Chip

Abstract

The utility model discloses a chip. The chip comprises a frame body, a chip main body and a fixing piece, the frame body forms a containing groove, the containing groove penetrates through the frame body in the thickness direction of the frame body, the chip main body is embedded in the containing groove, a fluid channel is formed in the chip main body, and the fixing piece is embedded in the containing groove and abuts against the chip main body. According to the chip, the chip body and the fixing piece are embedded in the containing groove formed by the frame body, so that the structure of the chip is compact, the occupied space of the chip can be reduced, in addition, the fixing piece abuts against the chip body, the fixing piece can play a role in supporting and protecting the chip body, and the chip body is prevented from being damaged. And the risk that the chip main body is damaged due to external collision is reduced.

Description

Technical Field

[0001] This utility model relates to the field of gene sequencing, and in particular to a chip. Background Technology

[0002] A chip adapted to a sequencing platform is a reaction device that can hold the nucleic acid to be tested and contain a solution to provide a reaction environment or detection environment for the nucleic acid to be tested. It is also called a flow cell.

[0003] On a sequencing platform (sometimes simply called a sequencer) based on an optical imaging system detection chip, imaging is performed on specific locations on the chip (the locations where the nucleic acid molecules to be tested are connected, sometimes also called reaction regions or fluid channels), and the base sequence of the nucleic acid molecules to be tested is identified and determined based on the information in these images. For example, specifically, in a platform that uses optically labeled nucleotides and performs sequencing on a synthesis-as-a-sequence basis, during sequencing, the sequencer irradiates the labeled material in the reagent solution and excites it to emit optical signals, then collects these optical signals, such as by taking pictures, to obtain images. The base sequence is then identified and determined based on the information in these images to achieve the sequencing purpose. In related technologies, the chip occupies a relatively large space. Utility Model Content

[0004] This utility model provides a chip.

[0005] The chip in this embodiment includes a frame, a chip body, and a fixing member. The frame forms a receiving groove that penetrates the frame along its thickness direction. The chip body is embedded in the receiving groove and has a fluid channel. The fixing member is embedded in the receiving groove and abuts against the chip body.

[0006] In the chip of this application embodiment, both the chip body and the fixing member are embedded in the receiving groove formed by the frame, which makes the chip structure compact and can reduce the space occupied by the chip. In addition, the fixing member abuts against the chip body, and the fixing member can support and protect the chip body, reducing the risk of the chip body being damaged by external collisions.

[0007] In some embodiments, the receiving groove includes a first receiving groove, a second receiving groove, and a third receiving groove. The first receiving groove, the second receiving groove, and the third receiving groove are arranged sequentially along the thickness direction of the frame and form a step shape. The cross-sectional area of ​​the first receiving groove, the second receiving groove, and the third receiving groove increases sequentially. The first receiving groove and the second receiving groove have a first stepped surface, and the second receiving groove and the third receiving groove have a second stepped surface. The chip body abuts against the first stepped surface, and the fixing member is disposed in the third receiving groove.

[0008] In some embodiments, the frame includes a first surface and a second surface disposed opposite to each other along the thickness direction of the frame, a first receiving groove extending from the first surface to the second surface, a third receiving groove extending from the second surface to the first surface, and the second receiving groove connecting the first receiving groove and the third receiving groove.

[0009] In some embodiments, the chip body includes a top plate, an intermediate layer, and a substrate. The top plate, the intermediate layer, and the substrate are stacked sequentially along the thickness direction of the frame. The intermediate layer connects the top plate and the substrate and forms a fluid channel. The top plate is disposed in a first receiving groove. The substrate is located between the intermediate layer and the fixing member and abuts against the first step surface.

[0010] In some embodiments, there is a gap between the top plate and the sidewall of the first receiving groove.

[0011] In some embodiments, the fluid channel includes a first flow channel, a second flow channel, and a third flow channel connected in sequence. The substrate forms an inlet and an outlet located near the inlet. The inlet is connected to the first flow channel, and the outlet is connected to the third flow channel.

[0012] In some embodiments, the inlet and outlet are located on the same side of the substrate. In some embodiments, the width of the first flow channel is smaller than the width of the third flow channel.

[0013] In some embodiments, the fixing member has a through hole that extends through the fixing member along its thickness direction. The chip includes a first sealing member that is inserted into the through hole and abuts against the substrate. The first sealing member has a first through hole and a second through hole that are respectively connected to the liquid inlet and the liquid outlet.

[0014] In some embodiments, the chip includes a second seal that seals the connection between the second stepped surface and the retainer.

