Modularized intelligent Internet of Things gateway

Abstract

The utility model discloses a modularized intelligent Internet of Things gateway, and relates to the technical field of gateways. The intelligent Internet of Things gateway device comprises a shell and an intelligent Internet of Things gateway module, the intelligent Internet of Things gateway module is fixedly installed inside the shell through screws, a top cover is fixedly installed on the top surface of the shell, a bottom cover is fixedly installed on the bottom surface of the shell, and a heat dissipation assembly is arranged on the bottom cover. The heat dissipation module is used for cooling the intelligent Internet of Things gateway module through air flow in the shell. According to the utility model, the intelligent Internet of Things gateway module is fixedly installed in the housing through screws, the housing plays a role in overall supporting and protection, the bottom cover and the top cover are fixedly installed on the bottom surface and the top surface of the housing, and the heat dissipation assembly is arranged on the bottom cover and is used for promoting air flow in the housing. The intelligent Internet of Things gateway module is cooled, the module is ensured to operate at a stable working temperature, the reliability of equipment is improved, and the service life of the equipment is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of gateway technology, specifically to a modular smart Internet of Things gateway. Background Technology

[0002] With the rapid development of IoT technology, IoT gateways play a crucial role in device interconnection and data transmission. An IoT gateway is essentially the "traffic hub" of an IoT system, responsible for collecting data generated by front-end sensors and terminal devices, transmitting it to cloud servers or back-end management systems, and simultaneously relaying instructions from the cloud to the terminal devices.

[0003] Existing IoT gateways generally have poor heat dissipation and protection performance. Gateways generate heat during operation, and if heat dissipation is not timely, the temperature of internal components will rise, affecting the stability and lifespan of the device. At the same time, gateways are usually deployed in various complex environments and are susceptible to factors such as dust, moisture, and vibration. The lack of effective protection measures will reduce the reliability and durability of the device.

[0004] To address this, a modular intelligent IoT gateway is proposed. Utility Model Content

[0005] The purpose of this utility model is to provide a modular intelligent Internet of Things gateway in order to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0007] A modular smart IoT gateway includes a housing and a smart IoT gateway module. The smart IoT gateway module is fixedly installed inside the housing by screws. A top cover is fixedly installed on the top surface of the housing, and a bottom cover is fixedly installed on the bottom surface of the housing. A heat dissipation component is provided on the bottom cover for dissipating heat from the smart IoT gateway module by airflow inside the housing.

[0008] Furthermore, the outer shell has heat dissipation holes equidistantly opened on both sides of the outer shell, and several sets of insertion interfaces are opened on the rear side wall of the heat dissipation holes. At least four sets of stepped support seats are fixedly installed on the inner bottom of the heat dissipation holes, and internal threaded connecting columns are fixedly installed on the inner bottom of the outer shell. Bolts are inserted into the top of the top cover and the internal threaded connecting columns to fix them.

[0009] Furthermore, the intelligent IoT gateway module includes a motherboard that is bolted to the top surface of the stepped support base. The top surface of the motherboard is provided with a core module. The sub-board of the motherboard is provided with several sets of network port modules and a set of power supply modules. The network port modules and power supply modules are arranged in a corresponding manner with the plug-in interface on the rear side wall of the housing.

[0010] Furthermore, a buffer ring is provided between the outer shell and the bottom cover, and the buffer ring is made of elastic foam / rubber material, and bolts are inserted into the bottom end of the bottom cover and the internal threaded connecting post to fix them.

[0011] Furthermore, the heat dissipation assembly includes an air intake channel fixedly mounted on the bottom cover. A motor mounting bracket is fixedly installed on the inner wall of the air intake channel. A motor is fixedly inserted into the inside of the motor mounting bracket, and a fan blade is fixedly connected to the output end of the motor. Metal mesh plates are fixedly installed on the inner wall of the air intake channel on the upper and lower sides of the motor and the fan blade, respectively.

[0012] Furthermore, two sets of parallel support legs are fixedly installed on the bottom surface of the bottom cover, so that when the support legs are placed on the gateway, the bottom surface of the bottom cover is suspended above the table.

