Infrared receiver, infrared receiving module and electronic equipment

Abstract

The utility model discloses an infrared receiver, an infrared receiving module and an electronic device, comprising a receiver main body, a pin and a support member located at the bottom of the receiver main body, the height of the support member protruding out of the bottom of the receiver main body is smaller than the height of the pin protruding out of the bottom of the receiver main body, and the support member is used for supporting the receiver main body. A gap is formed between the receiver main body and the printed circuit board, so that when the infrared receiver is assembled on the printed circuit board by adopting a through hole reflow soldering process, gas generated by heating solder paste is discharged through the gap between the receiver main body and the printed circuit board; and the problem that the infrared receiver is misplaced due to the fact that gas generated when the solder paste is heated impacts the infrared receiver is solved.

Description

Technical Field

[0001] This utility model relates to the field of optical device technology, specifically to an infrared receiver, an infrared receiving module, and an electronic device. Background Technology

[0002] Currently, through-hole potted infrared receivers are widely used in various electronic devices due to their low manufacturing cost. Although through-hole potted infrared receivers can be assembled onto printed circuit boards (PCBs) using a through-hole reflow soldering process, misalignment of individual infrared receivers often occurs in practical applications, affecting the signal reception performance. Utility Model Content

[0003] This utility model discloses an infrared receiver, an infrared receiving module, and an electronic device to solve the misalignment problem that occurs when assembling a through-hole potted infrared receiver using a through-hole reflow soldering process.

[0004] In a first aspect, this utility model discloses an infrared receiver, including a receiver body, pins located at the bottom of the receiver body, and a support member; the height of the support member protruding from the bottom of the receiver body is less than the height of the pins protruding from the bottom of the receiver body; the support member is used to support the receiver body, so that there is a gap between the receiver body and the printed circuit board.

[0005] In some embodiments of this utility model, the infrared receiver includes multiple support members, which are evenly arranged at the bottom of the receiver body, and the surfaces of the multiple support members facing away from the receiver body are located on the same plane.

[0006] In some embodiments of this utility model, the receiver body includes a lead frame, a photosensitive chip, and an encapsulating colloid; the lead frame includes a frame body and a plurality of pins; the photosensitive chip is fixed on the frame body and electrically connected to the plurality of pins; the frame body and the photosensitive chip are encapsulated inside the encapsulating colloid; the plurality of pins extend from the bottom of the encapsulating colloid to the outside of the encapsulating colloid; at least one of the support members is disposed on the portion of at least one of the pins extending to the outside of the encapsulating colloid.

[0007] In some embodiments of this utility model, the lead frame further includes a shielding cover; the shielding cover is connected to the frame body; the shielding cover can be bent to the top of the photosensitive chip and extends to the outside of the encapsulating colloid; at least one of the support members includes a portion of the shielding cover extending to the outside of the encapsulating colloid.

[0008] In some embodiments of this utility model, the infrared receiver includes three pins and two support members, one of which is disposed on the middle pin of the three pins, and the other support member includes the portion of the shielding cover extending to the outside of the encapsulating colloid.

[0009] In some embodiments of this utility model, the infrared receiver includes three pins and three support members. The first support member and the second support member are respectively disposed on two pins located on both sides of the three pins. The third support member includes the portion of the shielding cover extending to the outside of the encapsulating colloid.

[0010] In some embodiments of this utility model, the infrared receiver includes three pins and four support members, the first to third support members are respectively disposed on the three pins, and the fourth support member includes the portion of the shielding cover extending to the outside of the encapsulating colloid.

[0011] In some embodiments of this utility model, the support member includes a strip structure that intersects with the pin; or, the support member includes a bent portion of the pin; or, the support member includes a trapezoidal structure at the tail end of the shielding cover.

[0012] Secondly, this utility model discloses an infrared receiving module, including a printed circuit board and an infrared receiver as described in any of the above claims, wherein the pins of the infrared receiver are electrically connected to the printed circuit board, and the support of the infrared receiver is located between the infrared receiver body of the infrared receiver and the printed circuit board.

[0013] Thirdly, this utility model discloses an electronic device, including the infrared receiving module described above.

[0014] The infrared receiver, infrared receiving module, and electronic device disclosed in this utility model include a receiver body, pins located at the bottom of the receiver body, and a support member. The height of the support member protruding from the bottom of the receiver body is less than the height of the pins protruding from the bottom of the receiver body. The support member is used to support the receiver body, so that there is a gap between the receiver body and the printed circuit board. This allows the gas generated by the solder paste to be discharged through the gap between the receiver body and the printed circuit board when the infrared receiver is assembled onto the printed circuit board using a through-hole reflow soldering process. This avoids the problem of the infrared receiver being misaligned due to the impact of the gas generated by the solder paste on the infrared receiver. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the background art, the accompanying drawings used in the embodiments of this utility model or the background art will be described below.

[0016] Figures 1 to 3 This diagram illustrates the process of assembling a through-hole potted infrared receiver onto a printed circuit board using a through-hole reflow soldering process.

[0017] Figure 4 This is a three-dimensional structural diagram of an infrared receiver disclosed in an embodiment of the present utility model.