[0015] In some embodiments, the frame includes a first surface and a second surface disposed opposite to each other along the thickness direction of the frame, the frame forms a limiting groove, the limiting groove and the receiving groove are spaced apart along a first direction, the limiting groove extends from the second surface to the first surface and extends inward from the first sidewall of the frame, the first sidewall is located on one side of the frame in the first direction.

[0016] In some embodiments, the frame has a positioning hole, which is spaced apart from the receiving groove and the limiting groove, and extends from the second surface of the frame to the first surface.

[0017] In some embodiments, the frame includes a second sidewall located on one side of the frame in a second direction. The second sidewall is connected to the first sidewall and has a guide groove formed thereon. The guide groove communicates with a second surface and has a guide surface extending from the second sidewall to the second surface. The second direction, the first direction, and the thickness direction of the frame are perpendicular to each other.

[0018] In some embodiments, a chamfer and / or fillet is formed between the first sidewall and the second sidewall.

[0019] In some embodiments, the frame includes a first region, a second region, and a third region arranged sequentially along a second direction. The first region forms a receiving groove, the surface of the second region extends inward to form a mounting groove for attaching a label, and the surface of the third region extends inward to form a recess, the bottom surface of which protrudes outward to form a protrusion.

[0020] In some implementations, the protrusions are straight lines and / or broken lines.

[0021] In some embodiments, the end face of the frame facing the groove along the second direction is arc-shaped.

[0022] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] The above and / or additional aspects and advantages of this invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0024] Figure 1 This is a structural schematic diagram of the support device according to an embodiment of the present utility model;

[0025] Figure 2 This is a structural schematic diagram of the support device according to an embodiment of the present utility model;

[0026] Figure 3 yes Figure 2 An enlarged schematic diagram of Part I;

[0027] Figure 4 This is a schematic diagram of the chip structure according to an embodiment of the present invention;

[0028] Figure 5 This is an exploded structural diagram of the chip according to an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the chip structure according to an embodiment of the present invention;

[0030] Figure 7 yes Figure 6Schematic cross-sectional view along the AA direction;

[0031] Figure 8 This is a schematic diagram of the chip structure according to an embodiment of the present invention;

[0032] Figure 9 yes Figure 8 Schematic cross-sectional view along the AA direction;

[0033] Figure 10 This is a schematic diagram of the structure of the intermediate layer in an embodiment of this utility model;

[0034] Figure 11 This is a schematic diagram of the chip structure according to an embodiment of the present invention;

[0035] Figure 12 This is a schematic diagram of the chip structure according to an embodiment of the present invention.

[0036] Explanation of reference numerals in the attached drawings: 100, chip; 10, frame; 11, receiving groove; 111, first receiving groove; 112, second receiving groove; 113, third receiving groove; 114, first stepped surface; 115, second stepped surface; 12, first surface; 13, second surface; 131, limiting groove; 132, positioning hole; 14, first sidewall; 15, second sidewall; 151, guide groove; 152, guide surface; 16, first region; 17, second region; 171, mounting groove; 18, third region; 181, groove; 182, protrusion; 20, chip body; 21, fluid channel; 22, top plate; 23. Intermediate layer; 24. Substrate; 25. First flow channel; 26. Second flow channel; 27. Third flow channel; 28. Liquid inlet; 29. ​​Liquid outlet; 30. Fixing component; 31. Through hole; 40. First sealing component; 41. First through hole; 42. Second through hole; 50. Second sealing component; D1. First direction; D2. Second direction; 200. Support device; 210. Base; 220. Bracket; 230. Support platform; 231. Receiving groove; 232. Protrusion; 233. Sliding groove; 234. Positioning pin; 240. Pressure plate; 250. Drive assembly; 260. Linkage assembly; 270. Heating platform. Detailed Implementation

[0037] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0038] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0041] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0042] Please see Figures 1-3 When performing sequencing using chip 100, chip 100 must first be fixed onto carrier device 200. In some embodiments, carrier device 200 includes base 210, support 220, carrier stage 230, pressure plate 240, drive assembly 250, and linkage assembly 260. Support 220 is movably disposed on base 210, carrier stage 230 is disposed on support 220 and is used to support chip 100, and pressure plate 240 is movably disposed on carrier stage 230 to press or release chip 100, drive assembly 250 is disposed on base 210 and is used to drive support 220 to move relative to base 210, and linkage assembly 260 is disposed on support 220 and connected to pressure plate 240. Linkage assembly 260 is used to drive pressure plate 240 to move relative to carrier stage 230 during the process of drive assembly 250 driving support 220 to move relative to base 210.

