PCB structure for improving welding yield of plug-in device

Abstract

The utility model discloses a PCB structure for improving the welding yield of a plug-in device, which comprises a substrate, and a welding disc and a reinforcing disc which are arranged on the substrate, the welding disc is circular, and the projection of the welding disc is located in the projection of the reinforcing disc in the orthographic projection direction of the substrate. Through the design, welding flux can be distributed on the reinforcing disc and the welding disc in the welding process, so that the welding contact area is increased, the welding flux can better cover the welding disc, the risk of poor welding such as insufficient welding or welding spot cracking is reduced, the reinforcing disc can absorb and disperse thermal stress and mechanical stress generated in the welding process, and the welding quality is improved. Deformation or damage of the welding disc caused by stress concentration is reduced, stability and consistency of welding can be improved, and therefore the welding yield is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and more specifically, to a PCB structure that improves the soldering yield of through-hole devices. Background Technology

[0002] Printed Circuit Boards (PCBs) are indispensable components in electronic devices, providing physical support for various electronic components and handling signal transmission. With the continuous advancement of electronic technology, through-hole devices have become key components on PCBs for enabling signal connections between components. Ensuring the correct soldering of through-hole devices is a crucial step in the PCB design and manufacturing process.

[0003] Common connector types include through-hole connectors and surface mount connectors. In traditional through-hole connector designs, the pins are soldered to pads on the back of the PCB through drilled holes. However, most through-hole package pins have circular pads, limiting the actual solderable area and easily leading to poor soldering. Furthermore, since through-hole devices typically have some weight, this soldering method often cannot provide sufficient stability, increasing the risk of failure during use. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, this utility model provides a PCB structure that improves the soldering yield of through-hole devices, increases the soldering contact area, helps the solder to cover the solder pad, and thus improves the soldering yield of through-hole devices.

[0005] The technical solution of this utility model is as follows: A PCB structure for improving the soldering yield of plug-in devices includes a substrate and a soldering pad and a reinforcing pad disposed on the substrate. The soldering pad is circular in shape, and the projection of the soldering pad is located within the projection of the reinforcing pad in the orthogonal projection direction of the substrate.

[0006] Furthermore, the substrate is provided with a solder resist window area, the projection of the reinforcing disk is located within the solder resist window area, and the solder resist window area is formed by expanding outward by 0.1 mm from the edge of the reinforcing disk.

[0007] Furthermore, a steel mesh area is provided on the substrate, and the steel mesh area overlaps with the solder resist window area.

[0008] Furthermore, the diameter of the welding pad is 1.5mm to 2.8mm.

[0009] Furthermore, the substrate is provided with insertion holes, and the insertion holes and the soldering pads are coaxially arranged.

[0010] Furthermore, the diameter of the plug hole is 1.0 mm.

[0011] Furthermore, the reinforcing disk includes a base and an arc-shaped portion connected to the base. Two arc-shaped portions are provided, which are distributed on both sides of the base. In the orthogonal projection direction of the substrate, the projection of the welding disk is located within the projection of the base, and the center distance between the two arc-shaped portions is 3.2 mm.

[0012] Furthermore, the base is rectangular and the arcuate portion is semi-circular.

[0013] The advantages of this utility model based on the above solution are as follows:

[0014] (1) The present invention provides a PCB structure for improving the soldering yield of through-hole devices, comprising a substrate and solder pads and reinforcing pads disposed on the substrate. The solder pads are circular in shape, and the projection of the solder pads is located within the projection of the reinforcing pads in the orthogonal projection direction of the substrate. This design allows the solder to be distributed on the reinforcing pads and solder pads during the soldering process, thereby increasing the soldering contact area. This helps the solder to better cover the solder pads and reduces the risk of soldering defects such as cold solder joints or cracked solder joints.

[0015] (2) The PCB structure provided by this utility model for improving the soldering yield of plug-in components has the following advantages: During the soldering process, the reinforcing pad can absorb and disperse the thermal and mechanical stresses generated during soldering, reducing deformation or damage to the soldering pad due to stress concentration. This helps to improve the stability and consistency of the soldering, thereby increasing the soldering yield. Secondly, due to the presence of the reinforcing pad, the tolerance range of the soldering process is wider. Even when some process parameters deviate from the ideal value, the reinforcing pad can provide a certain degree of fault tolerance, ensuring that the soldering quality is not affected. This helps to reduce the operational difficulty and cost in the soldering process, while improving the soldering yield. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a partial structural diagram of the PCB structure in an embodiment of the present utility model;

[0018] Figure 2 for Figure 1 A magnified view of part A.

