7 A schematic diagram showing one side of a sub-circuit board of a circuit board assembly according to one embodiment of the present invention;

[0029] Figure 8 A schematic diagram showing one side of a sub-circuit board of a circuit board assembly according to another embodiment of the present invention;

[0030] Figure 9 A schematic diagram showing one side of a sub-circuit board of a circuit board assembly according to another embodiment of the present invention;

[0031] Figure 10 Show Figure 9 A schematic cross-sectional view of the electrical contact area of ​​the sub-circuit board;

[0032] Figure 11 A schematic diagram showing the mating connection area of ​​the main circuit board of a circuit board assembly according to one embodiment of the present invention;

[0033] Figure 12 A schematic cross-sectional view of the electrical contact area of ​​a sub-circuit board of a circuit board assembly according to one embodiment of the present invention is shown.

[0034] Figure 13 A schematic diagram showing the mating connection area of ​​the main circuit board of a circuit board assembly according to another embodiment of the present invention;

[0035] Figure 14 A schematic diagram showing the mating connection area of ​​the main circuit board of a circuit board assembly according to another embodiment of the present invention;

[0036] Figure 15 This diagram shows a mating connection area of ​​the main circuit board of a circuit board assembly according to another embodiment of the present invention. Detailed Implementation

[0037] The present invention will now be described with reference to the accompanying drawings, which illustrate several embodiments of the invention. These drawings are not necessarily to scale, and their emphasis is generally on illustrating the principles of the invention. For clarity, the thickness dimensions of lines, layers, and / or regions may be exaggerated in the drawings. However, it should be understood that the invention can be presented in many different ways and is not limited to the embodiments described below; in fact, the embodiments described below are intended to make the invention more complete and to fully illustrate the scope of protection of the invention to those skilled in the art. It should also be understood that the embodiments disclosed herein can be combined in various ways to provide further additional embodiments.

[0038] It should be understood that the terminology used herein is for describing specific embodiments only and is not intended to limit the scope of the invention. All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art unless otherwise defined. For the sake of brevity and / or clarity, well-known functions or structures may not be described in detail.

[0039] In this document, the term “A or B” includes both “A and B” and “A or B”, rather than exclusively including only “A” or only “B”, unless otherwise specified.

[0040] In this document, the term "exemplary" means "serving as an example, instance, or illustration." Any implementation described herein is not necessarily to be construed as preferred or advantageous over other implementations. Moreover, this invention is not limited to any stated or implied theory given in the foregoing technical field, background art, invention content, or specific embodiments.

[0041] It should also be understood that the term "including / comprises," as used herein, indicates the presence of the indicated feature, whole, step, operation, unit, and / or component, but does not preclude the presence or addition of one or more other features, wholes, steps, operations, units, and / or components, and / or combinations thereof. Unless otherwise defined, all terms (including technical and scientific terms) are used herein in the general sense they have in the field to which the example pertains.

[0042] Figure 1 and Figure 2 A circuit board assembly 1 according to one embodiment of the present invention is schematically shown. The circuit board assembly 1 includes a main circuit board 10 and at least one sub-circuit board 20. For example... Figure 2As can be most clearly seen, the sub-circuit board 20 is configured with a connecting portion 21, and the main circuit board 10 is configured with a mating connecting portion 11 for insertion of the connecting portion 21. The connecting portion 21 of the sub-circuit board 20 includes an electrical contact portion 22, which is configured to electrically connect with a mating electrical contact portion 12 on the main circuit board 10. Here, a mechanical connection between the sub-circuit board 20 and the main circuit board 10 can be achieved by means of the connecting portion 21 and the mating connecting portion 11. Furthermore, an electrical connection between the circuit board 20 and the main circuit board 10, particularly an electrical connection between the network on the sub-circuit board 20 and the corresponding network on the main circuit board 10, can be achieved by the electrical contact portion 22 and the mating electrical contact portion 12. Within the scope of this invention, "network" specifically refers to a PCB network.

