Metallized film capacitor with CP wire anti-drop structure
By designing snap-fit and anti-detachment structures in metallized film capacitors, the problem of CP wire breakage during welding was solved, achieving a stable and reliable connection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ANHUI SAFE ELECTRONICS
- Filing Date
- 2025-04-29
- Publication Date
- 2026-04-24
AI Technical Summary
During the soldering process, the CP line of a metallized film capacitor is prone to breakage at the connection between the outer lead and the main body due to bending, posing a risk of breakage.
The design incorporates a snap-fit connector and an anti-detachment mechanism. The snap-fit connector, with its conical design, is secured in the through-hole of the PCB board, clamping the external pins. The anti-detachment mechanism prevents the snap-fit connector from falling off, ensuring a stable connection.
The soldering process avoids breakage at the connection between the external pins and the main body, improving the reliability and stability of the connection.
Smart Images

Figure CN224164158U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of capacitor technology, and in particular relates to a metallized thin film capacitor with a CP line anti-detachment structure. Background Technology
[0002] Metallized film capacitors are high-performance capacitors due to their many excellent characteristics. Their main characteristics are as follows: non-polarity, high insulation resistance, excellent frequency characteristics (wide frequency response), and very low dielectric loss. Based on these advantages, metallized film capacitors are widely used in analog circuits. Especially in signal coupling sections, capacitors with good frequency characteristics and extremely low dielectric loss must be used to ensure that signals are not significantly distorted during transmission. Film capacitors can be divided into two main categories: DC film capacitors and AC film capacitors. DC film capacitors are those that operate in circuits powered by DC power supplies, commonly used for suppressing electromagnetic interference (safety regulations), pulse filtering, DC-Link support, absorption, and energy storage. AC film capacitors are those that operate in circuits powered by AC power supplies, commonly used for motor starting and running, power factor compensation, filtering, and phase shifting.
[0003] A common type of metallized film capacitor is the pin capacitor, whose lead is the CP line (external lead). During installation, the CP line is first passed through the through-hole of the PCB board, and then soldered with the help of an external soldering device. During the soldering process, if the operator inadvertently bends the external lead, it is easy to cause the connection between the external lead and the main body to bend, which may cause the connection between the external lead and the main body to break.
[0004] Therefore, this utility model proposes a metallized thin-film capacitor with a CP line anti-detachment structure. Utility Model Content
[0005] This utility model addresses the problems in the prior art by proposing the following technical solution:
[0006] A metallized film capacitor with a CP line anti-detachment structure includes a capacitor, the capacitor including a body and an outer lead, a snap-fit component is movably sleeved around the outer lead, the snap-fit component is conical, the outer diameter of the tip of the conical shape is smaller than the inner diameter of the through hole of the PCB board, and the outer diameter of the bottom of the conical shape is larger than the inner diameter of the through hole of the PCB board.
[0007] An anti-detachment component is fixedly sleeved around the end of the outer pin away from the main body, and the anti-detachment component is used to prevent the snap-fit component from falling off the outer pin.
[0008] As a preferred embodiment of the above technical solution, the snap-fit component includes a connecting ring coaxially arranged with the outer pin, a partition cylinder being fixedly connected coaxially to one side of the connecting ring near the main body, and a plurality of circumferentially distributed clips being fixedly connected to the other side.
[0009] As a preferred embodiment of the above technical solution, a first gap is formed between the plurality of clamping pieces.
[0010] As a preferred embodiment of the above technical solution, the ends of the plurality of clamping pieces away from the connecting ring are machined into rounded corners.
[0011] As a preferred embodiment of the above technical solution, the anti-detachment component includes a fixing collar fixedly sleeved around the outer pin, and a plurality of circumferentially distributed anti-detachment pieces are fixedly connected to the side of the fixing collar near the snap-fit component.
[0012] As a preferred embodiment of the above technical solution, a second gap is formed between the plurality of anti-detachment sheets;
[0013] Both the fixed collar and the side of the second gap that are far apart from each other are machined into a rounded shape.
[0014] The beneficial effects of this utility model are as follows:
[0015] When using this practical capacitor, first pass the outer lead through the through hole of the PCB board, and then pass the conical tip of the clamping piece through the through hole of the PCB board. Since the outer diameter of the conical bottom is larger than the inner diameter of the through hole of the PCB board, the clamping piece is locked at the position of the through hole of the PCB board. Under the action of the squeezing force, the clamping piece clamps the outer lead tightly. In this way, even if the operator bends the end of the outer lead during the subsequent soldering process, it will not affect the connection between the main body and the outer lead, thus avoiding the potential problem of breakage at the connection. Attached Figure Description
[0016] Figure 1 The diagram shown is a schematic representation of the overall three-dimensional structure of the metallized thin-film capacitor with a CP line anti-detachment structure in the embodiment.
[0017] Figure 2 The diagram shown is a top-view perspective of the snap-fit component and the anti-detachment component in the metallized thin-film capacitor with the CP line anti-detachment structure in the embodiment.
[0018] Figure 3 The diagram shown is a bottom-view three-dimensional structural diagram of the snap-fit component and the anti-detachment component in the metallized thin-film capacitor with CP line anti-detachment structure in the embodiment.
[0019] In the diagram: 10. Capacitor; 11. Main body; 12. External lead; 20. Snap-fit component; 21. Clip; 22. Connecting ring; 23. Divider; 24. First gap; 30. Anti-detachment component; 31. Fixing collar; 32. Anti-detachment piece; 33. Second gap. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.