[0019] In the figure, 1 is the substrate; 2 is the solder pad; 3 is the reinforcing pad; 31 is the base; 32 is the arc-shaped part; 4 is the insertion hole; D1 is the diameter of the solder pad; D2 is the diameter of the insertion hole; and D3 is the center distance between the two arc-shaped parts. Detailed Implementation

[0020] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present invention by way of example, but should not be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments.

[0021] To better understand this utility model, the following description, in conjunction with the accompanying drawings and embodiments, will further illustrate the present utility model:

[0022] A plug-in connector is an electronic component used to enable connections between circuits in electronic devices. It typically includes a series of pins that are soldered to pads on the back of a PCB (printed circuit board) through drilled holes to achieve electrical connection and mechanical fixation.

[0023] In terms of soldering processes, plug-in connectors typically employ wave soldering technology. Wave soldering is a commonly used soldering method whose basic principle is to pass a PCB with components through a wave formed by molten solder. During this process, the solder flows through the contact points between the pins and pads, forming a strong solder joint after cooling.

[0024] However, for heavier through-hole devices, the mechanical fixation provided by solder alone may not be sufficient to support their weight, especially when the device is subjected to vibration or impact, which can easily lead to solder joint failure. Secondly, most through-hole package pins use circular pads. With the miniaturization and increased integration of electronic devices, the space on the PCB has become increasingly limited, making it difficult to further expand the circular pads, thus limiting the actual solderable area. Due to the small soldering area, the solder cannot fully wet the contact surface between the pin and the pad during the cooling process, resulting in insufficient solder joint strength.

[0025] Based on this, the present invention provides a PCB structure for improving the soldering yield of through-hole devices, see [link to relevant documentation]. Figures 1-2 As shown, the PCB structure includes a substrate 1 and solder pads 2 and reinforcing pads 3 disposed on the substrate 1. The solder pads 2 are circular in shape, and in the orthogonal projection direction of the substrate 1, the projection of the solder pads 2 lies within the projection of the reinforcing pads 3. In this embodiment, the reinforcing pads 3 can be arranged according to the space on the substrate 1; that is, the reinforcing pads 3 can be formed by expanding the solder pads 2 outwards to both sides in the horizontal direction, or the reinforcing pads 3 can be formed by expanding the solder pads 2 outwards to both sides in the vertical direction.

[0026] In this embodiment, the solder pad 2 and the reinforcing pad 3 constitute a solder pad group, and multiple solder pad groups are provided on the substrate 1, with a certain distance between two adjacent solder pad groups.

[0027] Specifically, in traditional designs, the welding pad 2 is typically an independent circular structure, and its welding contact area is limited by the diameter D1 of the welding pad. However, in this embodiment, by introducing a reinforcing pad 3, the solder can be distributed not only on the welding pad 2 but also on the reinforcing pad 3 during the welding process, thus achieving a larger welding contact area. This helps the solder to better cover the welding pad 2, improving the reliability and stability of the welding process, reducing welding defects such as incomplete welds (i.e., weak welds with gaps) or weld cracking (i.e., welds breaking under external force or temperature changes), thereby improving the welding yield.

[0028] It is worth mentioning that during the soldering process, stress will be generated between the plug-in components and the PCB board due to thermal expansion and contraction and mechanical assembly. The design of the reinforcing plate 3 can effectively absorb and disperse these stresses, avoid stress concentration on the soldering plate 2, thereby reducing the deformation or damage of the soldering plate 2 due to excessive stress. Due to the presence of the reinforcing plate 3, the impact of stress changes generated during the soldering process on the soldering quality is significantly reduced, and the reliability of the soldering is improved.

[0029] In actual production, welding process parameters are often difficult to control completely within the ideal value. The design of the reinforcing disc 3 provides additional tolerance for minor deviations in these parameters. Even when some process parameters deviate from the ideal value, the welding quality can be guaranteed to be unaffected, thereby improving the stability of the welding process. Production personnel can flexibly adjust the welding process parameters without worrying too much about the welding quality. This not only reduces the need for high-precision equipment and strict operating procedures, but also reduces the rework and scrap costs caused by poor welding.