[0018] Figure 5 This is a side view of an infrared receiver disclosed in an embodiment of the present invention.

[0019] Figure 6 This is a side view of an infrared receiver and printed circuit board disclosed in an embodiment of the present invention.

[0020] Figure 7 This is a schematic diagram of the internal structure of the receiver body of an infrared receiver disclosed in an embodiment of this utility model.

[0021] Figure 8 This is a three-dimensional structural diagram of another infrared receiver disclosed in an embodiment of this utility model.

[0022] Figure 9 This is a schematic diagram of the structure of a bent lead frame disclosed in an embodiment of the present utility model.

[0023] Figure 10 This is a three-dimensional structural diagram of another infrared receiver disclosed in an embodiment of this utility model.

[0024] Figure 11 This is a schematic diagram of the planar structure of a lead frame disclosed in an embodiment of the present utility model.

[0025] Figure 12 This is a schematic diagram of the planar structure of another lead frame disclosed in an embodiment of the present utility model.

[0026] Figure 13 This is a schematic diagram of the planar structure of another lead frame disclosed in an embodiment of the present utility model. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Currently, infrared receivers are mainly packaged in two ways: through-hole packaging and surface-mount packaging. Surface-mount packaging is achieved through injection molding, which requires significant investment in injection equipment and molds and has relatively low production capacity, resulting in higher manufacturing costs for surface-mount infrared receivers. Through-hole packaging, on the other hand, is achieved through potting, which requires less investment in potting equipment and fixtures and has higher production capacity, making through-hole potted infrared receivers cheaper to manufacture and more widely used.

[0029] Currently, through-hole potted infrared receivers can be mounted onto printed circuit boards using a through-hole reflow soldering process. When using this process, such as... Figure 1 As shown, solder paste 10 needs to be printed onto the plated through-holes 110 of the printed circuit board 11 first, and then the pins 131 of the through-hole encapsulated infrared receiver 13 are inserted into the plated through-holes 110, as shown. Figure 2 As shown, pin 131 tears the solder paste 10 in the plated via 110 and pushes a portion of the solder paste 10 to the bottom of the plated via 110. Then, a reflow soldering process is used to melt the solder paste 10 in the plated via 110, causing the solder paste 10 at the bottom of the plated via 110 to flow back into the plated via 110 through capillary action, and as shown... Figure 3 The interior of the plated through-hole 110 is completely filled as shown.

[0030] Although the through-hole reflow process for assembling the through-hole potted infrared receiver 13 onto the printed circuit board 11 has advantages such as high precision, fast speed, low cost, and high production efficiency, when the solder paste 10 in the through-hole 110 is melted and plated using the reflow soldering process, the solder paste 10 will generate gas when heated. This gas will impact the receiver body of the infrared receiver 13 on the top of the plated through-hole 110, causing the infrared receiver 13 to become misaligned and affecting the signal reception effect of the infrared receiver.

[0031] Based on this, the present invention provides a support member at the bottom of the receiver body of the infrared receiver that is lower than the pin, so that there is a gap between the receiver body and the printed circuit board, and the gas generated by the solder paste being heated is discharged through the gap, so as to avoid the gas impacting the infrared receiver and causing the infrared receiver to become misaligned.

[0032] As an optional implementation of the disclosure of this utility model, an embodiment of this utility model discloses an infrared receiver. For example... Figure 4 and Figure 5As shown, the infrared receiver includes a receiver body 130, pins 131 located at the bottom of the receiver body 130, and a support member 132. The height H1 of the support member 132 protruding from the bottom of the receiver body 130 is less than the height H2 of the pins 131 protruding from the bottom of the receiver body 130. The support member 132 is used to support the receiver body 130, so that there is a certain distance between the receiver body 130 and the printed circuit board 11. Figure 6 The gap X shown.

[0033] Because the support member 132 located at the bottom of the receiver body 130 can support the receiver body 130, the gap X between the receiver body 130 and the printed circuit board 11 can be used to assemble the infrared receiver onto the printed circuit board 11 using the through-hole reflow soldering process. This allows the gas generated by the solder paste to be discharged through the gap X between the receiver body 130 and the printed circuit board 11, thereby avoiding the problem of the infrared receiver being misaligned due to the impact of the gas generated by the solder paste on the infrared receiver.

[0034] It should be noted that the height H1 of the support member 132 protruding from the bottom of the receiver body 130 can be set according to requirements. However, it is necessary to ensure that the support member 132 does not affect the insertion of the pin 131 into the through hole of the printed circuit board 11, that is, it does not affect the electrical connection between the infrared receiver and the printed circuit board 11 through the pin 131. It should also be noted that the receiver body 130 refers to the main structure of the infrared receiver that mainly realizes the light signal sensing function.

[0035] In some embodiments of this utility model, such as Figure 6 As shown, the surface of the support member 132 near the receiver body 130 is adjacent to or in contact with the bottom of the receiver body 130. However, the present invention is not limited to this. In some other embodiments, the surface of the support member 132 near the receiver body 130 may also be spaced a certain distance from the bottom of the receiver body 130, which will not be described in detail here.

