Double-sided heat dissipation type circuit board
By setting heat dissipation components on both the front and back of the circuit board, the problem of inefficient heat dissipation of traditional circuit boards is solved, enabling direct and effective heat dissipation of the chip module, protecting the chip module from damage, and improving the heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHAFA FRIEDRICH SCHAFFEN CO LTD
- Filing Date
- 2025-04-30
- Publication Date
- 2026-04-24
AI Technical Summary
Traditional circuit boards can only have heat sinks on the back, which cannot directly and efficiently dissipate heat from electronic components.
The chip module is embedded in the circuit board, and heat dissipation components are set on both the front and back of the circuit board. The insulating and thermally conductive layer is used to achieve insulation protection and heat conduction, and the heat dissipation components achieve efficient heat dissipation.
This enables direct and efficient heat dissipation from both the front and back of the circuit board, protecting the chip module from thermal damage and improving the overall heat dissipation effect.
Smart Images
Figure CN224164930U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and more specifically, to a double-sided heat dissipation circuit board. Background Technology
[0002] Circuit boards generate a lot of heat during operation and require heat dissipation. In traditional circuit boards, electronic components are mounted on the front, so heat sinks can only be placed on the back, which cannot directly and efficiently dissipate heat from the electronic components.
[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this utility model, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content
[0004] In view of this, the present invention provides a double-sided heat dissipation circuit board, which embeds the chip module into the circuit board, making the surface of the circuit board flat, and heat dissipation components are provided on both the front and back sides of the circuit board, so as to directly and efficiently dissipate heat from the chip module and other electronic components.
[0005] According to one aspect of the present invention, a double-sided heat-dissipating circuit board is provided, comprising: a chip-embedded circuit board, including a circuit board and a chip module embedded in the circuit board, the chip module having leads from the front side of the circuit board; a first heat dissipation component disposed on the front side of the chip-embedded circuit board, the first heat dissipation component including a first insulating thermally conductive layer mounted on the front side of the circuit board and a first heat dissipation member assembled with the first insulating thermally conductive layer; and a second heat dissipation component disposed on the back side of the chip-embedded circuit board, the second heat dissipation component including a second insulating thermally conductive layer pressed onto the back side of the circuit board and a second heat dissipation member assembled with the second insulating thermally conductive layer.
[0006] In some embodiments, the first insulating thermally conductive layer is a thermally conductive adhesive or a thermally conductive pad.
[0007] In some embodiments, the first heat dissipation component is a convection heat dissipation component, comprising: a first heat dissipation element attached to the first insulating thermally conductive layer; and a first cooling housing assembled with the first heat dissipation element; wherein a first cooling space for the flow of cooling medium is formed between the first cooling housing and the first heat dissipation element.
[0008] In some embodiments, the surface of the first heat dissipation element facing the first cooling housing is provided with heat dissipation fins.
[0009] In some embodiments, the first heat dissipation component is a conductive heat dissipation component, comprising: a first heat absorption module, which is attached to the first insulating thermally conductive layer; and a first heat dissipation module, which is in contact with the first heat absorption module; wherein the first heat absorption module at least partially covers the lead area of the chip module.
[0010] In some embodiments, the first heat-absorbing module is a copper block, the first heat-dissipating module is a plastic plate, and the first heat-absorbing module and the first heat-dissipating module are injection molded together.
[0011] In some embodiments, the first heat dissipation component partially exposes the lead area of the chip module.
[0012] In some embodiments, the second insulating and thermally conductive layer is a resin layer.
[0013] In some embodiments, the second heat dissipation component is a convection heat dissipation component, comprising: a second heat dissipation element, pressed together with the second insulating thermally conductive layer; and a second cooling housing, assembled with the second heat dissipation element; wherein a second cooling space for the flow of cooling medium is formed between the second cooling housing and the second heat dissipation element.
[0014] In some embodiments, the surface of the second heat dissipation element facing the second cooling housing is provided with heat dissipation fins.
[0015] The beneficial effects of this utility model compared with the prior art include at least the following:
[0016] The present invention relates to a double-sided heat dissipation circuit board, which embeds the chip module into the circuit board, making the surface of the circuit board flat. This allows heat dissipation components to be set on both the front and back of the circuit board, thereby directly and efficiently dissipating heat from the chip module and other electronic components.
