High-precision dispensing machine

Abstract

The utility model relates to the technical field of dispensing equipment, in particular to a high-precision dispensing machine. Comprising a conveying mechanism used for conveying a chip material belt in the dispensing machine; the dispensing mechanism comprises a plurality of dispensing assemblies which are the same in structure and carry out dispensing on set positions on the chip material belt along a set route, each dispensing assembly comprises a dispensing head located above the chip material belt, a first X-axis driving module, a first Y-axis driving module and a first Z-axis driving module, and the first X-axis driving module, the first Y-axis driving module and the first Z-axis driving module drive the dispensing head to move along three axes; the first visual detection assembly is fixed relative to the dispensing head and is used for detecting a dispensing part; the heating adsorption platform mechanism comprises a plurality of heating adsorption bearing table assemblies which are of the same structure and are arranged corresponding to the dispensing assemblies; the high-precision dispensing machine disclosed by the utility model is high in dispensing precision and high in yield.

Description

Technical Field

[0001] This utility model relates to the field of dispensing equipment technology, and in particular to a high-precision dispensing machine. Background Technology

[0002] In the chip manufacturing process, dispensing is a crucial step. As the core component of electronic devices, the stability and reliability of chips directly affect the overall performance of the equipment. The main function of dispensing is to provide comprehensive protection for the chip. First, it enhances the structural strength of the chip, preventing damage caused by external impacts. Second, the sealing layer formed by dispensing effectively isolates environmental factors such as moisture and dust, ensuring stable operation of the chip even under harsh conditions. Furthermore, it shields against electromagnetic interference, ensuring that chip performance remains unaffected. Simultaneously, dispensing also improves the chip's resistance to drops and shocks, allowing the chip to remain stable even when the equipment is accidentally dropped or subjected to pressure. However, existing chip roll dispensing machines suffer from low dispensing accuracy due to structural limitations. Moreover, during the transport of the chip roll, vibration can easily cause the adhesive to spread or shift, affecting the yield rate. Utility Model Content

[0003] The purpose of this invention is to provide a high-precision dispensing machine to solve the problems of low dispensing accuracy in existing chip roll dispensing machines due to structural factors, and the easy diffusion or deviation of glue during chip roll transmission due to vibration, which affects the yield.

[0004] The technical solution of this utility model is: a high-precision dispensing machine, comprising:

[0005] The conveying mechanism is used to transport the chip tape in the dispensing machine;

[0006] The dispensing mechanism includes multiple dispensing components with identical structures that dispense adhesive at predetermined positions on a chip strip along a predetermined route. Each dispensing component includes a dispensing head located above the chip strip, a first X-axis drive module, a first Y-axis drive module, and a first Z-axis drive module that drive the dispensing head to move along three axes, and a first vision detection component that is fixed relative to the dispensing head to detect the dispensing point.

[0007] The heating and adsorption platform mechanism includes multiple heating and adsorption support platform assemblies with identical structures and corresponding to the dispensing assembly. Each heating and adsorption support platform assembly includes a heating and adsorption support platform module, and a second X-axis drive module, a second Y-axis drive module, and a second Z-axis drive module that drive the heating and adsorption support platform module to move along three axes.

[0008] The sensor mechanism includes a first sensor assembly for detecting whether the chip strip bulges before dispensing adhesive and a second sensor assembly for detecting whether the chip strip leaks adhesive after dispensing adhesive.

[0009] The second vision inspection component is located below the chip strip after dispensing;

[0010] The first microscope mechanism, located on the side of the dispensing mechanism, is used for manual observation of the dispensing process of the dispensing head onto the chip strip.

[0011] Preferably, the dispensing machine further includes a pressure plate mechanism used in conjunction with the heating and adsorption platform mechanism. The pressure plate mechanism includes a pressure plate pressing on the top surface of the chip strip and a driving component for driving the pressure plate to rise and fall.