[0043] In some embodiments, the support stage 230 has a receiving groove 231 in which the chip 100 is disposed. The shape and size of the receiving groove 231 can be designed according to the shape and size of the chip 100. The chip 100 can be partially placed in the receiving groove 231 or completely placed in the receiving groove 231.

[0044] Please see Figure 4 and Figure 5 The chip 100 of this application includes a frame 10, a chip body 20 and a fixing member 30. The frame 10 forms a receiving groove 11, which penetrates the frame 10 along the thickness direction. The chip body 20 is embedded in the receiving groove 11 and has a fluid channel 21. The fixing member 30 is embedded in the receiving groove 11 and abuts against the chip body 20.

[0045] In the chip 100 of this application embodiment, both the chip body 20 and the fixing member 30 are embedded in the receiving groove 11 formed by the frame 10. This makes the structure of the chip 100 compact and can reduce the space occupied by the chip 100. In addition, the fixing member 30 abuts against the chip body 20, and the fixing member 30 can support and protect the chip body 20, reducing the risk of the chip body 20 being damaged by external collisions.

[0046] Specifically, the frame 10 is the outermost layer of the chip 100, serving to mount, fix, and protect the chip body 20. The frame 10 surrounds the chip body 20, providing a carrier for the sample and reagents to be tested. The frame 10 facilitates the placement and removal of the chip body 20 and prevents fingerprints or other residues from being left on the surface of the chip 100 when directly contacting the chip body 20, thus avoiding interference with the acquisition of optical signals generated within the chip 100. Furthermore, by configuring the structure of the frame 10, the chip 100 can be fixed in a specific area of ​​the testing instrument for the detection of the sample fixed within the chip body 20. For example, the chip 100 can be fixed to the surface of the sequencing platform's chip stage to achieve stable sequencing. The frame 10 can be made of resin, and its injection molding process results in low manufacturing costs and a simple manufacturing process.

[0047] The chip body 20, as the main component of the chip 100, is used to carry the sample to be tested. Taking the sequencing chip 100 as an example, the chip body 20 can carry the nucleic acid molecules to be tested, providing a reaction site for the reaction occurring on the surface of the chip 100, and providing channels for reagents and samples involved in the reaction. The chip body 20 can be an assembly formed by stacking multiple sheet-like parts. The overall shape of the chip body 20 can be set to match the shape of other structures of the chip 100. For example, the overall shape of the chip body 20 can be a rectangle, square, rhombus, other polygons, or an irregular shape with an arc-shaped outer perimeter. The shape of the fixing member 30 can be the same as the shape of the chip body 20. The middle part of the fixing member 30 can be a hollow structure, which can reduce the weight of the fixing member 30 and achieve the lightweighting of the chip 100.

[0048] Please see Figures 6-9In some embodiments, the receiving groove 11 includes a first receiving groove 111, a second receiving groove 112, and a third receiving groove 113. The first receiving groove 111, the second receiving groove 112, and the third receiving groove 113 are arranged sequentially along the thickness direction of the frame 10 and form a stepped shape. The cross-sectional area of ​​the first receiving groove 111, the second receiving groove 112, and the third receiving groove 113 increases sequentially. The first receiving groove 111 and the second receiving groove 112 have a first stepped surface 114, and the second receiving groove 112 and the third receiving groove 113 have a second stepped surface 115. The chip body 20 abuts against the first stepped surface 114, and the fixing member 30 is disposed in the third receiving groove 113.

[0049] The first receiving groove 111, the second receiving groove 112, and the third receiving groove 113 are arranged sequentially along the thickness direction of the frame 10 and form a stepped shape. The cross-sectional areas of the first receiving groove 111, the second receiving groove 112, and the third receiving groove 113 increase sequentially, meaning that the cross-sectional areas of the first receiving groove 111, the second receiving groove 112, and the third receiving groove 113 remain constant along the thickness direction of the frame 10, and the cross-sectional area of ​​the second receiving groove 112 is larger than that of the first receiving groove 111, and the cross-sectional area of ​​the third receiving groove 113 is larger than that of the second receiving groove 112. This facilitates the mounting of the chip body 20 onto the frame 10 from the third receiving groove 113. At the same time, the fixing member 30 can support the chip body 20.

[0050] The cross-sectional areas of the first receiving groove 111, the second receiving groove 112, and the third receiving groove 113 can increase sequentially. This can be because the dimensions of the first receiving groove 111, the second receiving groove 112, and the third receiving groove 113 increase sequentially along the length direction of the frame 10, or the dimensions of the first receiving groove 111, the second receiving groove 112, and the third receiving groove 113 increase sequentially along both the length and width directions of the frame 10.