[0017] The heat dissipation components located on the front and back of the chip embedded circuit board achieve insulation protection and heat conduction through insulating thermal conductive layers, and achieve efficient heat dissipation through heat dissipation components; the first insulating thermal conductive layer is attached to the front of the circuit board to avoid damage to the chip module by hot pressing and other processes; the second insulating thermal conductive layer is pressed to the back of the circuit board, and thermal conductive materials with better thermal conductivity can be selected to improve the overall heat dissipation effect.
[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit the present invention. Attached Figure Description
[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments conforming to the present invention and, together with the description, serve to explain the principles of the present invention. It is obvious that the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.
[0020] Figure 1 This diagram illustrates the structure of a double-sided heat dissipation circuit board according to an embodiment of the present invention.
[0021] Figure 2 This diagram illustrates the structure of another double-sided heat dissipation circuit board according to an embodiment of the present invention. Detailed Implementation
[0022] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to those described herein. Rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.
[0023] The accompanying drawings are merely illustrative of the present invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore, repeated descriptions of them will be omitted.
[0024] The use of terms such as "first," "second," and similar words in the specific description does not indicate any order, quantity, or importance, but is merely used to distinguish different components. In the description of this utility model, it should be noted that the terms "front," "back," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, in the description of this utility model, when it is said that a device is "in contact" or "connected" to another device, this includes not only direct contact or direct connection, but also indirect contact or indirect connection through other elements.
[0025] It should be noted that, unless otherwise specified, the embodiments of this utility model and the features in different embodiments can be combined with each other.
[0026] Figure 1 and Figure 2 The diagram illustrates the structures of two double-sided heat-dissipating circuit boards in embodiments of this utility model; combined with Figure 1 and Figure 2 As shown, the double-sided heat-dissipating circuit board provided in this embodiment of the present invention includes:
[0027] The chip embedded circuit board 10 includes a circuit board 11 and a chip module 12 embedded in the circuit board 11, with the chip module 12 having leads from the front side of the circuit board 11.
[0028] The first heat dissipation component 20 is disposed on the front side of the chip embedded circuit board 10. The first heat dissipation component 20 includes a first insulating thermally conductive layer 21 mounted on the front side of the circuit board 11 and a first heat dissipation member 22 assembled with the first insulating thermally conductive layer 21.
[0029] The second heat dissipation component 30 is disposed on the back side of the chip embedded circuit board 10. The second heat dissipation component 30 includes a second insulating thermally conductive layer 31 pressed onto the back side of the circuit board 11 and a second heat dissipation member 32 assembled with the second insulating thermally conductive layer 31.
[0030] The present invention discloses a double-sided heat dissipation circuit board in which the chip module 12 is embedded in the circuit board 11, making the surface of the circuit board 11 flat. This allows heat dissipation components to be set on both the front and back sides of the circuit board 11, thereby directly and efficiently dissipating heat from electronic components such as the chip module 12.
[0031] The heat dissipation components located on the front and back of the chip embedded circuit board 10 achieve insulation protection and heat conduction through insulating thermal conductive layers, and achieve efficient heat dissipation through heat dissipation components; and the first insulating thermal conductive layer 21 is attached to the front of the circuit board 11 to avoid damage to the chip module 12 by hot pressing and other processes; the second insulating thermal conductive layer 31 is pressed to the back of the circuit board 11, and a thermally conductive material with better thermal conductivity can be selected to improve the overall heat dissipation effect.
[0032] In some embodiments, the first insulating thermally conductive layer 21 is a thermally conductive adhesive or a thermally conductive pad. The assembly is completed by attaching thermally conductive materials such as thermally conductive adhesives and thermally conductive pads to the front side of the circuit board 11, without the need for hot pressing, curing or other processes, which effectively protects the chip module 12 and avoids damage to the chip module 12.
