Controller shell structure and mobile robot platform

Abstract

The utility model provides a controller shell structure and a mobile robot platform. The controller shell structure comprises a main shell frame, the main shell frame is used for providing a containing cavity, and multiple pairs of guide grooves are formed in the two sides of the interior of the main shell frame; the controller shell structure further comprises a sub-shell module, the sub-shell module comprises a plurality of sub-shells, the two sides of each sub-shell are provided with rack guide rails matched with the pair of guide grooves, and the sub-shells are used for installing board cards; the heat conduction module comprises a plurality of heat conduction silica gel pads in one-to-one correspondence with the plurality of sub-shells, each heat conduction silica gel pad is tightly attached to the surface of the board card of the corresponding sub-shell, the planes of the two sides of each heat conduction silica gel pad are in tight contact with the main shell frame, and a heat conduction loop is formed by the heat conduction silica gel pads, the sub-shell module and the main shell frame; and the heat dissipation module is used for dissipating heat conducted by the heat conduction loop. In order to avoid heat accumulation when multiple board cards are integrated, through the thermal coupling design of the heat conduction silica gel pad, the heat conduction loop and the external heat dissipation module, the heat dissipation efficiency is improved, and heat accumulation is avoided.

Description

Technical Field

[0001] This application relates to the technical field of controller housings, and in particular to a controller housing structure and a mobile robot platform. Background Technology

[0002] With the rapid development of autonomous driving and robotics technologies, the functions of intelligent mobile platforms are becoming increasingly complex. Vehicles require sensors to achieve functions such as environmental perception, localization, path planning, and control, and the types and number of sensors that need to be integrated are increasing dramatically, such as cameras, millimeter-wave radar, ultrasonic radar, lidar, and inertial navigation systems. These sensors typically process raw data using independent controller boards, and the industry currently generally adopts a distributed controller architecture.

[0003] Multiple separate controller housings, wiring harnesses, and connectors occupy a significant amount of valuable space inside robots or vehicles, resulting in a complex layout that hinders miniaturization and lightweight design. Meanwhile, high-performance computing boards and densely packed electronic components generate substantial heat. Traditional separate housings are not conducive to creating a unified and efficient cooling system, leading to low heat dissipation efficiency, heat buildup, and potential system throttling or crashes.

[0004] Therefore, the market urgently needs a controller housing structure and mobile robot platform for integrating multiple controller boards. Utility Model Content

[0005] In view of the above-mentioned problems in related technologies, this application provides a controller housing structure and a mobile robot platform.

[0006] The objective of this application is achieved through the following technical solution:

[0007] This application provides a controller housing structure, including a main housing frame for providing a receiving chamber, wherein multiple pairs of guide grooves are provided on both sides of the interior of the main housing frame; the controller housing structure further includes:

[0008] The sub-housing module includes multiple sub-housings, each of which has rack rails on both sides that match a pair of guide slots, and the sub-housings are used to install circuit boards;

[0009] The thermal conductive module includes multiple thermal conductive silicone pads that correspond one-to-one with the multiple sub-shells. Each thermal conductive silicone pad is tightly attached to the surface of the board of its corresponding sub-shell, and its two side planes are in close contact with the main shell frame, forming a thermal conductive circuit with the sub-shell module and the main shell frame.

[0010] A heat dissipation module is located outside the main housing frame and thermally coupled to the main housing frame, and is used to dissipate the heat conducted by the heat conduction circuit.

[0011] In some possible implementations, the rear end of the main housing frame is provided with a back plate for sealing the receiving chamber. The back plate is provided with a plurality of connecting devices including plug-in terminals and lead-out terminals. The plug-in terminals are located inside the receiving chamber, and the lead-out terminals are located outside the receiving chamber. The connecting devices include communication connecting devices and electrical connecting devices. When any sub-housing with the board is inserted into the receiving chamber through the sliding fit between the rack guide rail and the guide groove, the board is plugged into at least one plug-in terminal of the connecting device.

[0012] In some possible implementations, the sub-housing includes a board mounting plate and a front panel, the board mounting plate having an upper plane and a lower plane facing away from each other, and the front panel being vertically disposed on the edge of the upper plane away from the back panel; the rack rails are respectively disposed on two sides of the board mounting plate perpendicular to the front panel.