[0021] Example
[0022] like Figures 1-3 As shown, a metallized film capacitor with a CP line anti-detachment structure includes a capacitor 10. The capacitor 10 includes a body 11 and an outer lead 12. A snap-fit member 20 is movably sleeved around the outer lead 12. The snap-fit member 20 is conical in shape, and the outer diameter of the tip of the conical shape is smaller than the inner diameter of the through hole in the PCB board, while the outer diameter of the bottom of the conical shape is larger than the inner diameter of the through hole in the PCB board.
[0023] When using this practical capacitor, first pass the outer lead 12 through the through hole of the PCB board, and then pass the conical tip of the clamping piece 20 through the through hole of the PCB board. Since the outer diameter of the conical bottom is larger than the inner diameter of the through hole of the PCB board, the clamping piece 20 is clamped at the position of the through hole of the PCB board. Under the action of the squeezing force, the clamping piece 20 clamps the outer lead 12. In this way, even if the operator bends the end of the outer lead 12 during the subsequent soldering process, it will not affect the connection between the main body 11 and the outer lead 12, thereby avoiding the potential problem of breakage at the connection.
[0024] An anti-detachment component 30 is fixedly sleeved around the end of the outer pin 12 away from the main body 11, and the anti-detachment component 30 is used to prevent the snap-fit component 20 from falling off the outer pin 12.
[0025] In some high-power, high-vibration environments such as power modules and automotive electronics, when installing capacitor 10, a gap of 0.2 to 0.5 mm needs to be reserved between the main body 11 and the PCB board to promote air circulation and avoid heat accumulation that could lead to performance degradation or shortened lifespan.
[0026] The snap-fit component 20 includes a connecting ring 22 coaxially arranged with the outer pin 12. A partition cylinder 23 is coaxially fixedly connected to one side of the connecting ring 22 near the main body 11, and a plurality of circumferentially distributed clips 21 are fixedly connected to the other side.
[0027] The height of the partition cylinder 23 is the reserved gap of 0.2 to 0.5 mm. When installing the snap-fit part 20, the side of the partition cylinder 23 away from the connecting ring 22 abuts against the PCB board. It should be noted that the outer diameter of the partition cylinder 23 is larger than the inner diameter of the through hole of the PCB board.
[0028] A first gap 24 is formed between the multiple clips 21. When the inclined surface of the clips 21 is inserted into the through hole of the PCB board, under the action of the squeezing force, the multiple clips 21, together with the first gap 24, can clamp the external pin 12 in a claw-like shape.
[0029] The ends of the multiple clips 21 furthest from the connecting ring 22 are machined into rounded corners.
[0030] Since the end of the clip 21 furthest from the connecting ring 22 contacts the PCB board first, the rounded corner design can prevent the clip 21 from puncturing the PCB board.
[0031] The anti-detachment component 30 includes a fixing collar 31 fixedly sleeved around the outer pin 12. Multiple circumferentially distributed anti-detachment tabs 32 are fixedly connected to the side of the fixing collar 31 near the snap-fit component 20. A second gap 33 is formed between the multiple anti-detachment tabs 32.
[0032] In this embodiment, the anti-detachment piece 32 is designed in a trumpet shape facing the snap fastener 20, so as to catch the conical tip of the snap fastener 20 and prevent the snap fastener 20 from falling off the outer pin 12. It should also be noted that the outer diameter of the fixing collar 31 is smaller than the inner diameter of the PCB board through hole. When the outer pin 12 and the anti-detachment piece 30 pass through the PCB board through hole, the fixing collar 31 passes through the PCB board through hole first, and then the PCB board through hole squeezes the anti-detachment piece 32 so that the anti-detachment piece 32 is attached to the outer pin 12, so that the entire piece passes through the anti-detachment piece 30.
[0033] Both the retaining collar 31 and the second gap 33 are machined with rounded corners on the sides that are far apart from each other. Similarly, the rounded corner design can prevent damage to the PCB board.
[0034] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.
Claims
1. A metallized film capacitor with a CP line anti-derailment structure, comprising a capacitor (10), said capacitor (10) comprising a body (11) and external leads (12), characterized in that, The outer pin (12) is movably sleeved with a snap-fit component (20). The snap-fit component (20) is conical in shape, and the outer diameter of the tip of the conical shape is smaller than the inner diameter of the through hole in the PCB board, while the outer diameter of the bottom of the conical shape is larger than the inner diameter of the through hole in the PCB board. An anti-detachment component (30) is fixedly sleeved around the end of the outer pin (12) away from the main body (11), and the anti-detachment component (30) is used to prevent the snap-fit component (20) from falling off the outer pin (12).
2. The metallized film capacitor with CP wire anti-disconnection structure according to claim 1, characterized in that, The snap-fit component (20) includes a connecting ring (22) coaxially arranged with the outer pin (12). A partition cylinder (23) is coaxially fixedly connected to one side of the connecting ring (22) near the main body (11), and a plurality of circumferentially distributed clips (21) are fixedly connected to the other side.
3. The metallized film capacitor with CP wire anti-disconnection structure according to claim 2, characterized in that, A first gap (24) is formed between the plurality of said clips (21).
4. The metallized film capacitor with CP wire anti-disconnection structure according to claim 2, characterized in that, The ends of the multiple clips (21) away from the connecting ring (22) are machined into rounded corners.
5. The metallized film capacitor with CP wire anti-disconnection structure according to claim 1, characterized in that, The anti-detachment component (30) includes a fixing collar (31) fixedly sleeved around the outer pin (12), and a plurality of circumferentially distributed anti-detachment pieces (32) are fixedly connected to the side of the fixing collar (31) near the snap-fit component (20).
6. The metallized film capacitor with CP wire anti-disconnection structure according to claim 5, characterized in that, A second gap (33) is formed between the plurality of the anti-detachment tabs (32); The fixed collar (31) and the second gap (33) are both machined into rounded corners on the sides that are far apart from each other.