[0051] The central axes of the first receiving groove 111, the second receiving groove 112, and the third receiving groove 113 can be coaxially arranged along the thickness direction of the frame 10. The first step surface 114 can be the surface where the second receiving groove 112 communicates with the first receiving groove 111, and the second step surface 115 can be the surface where the third receiving groove 113 communicates with the second receiving groove 112.

[0052] Please see Figure 7In some embodiments, the frame 10 includes a first surface 12 and a second surface 13 disposed opposite to each other along the thickness direction of the frame 10, a first receiving groove 111 extending from the first surface 12 to the second surface 13, a third receiving groove 113 extending from the second surface 13 to the first surface 12, and the second receiving groove 112 connecting the first receiving groove 111 and the third receiving groove 113.

[0053] The chip body 20 can be disposed in the first accommodating groove 111 and the second accommodating groove 112. Furthermore, the surface of the chip body 20 along the thickness direction of the frame 10 is located between the first surface 12 and the second surface 13, so that the first accommodating groove 111 can serve as an observation window, that is, the sequencer can take pictures of the sample to be tested, such as the nucleic acid molecule to be tested, in the fluid channel 21 disposed on the chip body 20 from the first accommodating groove 111.

[0054] Please see Figure 5 , Figure 7 and Figure 9 In some embodiments, the chip body 20 includes a top plate 22, an intermediate layer 23 and a substrate 24. The top plate 22, the intermediate layer 23 and the substrate 24 are stacked sequentially along the thickness direction of the frame 10. The intermediate layer 23 connects the top plate 22 and the substrate 24 and forms a fluid channel 21. The top plate 22 is disposed in the first receiving groove 111. The substrate 24 is located between the intermediate layer 23 and the fixing member 30 and abuts against the first step surface 114.

[0055] In this way, the top plate 22 and the substrate 24 can provide support for the intermediate layer 23, thereby providing a space for reagents and test samples. At the same time, the top plate 22 and the substrate 24 can shield the fluid channel 21, reducing the contamination of reagents and test samples by the external environment.

[0056] Specifically, the substrate 24 and the top plate 22 may be made of materials such as silicon, silicon dioxide, crystal, or quartz glass. In some embodiments, the substrate 24 and the top plate 22 are made of one of the above materials. For example, the substrate 24 is a silicon substrate 24, a crystal substrate 24, a quartz glass substrate 24, etc.

[0057] In some embodiments, the area of ​​the top plate 22 is smaller than the area of ​​the substrate 24. For example, in the length and / or width direction of the chip body 20, the two ends of the top plate 22 are recessed towards the middle region, so that the two ends of the chip body 20 in the length and / or width direction are left empty relative to the top plate 22.

[0058] The top plate 22 may be made of, for example, glass, silicon dioxide, crystal, quartz glass, or any other suitable material. It should be understood that at least one of the substrate 24 and the top plate 22 is made of a light-transmitting material, including but not limited to glass and crystal.

[0059] In one embodiment, the substrate 24 and / or the top plate 22 are made of a light-transmitting material to enable the optical system to acquire optical signals generated on the surface of the chip 100. This expands the types of reactions occurring on the surface of the chip 100, particularly the chip body 20, to include optical applications. For example, in the sequencing chip 100, when a substrate containing a fluorescent group reacts with nucleic acid molecules immobilized on the surface of the chip 100, particularly on the surface of the chip body 20, the optical system acquires the optical signals generated by the fluorescent group on the surface of the chip body 20 to identify the reaction site and substrate type.

[0060] In some embodiments, the substrate 24 and / or the top plate 22 are made of glass. Thus, the glass substrate 24 and / or top plate 22 improve the fluidity of the liquid, making it less likely to adhere to the interior of the chip 100, thereby improving the accuracy of the chip 100 detection. Specifically, glass is an amorphous inorganic non-metallic material, generally made from various inorganic minerals such as quartz sand, borax, boric acid, barite, barium carbonate, limestone, feldspar, and soda ash as the main raw materials, with the addition of small amounts of auxiliary materials. Its main components are silicon dioxide and other oxides.

[0061] The intermediate layer 23 may be made of at least one of the following: epoxy resin (found in epoxy adhesives), acrylic resin (found in acrylate adhesives), OCA (Optically Clear Adhesive), PSA (Pressure Sensitive Adhesive), or PI (Polyimide) double-sided tape. Thus, the intermediate layer 23 can bond to the surface of the substrate 24 through its adhesive properties. Specifically, the intermediate layer 23 can bond the substrate 24 and the top plate 22. In this way, the substrate 24 and the top plate 22 are connected by adhesion, thereby fixing the substrate 24 and the top plate 22 together.