[0013] In some possible implementations, the sub-shell also includes a connecting portion, one end of which is connected to the front panel and the other end is bent toward the back panel, and the connecting portion is detachably connected to the main shell frame.

[0014] In some possible implementations, the connecting part has a first through hole, and the main housing frame has a second through hole or threaded hole at a position corresponding to the connecting part. The connecting part and the main housing frame are fixedly connected by fasteners passing through the first through hole and engaging with the second through hole or threaded hole.

[0015] In some possible implementations, the thermally conductive silicone pad includes opposing element contact surfaces and housing contact surfaces, the housing contact surfaces being fixed to the lower plane of a sub-housing or an inner surface of the receiving chamber; the element contact surfaces are in close contact with the heating element of their corresponding board.

[0016] In some possible implementations, the upper surface is provided with multiple mounting posts, and the board is mounted on the upper surface through each of the mounting posts.

[0017] In some possible implementations, the heat dissipation module includes heat dissipation fins fixed to the top of the main housing frame, and a cooling fan mounted above the heat dissipation fins.

[0018] This application also provides a mobile robot platform, comprising the controller housing structure described in any of the preceding claims and a plurality of circuit boards, wherein the controller housing structure is used to house the respective circuit boards.

[0019] In some possible implementations, each of the boards includes any combination of controller boards for cameras, millimeter-wave radar, ultrasonic radar, lidar, and inertial navigation sensors.

[0020] Based on the aforementioned technical solutions and the technical problems addressed, this application decomposes the entire system (structure) into a core housing (main housing frame) and multiple standard sensor expansion modules (sub-housing modules). These are quickly connected and locked via standardized mechanical interfaces (such as guide slots / bolt holes) and electrical interfaces (communication / network / USB / power supply, etc.), changing the traditional fixed relationship between sensors and controllers and enabling reconfigurability, flexible configuration, and convenient maintenance. The heat dissipation module, heat conduction module, and heat conduction circuit achieve precise heat dissipation from the main heat sources, ensuring stable operation of the vehicle's core computing unit within a compact space. The backplate, fixed to the main housing frame, provides multiple standardized interfaces externally and connects internally (via PCB connectors or flexible circuits) to circuit boards, reducing independent flying wires from circuit boards to individual sensors, achieving high-density integration, improving reliability, solving the problem of chaotic internal wiring in autonomous driving hardware, and providing a solid foundation for signal integrity and EMC electromagnetic compatibility design.

[0021] Its advantages include: standardized modular design allows multiple controllers (boards) to be integrated into a single housing frame, significantly reducing the volume of external connectors, wiring harnesses, and independent shells, making it particularly suitable for space-constrained security patrol robot platforms; significantly improved heat dissipation efficiency, with a two-stage heat conduction architecture of uniform heat distribution in the sub-shell and unified heat dissipation in the main frame, efficiently and evenly dissipating heat from each board, avoiding localized overheating, and improving the overall long-term reliability and stability under harsh environments; convenient maintenance and upgrades, supporting hot-swappable replacement of board modules in the field, enabling rapid maintenance and upgrades when sensor solutions change or a single controller fails, significantly reducing the overall lifecycle maintenance costs and time; enhanced scalability and flexibility, with a unified backplane and standardized module interfaces, allowing for flexible addition or reduction of board modules according to project needs, and users can select different module combinations for different robot models, enabling rapid customization and derivative development of the hardware platform; improved system reliability, with unified power supply and optimized backplane communication reducing connection point and cable failure rates. Physical isolation and independent heat dissipation between modules also reduce the risk of mutual thermal and electromagnetic interference. Attached Figure Description

[0022] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0023] Figure 1 This is a schematic diagram of the structure of a controller housing provided in an embodiment of this application from one perspective;

[0024] Figure 2 This is a schematic diagram of another perspective of a controller housing structure provided in an embodiment of this application;

[0025] Figure 3 This is an exploded view of the overall structure of a controller housing provided in an embodiment of this application;

[0026] Figure 4 This is a side view of a controller housing structure provided in an embodiment of this application;

[0027] Figure 5 yes Figure 4 A schematic diagram of the cross section of AA.