[0043] When the main circuit board 10 is placed flat or horizontally, the sub-circuit board 20 can be mounted on the main circuit board 10 via the connecting portion 21, making the sub-circuit board 20 upright relative to the main circuit board 10. The sub-circuit board 20 can be tilted or substantially vertical relative to the main circuit board 10, for example. The sub-circuit board 20 can be electrically connected to the main circuit board 10 via the electrical contact 22 located in the region of the connecting portion 21 and the mating electrical contact 12 in the region of the mating connecting portion 11. By setting the sub-circuit board 20, some of the circuitry that would normally be arranged on the main circuit board 10 can be transferred to the sub-circuit board 20. For example, circuit elements (not shown) can also be provided on the sub-circuit board 20. Advantageously, the circuit elements provided on the sub-circuit board 20 can be surface mount elements and / or through-hole elements, such as resistors, inductors, SCR protection devices, capacitors, etc. By setting the sub-circuit board 20 on the main circuit board 10, the area occupied by the circuit elements on the main circuit board 10 and the overall structural space required for the circuit board assembly 1 can be effectively reduced. This is particularly advantageous for applications that require the arrangement of complex circuits in a limited space.

[0044] Unlike additional metal pins or headers mounted on a circuit board, within the scope of this invention, the electrical contact 22 should be understood as a metallized contact integrated particularly in the edge region (or connection region) of the sub-circuit board 20, formed by the sub-circuit board 20 itself and existing as an integral part of the sub-circuit board 20. Compared to additional metal pins or headers, the electrical contact 22, as an integral part of the sub-circuit board 20, offers optimized integration, a simplified manufacturing process, and lower production costs.

[0045] Figure 3 A schematic cross-sectional view of the electrical contact area of ​​a conventional sub-circuit board 20' is shown. It can be seen that... Figure 3The conventional sub-circuit board 20' shown exemplarily has five pin definitions, namely PIN1 to PIN5, which are each formed by a pair of symmetrical or corresponding electrical contacts 22' on the first surface 23' and the second surface 25' of the sub-circuit board 20'. These pairs of symmetrical or corresponding electrical contacts 22' are electrically connected to each other via vias 30' and together define a logical pin. In such a sub-circuit board 20', since only one pin can be set at a position along the lateral direction (horizontal direction in the figure) of the arrangement of each pin PIN1 to PIN5, the number of pins that can be arranged in the sub-circuit board 20' with a fixed size will be limited by the size of the sub-circuit board 20' itself. If the number of pins increases, the size of the circuit board 20' must be expanded in the lateral direction to accommodate more pins. This will increase the size of the sub-circuit board 20' and its connections, and also require more space on the main circuit board 10 for the sub-circuit board 20' to set the mating connection 11 for the sub-circuit board 20'. This is not conducive to the integration and compactness of the circuit board assembly.

[0046] In contrast, such as Figures 4 to 6 As shown, in this invention, at least one first single-sided electrical contact 24 is advantageously provided on the first surface 23 of the sub-circuit board 20. The first single-sided electrical contact 24 is electrically isolated from the electrical contact 22 located on the second surface 25 of the sub-circuit board 20. At least one second single-sided electrical contact 26 is provided on the second surface 25 of the sub-circuit board 20, and the second single-sided electrical contact 26 is electrically isolated from the electrical contact 22 located on the first surface 23 of the sub-circuit board 20. For clarity in the figures, only portions of the electrical contact 22, or specifically the first single-sided electrical contact 24 and the second single-sided electrical contact 26, are given reference numerals. In this invention, the single-sided electrical contacts on the first surface 23 and the second surface 25 of the sub-circuit board 20 are electrically isolated from each other, so that each single-sided electrical contact can form an independent logic pin / signal pin. While keeping the size and spacing of the electrical contacts 22 constant, a greater number of pins can be set and defined on a sub-circuit board 20 of the same size, which advantageously improves the flexibility, compactness, and integration of the circuit board assembly design. Advantageously, the first single-sided electrical contact 24 and the second single-sided electrical contact 26 can belong to different networks. The sub-circuit board 20 can be constructed as a multilayer board, especially a double-layer board.

