Etching device capable of increasing magnetofluid rotation

Abstract

The utility model discloses an etching device for increasing magnetofluid rotation, which comprises an etching cavity, a turntable assembly, a cover plate assembly, a cavity cover assembly and a handle, the turntable assembly used for containing products is rotatably arranged in the etching cavity, the cover plate assembly is arranged in the etching cavity above the turntable assembly, and the cavity cover assembly is arranged above the turntable assembly. A plurality of gas source connectors used for being externally connected with XeF2 gas are arranged above the side end of the etching cavity and located above the cover plate assembly, a plurality of vent holes are formed in the cover plate assembly in an array mode, an extraction opening used for being externally connected with tail gas treatment equipment is formed in the bottom of the etching cavity, and a cavity cover assembly capable of being opened and closed is installed at the top of the etching cavity. A handle convenient to open and close is installed at the side end of the cavity cover assembly. According to the mode, the film-coating gas is subjected to flow equalization, and a film-coating product is driven to rotate, so that the etching uniformity is improved, the sealing effect is good, the leakage of the film-coating gas is avoided, and the etching state can be observed in real time.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to an etching apparatus that increases the rotation of magnetohydrodynamic fluid. Background Technology

[0002] XeF2 (xenon difluoride) dry etching machines are specialized equipment that uses gaseous xenon difluoride as an etchant to selectively etch specific materials through a chemical reaction. It falls under the category of "chemical dry etching" or "vapor phase etching," and differs significantly from common plasma dry etching (RIE, ICP, etc.). XeF2 is solid at room temperature but has a high vapor pressure, easily sublimating into a gas. When gaseous XeF2 molecules come into contact with the target material (mainly silicon, Si), a spontaneous, exothermic chemical reaction occurs, introducing XeF2 gas into the chamber, where it adsorbs onto the silicon surface and reacts. Because the gas source is singular and fixed in location, ensuring uniform etching of the product surface is a critical issue that needs to be addressed. Furthermore, XeF2 is highly toxic, a strong oxidizing agent, and highly corrosive, requiring high equipment sealing.

[0003] Based on the above defects and shortcomings, it is necessary to improve the existing technology and design an etching device that increases the rotation of magnetohydrodynamic fluid. Utility Model Content

[0004] The main technical problem solved by this utility model is to provide an etching device that increases the rotation of magnetohydrodynamics. By uniformly distributing the coating gas and driving the coating product to rotate, the etching uniformity is improved, the sealing effect is good, the coating gas leakage is avoided, and the etching status can be observed in real time.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: providing an etching device that increases the rotation of magnetohydrodynamic fluid. This etching device includes an etching cavity, a turntable assembly, a cover plate assembly, a cavity cover assembly, and a handle. The turntable assembly for holding products is rotatably installed inside the etching cavity. The cover plate assembly is installed inside the etching cavity above the turntable assembly. Several gas source interfaces for external XeF2 gas are provided on the upper side of the etching cavity. The gas source interfaces are located above the cover plate assembly. Several ventilation holes are arrayed on the cover plate assembly. An exhaust port for external exhaust gas treatment equipment is opened at the bottom of the etching cavity. A cavity cover assembly that can be opened and closed is installed on the top of the etching cavity. A handle for easy opening and closing is installed on the side of the cavity cover assembly.

[0006] Preferably, the turntable assembly includes a motor, a rotating shaft, and a turntable. The motor is mounted below the etching cavity via a motor bracket, and the rotating shaft is rotatably mounted to the bottom of the etching cavity via a bearing seat. The rotating shaft extends into the etching cavity and a turntable is mounted on its top. The rotating motor drives the turntable to rotate via the rotating shaft.

[0007] Preferably, the cover plate assembly includes a cover plate, a cover plate handle, and a first sealing ring. An annular platform for placing the cover plate is provided inside the etching cavity. A vent hole is provided on the cover plate. Two cover plate handles are installed on the upper end of the cover plate to facilitate the removal and placement of the cover plate. An annular groove is provided on the outer ring of the cover plate. The first sealing ring is installed in the annular groove and is in close contact with the inner wall of the etching cavity.

[0008] Preferably, the cover plate and cover plate handle are made of Teflon material.

[0009] Preferably, the cavity cover assembly includes a cavity cover, a cavity cover bracket, hinges, hinge fasteners, an automatic locking rotating strut, a bracket fixing seat, and a second sealing ring. The top of the etching cavity is provided with a cavity cover, which is installed on the cavity cover bracket. The cavity cover bracket is rotatably installed on the hinge fastener via two hinges. The hinge fastener is fixed to the mounting platform. The cavity cover brackets on both sides of the cavity cover are rotatably connected to the bracket fixing seat below via the automatic locking rotating struts. The bracket fixing seat is fixed to the mounting platform. Lifting the handle opens the cavity cover along the hinges, and pressing down the handle closes the cavity cover along the automatic locking rotating struts. The top surface of the etching cavity has an annular groove, and the second sealing ring is installed in the annular groove. When the cavity cover is closed, the second sealing ring fits tightly with the cavity cover.