[0012] The heating and adsorption support platform module includes a support platform, a heating component installed inside the support platform, and a vacuuming component connected to the support platform.

[0013] Preferably, the second X-axis drive module includes a first mounting plate, a first linear guide rail fixedly mounted on the first mounting plate with its length direction parallel to the X-axis, a first slider slidably mounted on the first linear guide rail, a second mounting plate fixedly mounted on the first slider, and a first adjusting vertical plate mounted on the first mounting plate through a first oblong hole and a first hand-tightening screw; the first adjusting vertical plate has a second oblong hole, and the second mounting plate is fixed on the first adjusting vertical plate through a second hand-tightening screw; the length directions of the first oblong hole and the second oblong hole are parallel to the X-axis direction;

[0014] The second Y-axis drive module includes a second linear guide rail fixedly mounted on a second mounting plate with its length direction parallel to the Y-axis, a second slider slidably mounted on the second linear guide rail, a third mounting plate fixedly mounted on the second slider, and a second adjusting vertical plate fixedly mounted on the second mounting plate. The second adjusting vertical plate has a third oblong hole, and the third mounting plate is fixed on the second adjusting vertical plate by a third hand-tightening screw; the length direction of the third oblong hole is parallel to the Y-axis direction.

[0015] The second Z-axis drive module includes a lifting drive component mounted on a third mounting plate, and the support platform is fixedly mounted on the movable part of the lifting drive component.

[0016] Preferably, the conveying mechanism includes a guide rail assembly, a first drive assembly and a second drive assembly located at both ends of the guide rail assembly in the conveying direction to provide power for the conveying of the chip strip;

[0017] The first visual detection component is a first CCD camera component;

[0018] The first Z-axis drive module is a Z-axis drive component, the first Y-axis drive module is a Y-axis drive component, and the first X-axis drive module is an X-axis drive component; the dispensing head is mounted on the movable part of the Z-axis drive component, the Z-axis drive component is mounted on the movable part of the Y-axis drive component, and the Y-axis drive component is mounted on the movable part of the X-axis drive component; the first CCD camera assembly is mounted on the movable part of the Z-axis drive component.

[0019] Preferably, the guide rail assembly includes a pair of parallel first linear guide rails and second linear guide rails, the first drive assembly is a first figure-eight wheel assembly, and the second drive assembly is a second figure-eight wheel assembly.

[0020] Preferably, the first sensor assembly is located above the chip strip and includes a first fiber optic sensor mounted vertically and a second fiber optic sensor disposed obliquely to the side of the first fiber optic sensor.

[0021] The second sensor assembly includes a third fiber optic sensor that is tilted above the chip strip.

[0022] Preferably, the first microscope mechanism includes a third linear guide rail arranged along the X-axis, a third slider slidably arranged on the third linear guide rail, and a first microscope mounted on the third slider;

[0023] The second visual detection component includes a second CCD camera component, a third X-axis drive module, a third Y-axis drive module, and a third Z-axis drive module that drive the second CCD camera component to move along three axes.

[0024] Preferably, the dispensing machine further includes a second microscope mechanism for inspecting the chip strip after dispensing. The second microscope mechanism includes a fourth linear guide rail arranged along the X-axis, a fourth slider slidably arranged on the fourth linear guide rail, and a second microscope mounted on the fourth slider.

[0025] Compared with the prior art, the advantages of this utility model are:

[0026] (1) A high-precision dispensing machine of this utility model includes: a conveying mechanism, a dispensing mechanism, a heating and adsorption platform mechanism, a sensor mechanism, a second vision detection component, and a first microscope mechanism. Before dispensing each chip, the chip position is located by taking pictures with the first CCD camera component. Then, the controller controls the movement path of the dispensing head to perform precise dispensing based on the obtained chip position. In this utility model, the heating and adsorption platform mechanism heats the carrier platform with heating wires when the dispensing mechanism is dispensing. Since the chip tape is adsorbed on the carrier platform, the adhesive on the chip tape is slightly cured by heat transfer to prevent the adhesive from flowing during the transmission of the chip tape after dispensing. The first sensor component detects whether the chip tape is arched before dispensing, and the second sensor component detects whether there is any leakage after dispensing. The second vision detection component detects the lines on the back of the chip after dispensing to check whether the lines are pulled and broken. The first microscope mechanism is used for dispensing machine debugging and manual sampling inspection. The overall design achieves high-precision dispensing and high product yield.