[0047] In some embodiments, at least one first one-sided electrical contact 24 on the first surface 23 of the sub-circuit board 20 may correspond to at least one second one-sided electrical contact 26 on the second surface 25 of the sub-circuit board 20. For example, Figure 4As shown, on the second surface 25 of the sub-circuit board 20, a second single-sided electrical contact 26 can be respectively provided at a position opposite to the five first single-sided electrical contacts 24 on the first surface 23 of the sub-circuit board 20. Here, on the first surface 23 and the second surface 25 of the sub-circuit board 20, two electrical contacts 22 that are positioned opposite each other each form single-sided electrical contacts (i.e., first single-sided electrical contacts 24 and second single-sided electrical contacts 26) and are electrically isolated from each other. These two corresponding electrical contacts 22 (or single-sided electrical contacts) can have different connection definitions, so each single-sided electrical contact can form an independent logic pin. In this way, in Figure 4 A maximum of 10 independent logic pins, PIN1 to PIN10, can exist within the system. Figure 3 The comparison shows that Figure 4 The embodiment has twice the number of pin definitions.

[0048] In some embodiments, such as Figure 5 As shown, the connection portion 21 of the sub-circuit board 20 may have a section in which the first single-sided electrical contact 24 on the first surface 23 of the sub-circuit board 20 and the second single-sided electrical contact 26 on the second surface 25 of the sub-circuit board 20 are offset from each other. This reduces wiring conflicts, reduces parasitic coupling between signals, and disperses mechanical stress to enhance the reliability of the circuit board. This is particularly suitable for scenarios such as high-density interconnection and high-speed signal transmission, and can achieve optimized electrical performance and structural strength within a limited space.

[0049] The electrical contacts 22 of the sub-circuit board 20 can be combined and designed in a variety of ways. Figure 6A schematic cross-sectional view of the electrical contact area of ​​a sub-circuit board 20 of a circuit board assembly 1 according to another embodiment of the present invention is shown. In this embodiment, various forms of electrical contacts 22 of the sub-circuit board 20 are shown. Specifically, on the far left of the sub-circuit board 20, three first single-sided electrical contacts 24 are provided on the first surface 23 of the sub-circuit board 20, forming logic pins PIN1, PIN3, and PIN5, respectively. Corresponding to the positions of these three first single-sided electrical contacts 24, three second single-sided electrical contacts 26 are provided on the second surface 25 of the sub-circuit board 20, forming logic pins PIN2, PIN4, and PIN6, respectively. Furthermore, a logic pin PIN7, formed by a pair of corresponding electrical contacts 22 and vias 30 on the first surface 23 and the second surface 25 of the sub-circuit board 20, is visible. It is constructed in a manner common in the prior art and can hereby be referred to as a double-sided electrical contact 29. To the right of the logic pin PIN7, another first single-sided electrical contact 24 and another second single-sided electrical contact 26 are provided, forming logic pins PIN8 and PIN9, respectively. Finally, a single first single-sided electrical contact 24 is visible on the far right of the sub-circuit board 20, which forms the logic pin PIN10. There is no other second single-sided electrical contact 26 on the opposite side of this single first single-sided electrical contact 24 (i.e., on the second side 25 of the sub-circuit board 20).

[0050] The following is combined with Figures 7 to 9 The construction of the connection portion 21 of the sub-circuit board 20 of the circuit board assembly 1 according to the present invention is described by way of example.

[0051] like Figure 7 As shown, in some embodiments, the connection portion 21 of the sub-circuit board 20 may include a connecting tooth 27. The connecting tooth 27 is formed by cutting the sub-circuit board 20 to remove circuit board material between the connecting teeth 27. The width of a connecting tooth 27 in the lateral direction (horizontal direction in the figure) may substantially correspond to the width of an electrical contact 22. For clarity, only portions of the connecting teeth 27 and electrical contacts 22 are provided with reference numerals. In some embodiments, a connecting tooth 27 may have only one first single-sided electrical contact 24 or only one second single-sided electrical contact 26, or a first single-sided electrical contact 24 on a first surface 23 and a second single-sided electrical contact 26 on a second surface.

[0052] like Figure 8As shown, in some embodiments, the connection portion 21 of the sub-circuit board 20 may include a connecting piece 28. Opposite to the connecting teeth 27, the connecting piece 28 can be understood here as a continuous region in the lateral direction (horizontal direction in the figure), the width of which in the lateral direction may be significantly greater than the width of an electrical contact 22. For clarity, only some of the electrical contacts 22 are given reference numerals. Multiple electrical contacts 22 arranged side-by-side may be provided on the connecting piece 28, for example, multiple first single-sided electrical contacts 24 on the first surface 23 and / or multiple second single-sided electrical contacts 26 on the second surface 25.

