Graphene heating pad capable of being used for automotive trim

Abstract

The utility model relates to the technical field of graphene, and provides a graphene heating pad for automotive trim, which comprises a packaging plate, a heating circuit board is arranged in the middle of the packaging plate, a graphene plate is arranged on one side, far away from the heating circuit board, of the packaging plate, and the packaging plate comprises a first packaging plate and a second packaging plate. The heating circuit board is located between the first packaging plate and the second packaging plate, and a net-shaped plate is arranged between the heating circuit board and the second packaging plate; gaps in the heating circuit board are effectively filled through the net-shaped plate, so that the heat distribution efficiency can be improved by reducing the gaps of the heating circuit board, namely, the heat flowing in the gaps of the heating circuit board is reduced, and the heat distribution is more uniform; on the other hand, the step effect caused by the gaps is relieved, that is, the gaps of the heating circuit board are filled with the net-shaped plate, and the gaps of the heating circuit board are reduced, so that the overall appearance of the heating pad is smoother as a whole, and the attractiveness of the product is improved.

Description

Technical Field

[0001] This invention relates to the field of graphene technology, and more specifically, to a graphene heating pad that can be used in automotive interiors. Background Technology

[0002] Graphene has excellent thermal conductivity (approximately 5300 W / m·K), making it one of the fastest thermally conductive materials known. Its unique two-dimensional structure enables efficient and uniform heating, and it features low-voltage drive, fast response (millisecond-level heating), and high-temperature stability (withstanding temperatures above 3000℃). It can be applied in flexible electric heating films, smart thermal clothing, de-icing systems, high-efficiency heat dissipation devices, automotive thermal management, and other fields, with significant energy-saving effects, making it an ideal material for next-generation heating technologies.

[0003] The automotive graphene heating pad fully utilizes the superior performance of graphene, achieving rapid heating in just 3 seconds at a low voltage of 12V. It provides uniform heating and effectively solves the problems of high power consumption, slow response, and easy aging of traditional metal heating wires. At the same time, it has excellent bending resistance and waterproof properties, greatly improving driving safety and the driving experience in winter.

[0004] In practical applications, the surface of graphene heating pads has a certain stepped structure. This characteristic has little impact on the arrangement of car seats (backrests and cushions). However, when applied to interior parts, the flatness requirements of interior surfaces are more stringent. This requires special optimization of the flatness performance of the heating pad based on the original design to ensure that the heating pad can perfectly fit various interior surfaces while maintaining the excellent heating performance of graphene.

[0005] Therefore, a graphene heating pad for automotive interiors is proposed to address existing problems. Utility Model Content

[0006] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a graphene heating pad that can be used in automotive interiors.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a graphene heating pad that can be used in automotive interiors, comprising an encapsulation plate, a heating circuit board disposed in the middle of the encapsulation plate, and a graphene plate disposed on the side of the encapsulation plate away from the heating circuit board. The encapsulation plate is used to protect the graphene plate and the heating circuit board, and the graphene plate and the heating circuit board are used to heat the automotive interior.

[0008] The present invention is further configured such that: the encapsulation plate includes a first encapsulation plate and a second encapsulation plate, and the heating circuit board is located between the first encapsulation plate and the second encapsulation plate.

[0009] The present invention is further configured such that: the thickness of the first packaging plate is the same as the thickness of the second packaging plate, the thickness of the graphene plate is the same as the thickness of the heating circuit board, and the thickness of both the first packaging plate and the second packaging plate is greater than the thickness of the graphene plate and the heating circuit board.

[0010] The present invention is further configured such that: the shape of the graphene plate is consistent with the shape of the heating circuit board, the shape of the first encapsulation plate is consistent with the shape of the second encapsulation plate, and the shapes of the first encapsulation plate and the second encapsulation plate are both adapted to the shapes of the graphene plate and the heating circuit board.

[0011] The present invention is further configured such that: the heating circuit board is sheet-shaped and arranged around the second encapsulation board, and the heating circuit board is provided with partitions.