[0010] Preferably, the cavity cover assembly is provided with a visible cavity cover, the top of the cavity cover is provided with an observation port, the observation port is provided above the observation port, the observation window is made of transparent material, the observation window is provided with pressure plates around the observation window, the pressure plates are attached to the cavity cover by screws, the top of the cavity cover is provided with an annular groove, the annular groove is provided with a third sealing ring, and the third sealing ring is tightly fitted with the observation window.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] The XeF2 gas introduced into the etching chamber can enter the coating chamber below relatively evenly under the action of several vent holes, which plays the role of uniform flow.

[0013] During the etching and coating process, the product rotates with the turntable, which improves the etching uniformity.

[0014] A sealing ring is provided at the connection between the cover plate assembly and the cavity cover assembly and the etching cavity, which has a good sealing effect and prevents the leakage of coating gas;

[0015] The cavity cover assembly is equipped with a visible cavity cover, which allows for real-time observation of the etching status. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of an etching apparatus that increases magnetohydrodynamic rotation.

[0017] Figure 2A side view of an etching apparatus that increases magnetohydrodynamic rotation.

[0018] Figure 3 A partial cross-sectional view of an etching apparatus that increases magnetohydrodynamic rotation.

[0019] Among them, 1. Etching cavity, 10. Annular platform, 11. Air source interface, 12. Air extraction port, 2. Turntable assembly, 21. Motor, 22. Rotating shaft, 23. Turntable, 3. Cover plate assembly, 30. Vent hole, 31. Cover plate, 32. Cover plate handle, 33. First sealing ring, 4. Cavity cover assembly, 41. Cavity cover, 42. Cavity cover bracket, 43. Hinge, 44. Hinge fixing piece, 45. Automatic locking type rotating support rod, 46. Bracket fixing seat, 47. Second sealing ring, 48. Observation window, 49. Pressure plate, 410. Third sealing ring, 5. Handle. Detailed Implementation

[0020] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0021] Please see Figures 1 to 3 The embodiments of this utility model include:

[0022] An etching apparatus for increasing magnetohydrodynamic rotation includes an etching cavity 1, a turntable assembly 2, a cover plate assembly 3, a cavity cover assembly 4, and a handle 5.

[0023] The etching chamber 1 is equipped with a turntable assembly 2 for holding products. The products rotate with the turntable, improving the etching uniformity. A cover plate assembly 3 is installed in the etching chamber 1 above the turntable assembly 2. Several gas source interfaces 11 for external XeF2 gas are provided on the upper side of the etching chamber 1. The gas source interfaces 11 are located above the cover plate assembly 3. Several ventilation holes 30 are arranged in an array on the cover plate assembly 3. The XeF2 gas introduced into the etching chamber 1 can enter the coating chamber below relatively evenly under the action of several ventilation holes 30, which plays a role in equalizing the flow. The bottom of the etching chamber 1 is provided with an exhaust port 12 for external exhaust gas treatment equipment. The top of the etching chamber 1 is equipped with a closable chamber cover assembly 4. A handle 5 for easy opening and closing is installed on the side of the chamber cover assembly 4.

[0024] The turntable assembly 2 includes a motor 21, a rotating shaft 22, and a turntable 23. The motor 21 is mounted below the etching cavity 1 via a motor bracket. The rotating shaft 22 is rotatably mounted to the bottom of the etching cavity 1 via a bearing seat. The rotating shaft 22 extends into the etching cavity 1 and the turntable 23 is mounted on its top. The rotating motor 21 drives the turntable 23 to rotate via the rotating shaft 22. During the etching and coating process, the turntable 23 rotates, resulting in uniform etching.

[0025] The cover plate assembly 3 includes a cover plate 31, a cover plate handle 32, and a first sealing ring 33. An annular platform 10 for placing the cover plate 31 is provided inside the etching cavity 1. A vent 30 is provided on the cover plate 31. Two cover plate handles 32 are installed on the upper end of the cover plate 31 to facilitate the removal and placement of the cover plate. The cover plate 31 and the cover plate handles 32 are made of Teflon material. An annular groove is provided on the outer ring of the cover plate 31. The first sealing ring 33 is installed in the annular groove. The first sealing ring 33 is in close contact with the inner wall of the etching cavity 1 to achieve a sealing effect.