[0053] The connecting teeth 27 and connecting pieces 28 of the sub-circuit board 20 can also be combined and designed in a variety of ways. Figure 9 A schematic diagram showing one side (here, the second side 25) of a sub-circuit board 20 of a circuit board assembly 1 according to one embodiment of the present invention is shown. Figure 10 Show Figure 9 A schematic cross-sectional view of the electrical contact area of ​​the sub-circuit board 20. In this embodiment, the sub-circuit board 20 may include a longer connecting piece 28 on the left and a shorter connecting piece 28 on the right. Three connecting teeth 27 may be constructed between the two connecting pieces 28. Here, the leftmost side of the longer connecting piece 28 may be provided with a double-sided electrical contact 29, which is formed by a pair of corresponding electrical contacts 22 and vias 30 on the first surface 23 and the second surface 25 of the sub-circuit board 20, respectively, and together defines a logic pin. The other electrical contacts 22 in the longer connecting piece 28 may all be single-sided electrical contacts 24, 26. In the shorter connecting piece 28, two first single-sided electrical contacts 24 may be provided on the first surface 23, and three second single-sided electrical contacts 26 may be provided on the second surface 25. The two first single-sided electrical contacts 24 and the three second single-sided electrical contacts 26 may be staggered from each other. The three connecting teeth 27 between the two connecting pieces 28 can each have a first single-sided electrical contact 24 on the first surface 23 and a second single-sided electrical contact 26 on the second surface 25. Each single-sided electrical contact 24, 26 can define a logic pin.

[0054] Figure 11 This schematic diagram shows the mating connection portion 11 area of ​​the main circuit board 10 of a circuit board assembly 1 according to one embodiment of the present invention. It has... Figure 11 The main circuit board 10 of the mating connection part 11 shown in the figure can, for example, be connected to the main circuit board 10 of the mating connection part 11. Figure 12 The sub-circuit board 20 shown in the diagram has mechanical and electrical connections. Figure 12The sub-circuit board 20 shown may have two first single-sided electrical contacts 24 on its first surface 23, which form logic pins PIN1 and PIN3, respectively. Corresponding to the positions of these two first single-sided electrical contacts 24, two second single-sided electrical contacts 26 are provided on the second surface 25 of the sub-circuit board 20, which form logic pins PIN2 and PIN4, respectively. In addition, a double-sided electrical contact 29 is visible, which forms logic pin PIN5.

[0055] exist Figure 11 The mating connection portion 11 shown may include a connection hole 13 for inserting the connection teeth 27 of the sub-circuit board 20. A mating electrical contact portion 12 for electrical connection with the electrical contact portion 22 of the sub-circuit board 20 may be provided in the region of the connection hole 13. The electrical contact portion 22 and the mating electrical contact portion 12 may be formed of conductive material, and the conductive material on the mating electrical contact portion 12 may be soldered to the conductive material on the electrical contact portion 22, particularly by wave soldering, thereby achieving the electrical connection between the sub-circuit board 20 and the main circuit board 10.

[0056] Continue to refer to Figure 11 Here, at the two connecting holes 13 on the left side, respectively, a connection can be provided with... Figure 12 The sub-circuit board 20 shown has a first mating electrical contact 14 that mates with a first single-sided electrical contact 24 and a second mating electrical contact 16 that mates with a second single-sided electrical contact 26. The first mating electrical contact 14 and the second mating electrical contact 16 can be electrically isolated from each other and, for example, belong to different networks. Thus, the two first mating electrical contacts 14 can form logic pins PIN1' and PIN3' corresponding to logic pins PIN1 and PIN3 of the sub-circuit board 20, respectively, while the two second mating electrical contacts 16 can form logic pins PIN2' and PIN4' corresponding to logic pins PIN2 and PIN4 of the sub-circuit board 20, respectively. A mating electrical contact 12 at a connection hole 13 on the right side can form a logic pin PIN5' corresponding to logic pin PIN5 of the sub-circuit board 20.