[0028] Illustration: 100, Main housing frame; 110, Back plate; 120, Connecting device; 200, Sub-housing module; 210, Sub-housing; 211, Board mounting plate; 212, Front panel; 213, Connector; 214, Mounting post; 300, Thermal module; 310, Thermal pad; 400, Heat dissipation module; 410, Heat dissipation fins; 420, Cooling fan; 500, Board. Detailed Implementation

[0029] The present application will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments. The implementation process of the present application will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementation procedures, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be understood that the preferred embodiments are only for illustrating the present application and not for limiting the scope of protection of the present application.

[0030] It should be noted that the various embodiments or technical features described below can be arbitrarily combined to form new embodiments, and the same or similar concepts or processes may not be described again in some embodiments. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0031] Related technologies are developing towards centralized domain controllers, but their core lies in integrating functions onto one or more high-performance SoCs. For scenarios such as security patrol robots that require the integration of multiple vendors and types of dedicated sensor controllers, a shell structure that enables modular integration and management of boards at the physical level remains an urgent engineering requirement. Based on this, this application provides a modular shell structure designed for mobile robot platforms for the integration of multiple boards (i.e., driver boards). This structure integrates multiple boards with different functions into a unified main shell frame in the form of standard modules, achieving high-density integration of the physical structure, efficient and unified heat dissipation, and convenient plug-and-play maintenance.

[0032] Example 1.

[0033] See Figures 1 to 5 This embodiment provides a controller housing structure, including a main housing frame 100, which provides a receiving chamber. The main housing frame 100 has multiple pairs of guide grooves on its internal two sides. The controller housing structure also includes:

[0034] The sub-housing module 200 includes multiple sub-housings 210, each of which has a rack rail on both sides that matches a pair of guide slots, and the sub-housing 210 is used to mount the board 500;

[0035] The thermal conductive module 300 includes a plurality of thermally conductive silicone pads 310 corresponding one-to-one with the plurality of sub-shells 210. Each thermally conductive silicone pad 310 is tightly attached to the surface of the board 500 of its corresponding sub-shell 210, and its two side planes are in close contact with the main shell frame 100, forming a thermal conductive circuit with the sub-shell module 200 and the main shell frame 100.

[0036] The heat dissipation module 400 is located outside the main housing frame 100 and thermally coupled to the main housing frame 100, and is used to dissipate the heat conducted by the heat conduction circuit.

[0037] Multiple pairs of guide grooves on the inner wall of the main housing frame 100 and the rack rails of the sub-housing 210 form a linear constraint, creating a drawer-type plug-in design. Heat generated by the circuit board 500 located in the sub-housing 210 is diffused through surface contact via the thermally conductive silicone pad 310, avoiding localized hot spots. The thermally conductive silicone pad 310 has a planar extension design on both sides, allowing it to contact the main housing frame 100. Heat is laterally transferred from the circuit board in the sub-housing 210 to the silicone pad and then to the main housing frame 100. The main housing frame 100 conducts the collected heat to the external heat dissipation module 400 (such as fan cooling or semiconductor cooling), dissipating the heat to the external environment. Simultaneously, the parallel arrangement of multiple pairs of guide grooves allows the sub-housing 210 to be physically plugged in and replaced, enabling the insertion of functional modules.

[0038] Therefore, compared to traditional independent controller housings, which occupy a large space and have a complex layout, the shared main frame structure and the drawer-type integrated architecture of the main housing frame 100, multiple pairs of guide slots, and sub-housing modules 200 improve space utilization. Simultaneously, to avoid heat buildup during multi-board integration, the thermal coupling design of the thermally conductive silicone pad 310, thermally conductive circuit, and external heat dissipation module 400 improves heat dissipation efficiency and prevents heat accumulation. The reserved design of multiple pairs of guide slots also provides a physical basis for future expansion.

[0039] See Figure 2 and Figure 3In some embodiments, the rear end of the main housing frame 100 is provided with a back plate 110 for sealing the receiving chamber. The back plate 110 is provided with a plurality of connecting devices 120 including plug-in ends and lead-out ends. The plug-in ends are located inside the receiving chamber, and the lead-out ends are located outside the receiving chamber. The connecting devices 120 include communication connecting devices and electrical connecting devices. When any sub-housing 210 with the board 500 is inserted into the receiving chamber through the sliding fit between the rack guide rail and the guide groove, the board 500 is plugged into at least one plug-in end of the connecting device 120.