[0026] The cavity cover assembly 4 includes a cavity cover 41, a cavity cover bracket 42, a hinge 43, a hinge fixing member 44, an automatic locking type rotating support rod 45, a bracket fixing seat 46, and a second sealing ring 47. The top of the etching cavity 1 is provided with a cavity cover 41. The cavity cover 41 is installed on the cavity cover bracket 42. The cavity cover bracket 42 is rotatably installed on the hinge fixing member 44 through two hinges 43. The hinge fixing member 44 is fixed to the mounting table. The cavity cover brackets 42 on both sides of the cavity cover 41 are rotatably connected to the bracket fixing seat 46 below through the automatic locking type rotating support rod 45. The bracket fixing seat 46 is fixed to the mounting table. Lifting the handle 5 will open the cavity cover 41 along the hinge 43. Pressing down the handle 5 will close the cavity cover 41 along the automatic locking type rotating support rod 45. The top surface of the etching cavity 1 has an annular groove, and the second sealing ring 47 is installed in the annular groove. When the cavity cover 41 is closed, the second sealing ring 47 fits tightly with the cavity cover 41.

[0027] The cavity cover assembly 4 is provided with a visible cavity cover. The top of the cavity cover 41 has an observation port, and an observation window 48 is provided above the observation port. The observation window 48 is made of transparent material. Pressure plates 49 are provided around the observation window 48. The pressure plates 49 are attached to the cavity cover 41 by screws. The top of the cavity cover 41 has an annular groove, and a third sealing ring 410 is installed in the annular groove. The third sealing ring 410 is tightly fitted with the observation window 48.

[0028] This invention relates to an etching device that increases the rotation of magnetohydrodynamic fluid. By uniformly distributing the coating gas and driving the coating product to rotate, it improves the etching uniformity, provides a good sealing effect, avoids coating gas leakage, and allows for real-time observation of the etching status.

[0029] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An etching apparatus for increasing magnetohydrodynamic rotation, characterized in that: The device includes an etching chamber, a turntable assembly, a cover plate assembly, a chamber cover assembly, and a handle. The turntable assembly for holding products is rotatably installed inside the etching chamber. The cover plate assembly is installed inside the etching chamber above the turntable assembly. Several gas source interfaces for external XeF2 gas are provided on the upper side of the etching chamber. The gas source interfaces are located above the cover plate assembly. Several vent holes are arrayed on the cover plate assembly. An exhaust port for external exhaust gas treatment equipment is opened at the bottom of the etching chamber. The chamber cover assembly, which can be opened and closed, is installed on the top of the etching chamber. A handle for easy opening and closing is installed on the side of the chamber cover assembly.

2. The etching apparatus for increasing magnetohydrodynamic rotation according to claim 1, characterized in that: The turntable assembly includes a motor, a rotating shaft, and a turntable. The motor is mounted below the etching cavity via a motor bracket. The rotating shaft is rotatably mounted to the bottom of the etching cavity via a bearing seat. The rotating shaft extends into the etching cavity and a turntable is mounted on its top. The rotating motor drives the turntable to rotate via the rotating shaft.

3. The etching apparatus for increasing magnetohydrodynamic rotation according to claim 1, characterized in that: The cover plate assembly includes a cover plate, a cover plate handle, and a first sealing ring. An annular platform for placing the cover plate is provided inside the etching cavity. A vent is provided on the cover plate. Two cover plate handles are installed on the upper end of the cover plate to facilitate the removal and placement of the cover plate. An annular groove is provided on the outer ring of the cover plate. The first sealing ring is installed in the annular groove and is in close contact with the inner wall of the etching cavity.

4. The etching apparatus for increasing magnetohydrodynamic rotation according to claim 3, characterized in that: The cover plate and cover plate handle are made of Teflon material.

5. The etching apparatus for increasing magnetohydrodynamic rotation according to claim 1, characterized in that: The cavity cover assembly includes a cavity cover, a cavity cover bracket, hinges, hinge fasteners, an automatic locking rotating strut, a bracket fixing seat, and a second sealing ring. The cavity cover is provided on the top of the etching cavity. The cavity cover is installed on the cavity cover bracket. The cavity cover bracket is rotatably installed on the hinge fastener via two hinges. The hinge fastener is fixed to the mounting platform. The cavity cover brackets on both sides of the cavity cover are rotatably connected to the bracket fixing seat below via the automatic locking rotating strut. The bracket fixing seat is fixed to the mounting platform. Lifting the handle opens the cavity cover along the hinges, and pressing down the handle closes the cavity cover along the automatic locking rotating strut. An annular groove is provided on the top surface of the etching cavity. The second sealing ring is installed in the annular groove. When the cavity cover is closed, the second sealing ring fits tightly with the cavity cover.

6. The etching apparatus for increasing magnetohydrodynamic rotation according to claim 5, characterized in that: The cavity cover assembly is equipped with a visible cavity cover. The top of the cavity cover has an observation port, and above the observation port is an observation window made of transparent material. The observation window is surrounded by pressure plates, which are attached to the cavity cover by screws. The top of the cavity cover has an annular groove, and a third sealing ring is installed in the annular groove. The third sealing ring fits tightly with the observation window.

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