[0057] In some embodiments, in order to achieve electrical isolation between the first mating electrical contact 14 and the second mating electrical contact 16 at the same connection hole 13, the connection hole 13 can be extended in the direction of its extension on the surface of the sub-circuit board 20 ( Figure 11Material removal portions 15 are respectively constructed at both ends of the transverse direction of the circuit board 10. After forming an electrical connection portion 12 by forming a connection hole 13 in the main circuit board 10 and laying conductive material (e.g., copper plating) around the connection hole 13 and the inner wall of the connection hole 13 on both sides of the main circuit board 10, material removal portions 15 are introduced at both ends of the connection hole 13. The conductive material in the material removal portion 15 is removed, while the conductive material in the remaining area is retained. The retained conductive material forms the first mating electrical contact portion 14 and the second mating electrical contact portion 16, respectively, and the first mating electrical contact portion 14 and the second mating electrical contact portion 16 are electrically isolated by the material removal portion 15.

[0058] The material removal section 15 can have various structural forms. For example, the material removal section 15 can be constructed as one, two, or more through holes communicating with the connecting hole. Figure 11 In the embodiment shown, the material removal section 15 can be configured as two through holes 17. Figure 11 The area of ​​through-hole 17 is schematically shown in the upper half of the figure with a light shading. Figure 11 For clarity, only parts of the material removal section 15 and the through hole 17 are marked with reference numerals. After electroplating conductive material at the connecting hole 13, a hole can be drilled in the light shaded area shown to create the material removal section 15. Figure 11 The lower half of the figure schematically shows the connecting hole 13 after the material removal section 15, where the conductive material on both sides has been removed.

[0059] In other embodiments, such as Figure 13 As shown, the material removal section 15 can be configured as a groove 18 extending through a plurality of connecting holes 13. Figure 13 The area of ​​the groove 18 is schematically shown in light shade in the upper half of the figure. After electroplating conductive material at each connecting hole 13, milling can be performed, for example, in the light shaded area shown, to create the material removal section 15. Figure 13 The lower half of the figure schematically shows the connection hole 13 after the material removal section 15, where the conductive material on both sides is removed and the two connection holes 13 are connected to each other.

[0060] In some embodiments, the mating connection portion 11 of the main circuit board 10 may include a connection groove for inserting a connecting piece 28 of the sub-circuit board 20. A first mating electrical contact 14, cooperating with a first single-sided electrical contact 24 of the sub-circuit board 20, and a second mating electrical contact 16, cooperating with a second single-sided electrical contact 26 of the sub-circuit board 20, may be provided in the region of the connection groove. This connection groove can be manufactured, for example, by means of a semi-circular hole process or a stamp perforation process. Furthermore, Figure 13The mating connection portion 11 of the main circuit board 10 shown can be connected to, for example, the three connecting teeth 27 of the sub-circuit board 20. Since it has slots 18 extending through multiple connecting holes 13, the interconnecting connecting holes 13 can also form a connecting slot for the connecting piece 28 of the sub-circuit board 20 to be inserted and connected.

[0061] Alternatively to the methods described above, such as introducing additional conductive material via electroplating to form the mating electrical contact 12, in some embodiments, such as Figure 14 and Figure 15 As shown, the mating electrical contacts on the main circuit board 10 can be formed solely by the conductive metal layer 19 of the main circuit board 10 itself.

[0062] In some embodiments, such as Figure 14 As shown, during the manufacturing process of the main circuit board 10, the mating connection portion 11, such as the connection groove 33 or the connection hole 13, of the main circuit board 10 can be introduced into the main circuit board 10 before etching the conductive layer metal 19 of the main circuit board 10. Figure 14 The upper half of the figure shows the main circuit board with the connecting groove 33 and connecting hole 13 introduced, where the conductive layer metal 19, such as copper foil, which still exists in a planar form, is indicated by dark shading. Here, the conductive layer metal 19 can be etched after the mating connection portion 11 is introduced to form the desired conductor circuit. By selectively removing the conductive layer metal 19 during the etching process, electrically isolated conductive layer metal 19 can be left on both sides of the connecting groove 33 and the connecting hole 13 to form corresponding first mating electrical contact portion 14 and second mating electrical contact portion 16. Figure 14 The lower half of the figure shows the main circuit board 10 after etching, with the etched areas indicated by light shading. Here, six independent logic pins PIN1' to PIN6', formed solely by the conductive layer metal 19, and their corresponding partial metal conductor paths can be seen. These mating electrical contacts, formed solely by the conductive layer metal 19, can be exposed to solder mask and, for example, to corresponding electrical contacts on a sub-circuit board.

