Test bench for UDP and TF gold spots

Abstract

The utility model discloses a test seat for UDP and TF gold dots, which comprises a base, a flip cover and a detachable block, one end of the flip cover is movably hinged to one end of the upper part of the base, the other end of the flip cover is buckled with the other end of the upper part of the base, the base is provided with a clamping notch, the bottom of the clamping notch is provided with a test needle for testing the UDP and TF gold dots, and the detachable block is connected with the flip cover. A detachable block is arranged at the position, corresponding to the clamping groove opening, of the inner side of the turning cover, and a flexible cushion block is fixedly arranged on the side, close to the clamping groove opening, of the surface of the detachable block. According to the utility model, the structure is simple, the operation is convenient, the UDP and TF test pins are integrated in one card slot, the compatibility is high, when a test is needed, a UDP or TF card can be placed at a position corresponding to the test in the card slot, then the flip cover is buckled with the base, and the flexible cushion block can extrude the UDP or TF, so that the gold point of the UDP or TF can be stably contacted with the corresponding test pin, and the test efficiency is improved. And the test stability and precision are improved.

Description

Technical Field

[0001] This utility model relates to the technical field of memory card testing equipment, and more specifically, to a test socket for UDP and TF gold points. Background Technology

[0002] UDP and TF cards are semiconductor packages used as data storage devices for various types of digital electronic products and digital cameras. Currently, after the production and testing of UDP and TF cards, defective products need to be retested, hidden defects need to be tested, and some practical applications need to be carried out to achieve reuse and avoid waste of resources. Most of the existing tests are done manually, using single-chip operation, which has poor compatibility, cannot achieve dual-card testing, and has poor work efficiency. At the same time, the test is greatly affected by human factors, making it difficult to guarantee the stability of the card during testing and reducing the accuracy of the test. Utility Model Content

[0003] The purpose of this invention is to provide a test socket for UDP and TF gold points that is highly compatible, simple to operate, and stable.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: A test socket for UDP and TF gold points includes a base, a flip cover, and a detachable block. One end of the flip cover is movably hinged to one end of the upper part of the base, and the other end of the flip cover is fastened to the other end of the upper part of the base. The base is provided with a slot, and the bottom of the slot is provided with test probes for testing UDP and TF gold points. The inner side of the flip cover is provided with a detachable block corresponding to the position of the slot, and a flexible pad is fixedly provided on the side of the detachable block near the position of the slot.

[0005] Preferably, the base has a notch at one end away from the hinge of the flip cover, and a protruding limiting plate is fixedly provided inside the notch. A buckle is fixedly installed at one end of the flip cover away from the hinge, and the flip cover is engaged with the protruding limiting plate by the buckle.

[0006] Preferably, the flexible pad is made of rubber.

[0007] Preferably, the inside of the flip cover has a receiving opening, and the detachable block is attracted into the receiving opening by a magnet.

[0008] Preferably, the surface of the flexible pad has a cross groove.

[0009] Preferably, the outer end of the buckle is fixed with an integral lifting plate.

[0010] Preferably, the inner surface of the flip cover has multiple openings at the periphery of the detachable block.

[0011] Compared with the prior art, the advantages of this utility model are:

[0012] This utility model has a simple structure and is easy to operate. By integrating the test probes of UDP and TF into a single slot, it has high compatibility. When testing is required, the UDP or TF card can be placed in the corresponding test position in the slot, and then the flip cover is snapped onto the base. At this time, the flexible pad can compress the UDP or TF, so that the gold point of the UDP or TF can stably contact the corresponding test probe, thereby improving the stability and accuracy of the test. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a perspective view of a test socket for UDP and TF gold points according to this utility model;

[0015] Figure 2 This is a side view of a test socket for UDP and TF gold points according to this utility model;

[0016] Figure 3 This is a top view of a test socket for UDP and TF gold points according to this utility model.