[0027] (2) The high-precision dispensing machine of this utility model can fix the chip strip more firmly by means of the cooperation of the pressure plate mechanism and the heating adsorption platform mechanism, thereby improving the dispensing accuracy of the dispensing machine. Attached Figure Description

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0029] Figure 1 This is a schematic diagram of the structure of a high-precision dispensing machine described in this embodiment;

[0030] Figure 2 This is a schematic diagram of the dispensing mechanism described in this embodiment;

[0031] Figure 3 This is a schematic diagram of the heating and adsorption platform mechanism described in this embodiment;

[0032] Figure 4 This is a schematic diagram of the conveying mechanism, pressure plate mechanism, and sensor mechanism described in this embodiment;

[0033] Figure 5 This is a schematic diagram of the pressure plate mechanism described in this embodiment;

[0034] Figure 6 This is a schematic diagram of the structure of the first microscope mechanism in this embodiment;

[0035] Figure 7 This is a schematic diagram of the structure of the second microscope mechanism and the second visual detection component in this embodiment;

[0036] Wherein: 10, conveying mechanism; 11, first linear guide rail; 12, second linear guide rail; 13, first figure-eight wheel assembly; 14, second figure-eight wheel assembly;

[0037] 20. Dispensing mechanism; 21. Dispensing head; 22. Third servo cylinder; 23. Second servo cylinder; 24. First servo cylinder; 25. First CCD camera assembly.

[0038] 30. Heating and adsorption platform mechanism; 31. Support platform; 32. Air extraction hole; 33. Heating wire; 34. First mounting plate; 35. Second mounting plate; 36. First oblong hole; 37. First hand-tightening screw; 38. First adjusting vertical plate; 39. Second oblong hole; 310. Second hand-tightening screw; 311. Third mounting plate; 312. Second adjusting vertical plate; 313. Third oblong hole; 314. Third hand-tightening screw; 315. Second cylinder;

[0039] 40. Second vision detection component; 41. Second CCD camera component; 42. First manual slide; 43. Second manual slide; 44. Third manual slide.

[0040] 50. First microscope mechanism; 51. First microscope; 52. Third linear guide rail; 53. Third slider.

[0041] 60. Second microscope mechanism; 61. Second microscope; 62. Fourth linear guide rail;

[0042] 70. Pressure plate; 71. First cylinder;

[0043] 80. First fiber optic sensor; 81. Second fiber optic sensor; 82. Third fiber optic sensor. Detailed Implementation

[0044] The present invention will be further described in detail below with reference to specific embodiments:

[0045] In the description of the utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0046] like Figure 1As shown, a high-precision dispensing machine includes: a conveying mechanism 10, a dispensing mechanism 20, a heating and adsorption platform mechanism 30, a sensor mechanism, a second vision detection component 40, a first microscope mechanism 50, a pressure plate mechanism, and a second microscope mechanism 60.