[0063] In other embodiments, such as Figure 15 As shown, the mating connection portion 11, such as the connection groove 33 or the connection hole 13, of the main circuit board 10 can also be introduced into the main circuit board 10 after the conductive layer metal 19 of the main circuit board 10 has been etched. Figure 15 The upper half of the diagram shows the main circuit board 10 after etching, with the etched areas indicated by light shading. Three mating electrical contact areas 12, widened relative to the conductor paths, are visible here; these will subsequently be used for electrical connection with corresponding electrical contacts on the sub-circuit boards. Figure 15As shown in the lower half of the figure, the corresponding conductive layer metal 19 can be divided into electrically isolated portions by introducing mating connection portions 11, such as connection grooves 33 or connection holes 13, in the corresponding areas, forming a first mating electrical contact portion 14 and a second mating electrical contact portion 16, respectively. That is, the electrical isolation between the first mating electrical contact portion and the second mating electrical contact portion 16 can be achieved by the connection hole 13 or the connection groove 33 itself. Figure 15 The lower half of the diagram contains a total of six independent logic pins, PIN1' to PIN6'. These mating electrical contacts, formed solely by the conductive metal layer 19, can be soldered, for example, to the corresponding electrical contacts on a sub-circuit board without being covered by the solder mask layer.

[0064] It is understandable that by selectively choosing the geometry and relative position of the retained conductive layer metal 19 and the connecting hole 13, a connection with... Figure 11 and Figure 13 Similarly, with Figure 12 The logic pin PIN5' is matched with PIN5 in the middle.

[0065] In some embodiments, such as Figure 1 and Figure 2 As shown, an edge connector 31 can be constructed on the free edge of the sub-circuit board 20. The edge connector 31 may include rows of gold fingers 32. The edge connector 31 can be configured to interconnect with a mating plug connector (not shown). The plug connector ("plug bar") can be understood here as an adapter between the edge connector 31 of the sub-circuit board 20 and the wiring harness of an external device, enabling a pluggable connection between the edge connector 31 of the sub-circuit board 20 and the wiring harness of the external device. Electrical connections can be established between the circuit board assembly 1 and devices or components (not shown) outside the circuit board assembly 20 via the edge connector 31. Specifically, the sub-circuit board 20 itself can be connected to an external device (not shown) via the edge connector 31, and based on the electrical connection between the sub-circuit board 20 and the main circuit board 10, the main circuit board 10 can also be electrically connected to an external device via the sub-circuit board 20 through the edge connector 31. Therefore, the edge connector 31 provided on the sub-circuit board 20 can be used as a connection interface between the entire circuit board assembly 1 and external devices, thereby advantageously eliminating the need for costly connection terminals or at least reducing the number of connection terminals in the entire circuit board assembly 1.

[0066] Not limited to the illustrated embodiment, the edge connector 31 may also be constructed on the side edge of the sub-circuit board 20. Exemplarily, the sub-circuit board 20 may have a laterally protruding portion for carrying the edge connector 31. Furthermore, more than one edge connector 31 may be constructed on a single sub-circuit board 20.

[0067] In some embodiments, the edge connector 31 may include at least one first single-sided gold finger on the first side 23 of the sub-circuit board 20, the first single-sided gold finger being electrically isolated from gold fingers 32 on the second side 25 of the sub-circuit board 20. The edge connector 31 may also include at least one second single-sided gold finger on the second side 25 of the sub-circuit board 20, the second single-sided gold finger being electrically isolated from gold fingers 32 on the sub-circuit board 20. The first and second single-sided gold fingers may belong to different networks. By providing the first and second single-sided gold fingers, a greater number of logic pins can be provided on a sub-circuit board 20 of the same size, or rather, an edge connector 31 of the same size, which advantageously improves the flexibility, compactness, and integration of the circuit board assembly in interconnecting with external devices. The configuration and arrangement of the first and second single-sided gold fingers can be similar to those of the first single-sided electrical contact 24 and the second single-sided electrical contact 26, and therefore will not be described further.

[0068] Some embodiments, not shown, also relate to household appliances, which may include, for example, a circuit board assembly 1.

[0069] This invention is not limited to the embodiments shown, but includes or extends to all technical equivalents that fall within the scope of the appended claims. The positional designations chosen in the specification, such as, for example, top, bottom, left, right, etc., refer directly to the description and the accompanying drawings, and can be adapted to new positions as their meaning changes.

