Novel thermal shrinkage bag for packaging electronic products
By setting flexible pads and split grooves on the inside of the heat shrink bag, and applying an anti-fingerprint coating on the outside and an anti-static layer on the inside, the problems of easy breakage and static electricity in heat shrink bags are solved, improving packaging quality and reusability, making it suitable for electronic product packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN MGM PACKAGING PROD CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-04-24
AI Technical Summary
Existing heat shrink bags are prone to tearing when packaging irregular products, have low reuse value, and can cause static electricity to affect electronic products.
Flexible pads and split grooves are provided on the inside of the heat shrink bag, and an anti-fingerprint coating is provided on the outside and an anti-static layer is provided on the inside. A pull strip is provided on the split groove to facilitate regular tearing and recycling.
It improves packaging quality, reduces the probability of heat shrink bag breakage, increases reuse value, prevents static electricity from affecting electronic products, and maintains the product's appearance.
Smart Images

Figure CN224159681U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat shrink bag technology, and in particular to a novel heat shrink bag for packaging electronic products. Background Technology
[0002] Heat shrink bags are packaging materials with heat-shrink properties, allowing them to tightly adhere to various items for protection, fixation, and dust prevention. Heat shrink bags are typically made of plastic film, such as POF (polyolefin), PVC (polyvinyl chloride), or PE (polyethylene). When heated, these films shrink and tightly wrap around the items.
[0003] Existing heat shrink bags typically involve wrapping the heat shrink film around the product, then using a sealing machine to cut off any excess and seal the bag. Hot air is then blown onto the heat shrink film, causing it to shrink and adhere tightly to the product, completing the packaging. However, because the heat shrink film adheres tightly to the product after heating, it is prone to tearing under impact when the product is irregularly shaped, affecting packaging quality. Furthermore, heat shrink film is usually torn and discarded directly, resulting in various shapes and low reuse value, leading to resource waste. Therefore, a novel heat shrink bag for packaging electronic products is proposed as an improvement. Utility Model Content
[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.
[0005] Therefore, one objective of this utility model is to propose a novel heat shrink bag for packaging electronic products, in order to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.
[0006] To achieve the above objectives, one embodiment of the present invention provides a novel heat shrink bag for packaging electronic products, comprising a heat shrink bag, wherein a plurality of flexible pads are provided on the inner side of the heat shrink bag, a plurality of split grooves are provided on the heat shrink bag, and a pull strip is provided on the heat shrink bag at the split grooves, extending from the inner side of the heat shrink bag to the outer side of the heat shrink bag.
[0007] Preferably, as described in any of the above embodiments, the heat shrink bag has an antistatic layer on its inner side, and the flexible pad also has an antistatic layer.
[0008] Preferably, in any of the above embodiments, the antistatic layer is an antistatic agent coating that is fully applied to the inside of the heat shrink bag.
[0009] Using the above technical solution: heat shrink bags can be made of plastic film, such as POF (polyolefin), PVC (polyvinyl chloride), or PE (polyethylene). After heating, the heat shrink bag shrinks and tightly wraps around the item. Heat shrink bags are characterized by high transparency, strong shrinkage, dust and moisture resistance, and strong protection, making them well-suited for packaging electronic products. An antistatic layer is placed on the inside of the heat shrink bag. This layer effectively prevents static electricity from being generated when the heat shrink bag comes into contact with electronic products, thus avoiding any impact of static electricity on the products and making it even more suitable for packaging electronic products. The mechanism of action of the coating-type antistatic agent is mainly to increase the ion concentration on the film surface, preventing charge accumulation by neutralizing positive charges with anions or negative charges with cations. This ensures that no static electricity is generated between the inside of the bubble bag and the packaged item, guaranteeing the quality of the item. The antistatic layer uses an antistatic agent coating that covers the entire inside of the heat shrink bag, which helps to ensure the antistatic performance of the heat shrink bag throughout.
[0010] Preferably, the heat shrink bag has an anti-fingerprint coating on its outer side, and a plurality of the flexible pads are evenly arranged on the inner side of the heat shrink bag.