[0033] In some embodiments, refer to Figure 1 As shown, the first heat dissipation component 22 is a convection heat dissipation component, including: a first heat dissipation element 221, which is attached to the first insulating thermally conductive layer 21; and a first cooling shell 222, which is assembled with the first heat dissipation element 221; wherein, a first cooling space 610 for the flow of cooling medium is formed between the first cooling shell 222 and the first heat dissipation element 221.
[0034] Convection-type heat dissipation components primarily achieve cooling through cooling media such as cooling liquids or cooling gases. The first cooling housing 222 and the first heat dissipation element 221 can be pre-assembled using fasteners, and then the entire assembly is attached to the first insulating and thermally conductive layer 21, allowing the first heat dissipation element 221 to be slightly embedded in the first insulating and thermally conductive layer 21 and fixed by surface adhesive. The first cooling space 610 can be connected to the supply and outlet pipes of the cooling medium via a cooling interface (not specifically shown in the figure).
[0035] The first heat dissipation element 221 can be made of aluminum, which has good thermal conductivity and heat dissipation effect; the first cooling shell 222 can be made of plastic, but is not limited thereto.
[0036] Furthermore, in some embodiments, the surface of the first heat dissipation element 221 facing the first cooling housing 222 is provided with heat dissipation fins 2210. The heat dissipation fins 2210 increase the heat dissipation area and the contact area with the cooling medium, thereby improving the heat dissipation effect.
[0037] In some embodiments, refer to Figure 2 As shown, the first heat dissipation component 22 is a conductive heat dissipation component, including: a first heat absorption module 224, which is attached to the first insulating thermally conductive layer 21; and a first heat dissipation module 225, which is in contact with the first heat absorption module 224; wherein, the first heat absorption module 224 at least partially covers the lead area 120 of the chip module 12.
[0038] Conductive heat dissipation components primarily achieve heat dissipation through heat conduction. The first heat-absorbing module 224 comes into contact with the heat source and absorbs the heat generated by the chip module 12, especially under the instantaneous operating conditions of the chip module 12 operating at high power, achieving rapid heat absorption and temporarily storing the heat inside the first heat-absorbing module 224; then, the first heat-absorbing module 224 dissipates the heat through natural heat dissipation and heat dissipation through the first heat dissipation module 225.
[0039] The first heat-absorbing module 224 can be a copper block; copper has excellent thermal conductivity and can quickly absorb and dissipate heat. The first heat-dissipating module 225 can be a plastic plate, but is not limited thereto. The first heat-absorbing module 224 and the first heat-dissipating module 225 can be connected by injection molding to form an integral first heat-dissipating component 22, which is then attached to the first insulating thermally conductive layer 21, so that the first heat-absorbing module 224 is slightly embedded in the first insulating thermally conductive layer 21 and fixed by surface adhesive.
[0040] Continue to combine Figure 1 and Figure 2 As shown, in some embodiments, the first heat dissipation member 22 partially exposes the lead area 120 of the chip module 12. For example, the gate lead area 120' may be exposed. This facilitates the wiring of the chip module 12.
[0041] In some embodiments, the second insulating and thermally conductive layer 31 is a resin layer. Resin has good thermal conductivity, which can improve heat dissipation. Furthermore, the resin layer can be fixed by hot pressing with a press without damaging the chip module 12.
[0042] In some embodiments, the second heat dissipation component 32 is a convection heat dissipation component, including: a second heat dissipation element 321, which is pressed together with the second insulating thermally conductive layer 31; and a second cooling housing 322, which is assembled with the second heat dissipation element 321; wherein a second cooling space 620 for the flow of cooling medium is formed between the second cooling housing 322 and the second heat dissipation element 321.
[0043] When assembling the second heat dissipation component 32, the second heat dissipation element 321 can be first attached to the second insulating thermally conductive layer 31, and then the second insulating thermally conductive layer 31 can be pressed between the second heat dissipation element 321 and the back of the circuit board 11 using a press. Next, the second cooling housing 322 can be assembled to the second heat dissipation element 321 using fasteners and other assembly parts. The second cooling space 620 can be connected to the supply and outlet pipes of the cooling medium through a cooling interface (not specifically shown in the figure).
[0044] The second heat dissipation element 321 can be made of aluminum, which has good thermal conductivity and heat dissipation effect; the second cooling housing 322 can be made of plastic, but is not limited thereto.