[0062] In some embodiments, the area of ​​the substrate 24 is smaller than the area of ​​the fixing member 30. For example, in the length and / or width direction of the chip 100, the two ends of the substrate 24 are recessed towards the middle region, so that the chip body 20 is left empty relative to the top plate 22 at both ends in the length and / or width direction.

[0063] Please see Figure 7 and Figure 9 In some embodiments, there is a gap between the top plate 22 and the sidewall of the first receiving groove 111.

[0064] In this way, when the sequencer takes pictures of the sample to be tested in the fluid channel 21 through the top plate 22, the interference of the frame 10 on the imaging lens can be reduced.

[0065] Specifically, there may be a gap between the top plate 22 and one side wall of the first receiving groove 111, or there may be gaps between the top plate 22 and multiple side walls of the first receiving groove 111. For example, there may be gaps between the top plate 22 and three side walls of the first receiving groove 111.

[0066] Please see Figure 5 and Figure 10 In some embodiments, the fluid channel 21 includes a first flow channel 25, a second flow channel 26 and a third flow channel 27 connected in sequence. The substrate 24 forms an inlet 28 and an outlet 29 disposed near the inlet 28. The inlet 28 is connected to the first flow channel 25 and the outlet 29 is connected to the third flow channel 27.

[0067] Specifically, the first flow channel 25 can be a preheating flow channel so that the reagent can be preheated in the first flow channel 25, the second flow channel 26 can be a connecting flow channel so as to connect the first flow channel 25 and the second flow channel 26, and the third flow channel 27 can be a biochemical reaction flow channel so that the reagent can undergo a biochemical reaction in the third flow channel 27.

[0068] The fluid channel 21 of this application is provided with a preheating channel and a biochemical reaction channel, thereby dividing the fluid channel 21 into a preheating zone and a biochemical reaction zone. By controlling the temperatures of the preheating channel and the biochemical reaction channel separately, precise temperature control of the reaction system in the biochemical reaction zone can be achieved. By preheating the reagents flowing through this zone in the preheating zone, the reagents are preheated to the temperature required for the reaction or close to the temperature required for the reaction, which can shorten the heating time of the reagents in the biochemical reaction zone, thereby shortening the sequencing time. At the same time, a small temperature gradient is ensured between the inlet and outlet of the biochemical reaction zone, ensuring the temperature consistency of the biochemical reaction zone, thereby maintaining the consistency of the biochemical reaction and improving the reaction sequencing efficiency. Since the preheating zone is integrated into the chip body 20, the size and design complexity of the heating and cooling device are greatly reduced.

[0069] When the reagent is added to the chip body 20 at a limited flow rate, the reagent first flows into the preheating channel through the inlet 28 for preheating, then flows into the biochemical reaction channel through the connecting channel for biochemical reaction, and finally flows out of the biochemical reaction channel through the outlet 29.

[0070] Please see Figure 5 In some embodiments, the liquid inlet 28 and the liquid outlet 29 are located on the same side of the substrate 24.

[0071] The fluid channel 21 can be approximately U-shaped, meaning that the first flow channel 25 and the third flow channel 27 are located on the same side of the width direction of the second flow channel 26. This reduces the space occupied by the fluid channel 21 in the intermediate layer 23, enabling miniaturization of the chip 100.

[0072] The inlet 28 can be located on the side of the preheating channel away from the connecting channel, and the outlet 29 can be located on the side of the biochemical reaction channel away from the connecting channel, so that the reagent can flow through the entire channel portion of the first channel 25, the second channel 26 and the third channel 27 in sequence.

[0073] Please see Figure 10 In some embodiments, the width of the first flow channel 25 is smaller than the width of the third flow channel 27. That is, the width of the preheating flow channel is smaller than the width of the biochemical reaction flow channel, thereby allowing the reagents to pass through the preheating flow channel more quickly and to undergo a sufficient biochemical reaction in the biochemical reaction flow channel.

[0074] In one embodiment, the width of the second flow channel 26 is smaller than the width of the first flow channel 25, that is, the width of the connecting flow channel is smaller than the width of the preheating flow channel.

[0075] Please see Figure 5 In some embodiments, the fixing member 30 has a through hole 31 that extends through the fixing member 30 along its thickness direction. The chip 100 includes a first sealing member 40, which is inserted into the through hole 31 and abuts against the substrate 24. The first sealing member 40 has a first through hole 41 and a second through hole 42, which are respectively connected to the liquid inlet 28 and the liquid outlet 29.