[0011] The above technical solution involves applying an anti-fingerprint coating to the outer side of the heat shrink bag. This coating forms a very thin protective layer on the surface of the heat shrink bag, providing excellent anti-fingerprint, anti-scratch, waterproof, and oil-resistant properties. This ensures the heat shrink bag is protected against fingerprints, preventing fingerprints from adhering to the packaged product and affecting its appearance. Flexible pads are placed inside the heat shrink bag to cushion the product and reduce the impact of irregular products or product edges on the bag. This lowers the probability of the heat shrink bag breaking during packaging and improves packaging quality. Several flexible pads are evenly distributed inside the heat shrink bag, ensuring uniform protection throughout.
[0012] Preferably, in any of the above embodiments, the splitting groove includes a transverse splitting groove and a longitudinal splitting groove, wherein the transverse splitting groove is arranged along the entire transverse length of the heat shrink bag, and the longitudinal splitting groove is arranged along the entire longitudinal length of the heat shrink bag.
[0013] Preferably, as described in any of the above schemes, there are several transverse split grooves and longitudinal split grooves, which are evenly arranged on the heat shrink bag.
[0014] Preferably, in any of the above embodiments, the tie rod includes a transverse tie rod disposed on the transverse split groove and a longitudinal tie rod disposed on the longitudinal split groove, and there are a plurality of both the transverse tie rod and the longitudinal tie rod.
[0015] The above technical solution utilizes a tearing groove to assist users in tearing the heat shrink bag. The groove's design ensures that the bag tears along its direction, resulting in a more regular tear. This regular tearing also facilitates recycling and increases the bag's reuse value. The presence of a pull strip within the tearing groove allows users to easily pull the bag to break it, eliminating the need for tools or fingernails to tear it, further promoting tearing along the groove. The combination of a horizontal tearing groove, a vertical tearing groove, and both horizontal and vertical pull strips allows the heat shrink bag to tear regularly in different directions and positions, making it more flexible to use.
[0016] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:
[0017] 1. This novel heat-shrink bag for packaging electronic products utilizes a structure incorporating flexible pads, tearing grooves, and pull strips. During packaging, the heat-shrink bag is wrapped around the product, and a sealing machine cuts off any excess material to seal the bag. Then, a hot air blower blows hot air onto the heat-shrink film, causing it to shrink and adhere tightly to the product, completing the packaging. The flexible pads cushion the product and reduce the impact of irregular shapes or product edges on the heat-shrink bag, thus lowering the probability of breakage and improving packaging quality. The tearing grooves ensure that the heat-shrink bag tears along the groove direction when the user tears it, resulting in a more regular tear. Regularly shaped heat-shrink bags are also easier to recycle, increasing their reuse value. The pull strips on the tearing grooves allow users to easily pull the bag to tear it, eliminating the need for tools or fingernails to pry it open, further facilitating tearing along the grooves.
[0018] 2. This novel heat-shrink bag for packaging electronic products features an antistatic layer on the inside. This layer effectively prevents static electricity from generating between the heat-shrink bag and the electronic product, thus avoiding any negative impact from static electricity and making it more suitable for packaging electronic products. The antistatic layer is a full-coverage antistatic agent coating on the inside of the heat-shrink bag, ensuring its antistatic performance throughout. An anti-fingerprint coating on the outside of the heat-shrink bag provides fingerprint protection, preventing fingerprints from adhering to the packaged product and affecting its appearance.
[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0021] Figure 1 This is a first-view structural diagram of the present invention;
[0022] Figure 2 This is a schematic diagram of the second-view structure of the present invention;
[0023] Figure 3 This is a cross-sectional structural diagram of the present invention.
[0024] In the diagram: 1-Heat shrink bag, 2-Antistatic layer, 3-Anti-fingerprint coating, 4-Flexible pad, 5-Split groove, 501-Transverse split groove, 502-Vertical split groove, 6-Stretch strip, 601-Transverse stretch strip, 602-Vertical stretch strip. Detailed Implementation
[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.
[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0027] like Figures 1-3 As shown, this utility model includes a heat shrink bag 1, with a plurality of flexible pads 4 provided on the inner side of the heat shrink bag 1, a plurality of split grooves 5 provided on the heat shrink bag 1, and a pull strip 6 provided on the heat shrink bag 1 at the split grooves 5, extending from the inner side of the heat shrink bag to the outer side of the heat shrink bag.