[0040] The backplane 110 is fixed to the rear end of the main housing frame 100, forming the rearward boundary of the accommodating chamber and serving as the convergence plane for all board electrical signals. Each connector 120 has a plug-in end (inner) and a lead-out end (outer), forming a transition node for inner and outer partitions. The plug-in end faces the interior of the chamber and can be pre-configured as a fixed socket; the lead-out end extends to the exterior of the chamber for connecting external wiring harnesses. The backplane 110 also pre-configures communication connection devices (such as Ethernet, CAN, PCIe) and electrical connection devices (such as power pins). Thus, all interfaces are aggregated onto a single backplane 110, reducing the number of wiring harnesses.

[0041] See Figure 1 and Figure 3 In some embodiments, the sub-housing 210 includes a board mounting plate 211 and a front panel 212. The board mounting plate 211 has an upper plane and a lower plane facing away from each other. The front panel 212 is vertically disposed on the edge of the upper plane away from the back plate 110. The rack guide rails are respectively disposed on two sides of the board mounting plate 211 and the front panel 212 that are perpendicular to each other.

[0042] The technical solution provided in this embodiment adopts an L-shaped tray structure with an orthogonal combination of a mounting plate 211 (horizontal load-bearing) and a front panel 212 (vertical sealing). Frame guide rails are arranged on the left and right sides of this L-shaped structure, forming a modular drawer in the form of tray-front panel-double side rails. The front panel 212 is vertically positioned on the upper plane away from the edge of the back panel 110, serving as a point of force for pushing and pulling. Operators can easily insert and remove the sub-shell 210 by holding the front panel 212. The L-shaped tray and double side rail structure eliminates the need for a rear panel, simplifying the overall structure.

[0043] See Figure 3 In some embodiments, the sub-shell 210 further includes a connecting portion 213, one end of which is connected to the front panel 212, and the other end is bent toward the back panel 110. The connecting portion 213 is detachably connected to the main shell frame 100.

[0044] A connecting part 213 is added to the front panel 212. The connecting part 213 is in the shape of a cantilever that bends toward the back panel 110, and its end forms a detachable fastening node with the main housing frame 100.

[0045] Specifically, the connecting part 213 has a first through hole, and the main housing frame 100 has a second through hole or threaded hole at a position corresponding to the connecting part 213. The connecting part 213 and the main housing frame 100 are fixedly connected by fasteners passing through the first through hole and engaging with the second through hole or threaded hole. Coarse positioning is achieved by aligning the two through holes or pairing the through hole with the threaded hole. After aligning the two through holes, a bolt is passed through the through hole for coarse positioning, and then fine positioning is achieved by using a nut and bolt. Alternatively, after pairing the through hole with the threaded hole, a bolt is passed through the through hole and tightened through the threaded hole for final fixation.

[0046] In specific applications, the connecting part 213 may be equipped with a permanent magnet, and the corresponding position of the main and guest frames may be equipped with a magnetically conductive steel plate. When the two are in the mating position, the position is fixed by magnetic attraction.

[0047] See Figure 4 and Figure 5 In some embodiments, the thermally conductive silicone pad 310 includes an opposing element contact surface and a housing contact surface, the housing contact surface being fixed to the lower plane of a sub-housing 210 or an inner surface of the receiving chamber; the element contact surface is tightly fitted to the heating element of its corresponding board 500.

[0048] A heat conduction channel is established between the heating element and the controller housing structure: heating element, element contact surface, thermally conductive silicone pad 310, sub-housing 210, main housing frame 100, and heat dissipation module 400. The double-sided contact design of the thermally conductive silicone pad 310 transforms the original air cooling or natural conduction heat dissipation method into conductive heat dissipation. The elasticity and compressibility of the thermally conductive silicone pad 310 fill the gap between the heating element and the lower surface of the sub-housing. Specifically, the thermally conductive silicone pad 310 can be pre-positioned to the lower surface of the sub-housing 210 or an inner surface of the receiving chamber through adhesive, backing adhesive, or limiting structures to ensure continuous and stable contact pressure and prevent poor contact caused by vibration or impact.