[0012] The present invention is further configured such that a mesh plate is provided between the heating circuit board and the second packaging plate, the mesh plate being used to fill the gaps in the heating circuit board.

[0013] The present invention is further configured such that the mesh plate is configured as a woven mesh layer structure.

[0014] In summary, this application includes at least one of the following beneficial technical effects:

[0015] By effectively filling the gaps in the heating circuit board with a mesh plate, the reduction of the gaps in the heating circuit board can improve the heat distribution efficiency, that is, reduce the flow of heat in the gaps of the heating circuit board and make the heat distribution more uniform. On the other hand, it can alleviate the step effect caused by the gaps. Since the mesh plate fills the gaps in the heating circuit board, the gaps in the heating circuit board are reduced, which makes the overall appearance of the heating pad flatter and improves the aesthetics of the product. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the graphene heating pad of this utility model that can be used in automotive interiors;

[0017] Figure 2 This is a schematic diagram of the overall structure of the heating circuit board and the mesh plate in this utility model;

[0018] Figure 3 This is a filled-in diagram of the heating circuit board and mesh plate in this utility model;

[0019] Explanation of reference numerals in the attached diagram: 1. Encapsulation board; 11. First encapsulation board; 12. Second encapsulation board; 2. Graphene board; 3. Heating circuit board; 4. Mesh board. Detailed Implementation

[0020] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0022] Please see Figures 1-3 The present invention provides the following technical solution:

[0023] Example 1, see Figures 1-3 A graphene heating pad for use in automotive interiors includes an encapsulation plate 1, a heating circuit board 3 located in the middle of the encapsulation plate 1, and a graphene plate 2 located on the side of the encapsulation plate 1 away from the heating circuit board 3. The encapsulation plate 1 is used to protect the graphene plate 2 and the heating circuit board 3, and the graphene plate 2 and the heating circuit board 3 are used to heat the automotive interior.

[0024] See Figures 1-3 Furthermore, the encapsulation board 1 includes a first encapsulation board 11 and a second encapsulation board 12, and the heating circuit board 3 is located between the first encapsulation board 11 and the second encapsulation board 12.

[0025] The first encapsulation plate 11 and the second encapsulation plate 12 are located on both sides of the heating circuit board 3. The first encapsulation plate 11 and the second encapsulation plate 12 can bear the weight of the heating circuit board 3, reduce the load on the heating circuit board 3 itself, enable it to withstand greater pressure and external force, prevent deformation, bending or breakage due to gravity or external load, and reduce damage to the heating circuit board 3 from the outside world. At the same time, the heating circuit board 3 can also cooperate with the graphene plate 2 to realize the heating function, thereby providing warmth to the human body.

[0026] See Figures 1-3 Furthermore, the thickness of the first encapsulation plate 11 is the same as the thickness of the second encapsulation plate 12, the thickness of the graphene plate 2 is the same as the thickness of the heating circuit board 3, and the thickness of the first encapsulation plate 11 and the second encapsulation plate 12 is greater than the thickness of the graphene plate 2 and the heating circuit board 3.

[0027] See Figures 1-3 Furthermore, the shape of the graphene plate 2 is consistent with the shape of the heating circuit board 3, the shape of the first encapsulation plate 11 is consistent with the shape of the second encapsulation plate 12, and the shapes of the first encapsulation plate 11 and the second encapsulation plate 12 are both adapted to the shapes of the graphene plate 2 and the heating circuit board 3.

[0028] The first encapsulation board 11 and the second encapsulation board 12 are identical in shape to the internal heating circuit board 3. This ingenious design allows the components to be seamlessly connected during assembly, greatly simplifying the installation process. It not only reduces the difficulty of assembly but also reduces the error caused by shape mismatch and the time spent on repeated adjustments, thereby significantly improving the overall assembly efficiency.