[0013] The beneficial effects of this utility model are as follows:

[0014] The smart IoT gateway module is fixed inside the housing with screws. The housing provides overall support and protection. It is fixed to the bottom and top surfaces of the housing with a bottom cover and a top cover. The bottom cover is equipped with a heat dissipation component to promote airflow inside the housing, dissipate heat from the smart IoT gateway module, ensure that the module operates at a stable operating temperature, and improve the reliability and service life of the device. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a rear view of the present invention;

[0017] Figure 3 This is an exploded view of this utility model;

[0018] Figure 4 This is a partial exploded view of this utility model;

[0019] Figure 5 This is a side sectional view of the present invention;

[0020] Reference numerals: 1. Outer shell; 101. Heat dissipation hole; 102. Plug interface; 103. Stepped support base; 104. Internal threaded connecting post; 2. Smart IoT gateway module; 201. Main board; 202. Core module; 203. Network port module; 204. Power supply module; 3. Top cover; 4. Buffer ring; 5. Bottom cover; 51. Support leg; 6. Heat dissipation component; 601. Air inlet channel; 602. Motor mounting bracket; 603. Motor; 604. Fan blade; 605. Metal mesh plate. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0023] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] In the description of the embodiments of this utility model, it should be noted that the terms "inner", "outer", "upper", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] like Figures 1 to 5 As shown, a modular smart IoT gateway includes a housing 1 and a smart IoT gateway module 2, which is fixedly installed inside the housing 1 by screws; as Figure 3 , Figure 4 and Figure 5 As shown, specifically, heat dissipation holes 101 are equidistantly provided on both sides of the outer shell 1, and several sets of insertion interfaces 102 are provided on the rear side wall of the heat dissipation holes 101. At least four sets of stepped support seats 103 are fixedly installed on the inner bottom of the heat dissipation holes 101, and internal threaded connecting columns 104 are fixedly installed on the inner bottom of the outer shell 1. Bolts are inserted into the top of the top cover 3 and the internal threaded connecting columns 104 to fix them.

[0026] More specifically, the rear side wall of the outer casing 1 is provided with several sets of plug-in interfaces 102 for electrical connection with other devices or modules. The stepped support 103 on the bottom inner side of the outer casing 1 is used to support and position the smart IoT gateway module 2. The top cover 3 is fixed to the inner casing 3 by bolts through the internal threaded connecting column 104, ensuring a tight connection between the top cover 3 and the outer casing 1, facilitating disassembly and installation, so as to maintain and upgrade the internal module.

[0027] like Figure 3 and Figure 4 As shown, specifically, the smart IoT gateway module 2 includes a motherboard 201 that is bolted to the top surface of the stepped support 103. The top surface of the motherboard 201 is provided with a core module 202. The sub-board of the motherboard 201 is provided with several sets of network port modules 203 and a set of power supply modules 204. The network port modules 203 and the power supply modules 204 are correspondingly arranged with the plug interface 102 on the rear side wall of the outer casing 1.

[0028] More specifically, the top surface of the motherboard 201 is equipped with a core module 202, which is responsible for core functions such as data processing and protocol conversion. The network port module 203 is used for wired connection with other network devices. The power supply module 204 provides power support for the entire gateway module. The network port module 203 and the power supply module 204 are correspondingly set with the plug interface 102 on the rear side wall of the casing 1 to ensure that the electrical connection between the module and the casing 1 is stable and reliable, and to realize the data transmission and power supply functions.

[0029] A top cover 3 is fixedly installed on the top surface of the outer casing 1, and a bottom cover 5 is fixedly installed on the bottom surface of the outer casing 1; for example Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, specifically, a buffer ring 4 is provided between the outer shell 1 and the bottom cover 5, and the buffer ring 4 is made of elastic foam / rubber material, and bolts are inserted into the bottom end of the bottom cover 5 and the internal threaded connecting post 104 to fix them.

[0030] More specifically, the buffer ring 4 is made of elastic foam or rubber material, which has good sealing performance and can effectively prevent dust, moisture and other external substances from entering the interior of the outer shell 1, thereby improving the protection level of the equipment. At the same time, the buffer ring 4 can also play a certain role in shock absorption, enhancing the stability of the equipment during use.

[0031] like Figure 1 and Figure 2 As shown, in some practical applications, two sets of parallel support legs 51 are fixedly installed on the bottom surface of the bottom cover 5. When the support legs 51 are placed on the gateway, the bottom surface of the bottom cover 5 is suspended from the table.

[0032] More specifically, when the modular smart IoT gateway is placed on a desktop or other flat surface, the support leg 51 raises the bottom of the bottom cover 5 above the desktop, which can elevate the device, prevent the bottom from directly contacting the desktop and affecting heat dissipation, avoid damage to the device due to moisture on the desktop, and increase the stability of the device placement, preventing the device from shifting or tipping over due to accidental collisions during use.