[0047] like Figure 4 As shown, the conveying mechanism 10 is used to convey chip strips in a dispensing machine. The conveying mechanism 10 includes a guide rail assembly, a first drive assembly and a second drive assembly located at both ends of the guide rail assembly in the conveying direction to provide power for the conveying of the chip strip. The guide rail assembly includes a pair of parallel first linear guide rails 11 and second linear guide rails 12. The first drive assembly is a first figure-eight wheel assembly 13, and the second drive assembly is a second figure-eight wheel assembly 14. The first linear guide rails 11 and second linear guide rails 12 are distributed in parallel and spaced apart to form a material guide groove, providing rigid support and guidance for the chip strip, preventing lateral deviation or jitter, and ensuring the straightness and consistency of the tape path. The first figure-eight wheel assembly 13 and the second figure-eight wheel assembly 14 are located at both ends of the guide rail assembly in the conveying direction. By synchronously driving the chip strip at both ends, the problem of uneven tension or tape deviation that may be caused by single-point driving is avoided. In this embodiment, the structure of the first figure-eight wheel assembly 13 and the second figure-eight wheel assembly 14 is prior art and will not be described in detail here.

[0048] like Figure 2 As shown, the dispensing mechanism 20 includes multiple dispensing components with identical structures that dispense adhesive at predetermined positions on the chip strip along a predetermined route. Each dispensing component includes a dispensing head 21 located above the chip strip, a first X-axis drive module, a first Y-axis drive module, and a first Z-axis drive module that drive the dispensing head 21 to move along three axes, and a first vision detection component fixed relative to the dispensing head 21 to detect the dispensing location. In this embodiment, the number of dispensing components is four, and the dispensing machine simultaneously dispenses adhesive at four chip locations on the chip strip. The first vision detection component is a first CCD camera component 25. Since the chip strip is a flexible substrate, it is susceptible to tension fluctuations during transport. Due to mechanical deformation, the position of each chip at the dispensing point may deviate. Therefore, before dispensing each chip, the first CCD camera assembly 25 is used to photograph and locate the chip's position. Then, the controller uses the acquired chip position to control the movement path of the dispensing head 21 for precise dispensing. The first Z-axis drive module is a Z-axis drive component, the first Y-axis drive module is a Y-axis drive component, and the first X-axis drive module is an X-axis drive component. The dispensing head 21 is mounted on the movable part of the Z-axis drive component, the Z-axis drive component is mounted on the movable part of the Y-axis drive component, and the Y-axis drive component is mounted on the movable part of the X-axis drive component. The first CCD camera assembly 25 is mounted on the movable part of the Z-axis drive component. In this embodiment, the Z-axis drive component, Y-axis drive component, and X-axis drive component can be the third servo cylinder 22, the second servo cylinder 23, and the first servo cylinder 24, respectively.

[0049] like Figure 3 As shown, the heating adsorption platform mechanism 30 includes multiple identical heating adsorption carrier stage assemblies corresponding to the dispensing assembly. Each heating adsorption carrier stage assembly includes a heating adsorption carrier stage module and a second X-axis drive module, a second Y-axis drive module, and a second Z-axis drive module that drive the entire heating adsorption carrier stage module to move along three axes. The heating adsorption carrier stage module includes a carrier stage 31, a heating component installed inside the carrier stage 31, and a vacuum component connected to the carrier stage 31. The heating component is a heating wire 33. A vacuum hole 32 is vertically opened on the carrier stage 31 and is connected to the vacuum component. In this embodiment, there are four heating adsorption carrier stage modules. In this embodiment, when the dispensing mechanism 20 performs dispensing, the heating adsorption platform mechanism 30 heats the carrier stage 31 through the heating wire 33. Since the chip tape is adsorbed on the carrier stage 31, the adhesive on the chip tape is slightly cured through heat transfer, preventing the adhesive from flowing during the transfer of the chip tape after dispensing. The dispensing machine also includes a pressure plate mechanism used in conjunction with the heating and adsorption platform mechanism 30. The pressure plate mechanism includes a pressure plate 70 pressing on the top surface of the chip strip and a driving component for driving the pressure plate 70 to rise and fall. In this embodiment, the driving component for driving the pressure plate 70 to rise and fall is a first cylinder 71. In this embodiment, through the cooperation of the pressure plate mechanism and the heating and adsorption platform mechanism 30, the chip strip can be more firmly fixed, thereby improving the dispensing accuracy of the dispensing machine.

