Temperature control mechanism for chip detection equipment

Abstract

The utility model discloses a temperature control mechanism for chip detection equipment, which is arranged on an outer shell, a control structure is arranged on the outer shell, the inner part of the outer shell is divided into a plurality of cavities, the front ends of the plurality of cavities are sealed by door plates, the rear ends of the plurality of cavities are sealed by heat dissipation plates, and drawers are arranged in the cavities in a sliding manner; a plurality of diathermanous grooves are formed in the side direction of the drawer, the fixed-point temperature control structure comprises a penetrating structure arranged on the side face of the cavity, fixing structures corresponding to the diathermanous grooves are arranged on the penetrating structure, and when the drawer is in place, heat generated by the penetrating structure directly enters the diathermanous grooves, and the fixing structures are fixed to the diathermanous grooves. According to the utility model, the uniform temperature or humidity effect on the to-be-tested equipment can be ensured, so that the accuracy of test data is improved.

Description

Technical Field

[0001] This utility model relates to a chip testing device, and more particularly to a temperature control mechanism for a chip testing device. Background Technology

[0002] Semiconductor products are widely used in new energy vehicles, photovoltaics and energy storage industries. As key equipment in the third-generation semiconductor industry, they need to undergo various tests before being put into use. For example, they need to simulate the working conditions of the products in complex temperature and humidity change environments to provide strong support for product quality control, reliability verification and environmental adaptability assessment.

[0003] When testing semiconductor products, due to the complexity of the environment, existing technologies mostly adopt testing methods in a sealed environment. The test is conducted in a sealed enclosure, which is divided into individual frames and controlled by a unified temperature controller. However, this control method can only process single components in batches and cannot handle multiple components. Therefore, some equipment uses a single-unit control method, that is, each unit has an individual temperature control structure. Although this temperature control method can achieve the effect of local temperature control, the local temperature control effect is not very accurate, and the test parameters cannot reflect the most accurate data, which can easily lead to inaccurate test data. Utility Model Content

[0004] This invention provides a temperature control mechanism for chip testing equipment, which can ensure that the device under test is subjected to uniform temperature or humidity, thereby improving the accuracy of test data and effectively solving the above-mentioned problems.

[0005] This utility model is implemented as follows:

[0006] A temperature control mechanism for a chip testing device is mounted on a housing. The housing has a control structure, and the interior of the housing is divided into several chambers. The front ends of several chambers are closed by door panels, and the rear ends of several chambers are closed by heat sinks. Each chamber is slidably fitted with a drawer. The device also includes:

[0007] The fixed-point temperature control structure has several heat-permeable grooves on the side of the drawer. The fixed-point temperature control structure includes a through-positioning structure disposed on the side of the chamber. The through-positioning structure is provided with a fixing structure corresponding to the heat-permeable groove. When the drawer is in position, the heat generated by the through-positioning structure is directly transmitted to the heat-permeable groove, and the fixing structure penetrates into the heat-permeable groove to limit the drawer's position.

[0008] As a further improvement, the through-positioning structure includes two heating plates disposed on the side of the chamber, a stop plate fixedly connected to the heating plate, and a plurality of alignment holes opened on the stop plate. When the drawer is in position, the alignment holes are aligned with the heat transmission groove in a straight line.

[0009] As a further improvement, a transverse T-shaped shaft is provided at the top of the cavity, and holes are provided at both the end of the long shaft and the side of the T-shaped shaft. The bottom of one end of the short shaft of the T-shaped shaft is located in the gap between the stop plate and the drawer.

[0010] As a further improvement, two mating ribs are provided on the bottom side of the T-shaped shaft, and U-shaped buckets are provided on the stop plate and the drawer. After the drawer slides into the cavity, the U-shaped buckets are engaged in the mating ribs.

[0011] As a further improvement, the fixing structure includes a pusher disposed outside the chamber, the end of which is connected to a moisture cylinder, which is connected to a cold air pipe through a pipeline.

[0012] The beneficial effects of this utility model are:

[0013] Since each drawer's corresponding chamber is relatively independent, it also requires relatively independent space and control during operation. To improve the accuracy of the drawer's positioning and the stability of the drawer's internal space during testing, this invention uses a fixed-point temperature control structure. When the drawer is fully in place, the heat-transmitting groove on the drawer corresponds to the through-positioning structure, thus achieving the corresponding test results under both high temperature and high humidity conditions. Furthermore, once the heat-transmitting groove and through-positioning structure are in the corresponding positions, the drawer's position can be immediately limited by a fixing structure, ensuring that the drawer is always in the optimal position during testing to achieve the best contact effect with high-temperature or high-humidity gases.