[0049] See Figure 3 and Figure 5 In some embodiments, the upper surface is provided with a plurality of mounting posts 214, and the board 500 is mounted on the upper surface through each of the mounting posts 214. The plurality of mounting posts 214 form a supporting space between the upper surface and the board 500, allowing the board 500 to detach from the surface of the upper surface and form a suspended installation state.

[0050] See Figure 1 and Figure 3In some embodiments, the heat dissipation module 400 includes heat dissipation fins 410 fixed to the top of the main housing frame 100, and a heat dissipation fan 420 mounted above the heat dissipation fins 410.

[0051] The heat dissipation fins 410 are fixed to the top of the main housing frame 100. The high specific surface area of ​​the heat dissipation fins 410 is used to further efficiently conduct the heat of the heat source to the air between the fins. The cooling fan 420 is installed directly above the heat dissipation fins. It can exhaust air away from the heat dissipation fins 410 or blow air towards the heat dissipation fins 410.

[0052] As an example, a controller housing structure is provided for implementing an autonomous mobile robot platform, comprising:

[0053] Board 500 is an independent controller for each sensor (such as a vision processing module or a radar processing module). The controller housing structure includes:

[0054] The main housing frame 100, a hollow rectangular box, serves as the support base for all modules. It has guide grooves on both sides and a (uniform) backplate 110 on the rear wall. The main housing frame 100 has mounting holes for fixing to the vehicle. It can also reserve one or more standard-sized board mounting positions and corresponding connection parts 213 (backplate 110 connectors) for future expansion of new controller modules. The backplate 110 is fixed to the rear wall inside the main housing frame 100 and integrates the communication bus, power supply interface, and external input / output interface. Its core is to provide a pre-integrated electrical and communication connection plane. The backplate 110 has standardized connectors and power pins reserved for each board, avoiding the complex flying wires of traditional solutions and ensuring signal integrity and power supply stability.

[0055] The sub-housing module 200 includes multiple sub-housings 210 corresponding to each circuit board. Each sub-housing 210 includes a circuit board mounting plate 211, a front panel 212, and a connecting portion 213 including mounting holes. Rack rails are respectively disposed on two sides perpendicular to the circuit board mounting plate 211 and the front panel 212, and match the guide grooves of the main housing frame 100. It can be assumed that the circuit board mounting plate 211 of the sub-housing 210 and the main housing frame 100 are made of metal.

[0056] The thermally conductive module 300 includes a plurality of thermally conductive silicone pads 310 corresponding one-to-one with the plurality of sub-shells 210. One side of each thermally conductive silicone pad 310 is tightly attached to the surface of the board 500 of its corresponding sub-shell 210, and the other side is fixed to the lower plane of the sub-shell 210 above it. When there is no sub-shell 210 above it (i.e., it is already the uppermost layer), the thermally conductive silicone pad 310 is disposed on the inner wall of the corresponding receiving chamber. The two side planes of the thermally conductive silicone pad 310 are in close contact with the main shell frame 100, forming a thermally conductive circuit with the sub-shell module 200 and the main shell frame 100. In this case, the sub-shell 210 contacted by the thermally conductive silicone pad 310 can be considered as a heat dissipation heat sink of the board 500.

[0057] The heat dissipation module 400 includes heat dissipation fins 410 fixed to the top of the main housing frame 100 and a cooling fan 420 mounted above the heat dissipation fins 410. When the sub-housing module 200 carrying the board 500 is pushed into place in the main housing frame 100, its upper board mounting plate 211 will be tightly pressed against the pre-set thermally conductive silicone pad 310 inside the frame. When multiple sub-housing modules 210 are inserted side by side, their metal shells are connected through the thermally conductive silicone pad 310 inside the frame, conducting heat to the heat dissipation fins 410 on the main housing frame 100. Finally, the heat is forcibly exhausted by the cooling fan 420 at the top. This method of converging dispersed heat sources into a unified heat dissipation path is far more efficient than individual heat dissipation. Moreover, the thermally conductive silicone pad 310, in a compressible solid form, effectively replaces the air gap between electronic components and heat sinks, establishing an efficient heat transfer channel, and also has the advantages of electrical insulation, mechanical buffering, and simple manufacturing process.