[0028] Example 1: An antistatic layer 2 is provided on the inner side of the heat shrink bag 1, and an antistatic layer 2 is also provided on the flexible pad 4. The antistatic layer 2 is an antistatic agent coating that covers the entire inner side of the heat shrink bag 1. The heat shrink bag 1 can be made of plastic film, such as POF (polyolefin), PVC (polyvinyl chloride), or PE (polyethylene). After heating, the heat shrink bag 1 can shrink and tightly wrap the item. The heat shrink bag 1 has the characteristics of high transparency, strong shrinkage, dust and moisture protection, and strong protection, and can be well applied to the packaging of electronic products. The antistatic layer 2 provided on the inner side of the heat shrink bag 1 can effectively prevent static electricity from being generated when the heat shrink bag 1 comes into contact with electronic products, thus avoiding the impact of static electricity on electronic products and making it more suitable for packaging electronic products. The mechanism of action of the coating-type antistatic agent is mainly to increase the ion concentration on the film surface, using anions to neutralize positive charges or cations to neutralize negative charges to prevent charge accumulation, so that no static electricity is generated between the inside of the bubble bag and the packaged item, ensuring the quality of the item. The antistatic layer 2 is an antistatic agent coating that is fully applied to the inside of the heat shrink bag 1, which helps to ensure the antistatic performance of the heat shrink bag 1.
[0029] Example 2: An anti-fingerprint coating 3 is provided on the outer side of the heat shrink bag 1, and several flexible pads 4 are evenly arranged on the inner side of the heat shrink bag 1. The anti-fingerprint coating 3 on the outer side of the heat shrink bag 1 forms an extremely thin protective layer on the surface of the heat shrink bag 1, possessing excellent anti-fingerprint, anti-scratch, waterproof, and oil-resistant properties. This provides fingerprint protection for the heat shrink bag 1, preventing fingerprints from adhering to the packaged product when handled, thus affecting its aesthetic appearance. The flexible pads 4 on the inner side of the heat shrink bag 1 cushion the product from the heat shrink bag 1, reducing the impact of irregular products or product edges on the heat shrink bag 1. This reduces the probability of the heat shrink bag 1 breaking during product packaging, improving packaging quality. The even arrangement of several flexible pads 4 inside the heat shrink bag 1 ensures uniform protection throughout the heat shrink bag 1.
[0030] Example 3: The splitting groove 5 includes a transverse splitting groove 501 and a longitudinal splitting groove 502. The transverse splitting groove 501 is arranged along the entire transverse length of the heat shrink bag 1, and the longitudinal splitting groove 502 is arranged along the entire longitudinal length of the heat shrink bag 1. There are multiple transverse splitting grooves 501 and longitudinal splitting grooves 502, which are evenly distributed on the heat shrink bag 1. The pull strip 6 includes a transverse pull strip 601 provided on the transverse splitting groove 501 and a longitudinal pull strip 602 provided on the longitudinal splitting groove 502. There are multiple transverse pull strips 601 and longitudinal pull strips 602. The splitting groove 5 can assist the user in tearing open the heat shrink bag 1. The setting of the splitting groove 5 makes it highly likely that the heat shrink bag 1 will tear along the direction of the splitting groove 5 when the user tears it open, so that the heat shrink bag 1 can be torn regularly. The regularly torn heat shrink bag 1 is also more convenient to recycle and has higher reuse value. A spicy strip 6 is provided on the split groove 5, making it convenient for users to pull the heat shrink bag 1 to break it, without the need for users to use tools or fingernails to tear the heat shrink bag 1, which facilitates the heat shrink bag 1 to break along the split groove 5. The horizontal split groove 501, together with the vertical split groove 502, the horizontal pull strip 601 and the vertical pull strip 602, allows the heat shrink bag 1 to break regularly in different directions and positions, making it more flexible to use.
[0031] The working principle of this utility model is as follows:
[0032] S1. Wrap the heat shrink bag 1 around the product, and use a sealing machine to cut off the excess and seal it. Then, use a hot air blower to blow hot air onto the heat shrink film. The heat shrink film shrinks and adheres tightly to the outside of the product, completing the packaging.
[0033] S2, the flexible pad 4 can buffer between the product and the heat shrink bag 1, reducing the impact of irregular products or the corners of the product on the heat shrink bag 1, thus reducing the probability of the heat shrink bag 1 breaking when packaging products and improving packaging quality.