[0014] The through-positioning structure is mainly used for testing under high heat temperatures. It heats the inside of the drawer through a heating plate. In order to improve the heat transfer effect, the heating plate is directly connected to the heat-transmitting groove on the drawer after it is in place through a stop plate with alignment holes, so as to achieve point-to-point heat radiation heating with excellent heating effect.

[0015] To facilitate heat circulation and better simulate the use of semiconductor devices in complex environments, this invention features a T-shaped shaft at the top of the cavity. This T-shaped shaft allows hot air that has dissipated to the top to circulate to the lower part of the cavity. Furthermore, the T-shaped shaft serves not only as a circulation path but also has two mating ribs at its lower end. These ribs guide the drawer's entry and exit, improving airtightness while also providing a certain degree of circulation.

[0016] During high humidity testing, moisture is introduced from the outside. However, if only one pipe is used, the moisture distribution will be uneven, and the pipe will only serve the purpose of transmitting moisture. Therefore, this invention, through a fixed structure, allows external moisture to enter through the moisture cylinder while simultaneously limiting the heat dissipation groove of the drawer. This prevents the drawer from retracting once it is in position until the entire test is completed. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of this utility model in conjunction with the outer shell.

[0019] Figure 2 This is a schematic diagram of the external structure of the chamber and drawer of this utility model.

[0020] Figure 3 This is a schematic diagram of the internal structure of the chamber and drawer of this utility model.

[0021] Figure 4 This is a schematic diagram of the cavity structure of this utility model.

[0022] Figure 5 This is a utility model Figure 4 The front view.

[0023] Figure 6 This is a schematic diagram of the internal positioning structure of this utility model.

[0024] Figure 7 This is a schematic diagram of the drawer structure of this utility model. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0026] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0027] Reference Figures 1 to 7As shown, a temperature control mechanism for a chip testing device is disposed in a housing 10. A control structure is provided on the housing 10. The interior of the housing 10 is divided into several chambers 20. The front ends of several chambers 20 are closed by door panels 30, and the rear ends of several chambers 20 are closed by heat sinks. Each chamber 20 is slidably fitted with a drawer 50. The device also includes a fixed-point temperature control structure 60. Several heat-permeable grooves 51 are opened on the side of each drawer 50. The fixed-point temperature control structure 60 includes a through-hole structure 61 disposed on the side of each chamber 20. The through-hole structure 61 is provided with a fixing structure 62 corresponding to the heat-permeable groove 51. When the drawer 50 is in position, the heat generated by the through-hole structure 61 is directly transmitted to the heat-permeable groove 51. 1. The fixing structure 62 extends through the heat-transmitting groove 51 to limit the drawer 50; the inner positioning structure 70 has an inner groove 52 on the bottom side of the drawer 50 near the heat dissipation plate. The inner positioning structure 70 includes an electric pull member 71 disposed in the cavity 20. A mating member 72 is movably disposed on the output end of the electric pull member 71. The mating member 72 is adjusted in direction by an adjusting member 73. An electric linkage member is disposed above the electric pull member 71. The mating member 72 is located below the inner groove 52 of the drawer 50 after it is pushed in. After the mating member 72 flips, it hooks into the inner groove 52 and drives the drawer 50 to a preset position. After the drawer 50 reaches the preset position, the electric linkage member is embedded in the drawer 50.

[0028] During use, the tester first opens the door panel 30, pulls out all the drawers 50, sets different parameters in different drawers 50, puts in different semiconductor devices, and then closes the drawers 50 to automatically power on and start testing.

[0029] The control structure is an electrical control cabinet, which is existing technology and will not be described in detail.

[0030] In existing testing cabinets, a separate temperature control structure is directly installed in the chamber 20 inside the testing cabinet. Although this achieves temperature control, if it cannot be confirmed whether the object being tested has reached its specific position, even with a separate temperature control structure, the object cannot be precisely controlled in terms of temperature. When the drawer 50 is manually pushed into place, it is not fully in position. Therefore, this invention, through the internal fixed-point positioning structure 70, allows the adjusting component 73 to rotate the mating component 72 after the drawer 50 reaches its theoretical position. This further allows the electric pull component 71 to move the mating component 72 inward, thus pulling the drawer 50 further inward until it is fully in position. Once in position, the drawer 50 will form an electric engagement with the electric linkage component, and the entire device will be fully powered on. This ensures that the entire machine structure will only start power after the drawer 50 is fully in position, guaranteeing airtightness and maintaining testing accuracy during subsequent high humidity or high temperature tests.