[0030] In one embodiment, a solder resist window area is provided on the substrate 1, the projection of the reinforcing disk 3 is located within the solder resist window area, and the solder resist window area is formed by extending outward by 0.1 mm from the edge of the reinforcing disk 3. A stencil area is provided on the substrate 1, and the stencil area and the solder resist window area overlap.

[0031] In some embodiments, the diameter D1 of the solder pad is 1.5mm to 2.8mm, and the substrate 1 is provided with a plug-in hole 4, which is coaxially arranged with the solder pad 2. Specifically, the diameter D2 of the plug-in hole is 1.0mm, and the pins of the plug-in connector pass through the plug-in hole to solder with the solder pad 2 located on the back of the substrate 1.

[0032] The insertion hole 4 on the substrate 1 allows the pins of the plug-in connector to pass through, enabling them to be soldered to the solder pad 2 located on the back of the substrate 1. Specifically, the 1.0mm diameter of the insertion hole 4 is merely an example size; in actual applications, the diameter of the insertion hole 4 can be adjusted according to the pin diameter of the plug-in connector used. For example, there may be a gap of approximately 0.1mm between the insertion hole 4 and the plug-in connector pins, a design that facilitates the insertion of the plug-in connector pins.

[0033] During the PCB manufacturing stage, holes of precise dimensions are pre-drilled on substrate 1 according to design requirements. These holes are called through holes 4. To ensure that the hole diameter matches the design specifications, the actual drilling size is slightly larger than the design value so that the final hole diameter can be achieved after copper plating in the subsequent electroplating process. This pre-enlargement measure helps to compensate for possible errors during the drilling process and the influence of the plating layer thickness.

[0034] In one embodiment, the reinforcing disk 3 includes a base 31 and an arcuate portion 32 connected to the base 31. Two arcuate portions 32 are provided, distributed on both sides of the base 31. In the orthographic projection direction of the substrate 1, the projection of the welding disk 2 lies within the projection of the base 31, and the center-to-center distance between the two arcuate portions 32 is 3.2 mm. This design increases the welding contact area, which helps the solder to better cover the welding disk 2, reducing the risk of poor welding such as cold solder joints or cracked solder joints.

[0035] Specifically, the base 31 is rectangular and the arc-shaped part 32 is semi-circular.

[0036] It should be noted that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art, or the orientation or positional relationship that the product is usually placed in during use. It is only for the purpose of facilitating the description of this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0037] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0038] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made using the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other situations without modification, are all within the protection scope of the present utility model.

Claims

1. A PCB structure for improving the solder yield of a plug-in device, characterized by, It includes a substrate (1) and a welding pad (2) and a reinforcing pad (3) disposed on the substrate (1). The welding pad (2) is circular in shape, and the projection of the welding pad (2) is located within the projection of the reinforcing pad (3) in the orthogonal projection direction of the substrate (1).

2. The PCB structure for improving the soldering yield of a plug-in device according to claim 1, wherein: The substrate (1) is provided with a solder resist window area, the projection of the reinforcing disk (3) is located within the solder resist window area, and the solder resist window area is formed by extending outward by 0.1 mm from the edge of the reinforcing disk (3).

3. The PCB structure for improving the soldering yield of a plug-in device according to claim 2, wherein: A steel mesh area is provided on the substrate (1), and the steel mesh area and the solder resist window area overlap.

4. The PCB structure for improving the soldering yield of a plug-in device according to claim 1, wherein: The diameter of the welding pad is 1.5mm to 2.8mm.

5. The PCB structure for improving the soldering yield of a plug-in device according to claim 1, wherein: The substrate (1) is provided with a plug-in hole (4), and the plug-in hole (4) and the soldering pad (2) are coaxially arranged.

6. The PCB structure for improving the soldering yield of a plug-in device according to claim 5, wherein: The diameter of the plug hole is 1.0 mm.

7. The PCB structure for improving the soldering yield of a plug-in device according to claim 1, wherein: The reinforcing disk (3) includes a base (31) and an arc-shaped portion (32) connected to the base (31). There are two arc-shaped portions (32), which are distributed on both sides of the base (31). In the orthogonal projection direction of the substrate (1), the projection of the welding disk (2) is located within the projection of the base (31), and the center distance between the two arc-shaped portions (32) is 3.2 mm.

8. The PCB structure for improving the soldering yield of a plug-in device according to claim 7, wherein: The base (31) is rectangular, and the arc-shaped part (32) is semi-circular.

Images