[0034] The design of S3 and the tearing groove 5 ensures that the heat shrink bag 1 is likely to tear along the direction of the tearing groove 5 when the user tears it open, thus allowing the heat shrink bag 1 to be torn in a regular manner. A regular heat shrink bag 1 is also easier to recycle and has higher reuse value. The addition of a spicy strip 6 on the tearing groove 5 makes it easy for the user to pull the heat shrink bag 1 to tear it, eliminating the need for tools or fingernails to pry it open, and facilitating the tearing of the heat shrink bag 1 along the tearing groove 5.
[0035] Compared with the prior art, the present invention has the following advantages:
[0036] 1. This novel heat-shrink bag for packaging electronic products, through the inclusion of flexible pads 4, tearing grooves 5, and pull strips 6, allows for efficient packaging. During packaging, the heat-shrink bag 1 is wrapped around the product, and a sealing machine cuts off any excess and seals the bag. Then, a hot air blower blows hot air onto the heat-shrink film, causing it to shrink and adhere tightly to the outside of the product, completing the packaging. The flexible pads 4 cushion the product and the heat-shrink bag 1, reducing the impact of irregular products or product edges on the bag, thus lowering the probability of breakage and improving packaging quality. The tearing grooves 5 ensure that the heat-shrink bag 1 tears along the groove direction when the user tears it, resulting in a more regular tear. Regularly shaped heat-shrink bags are also easier to recycle, increasing their reuse value. Spicy strips 6 are placed on the split groove 5, which makes it convenient for users to pull the heat shrink bag 1 to break it. Users do not need to use tools or fingernails to tear the heat shrink bag 1, which is conducive to the heat shrink bag 1 breaking along the split groove 5.
[0037] 2. This novel heat-shrink bag for packaging electronic products features an antistatic layer 2 on the inner side of the heat-shrink bag 1. The antistatic layer 2 effectively prevents static electricity from being generated when the heat-shrink bag 1 comes into contact with the electronic product, thus avoiding any impact from static electricity on the electronic product and making it more suitable for packaging electronic products. The antistatic layer 2 is a coating of antistatic agent that covers the entire inner side of the heat-shrink bag 1, ensuring the antistatic performance of the heat-shrink bag 1 throughout. An anti-fingerprint coating 3 is applied to the outer side of the heat-shrink bag 1, providing fingerprint protection and preventing fingerprints from adhering to the packaged product when handling it, thus maintaining its aesthetic appeal.
Claims
1. A novel heat shrink bag for packaging electronic products, comprising a heat shrink bag (1); characterized in that, The heat shrink bag (1) has several flexible pads (4) on its inner side, and several split grooves (5) are provided on the heat shrink bag (1). A pull strip (6) is provided on the heat shrink bag (1) at the split groove (5) and extends from the inside of the heat shrink bag to the outside of the heat shrink bag.
2. A novel heat shrink bag for packaging electronic products as described in claim 1, characterized in that: An antistatic layer (2) is provided on the inner side of the heat shrink bag (1), and an antistatic layer (2) is also provided on the flexible pad (4).
3. A novel heat shrink bag for packaging electronic products as described in claim 2, characterized in that: The antistatic layer (2) is an antistatic agent coating that is fully applied to the inside of the heat shrink bag (1).
4. A novel heat shrink bag for packaging electronic products as described in claim 3, characterized in that: The heat shrink bag (1) is provided with an anti-fingerprint coating (3) on the outside, and a number of flexible pads (4) are evenly arranged on the inside of the heat shrink bag (1).
5. A novel heat shrink bag for packaging electronic products as described in claim 4, characterized in that: The split groove (5) includes a transverse split groove (501) and a longitudinal split groove (502). The transverse split groove (501) is arranged along the entire transverse length of the heat shrink bag (1), and the longitudinal split groove (502) is arranged along the entire longitudinal length of the heat shrink bag (1).
6. A novel heat shrink bag for packaging electronic products as described in claim 5, characterized in that: There are several transverse split grooves (501) and longitudinal split grooves (502), which are evenly arranged on the heat shrink bag (1).
7. A novel heat shrink bag for packaging electronic products as described in claim 6, characterized in that: The pull bar (6) includes a transverse pull bar (601) disposed on the transverse split groove (501) and a longitudinal pull bar (602) disposed on the longitudinal split groove (502), and there are several transverse pull bars (601) and longitudinal pull bars (602).