[0070] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solution of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A circuit board assembly, characterized by, The circuit board assembly (1) includes a main circuit board (10) and at least one sub-circuit board (20). The sub-circuit board is configured with a connecting portion (21), and the main circuit board is configured with a mating connecting portion (11) for insertion of the connecting portion. The connecting portion includes an electrical contact portion (22) configured to be electrically connected to the mating electrical contact portion (12) on the main circuit board. At least one first single-sided electrical contact portion (24) is provided on the first side (23) of the sub-circuit board. The first single-sided electrical contact portion is electrically isolated from the electrical contact portion located on the second side (25) of the sub-circuit board. At least one second single-sided electrical contact portion (26) is provided on the second side of the sub-circuit board. The second single-sided electrical contact portion is electrically isolated from the electrical contact portion located on the first side of the sub-circuit board.

2. The circuit board assembly of claim 1, wherein, The first single-sided electrical contact and the second single-sided electrical contact belong to different networks.

3. The circuit board assembly of claim 1, wherein, At least one first single-sided electrical contact on the first surface of the sub-circuit board corresponds to at least one second single-sided electrical contact on the second surface of the sub-circuit board.

4. The circuit board assembly of claim 1, wherein, The connection portion has a partial section in which a first one-sided electrical contact portion on a first surface of the sub-circuit board and a second one-sided electrical contact portion on a second surface of the sub-circuit board are offset from each other.

5. The circuit board assembly of any one of claims 1 to 4, wherein, The connecting part includes a connecting tooth (27), and a first single-sided electrical contact and / or a second single-sided electrical contact are provided on a connecting tooth.

6. The circuit board assembly of claim 5, wherein, The mating connection includes a connection hole (13) for inserting the connecting teeth, and a first mating electrical contact (14) that mates with the first single-sided electrical contact and / or a second mating electrical contact (16) that mates with the second single-sided electrical contact are provided in the region of the connection hole.

7. The circuit board assembly of claim 6, wherein, Material removal portions (15) are respectively constructed at both ends of the connection hole in the surface extension direction of the sub-circuit board to achieve electrical isolation between the first mating electrical contact portion and the second mating electrical contact portion.

8. The circuit board assembly of claim 7, wherein, The material removal section is constructed in the form of one, two or more through holes (17) communicating with the connecting holes; or the material removal section is constructed in the form of a groove (18) extending through multiple connecting holes.

9. The circuit board assembly of any one of claims 1 to 4, wherein, The connecting part includes a connecting piece (28), on which a plurality of first single-sided electrical contacts and a plurality of second single-sided electrical contacts are provided.

10. The circuit board assembly of claim 9, wherein, The mating connection includes a connecting groove for inserting the connecting piece, and in the region of the connecting groove are provided a plurality of first mating electrical contacts that are matched with the plurality of first single-sided electrical contacts and a plurality of second mating electrical contacts that are matched with the plurality of second single-sided electrical contacts.

11. The circuit board assembly according to claim 6 or 10, characterized in that, Electrical isolation between the first and second mating electrical contacts is achieved through the mating connection itself.

12. The circuit board assembly of any one of claims 1 to 4, wherein, The electrical contact portion and the mating electrical contact portion are formed of conductive material, and the conductive material on the electrical contact portion and the mating electrical contact portion is welded to each other, wherein the conductive material is electroplated on the main circuit board, or the mating electrical contact portion is formed only by the conductive layer metal of the main circuit board itself.

13. The circuit board assembly of any one of claims 1 to 4, wherein, An edge connector (31) is constructed on the free edge of the sub-circuit board. The edge connector includes rows of gold fingers (32) and is configured to connect with a mating plug connector.

14. The circuit board assembly of claim 13, wherein, The edge connector includes at least one first single-sided gold finger on a first side of the sub-circuit board, the first single-sided gold finger being electrically isolated from gold fingers on a second side of the sub-circuit board, and the edge connector also includes at least one second single-sided gold finger on the second side of the sub-circuit board, the second single-sided gold finger being electrically isolated from gold fingers on the sub-circuit board.

15. A domestic appliance characterized in that, The household appliance includes a circuit board assembly according to any one of claims 1 to 14.

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