[0033] A heat dissipation component 6 is provided on the bottom cover 5 to dissipate heat from the airflow inside the outer casing 1 to the smart IoT gateway module 2; for example Figure 3 and Figure 5 As shown, specifically, the heat dissipation assembly 6 includes an air inlet channel 601 fixedly mounted on the bottom cover 5. A motor mounting bracket 602 is fixedly installed on the inner wall of the air inlet channel 601. A motor 603 is fixedly inserted into the inside of the motor mounting bracket 602, and a fan blade 604 is fixedly connected to the output end of the motor 603. Metal mesh plates 605 are fixedly installed on the inner wall of the air inlet channel 601 on the upper and lower sides of the motor 603 and the fan blade 604, respectively.

[0034] More specifically, the output of the motor 603 drives the fan blades 604 to rotate, generating airflow inside the housing 1 to remove the heat generated by the smart IoT gateway module 2, thus achieving heat dissipation and ensuring stable operation of the device. The metal mesh plate 605 serves as a filter and protector, preventing foreign objects from entering the interior of the housing 1.

[0035] In summary: The smart IoT gateway module 2 is fixedly installed inside the housing 1 with screws. The housing 1 provides overall support and protection. It is fixedly installed on the bottom and top surfaces of the housing 1 by the bottom cover 5 and the top cover 3. The bottom cover 5 is equipped with a heat dissipation component 6 to promote airflow inside the housing 1, dissipate heat from the smart IoT gateway module 2, ensure that the module operates at a stable operating temperature, and improve the reliability and service life of the device.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A modular intelligent IoT gateway, characterized in that, The device includes a housing (1) and a smart IoT gateway module (2). The smart IoT gateway module (2) is fixedly installed inside the housing (1) by screws. A top cover (3) is fixedly installed on the top surface of the housing (1), and a bottom cover (5) is fixedly installed on the bottom surface of the housing (1). A heat dissipation component (6) is provided on the bottom cover (5) to dissipate heat from the smart IoT gateway module (2) by airflow inside the housing (1).

2. The modular intelligent IoT gateway according to claim 1, characterized in that, The outer shell (1) has heat dissipation holes (101) equidistantly opened on both sides of the outer shell (1). The rear side wall of the heat dissipation holes (101) has several sets of insertion interfaces (102). At least four sets of stepped bearing seats (103) are fixedly installed on the inner bottom of the heat dissipation holes (101). The inner bottom of the outer shell (1) is fixedly installed with an internal threaded connecting column (104). The top cover (3) and the top of the internal threaded connecting column (104) are fixed with bolts.

3. A modular intelligent IoT gateway according to claim 2, characterized in that, The intelligent IoT gateway module (2) includes a motherboard (201) that is bolted to the top surface of the stepped support (103). The top surface of the motherboard (201) is provided with a core module (202). The sub-board of the motherboard (201) is provided with several sets of network port modules (203) and a set of power supply modules (204). The network port modules (203) and power supply modules (204) are correspondingly arranged with the plug interface (102) on the rear side wall of the outer shell (1).

4. A modular intelligent IoT gateway according to claim 2, characterized in that, A buffer ring (4) is provided between the outer shell (1) and the bottom cover (5), and the buffer ring (4) is made of elastic foam / rubber material. Bolts are inserted into the bottom end of the bottom cover (5) and the internal threaded connecting post (104) to fix them.

5. A modular intelligent IoT gateway according to claim 1, characterized in that, The heat dissipation assembly (6) includes an air inlet channel (601) fixedly mounted on the bottom cover (5). A motor mounting bracket (602) is fixedly installed on the inner wall of the air inlet channel (601). A motor (603) is fixedly inserted into the inside of the motor mounting bracket (602), and a fan blade (604) is fixedly connected to the output end of the motor (603). Metal mesh plates (605) are fixedly installed on the inner wall of the air inlet channel (601) and on the upper and lower sides of the motor (603) and the fan blade (604).

6. A modular intelligent IoT gateway according to claim 1, characterized in that, The bottom surface of the bottom cover (5) is fixedly equipped with two sets of parallel support legs (51). When the support legs (51) are placed on the gateway, the bottom surface of the bottom cover (5) and the table are suspended.

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