[0031] After the drawer 50 has been pushed to a certain distance, it cannot be pushed forward any further, or it is difficult to push it into place manually. Even if it is pushed into place, it is easy for it to pop out again. Therefore, the electric pull component 71 in this embodiment includes an electric push rod 711 disposed in the chamber 20. A folded hinge seat 712 is provided on the output end of the electric push rod 711. The mating component 72 is movably installed in the hinge seat 712. After the drawer 50 is pushed once, the electric push rod 711 pulls the drawer 50 inward through the mating component 72, so that the drawer 50 is fully in place. This avoids the problem of incomplete filling when manually pushing and pulling, which makes it difficult to accurately control the temperature and humidity.

[0032] During the process of pushing the drawer 50 back, the mating part 72 is a hook that is hinged to the output end of the electric pull part 71. The hook is hinged, so that when it is necessary to pull back, the hook can be swung upward to drive the drawer 50 back. When the drawer 50 is pulled outward, the hook can be swung downward to avoid affecting the normal outward pulling phenomenon of the drawer 50. Thus, the two movement states of the drawer 50 can be switched without affecting each other.

[0033] The orientation of the mating component 72 is changed by the adjusting component 73. However, since the position of the mating component 72 is constantly changing, the position of the adjusting component 73 also needs to be changed accordingly. Therefore, the adjusting component 73 in this embodiment includes two connecting rods 731 connected to the outside of the hook. The ends of the connecting rods 731 are connected to a rotating motor 732. A guide groove 21 is provided on the side of the chamber 20. The connecting rods 731 are slidably installed in the guide groove 21. A rib groove 22 is provided on the outside of the guide groove 21. The rotating motor 732 is movably installed on the outside of the guide groove 21. The adjusting component 73 not only includes a rotating motor 732 for changing the position of the mating component 72, but also the connecting rods 731 and the rotating motor 732 cooperate with the guide groove 21 and the rib groove respectively, thereby realizing the change of lateral position and achieving the movable cooperation effect with the mating component 72, thus improving the practicality of this utility model.

[0034] To prevent the connecting rod 731 from detaching from the hook, the outer side of the hook is a hexagonal stud, and the inner side of the connecting rod 731 is an internal hexagonal stud, so that they will not detach during rotation.

[0035] In conventional testing structures, testers cannot confirm whether the test item is in place before turning on the test switch, thus making it impossible to verify the accuracy of the test results. Therefore, the electric linkage in this embodiment includes two silver electrode plates 741 disposed at the bottom of the drawer 50 and two contacts 742 fixed above the electric pull member 71. The contacts 742 are connected to the power supply of the control structure. When the drawer 50 is in place, the silver electrode plates 741 and contacts 742 form a circuit, and the electric linkage intelligently turns the switch of the entire testing structure on and off. Only after the corresponding drawer 50 is in place will the silver electrode plates 741 and contacts 742 cooperate, thereby opening the test of the corresponding drawer 50. This allows all test areas to be relatively independent, and the test is only performed after the drawer 50 is in place, resulting in more accurate test results and better sealing of the current area.

[0036] Since each drawer 50 corresponds to a relatively independent chamber 20, it also requires relatively independent space and control during control. In order to improve the accuracy of the drawer 50 when it is in position and the stability of the internal space of the drawer 50 during the test, this utility model uses a fixed-point temperature control structure 60. When the drawer 50 is fully in position, the heat-transmitting groove 51 on the drawer 50 corresponds to the through-position structure 61. Thus, the corresponding test results can be obtained under both high temperature and high humidity conditions. Furthermore, after the heat-transmitting groove 51 and the through-position structure 61 are in the corresponding positions, the position of the drawer 50 can be immediately limited by the fixing structure 62, so that the drawer 50 can always be in the optimal position during the test to achieve the best contact effect with the high temperature gas or high humidity gas.