[0017] In the diagram: 1. Base; 11. Notch; 12. Protruding limiting plate; 2. Flip cover; 21. Clearance opening; 3. Slot opening; 31. Test probe; 4. Detachable block; 41. Flexible pad; 42. Cross groove; 5. Buckle; 51. Handle plate. Detailed Implementation

[0018] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0019] See Figures 1-3As shown, this utility model provides a test socket for UDP and TF gold points, including a base 1, a flip cover 2, and a detachable block 4. One end of the flip cover 2 is movably hinged to one end of the upper part of the base 1. The base 1 and the flip cover 2 are manufactured by injection molding. The other end of the flip cover 2 is fastened to the other end of the upper part of the base 1. The base 1 is provided with a card slot 3. The cross-sectional dimensions of the card slot 3 are matched with the dimensions of UDP cards and TF cards in the prior art. The bottom of the card slot 3 is provided with a test pin 31 for testing UDP and TF gold points. The inner side of the flip cover 2 is provided with a detachable block 4 corresponding to the position of the card slot 3. A flexible pad 41 is fixedly provided on the side of the detachable block 4 near the position of the card slot 3. The flexible pad 41 is used to squeeze and fix the UDP and TF cards placed in the card slot 3.

[0020] Furthermore, in order to achieve quick engagement between the flip cover 2 and the base 1, in this embodiment, a notch 11 is provided at one end of the base 1 away from the hinge position of the flip cover 2. A protruding limiting plate 12 is fixedly provided on the inner side of the notch 11. The upper part of the protruding limiting plate 12 is inclined. A buckle 5 is fixedly installed at one end of the flip cover 2 away from the hinge position. A hook is provided on the inner side of the end of the buckle 5. Therefore, the flip cover 2 is engaged with the protruding limiting plate 12 through the buckle 5.

[0021] Furthermore, in this embodiment, the flexible pad 41 is made of rubber.

[0022] Furthermore, to facilitate the replacement of the removable block 4, in this embodiment, the inner side of the flip cover 2 is provided with a receiving opening, a patch is fixedly adhered to the inner side of the receiving opening, and a magnet is fixedly installed on the inner side of the removable block 4, so that the removable block 4 is attracted to the receiving opening by the magnet.

[0023] In this embodiment, the surface of the flexible pad 41 is provided with a cross groove 42, which serves to vent air and ensure that the flexible pad 41 will not attract the UDP and TF cards due to negative pressure when it squeezes the UDP and TF cards.

[0024] Furthermore, in this embodiment, the outer end of the buckle 5 is fixed with an integral lifting plate 51, which makes it convenient for the user to open the flip cover 2.

[0025] In this embodiment, the inner surface of the flip cover 2 has multiple clearance openings 21 at the periphery of the detachable block 4, which reduces the amount of material used, thereby reducing the weight of the flip cover 2 and reducing manufacturing costs.

[0026] The specific operating steps are as follows: When testing is required, the UDP or TF card can be placed in the card slot 3 at the position corresponding to the test pin 31, and then the flip cover 2 is fastened to the base 1. At this time, the flexible pad 41 can squeeze the UDP or TF, so that the gold point of the UDP or TF can stably contact the corresponding test pin 31. At this time, the UDP or TF can be tested through the test pin 31.

[0027] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, the patent owner may make various modifications or alterations within the scope of the appended claims, as long as they do not exceed the protection scope described in the claims of the present invention, they shall all be within the protection scope of the present invention.

Claims

1. A test socket for UDP and TF gold points, comprising a base, characterized in that: It also includes a flip cover and a detachable block. One end of the flip cover is movably hinged to one end of the upper part of the base, and the other end of the flip cover is fastened to the other end of the upper part of the base. The base is provided with a slot, and the bottom of the slot is provided with a test probe for testing UDP and TF gold points. The inner side of the flip cover is provided with a detachable block corresponding to the position of the slot. A flexible pad is fixed on the side of the detachable block near the position of the slot.

2. The test socket for UDP and TF gold points according to claim 1, characterized in that: The base has a notch at one end away from the hinge of the flip cover, and a protruding limiting plate is fixedly provided inside the notch. A buckle is fixedly installed at one end of the flip cover away from the hinge, and the flip cover is engaged with the protruding limiting plate by the buckle.

3. A test socket for UDP and TF gold points according to claim 1, characterized in that: The flexible pad is made of rubber.

4. A test socket for UDP and TF gold points according to claim 1, characterized in that: The inside of the flip cover has an opening for receiving, and the detachable block is attracted into the opening by a magnet.

5. A test socket for UDP and TF gold points according to claim 3, characterized in that: The surface of the flexible pad has a cross groove.

6. A test socket for UDP and TF gold points according to claim 2, characterized in that: The outer end of the buckle is fixed with an integral lifting plate.

7. A test socket for UDP and TF gold points according to claim 1, characterized in that: The inner surface of the flip cover has multiple openings around the detachable block.

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