[0029] See Figures 1-3 Furthermore, the heating circuit board 3 is sheet-shaped and arranged around the second encapsulation plate 12, and the heating circuit board 3 is provided with partitions.

[0030] Among them, the heating circuit board 3 adopts a sheet structure, which provides a large area in a limited space and improves the heat distribution efficiency. In addition, since the heating circuit board 3 is set as a sheet structure, the circuit components on the heating circuit board 3 are small in size and lightweight, making it easy to integrate into the packaging board 1, saving the space of the packaging board 1. At the same time, it also enhances the reliability of the circuit and has stronger durability and higher fault tolerance.

[0031] The arrangement design of the heating circuit board 3 ensures uniform heat distribution and effectively avoids local overheating or insufficient heating.

[0032] See Figures 1-3 Furthermore, a mesh plate 4 is provided between the heating circuit board 3 and the second encapsulation plate 12, and the mesh plate 4 is used to fill the gaps in the heating circuit board 3.

[0033] Among them, the mesh plate 4 can effectively fill the gaps in the heating circuit board 3. The reduction of the gaps in the heating circuit board 3 can improve the heat distribution efficiency, that is, reduce the heat flow in the gaps in the heating circuit board 3 and make the heat distribution more uniform. On the other hand, it can alleviate the step effect caused by the gaps. That is, since the mesh plate 4 fills the gaps in the heating circuit board 3, the gaps in the heating circuit board 3 are reduced, which makes the overall appearance of the heating pad flatter and improves the aesthetics of the product.

[0034] See Figures 1-3 Furthermore, the mesh plate 4 is configured as a woven mesh layer structure.

[0035] The woven mesh structure can adapt to gaps of different shapes, meaning it can fill various gaps in the heating circuit board 3 with a high degree of gap filling. This filling of the gaps in the heating circuit board 3 results in a more uniform heat distribution and a smoother appearance. The design also makes the structure more flexible, adaptable to different shapes and bending requirements.

[0036] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

Claims

1. A graphene heating pad that can be used in automotive interiors, characterized in that: include, A packaging plate (1) is provided with a heating circuit board (3) in the middle of the packaging plate (1). A graphene plate (2) is provided on the side of the packaging plate (1) away from the heating circuit board (3). The packaging plate (1) is used to protect the graphene plate (2) and the heating circuit board (3). The graphene plate (2) and the heating circuit board (3) are used to heat the interior of the car. A mesh plate (4) is provided between the heating circuit board (3) and the second packaging plate (12), and the mesh plate (4) is used to fill the gaps in the heating circuit board (3).

2. The graphene heating pad for automotive interiors according to claim 1, characterized in that: The encapsulation board (1) includes a first encapsulation board (11) and a second encapsulation board (12), and the heating circuit board (3) is located between the first encapsulation board (11) and the second encapsulation board (12).

3. The graphene heating pad for automotive interiors according to claim 2, characterized in that: The thickness of the first encapsulation plate (11) is the same as the thickness of the second encapsulation plate (12), the thickness of the graphene plate (2) is the same as the thickness of the heating circuit board (3), and the thickness of the first encapsulation plate (11) and the second encapsulation plate (12) is greater than the thickness of the graphene plate (2) and the heating circuit board (3).

4. The graphene heating pad for automotive interiors according to claim 3, characterized in that: The graphene plate (2) has the same shape as the heating circuit board (3), the first encapsulation plate (11) has the same shape as the second encapsulation plate (12), and the shapes of the first encapsulation plate (11) and the second encapsulation plate (12) are both adapted to the shapes of the graphene plate (2) and the heating circuit board (3).

5. The graphene heating pad for automotive interiors according to claim 4, characterized in that: The heating circuit board (3) is sheet-shaped and arranged around the second encapsulation board (12), and the heating circuit board (3) is provided with partitions.

6. The graphene heating pad for automotive interiors according to claim 5, characterized in that: The mesh plate (4) is configured as a woven mesh layer structure.

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