[0037] The through-positioning structure 61 is mainly used for testing under high heat temperatures. Specifically, the through-positioning structure 61 includes two heating plates 611 disposed on the side of the chamber 20. A stop plate 612 is fixed to the heating plate 611. The stop plate 612 has several alignment holes 613. When the drawer 50 is in position, the alignment holes 613 are aligned with the heat-transmitting groove 51. The drawer 50 is heated through the heating plates 611. In order to improve the heat transfer effect, the heating plates 611 are directly connected to the heat-transmitting groove 51 on the drawer 50 after it is in position through the stop plate 612 with the alignment holes 613, so as to realize point-to-point regional heat radiation heating with excellent heating effect.

[0038] To facilitate heat circulation and better simulate the use of semiconductor devices in complex environments, a transverse T-shaped shaft 614 is provided at the top of the cavity 20 in this embodiment. Holes are provided at the end of the long axis and laterally of the T-shaped shaft 614. The bottom of the short axis of the T-shaped shaft 614 is located in the gap between the baffle plate 612 and the drawer 50. The T-shaped shaft 614 allows hot air overflowing from the top to circulate to the lower position. Specifically, two mating ribs 6141 are provided on the bottom side of the T-shaped shaft 614. Both the baffle plate 612 and the drawer 50 are provided with U-shaped buckets 6142. After the drawer 50 slides into the cavity 20, the U-shaped buckets 6142 engage with the mating ribs 6141. The T-shaped shaft 614 not only serves as a circulation path, but its lower end also has two mating ribs 6141. These ribs guide the drawer 50, regulating its entry and exit positions and improving airtightness while also providing a certain circulation effect.

[0039] During high humidity testing, moisture is introduced externally. However, if only one pipe is used, the moisture distribution will be uneven, and the pipe will only serve the function of transporting moisture. Therefore, the fixing structure 62 in this embodiment includes a pusher 621 located outside the chamber 20. The end of the pusher 621 is connected to a moisture cylinder 622. The moisture cylinder 622 is connected to a cooling pipe through a pipe. With the fixing structure 62, external moisture can enter through the moisture cylinder 622, and the moisture cylinder 622 can also limit the heat transmission groove 51 of the drawer 50, so that the drawer 50 cannot be withdrawn once it is in place until the entire test process is completed.

[0040] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A temperature control mechanism for a chip testing device, characterized in that, The system is mounted on an outer casing (10), on which a control structure is provided. The interior of the outer casing (10) is divided into several chambers (20). The front ends of the chambers (20) are closed by door panels (30), and the rear ends of the chambers (20) are closed by heat dissipation plates. Each chamber (20) is slidably fitted with a drawer (50). The system also includes: A fixed-point temperature control structure (60) is provided, wherein a plurality of heat-transmitting grooves (51) are provided on the side of the drawer (50). The fixed-point temperature control structure (60) includes a through-positioning structure (61) provided on the side of the chamber (20). A fixing structure (62) corresponding to the heat-transmitting groove (51) is provided on the through-positioning structure (61). When the drawer (50) is in place, the heat generated by the through-positioning structure (61) is directly transmitted to the heat-transmitting groove (51), and the fixing structure (62) penetrates into the heat-transmitting groove (51) to limit the drawer (50).

2. The temperature control mechanism for a chip testing device according to claim 1, characterized in that, The through-positioning structure (61) includes two heating plates (611) disposed on the side of the chamber (20). A stop plate (612) is fixedly connected to the heating plate (611). The stop plate (612) is provided with a plurality of alignment holes (613). When the drawer (50) is in place, the alignment holes (613) and the heat transmission groove (51) are in the same straight line.

3. The temperature control mechanism for a chip testing device according to claim 1, characterized in that, A transverse T-shaped shaft (614) is provided at the top of the interior of the chamber (20). Holes are provided at the end of the long shaft and laterally of the T-shaped shaft (614). The bottom of one end of the short shaft of the T-shaped shaft (614) is located in the gap between the stop plate (612) and the drawer (50).

4. The temperature control mechanism for a chip testing device according to claim 3, characterized in that, Two mating ribs (6141) are provided on the bottom side of the T-shaped shaft (614). U-shaped buckets (6142) are provided on the stop plate (612) and the drawer (50). After the drawer (50) slides into the chamber (20), the U-shaped buckets (6142) are inserted into the mating ribs (6141).

5. The temperature control mechanism for a chip testing device according to claim 1, characterized in that, The fixed structure (62) includes a pusher (621) disposed outside the chamber (20), the end of which is connected to a moisture cylinder (622), which is connected to a cold air pipe through a pipeline.

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