[0058] To facilitate understanding, the structure provided in this embodiment will be described in detail below, taking into account the three controller boards that a robot needs to integrate:

[0059] Step 1: Structure and Connections:

[0060] The main housing frame 100 is an open front frame, and the back plate 110 is fixed inside the rear side. The three boards 500 respectively carry the processing functions of visual signals, radar signals and navigation system. The sub-housing 210 corresponding to each board 500 has the same size.

[0061] Step 2: Installation and Integration

[0062] The operator holds board 500 and directly secures it to sub-housing 210 using bolts (mounting posts 214) and rubber gaskets, aligning it with the guide groove inside the main housing frame 100, and smoothly pushes it horizontally backward. During this process, the connector at the rear of board 500 connects with the corresponding socket (plug end) on the backplate 110 (specifically, this connection can be achieved through a PCB connector or flexible circuit). When pushed to the end, the openings on both sides of the connecting part 213 of sub-housing 210 align with the nuts on the main housing and are screwed in. This achieves mechanical fixation of sub-housing 210 and electrical connection of the board.

[0063] Step 3: Heat dissipation:

[0064] The heat generated by the main control chip inside the board is transferred to its adjacent sub-casing 210 through the thermally conductive silicone pad 310. When the sub-casing module 200 is locked, the heat is carried away through the heat dissipation fins 410 and the cooling fan 420 on the main housing frame 100. The heat of all modules is discharged through this unified path.

[0065] Step 4: Maintenance and Replacement

[0066] When one of the boards needs upgrading, simply loosen the bolts on its sub-casing 210 to pull it out horizontally, disconnecting it from the backplane 110. Replace the new module and then reverse the process. The entire process requires no touching of other modules or tidying up complex wiring harnesses, enabling quick replacement and maintenance.

[0067] Therefore, the technical solution provided in this application decomposes the entire system into a core housing (main housing frame 100) and multiple standard sensor expansion modules (sub-housing modules 200). The two are quickly connected and locked through standardized mechanical interfaces (such as guide grooves / bolt holes) and electrical interfaces (communication / network / USB / power supply, etc.), which changes the traditional fixed relationship between the sensor and the controller, making it reconfigurable, flexibly configurable, and convenient to maintain.

[0068] The heat dissipation module 400, heat conduction module 300, and heat conduction circuit enable precise heat dissipation from the main heat sources, ensuring stable operation of the vehicle's core computing unit within a compact space. The backplate 110, fixed to the main housing frame 100, provides various standardized interfaces externally and connects internally (via PCB connectors or flexible circuitry) to circuit boards, reducing independent flying wires from circuit boards to various sensors, achieving high-density integration, improving reliability, resolving the problem of messy internal wiring in autonomous driving hardware, and providing a solid foundation for signal integrity and EMC electromagnetic compatibility design.

[0069] In practical applications, one or more standard-sized board sub-shell 210 mounting positions and corresponding backplane 110 connectors can be reserved for future expansion of new controller modules.

[0070] In summary, its advantages are as follows: Through standardized modular design, multiple controllers (boards) can be integrated into a single housing frame, significantly reducing the volume of external connectors, wiring harnesses, and independent shells, making it particularly suitable for space-constrained security patrol robot platforms; significantly improved heat dissipation efficiency, with a two-stage heat conduction architecture of heat dissipation through the sub-shell 210 and unified heat dissipation through the main frame, efficiently and evenly dissipating heat from each board, avoiding localized overheating, and improving the overall long-term reliability and stability under harsh environments; convenient maintenance and upgrades, supporting hot-swappable replacement of board modules in the field, enabling rapid maintenance and upgrades when sensor solutions change or a single controller fails, significantly reducing the overall lifecycle maintenance costs and time; enhanced scalability and flexibility, with a unified backplane and standardized module interfaces, allowing for flexible addition or reduction of board modules according to project needs, and users can select different module combinations for different robot models, enabling rapid customization and derivative development of the hardware platform; improved system reliability, with unified power supply and optimized backplane 110 communication reducing connection point and cable failure rates. Physical isolation and independent heat dissipation between modules also reduce the risk of thermal and electromagnetic interference between them.

[0071] Example 2.