[0076] Thus, the first sealing member 40 can improve the connection sealing between the substrate 24 and the fixing member 30, reduce the risk of reagent leakage from the gap between the substrate 24 and the fixing member 30, and reduce reagent waste. In addition, by setting the first via 41 and the second via 42 on the same first sealing member 40, the material cost and assembly time of the chip 100 can be reduced.

[0077] Specifically, the first sealing element 40 can be a silicone gasket, a rubber gasket, etc. The portion of the first sealing element 40 that forms the first through hole 41 and the portion that forms the second through hole 42 can be inserted into the same through hole 31, or they can be inserted into two separate through holes 31.

[0078] In one embodiment, there are two first seals 40, each having a first through hole 41 and a second through hole 42, and each first seal 40 is inserted into a second through hole 31.

[0079] The central axis of the first through hole 41 can be coaxially set with the central axis of the liquid inlet 28, and the central axis of the second through hole 42 can be coaxially set with the central axis of the liquid outlet 29.

[0080] Please see Figure 5 and Figure 9In some embodiments, the chip 100 includes a second seal 50 that seals the connection between the second stepped surface 115 and the retainer 30.

[0081] Thus, the second sealing element 50 can not only seal the surface, but also connect the second step surface 115 and the fixing element 30 to fix the fixing element 30 to the frame 10.

[0082] Specifically, the second sealing element 50 can be double-sided adhesive, and the second sealing element 50 can be arranged along the circumference of the fixing element 30. For example, the fixing element 30 has a U-shaped structure, with a through hole 31 provided on one side, and the second sealing element 50 provided on the other three sides.

[0083] Please see Figure 11 and Figure 12 In some embodiments, the frame 10 includes a first surface 12 and a second surface 13 disposed opposite to each other along the thickness direction of the frame 10. The frame 10 forms a limiting groove 131, which is spaced apart from the receiving groove 11 along the first direction D1. The limiting groove 131 extends from the second surface 13 to the first surface 12 and extends inward from the first sidewall 14 of the frame 10. The first sidewall 14 is located on one side of the frame 10 in the first direction D1.

[0084] Combination Figure 3 A protrusion 232 can be formed in the receiving groove 231. The protrusion 232 is inserted into the limiting groove 131 and can limit the chip 100. The top surface of the protrusion 232 is connected to the side surface of the receiving groove 231 to form a sliding groove 233. The chip 100 slides along the sliding groove 233 until the protrusion 232 engages with the limiting groove 131 or the chip 100 separates from the receiving groove 231. The sliding groove 233 can guide the movement of the chip 100 in the receiving groove 231.

[0085] The first direction D1 can be the width direction of the frame 10, and the first sidewall 14 can be the sidewall of the frame 10 along the first direction D1. There can be two first sidewalls 14, and the two first sidewalls 14 are arranged parallel to each other along the first direction D1. There can be two limiting grooves 131 and two protrusions 232. The two limiting grooves 131 are located on both sides of the frame 10 along the first direction D1, and the two limiting grooves 131 and the two protrusions 232 are matched one-to-one.

[0086] Please see Figure 11 and Figure 12 In some embodiments, the frame 10 forms a positioning hole 132, which is spaced apart from the receiving groove 11 and the limiting groove 131, and extends from the second surface 13 of the frame 10 to the first surface 12.

[0087] Combination Figure 3A positioning pin 234 can be formed in the receiving groove 231. The positioning pin 234 and the protrusion 232 are spaced apart. The positioning hole 132 cooperates with the positioning pin 234 to position the chip 100 and ensure that the chip 100 is in the correct position on the carrier device 200.

[0088] There can be two positioning holes 132 and two positioning pins 234. The two positioning holes 132 and the two positioning pins 234 are matched one-to-one. When the positioning hole 132 and the positioning pin 234 are matched, the first through hole 41 and the second through hole 42 can correspond one-to-one with the inlet and outlet of the manifold on the sequencer and be sealed. Liquid can be pumped into the chip 100 through the external pumping system.

[0089] Please see Figure 11 and Figure 12 In some embodiments, the frame 10 includes a second sidewall 15 located on one side of the second direction D2 of the frame 10. The second sidewall 15 is connected to the first sidewall 14. The second sidewall 15 forms a guide groove 151 that communicates with the second surface 13. The guide groove 151 has a guide surface 152 extending from the second sidewall 15 to the second surface 13. The second direction D2, the first direction D1, and the thickness direction of the frame 10 are perpendicular to each other.