[0050] like Figure 3As shown, the second X-axis drive module includes a first mounting plate 34, a first linear guide rail 11 with its length direction parallel to the X-axis fixedly mounted on the first mounting plate 34, a first slider slidably mounted on the first linear guide rail 11, a second mounting plate 35 fixedly mounted on the first slider, and a first adjusting vertical plate 38 mounted on the first mounting plate 34 through a first oblong hole 36 and a first hand-tightening screw 37; the first adjusting vertical plate 38 has a second oblong hole 39, and the second mounting plate 35 is fixed to the first adjusting vertical plate through a second hand-tightening screw 310. 38; the length directions of the first oblong hole 36 and the second oblong hole 39 are parallel to the X-axis direction; first, roughly adjust the positions of the first adjusting vertical plate 38 and the first slide on the first linear guide 11, and after adjustment, tighten the first hand-tightening screw 37 to fix the first adjusting vertical plate 38 on the first mounting plate 34; then, precisely adjust the position of the first slide on the first linear guide 11, and after adjustment, tighten the second hand-tightening screw 310 to fix the second mounting plate 35 on the first adjusting vertical plate 38, thus completing the heating adsorption support platform module in the X-axis direction. Position adjustment; the second Y-axis drive module includes a second linear guide rail 12, parallel to the Y-axis in the length direction, fixedly mounted on the second mounting plate 35; a second slider slidably mounted on the second linear guide rail 12; a third mounting plate 311 fixedly mounted on the second slider; and a second adjusting vertical plate 312 fixedly mounted on the second mounting plate 35. The second adjusting vertical plate 312 has a third oblong hole 313. The third mounting plate 311 is fixed to the second adjusting vertical plate 312 by a third hand-tightening screw 314. This completes the heating and adsorption support platform module's position on the X-axis. After adjusting the position of the direction, adjust the position of the second slide on the second linear guide 12. After the adjustment is completed, tighten the third hand screw 314 to fix the third mounting plate 311 on the second adjusting vertical plate 312, thus completing the position adjustment of the heating adsorption support platform module in the Y-axis direction. The length direction of the third waist-shaped hole 313 is parallel to the Y-axis direction. The second Z-axis drive module includes a lifting drive component mounted on the third mounting plate 311. The support platform 31 is fixedly mounted on the movable part of the lifting drive component. In this embodiment, the lifting drive component is the second cylinder 315.

[0051] like Figure 4As shown, the sensor mechanism includes a first sensor assembly for detecting whether the chip tape bulges before dispensing adhesive, and a second sensor assembly for detecting whether adhesive leakage occurs after dispensing adhesive. The first sensor assembly is located above the chip tape and includes a vertically mounted first fiber optic sensor 80 and a second fiber optic sensor 81 tilted to the side of the first fiber optic sensor 80. The vertically mounted first fiber optic sensor 80 monitors changes in the height of the chip tape. If bulging occurs (partial bulging of the tape), the bulging part will approach the first fiber optic sensor 80, resulting in a shortened detection distance. The tilted second fiber optic sensor 81 can simultaneously sense the height and horizontal position of the chip tape. The first and second fiber optic sensors 80 are triggered simultaneously to issue an bulging alarm. The second sensor assembly includes a third fiber optic sensor 82 tilted above the chip tape. The third fiber optic sensor 82 forms an tilted optical path, and the dispensing status is determined by the light-blocking effect when adhesive is present: when no adhesive is dispensed, the third fiber optic sensor 82 fully receives the light signal; when adhesive covers the light, it blocks the optical path and triggers the determination.

[0052] like Figure 7 As shown, the second vision inspection component 40 is positioned below the chip strip after dispensing. The second vision inspection component 40 includes a second CCD camera component 41, a third X-axis drive module, a third Y-axis drive module, and a third Z-axis drive module that drive the second CCD camera component 41 to move along three axes. In this embodiment, the third X-axis drive module, the third Y-axis drive module, and the third Z-axis drive module are respectively a first manual slide 42, a second manual slide 43, and a third manual slide 44. The second vision inspection component 40 inspects the wiring on the back of the chip after dispensing to detect whether any wiring has been pulled or broken.