[0045] Furthermore, in some embodiments, the surface of the second heat dissipation element 321 facing the second cooling housing 322 is provided with heat dissipation fins 3210. The heat dissipation fins 3210 increase the heat dissipation area and the contact area with the cooling medium, thereby improving the heat dissipation effect.
[0046] In summary, this utility model's double-sided heat-dissipating circuit board embeds the chip module 12 into the circuit board 11, making the surface of the circuit board 11 flat. This allows for heat dissipation components to be placed on both the front and back sides of the circuit board 11, directly and efficiently dissipating heat from the chip module 12 and other electronic components. The heat dissipation components on the front and back sides of the chip-embedded circuit board 10 achieve insulation protection and heat conduction through insulating thermal conductive layers, and achieve efficient heat dissipation through heat dissipation components. Specifically, the first insulating thermal conductive layer 21 is attached to the front side of the circuit board 11 to avoid damage to the chip module 12 during hot pressing and other processes. The first heat dissipation component 22 can be a convection heat dissipation component or a conduction heat dissipation component as needed. The second insulating thermal conductive layer 31 is pressed onto the back side of the circuit board 11, and a thermally conductive material with better thermal conductivity can be selected. Furthermore, the second heat dissipation component 32 can be a convection heat dissipation component to improve the overall heat dissipation effect.
[0047] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.
Claims
1. A double-sided heat-dissipating circuit board, characterized in that, include: A chip-embedded circuit board includes a circuit board and a chip module embedded in the circuit board, wherein the chip module has leads from the front side of the circuit board; A first heat dissipation component is disposed on the front side of the chip embedded circuit board. The first heat dissipation component includes a first insulating thermally conductive layer attached to the front side of the circuit board and a first heat dissipation component assembled with the first insulating thermally conductive layer. The second heat dissipation component is disposed on the back side of the chip embedded circuit board. The second heat dissipation component includes a second insulating thermally conductive layer pressed onto the back side of the circuit board and a second heat dissipation member assembled with the second insulating thermally conductive layer.
2. The double-sided heat-dissipating circuit board as described in claim 1, characterized in that, The first insulating and thermally conductive layer is a thermally conductive adhesive or a thermally conductive pad.
3. The double-sided heat dissipation circuit board as described in claim 1, characterized in that, The first heat dissipation component is a convection heat dissipation component, comprising: The first heat dissipation element is attached to the first insulating and thermally conductive layer; The first cooling housing is assembled with the first heat dissipation element; The first cooling housing and the first heat dissipation element form a first cooling space for the flow of cooling medium.
4. The double-sided heat dissipation circuit board as described in claim 3, characterized in that, The surface of the first heat dissipation element facing the first cooling housing has heat dissipation fins.
5. The double-sided heat-dissipating circuit board as described in claim 1, characterized in that, The first heat dissipation component is a conductive heat dissipation component, comprising: The first heat-absorbing module is attached to the first insulating and thermally conductive layer; The first heat dissipation module is in contact with the first heat absorption module; The first heat-absorbing module at least partially covers the lead area of the chip module.
6. The double-sided heat-dissipating circuit board as described in claim 5, characterized in that, The first heat-absorbing module is a copper block, and the first heat-dissipating module is a plastic plate. The first heat-absorbing module and the first heat-dissipating module are injection molded together.
7. The double-sided heat-dissipating circuit board as described in any one of claims 1-6, characterized in that, The first heat dissipation component partially exposes the lead area of the chip module.
8. The double-sided heat-dissipating circuit board as described in claim 1, characterized in that, The second insulating and thermally conductive layer is a resin layer.
9. The double-sided heat-dissipating circuit board as described in claim 1, characterized in that, The second heat dissipation component is a convection heat dissipation component, comprising: The second heat dissipation element is pressed together with the second insulating and thermally conductive layer; The second cooling housing is assembled with the second heat dissipation element; The second cooling housing and the second heat dissipation element form a second cooling space for the flow of cooling medium.
10. The double-sided heat-dissipating circuit board as described in claim 9, characterized in that, The second heat dissipation element has heat dissipation fins distributed on its surface facing the second cooling housing.