[0090] The second direction D2 can be the length direction of the frame 10, and the second side wall 15 can be the side wall of the frame 10 along the second direction D2.

[0091] Combination Figure 3 In one embodiment, the support device 200 includes a heating stage 270 for heating or cooling the chip 100. The heating stage 270 protrudes from the bottom surface of the receiving groove 231. The guide groove 151 serves to avoid the heating stage 270, reducing interference between the heating stage 270 and the chip 100. The guide surface 152 guides the movement of the chip 100 within the receiving groove 231 and reduces the resistance to movement of the chip 100. The depth of the guide groove 151 and the inclination of the guide surface 152 can be designed according to actual needs.

[0092] Please see Figure 12 In some embodiments, a chamfer and / or fillet is formed between the first sidewall 14 and the second sidewall 15.

[0093] In this way, chamfers and rounded corners can serve as guides and at the same time improve the aesthetics of the frame 10.

[0094] Specifically, it is possible that both first sidewalls 14 and second sidewalls 15 are chamfered, or both first sidewalls 14 and second sidewalls 15 are rounded, or one of the first sidewalls 14 and second sidewalls 15 is chamfered and the other is rounded.

[0095] Please see Figure 8 In some embodiments, the frame 10 includes a first region 16, a second region 17 and a third region 18 arranged sequentially along the second direction D2. The first region 16 forms a receiving groove 11. The surface of the second region 17 extends inward to form a mounting groove 171 for attaching a label. The surface of the third region 18 extends inward to form a recess 181. The bottom surface of the recess 181 protrudes outward to form a protrusion 182.

[0096] In this way, the frame 10 is divided into multiple areas, so that the chip body 20, the label and the protrusion 182 can be set in each area of ​​the frame 10, reducing mutual interference.

[0097] Specifically, the surface of the first region 16 can be the first surface 12 and the second surface 13, and one of the surfaces of the second region 17 and the third region 18 can be located on the side of the first surface 12 away from the second surface 13, while the other surface coincides with the second surface 13.

[0098] The number of mounting slots 171 can be one, and a mounting slot 171 can be formed by extending from one surface of the second region 17 to another surface. The shape and size of the mounting slot 171 can be designed according to the shape and size of the label; for example, if the label is square, then the mounting slot 171 is square. A QR code or barcode can be set on the label to record sample information for easy identification of the chip 100.

[0099] The number of grooves 181 can be one, which can be formed by extending one surface of the third region 18 to the other surface; the number of grooves 181 can also be two, which can be formed by extending inward from the two surfaces of the third region 18. The protrusions 182 facilitate clamping the chip 100 and improve the aesthetics of the chip 100.

[0100] Please see Figure 8 and Figure 12 In some embodiments, the protrusion 182 is in the form of a straight line and / or a broken line.

[0101] Specifically, the protrusions 182 in both grooves 181 can be straight or broken lines, or one of the protrusions 182 in one groove 181 can be straight and the other can be broken line. The protrusions 182 in the two grooves 181 have different shapes, which makes it easier to distinguish the two surfaces of the chip 100.

[0102] The number of protrusions 182 in a groove 181 can be one or more, and the multiple protrusions 182 can be arranged in parallel. The dimensions of the multiple protrusions 182 can be the same or different.

[0103] Please see Figure 8 In some embodiments, the end face of the frame 10 facing the groove 181 along the second direction D2 is arc-shaped. This satisfies the length and width dimensions of the frame 10 while reducing its weight, increasing its aesthetics, and making it easier to hold the chip 100.

[0104] The arc-shaped end face can be directly connected to the two first sidewalls 14, or it can be connected through a third sidewall. In one embodiment, the diameter of the arc is the distance between the two first sidewalls 14, i.e., the width of the frame 10, in which case the arc-shaped end face is directly connected to and tangent to the two first sidewalls 14. In another embodiment, the diameter of the arc is smaller than the width of the frame 10, in which case the arc-shaped end face is connected to the two first sidewalls 14 through a third sidewall, and the third sidewall forms an obtuse angle with the first sidewall 14.

[0105] The assembly process of the chip 100 in this embodiment can be as follows: First, the intermediate layer 23 is attached to the substrate 24 using a roller laminating machine. Then, the top plate 22 and the substrate 24 are bonded together through the intermediate layer 23 using a vacuum laminating machine to form the chip body 20. Next, the second sealing member 50 is attached to the fixing member 30, and the first sealing member 40 is inserted into the through hole 31 formed by the fixing member 30. Then, the chip body 20 is placed in the first receiving groove 111 and the second receiving groove 112, so that the substrate 24 abuts against the first step surface 114. Then, the fixing member 30 is attached to the second step surface 115 of the third receiving groove 113 through the second sealing member 50. Finally, a label is affixed to the mounting groove 171 formed by the frame 10.