[0053] like Figure 6 As shown, the first microscope mechanism 50 is located on the side of the dispensing mechanism 20 and is used for manual observation of the dispensing process of the dispensing head 21 onto the chip strip. The first microscope mechanism 50 includes a third linear guide rail 52 arranged along the X-axis, a third slider 53 slidably arranged on the third linear guide rail 52, and a first microscope 51 mounted on the third slider 53; the first microscope 51 is translated by the movement of the third slider 53 on the third linear guide rail 52. The first microscope mechanism 50 can be used for dispensing machine debugging and manual sampling inspection.

[0054] like Figure 7As shown, the dispensing machine also includes a second microscope mechanism 60 for inspecting the dispensed chip ribbon. The second microscope mechanism 60 includes a fourth linear guide rail 62 arranged along the X-axis, a fourth slider slidably arranged on the fourth linear guide rail 62, and a second microscope 61 mounted on the fourth slider. The second microscope 61 is translated by the movement of the fourth slider on the fourth linear guide rail 62. The second microscope mechanism 60 can be used for quality inspection of the dispensing of chips in the chip ribbon.

[0055] The working principle of the high-precision dispensing machine of this utility model is as follows: the first figure-eight wheel assembly 13 and the second figure-eight wheel assembly 14 drive the chip strip to be conveyed forward on the guide rail assembly. When the four chips move to the dispensing station of the dispensing mechanism 20, they stop. The support platforms 31 of the four heated adsorption support platform modules are continuously heated by the heating wire 33, and then driven to rise by the second cylinder 315 respectively. The four vacuum components evacuate the vacuum, adsorbing and fixing the chip strip. Then the piston rod of the first cylinder 71 retracts, driving the pressure plate 70 to descend and fix the chip strip on the guide rail assembly; the four The first CCD camera assembly 25 takes pictures of the four chips on the chip strip to locate the position of each chip. Then, the controller controls the third servo cylinder 22, the second servo cylinder 23, and the first servo cylinder 24 to drive the dispensing head 21 to dispense glue to the chip based on the obtained chip position. After the dispensing is completed, the pressure plate 70 and the carrier platform 31 are reset. The first figure-eight wheel assembly 13 and the second figure-eight wheel assembly 14 drive the chip strip to continue to be conveyed forward on the guide rail assembly. The dispensing stops when the next four chips move to the dispensing station of the dispensing mechanism 20. The dispensing work is repeated in this way.

[0056] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and therefore, all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within this utility model.

Claims

1. A high-precision dispensing machine, characterized in that, include: The conveying mechanism is used to transport the chip tape in the dispensing machine; The dispensing mechanism includes multiple dispensing components with identical structures that dispense adhesive at predetermined positions on a chip strip along a predetermined route. Each dispensing component includes a dispensing head located above the chip strip, a first X-axis drive module, a first Y-axis drive module, and a first Z-axis drive module that drive the dispensing head to move along three axes, and a first vision detection component that is fixed relative to the dispensing head to detect the dispensing point. The heating and adsorption platform mechanism includes multiple heating and adsorption support platform assemblies with identical structures and corresponding to the dispensing assembly. Each heating and adsorption support platform assembly includes a heating and adsorption support platform module, as well as a second X-axis drive module, a second Y-axis drive module, and a second Z-axis drive module that drive the heating and adsorption support platform module to move along three axes. The sensor mechanism includes a first sensor assembly for detecting whether the chip strip bulges before dispensing adhesive and a second sensor assembly for detecting whether the chip strip leaks adhesive after dispensing adhesive. The second vision inspection component is located below the chip strip after dispensing; The first microscope mechanism, located on the side of the dispensing mechanism, is used for manual observation of the dispensing process of the dispensing head onto the chip strip.