[0072] This embodiment also provides a mobile robot platform, including the controller housing structure described in any one of embodiments 1 and multiple circuit boards, wherein the controller housing structure is used to house each of the circuit boards. The structure and function of the controller housing structure are the same as in embodiment 1, and will not be described again. The mobile robot platform is an intelligent mobile platform used in autonomous vehicles such as security patrol robots.

[0073] In some embodiments, each of the boards includes any combination of controller boards for cameras, millimeter-wave radar, ultrasonic radar, lidar, and inertial navigation sensors.

[0074] It should be noted that in the embodiments of this application, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, and c can be single or multiple. It is worth noting that "at least one" can also be interpreted as "one or more".

[0075] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are configured to distinguish similar objects and are not necessarily configured to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0076] This application describes the invention from the perspectives of purpose, effectiveness, progress, and novelty, and it meets the functional enhancement and use requirements emphasized by the Patent Law. The above description and accompanying drawings are merely preferred embodiments of this application and are not intended to limit this application. Therefore, all structures, devices, features, etc., that are similar to or identical to those of this application, i.e., all equivalent substitutions or modifications made in accordance with the scope of this patent application, shall fall within the scope of protection of this patent application.

Claims

1. A controller housing structure comprising a main housing frame for providing a housing chamber, characterized in that, The main housing frame has multiple pairs of guide grooves on both sides of its interior; the controller housing structure also includes: The sub-housing module includes multiple sub-housings, each of which has rack rails on both sides that match a pair of guide slots, and the sub-housings are used to mount circuit boards; The thermal conductive module includes multiple thermal conductive silicone pads that correspond one-to-one with the multiple sub-shells. Each thermal conductive silicone pad is tightly attached to the surface of the board of its corresponding sub-shell, and its two side planes are in close contact with the main shell frame, forming a thermal conductive circuit with the sub-shell module and the main shell frame. A heat dissipation module is located outside the main housing frame and thermally coupled to the main housing frame, and is used to dissipate the heat conducted by the heat conduction circuit.

2. The controller housing structure of claim 1, wherein The rear end of the main housing frame is provided with a back plate for sealing the receiving chamber. The back plate is provided with a plurality of connecting devices including plug-in ends and lead-out ends. The plug-in ends are located inside the receiving chamber, and the lead-out ends are located outside the receiving chamber. When any sub-housing with the board installed is inserted into the receiving chamber through the sliding fit between the frame guide rail and the guide groove, the board is plugged into at least one plug-in end of the connecting device. The connecting device includes communication connecting devices and electrical connecting devices.

3. The controller housing structure of claim 2, wherein, The sub-housing includes a board mounting plate and a front panel. The board mounting plate has an upper plane and a lower plane facing away from each other. The front panel is vertically disposed on the edge of the upper plane away from the back panel. The frame guide rails are respectively disposed on two sides of the board mounting plate that are perpendicular to the front panel.

4. The controller housing structure of claim 3, wherein, The sub-shell also includes a connecting part, one end of which is connected to the front panel and the other end is bent toward the back panel. The connecting part is detachably connected to the main shell frame.

5. The controller housing structure of claim 4, wherein, The connecting part has a first through hole, and the main housing frame has a second through hole or threaded hole at the position corresponding to the connecting part. The connecting part and the main housing frame are fixedly connected by fasteners passing through the first through hole and engaging with the second through hole or threaded hole.

6. The controller housing structure of claim 3, wherein, The thermally conductive silicone pad includes an opposing component contact surface and a housing contact surface. The housing contact surface is fixed to the lower plane of a sub-housing or an inner surface of the receiving chamber. The component contact surface is tightly fitted to the heating element of its corresponding board.

7. The controller housing structure of claim 3, wherein The upper surface is provided with multiple mounting posts, and the plate is mounted on the upper surface through each of the mounting posts.

8. The controller housing structure of claim 1, wherein, The heat dissipation module includes heat dissipation fins fixed to the top of the main housing frame, and a cooling fan mounted above the heat dissipation fins.

9. A mobile robotic platform characterized by, The controller housing structure includes the controller housing structure as described in any one of claims 1-8 and a plurality of circuit boards, wherein the controller housing structure is used to house each of the circuit boards.

10. The mobile robotic platform of claim 9, wherein, Each of the aforementioned boards includes any combination of controller boards for cameras, millimeter-wave radar, ultrasonic radar, lidar, and inertial navigation sensors.

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