[0106] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0107] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A chip, characterized in that, include: A frame, wherein the frame forms a receiving groove, the receiving groove penetrating the frame along the thickness direction of the frame; A chip body, which is embedded in the receiving groove and has a fluid channel; A fastener is embedded in the receiving groove and abuts against the chip body.

2. The chip according to claim 1, characterized in that, The receiving groove includes a first receiving groove, a second receiving groove, and a third receiving groove. The first receiving groove, the second receiving groove, and the third receiving groove are arranged sequentially along the thickness direction of the frame and form a step shape. The cross-sectional area of ​​the first receiving groove, the second receiving groove, and the third receiving groove increases sequentially. The first receiving groove and the second receiving groove have a first stepped surface, and the second receiving groove and the third receiving groove have a second stepped surface. The chip body abuts against the first stepped surface, and the fixing member is disposed in the third receiving groove.

3. The chip according to claim 2, characterized in that, The frame includes a first surface and a second surface disposed opposite to each other along the thickness direction of the frame. The first receiving groove extends from the first surface to the second surface, and the third receiving groove extends from the second surface to the first surface. The second receiving groove connects the first receiving groove and the third receiving groove.

4. The chip according to claim 2, characterized in that, The chip body includes a top plate, an intermediate layer, and a substrate. The top plate, the intermediate layer, and the substrate are stacked sequentially along the thickness direction of the frame. The intermediate layer connects the top plate and the substrate and forms the fluid channel. The top plate is disposed in the first receiving groove. The substrate is located between the intermediate layer and the fixing member and abuts against the first stepped surface.

5. The chip according to claim 4, characterized in that, There is a gap between the top plate and the side wall of the first receiving groove.

6. The chip according to claim 4, characterized in that, The fluid channel includes a first flow channel, a second flow channel, and a third flow channel connected in sequence. The substrate forms a liquid inlet and a liquid outlet located near the liquid inlet. The liquid inlet is connected to the first flow channel, and the liquid outlet is connected to the third flow channel.

7. The chip according to claim 6, characterized in that, The liquid inlet and the liquid outlet are located on the same side of the substrate.

8. The chip according to claim 6, characterized in that, The width of the first flow channel is smaller than the width of the third flow channel.

9. The chip according to any one of claims 6-8, characterized in that, The fixing member has a through hole that extends through the fixing member along its thickness direction. The chip includes a first sealing member that is inserted into the through hole and abuts against the substrate. The first sealing member has a first through hole and a second through hole that are respectively connected to the liquid inlet and the liquid outlet.

10. The chip according to claim 2, characterized in that, The chip includes a second seal that seals the connection between the second stepped surface and the fixing member.

11. The chip according to claim 1, characterized in that, The frame includes a first surface and a second surface disposed opposite to each other along the thickness direction of the frame. The frame forms a limiting groove, which is spaced apart from the receiving groove along a first direction. The limiting groove extends from the second surface to the first surface and extends inward from the first sidewall of the frame. The first sidewall is located on one side of the frame in the first direction.

12. The chip according to claim 11, characterized in that, The frame has a positioning hole, which is spaced apart from the receiving groove and the limiting groove. The positioning hole extends from the second surface of the frame to the first surface.

13. The chip according to claim 1, characterized in that, The frame includes a second sidewall located on one side of the frame in a second direction. The second sidewall is connected to the first sidewall. The second sidewall forms a guide groove that communicates with a second surface. The guide groove has a guide surface extending from the second sidewall to the second surface. The second direction, the first direction, and the thickness direction of the frame are perpendicular to each other.

14. The chip according to claim 13, characterized in that, A chamfer and / or fillet are formed between the first sidewall and the second sidewall.

15. The chip according to claim 1, characterized in that, The frame includes a first region, a second region, and a third region arranged sequentially along a second direction. The first region forms a receiving groove, the surface of the second region extends inward to form a mounting groove for attaching labels, and the surface of the third region extends inward to form a recess, the bottom of which protrudes outward to form a protrusion.

16. The chip according to claim 15, characterized in that, The protrusions are in the form of straight lines and / or broken lines.

17. The chip according to claim 15, characterized in that, The end face of the frame facing the groove along the second direction is arc-shaped.

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