2. The high-precision dispensing machine according to claim 1, characterized in that: The dispensing machine also includes a pressure plate mechanism used in conjunction with the heating and adsorption platform mechanism. The pressure plate mechanism includes a pressure plate that presses against the top surface of the chip strip and a drive component that drives the pressure plate to rise and fall. The heating and adsorption support platform module includes a support platform, a heating component installed inside the support platform, and a vacuuming component connected to the support platform.

3. A high-precision dispensing machine according to claim 2, characterized in that: The second X-axis drive module includes a first mounting plate, a first linear guide rail fixedly mounted on the first mounting plate with its length direction parallel to the X-axis, a first slider slidably mounted on the first linear guide rail, a second mounting plate fixedly mounted on the first slider, and a first adjusting vertical plate mounted on the first mounting plate through a first oblong hole and a first hand-tightening screw; the first adjusting vertical plate has a second oblong hole, and the second mounting plate is fixed on the first adjusting vertical plate through a second hand-tightening screw; the length directions of the first oblong hole and the second oblong hole are parallel to the X-axis direction; The second Y-axis drive module includes a second linear guide rail fixedly mounted on a second mounting plate with its length direction parallel to the Y-axis, a second slider slidably mounted on the second linear guide rail, a third mounting plate fixedly mounted on the second slider, and a second adjusting vertical plate fixedly mounted on the second mounting plate. The second adjusting vertical plate has a third oblong hole, and the third mounting plate is fixed on the second adjusting vertical plate by a third hand-tightening screw; the length direction of the third oblong hole is parallel to the Y-axis direction. The second Z-axis drive module includes a lifting drive component mounted on a third mounting plate, and the support platform is fixedly mounted on the movable part of the lifting drive component.

4. A high-precision dispensing machine according to claim 3, characterized in that: The conveying mechanism includes a guide rail assembly, a first drive assembly and a second drive assembly located at both ends of the guide rail assembly in the conveying direction to provide power for the conveying of the chip strip; The first visual detection component is a first CCD camera component; The first Z-axis drive module is a Z-axis drive component, the first Y-axis drive module is a Y-axis drive component, and the first X-axis drive module is an X-axis drive component; the dispensing head is mounted on the movable part of the Z-axis drive component, the Z-axis drive component is mounted on the movable part of the Y-axis drive component, and the Y-axis drive component is mounted on the movable part of the X-axis drive component; the first CCD camera assembly is mounted on the movable part of the Z-axis drive component.

5. A high-precision dispensing machine according to claim 4, characterized in that: The guide rail assembly includes a pair of parallel first linear guide rails and second linear guide rails, the first drive assembly is a first figure-eight wheel assembly, and the second drive assembly is a second figure-eight wheel assembly.

6. A high-precision dispensing machine according to claim 1, characterized in that: The first sensor assembly is located above the chip strip and includes a first fiber optic sensor mounted vertically and a second fiber optic sensor tilted to the side of the first fiber optic sensor. The second sensor assembly includes a third fiber optic sensor that is tilted above the chip strip.

7. A high-precision dispensing machine according to claim 1, characterized in that: The first microscope mechanism includes a third linear guide rail arranged along the X-axis, a third slider slidably arranged on the third linear guide rail, and a first microscope mounted on the third slider; The second visual detection component includes a second CCD camera component, a third X-axis drive module, a third Y-axis drive module, and a third Z-axis drive module that drive the second CCD camera component to move along three axes.

8. A high-precision dispensing machine according to claim 1, characterized in that: The dispensing machine also includes a second microscope mechanism for inspecting the chip strip after dispensing. The second microscope mechanism includes a fourth linear guide rail arranged along the X-axis, a fourth slider slidably arranged on the fourth linear guide rail, and a second microscope mounted on the fourth slider.

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