[0036] In some embodiments of this utility model, such as Figures 4 to 6 As shown, the infrared receiver may include multiple support members 132 located at the bottom of the receiver body 130. The multiple support members 132 are evenly arranged at the bottom of the receiver body 130, and the surfaces of the multiple support members 132 on the side opposite to the receiver body 130 are located on the same plane to ensure the assembly stability of the infrared receiver and prevent the infrared receiver from shaking.

[0037] Of course, this utility model is not limited to this. In other embodiments, the infrared receiver may only include a support member 132 located at the bottom of the receiver body 130. The support member 132 may be a ring structure surrounding the bottom of the receiver body 130. This can also ensure the assembly stability of the infrared receiver and prevent the infrared receiver from shaking.

[0038] In some embodiments of this utility model, such as Figure 7 As shown, the receiver body 130 includes a lead frame 133, a photosensitive chip 134, and an encapsulating colloid 135. The lead frame 133 includes a frame body 136 and a plurality of pins 131. The photosensitive chip 134 is fixed on the frame body 136 and is electrically connected to the plurality of pins 131. The frame body 136 and the photosensitive chip 134 are encapsulated inside the encapsulating colloid 135. The plurality of pins 131 extend from the bottom of the encapsulating colloid 135 to the outside of the encapsulating colloid 135. At least one support member 132 is disposed on the portion of at least one pin 131 extending to the outside of the encapsulating colloid 135.

[0039] In some embodiments of this utility model, such as Figure 5 As shown, the infrared receiver includes three pins 131, which are arranged sequentially in a first direction, and a support member 132 is disposed on the middle pin 131. Of course, this invention is not limited to this; in other embodiments, such as... Figure 8 As shown, the two support members 132 can also be respectively disposed on the two pins 131 located on both sides of the three pins 131. Of course, in other embodiments, a single support member 132 can also be disposed on either pin 131 of the two pins 131 located on both sides.

[0040] It should be noted that, in order to simplify the manufacturing process, the pin 131 and the support 132 set on it can be integrally formed. Of course, the support 132 can also be fixed to the pin 131 by screws or the like, which will not be elaborated here.

[0041] Based on this, in some embodiments of the present invention, other support members 132 can be directly fixed to the bottom of the receiver body 130. However, the present invention is not limited to this. In other embodiments, another support member 132 can also be provided on the portion of the lead frame 133 where the shielding cover 138 extends to the outside of the encapsulating colloid 135. For example... Figure 7 and Figure 9 As shown, the lead frame 133 includes a shielding cover 138, which is connected to the frame body 136. The shielding cover 138 can be bent to the top of the photosensitive chip 134 and extends to the outside of the encapsulating colloid 135.

[0042] like Figure 7As shown, at least one support member 132 includes a portion of a shielding cover 138 extending outside the encapsulating colloid 135. The shielding cover 138 can be lengthened so that the portion extending outside the encapsulating colloid 135 constitutes a support member 132.

[0043] In some embodiments of this utility model, such as Figure 5 As shown, the infrared receiver includes three pins 131 and two supports 132. The three pins 131 are arranged sequentially in a first direction, and the two supports 132 are arranged sequentially in a second direction, which intersects with the first direction. One support 132 is disposed on the middle pin 131 among the three pins 131, and the other support 132 includes a shielding cover 138 extending to the outside of the encapsulating colloid 135.

[0044] Of course, this utility model is not limited to this; in other embodiments, such as... Figure 8 As shown, the infrared receiver includes three pins 131 and three supports 132. The three pins 131 are arranged sequentially in a first direction. The first support 132 and the second support 132 are respectively disposed on two pins 131 located on both sides of the three pins 131. The third support 132 includes a shielding cover 138 extending to the outside of the encapsulating colloid 135. The third support 132 and the first support 132 or the second support 132 are arranged sequentially in a second direction, and the second direction intersects with the first direction.

[0045] In other embodiments, such as Figure 10 As shown, the infrared receiver includes three pins 131 and four supports 132. The three pins 131 are arranged sequentially in a first direction. The first to third supports 132 are respectively disposed on the three pins 131. The fourth support 132 includes a shielding cover 138 extending to the outside of the encapsulating colloid 135. The fourth support 132 and the first support 132 or the second support 132 or the third support 132 are arranged sequentially in a second direction, and the second direction intersects with the first direction.

[0046] In some embodiments of this utility model, such as Figure 11 and Figure 13 As shown, the support member 132 includes a strip-shaped structure that intersects with the pin 131. Of course, this invention is not limited to this; in other embodiments, such as... Figure 12 and Figure 13 As shown, the support member 132 includes a bent portion of the pin 131. (As indicated...) Figures 11 to 13As shown, the support member 132 includes a trapezoidal structure at the tail end of the shielding cover. Of course, in other embodiments, the structure and shape of the support member 132 can be set according to requirements, which will not be described in detail here.

[0047] In some embodiments of this utility model, such as Figure 7 As shown, the receiver body 130 also includes a processing chip 137, which is fixed to the frame body 136 and electrically connected to the photosensitive chip 134. The processing chip 137 is also encapsulated inside the encapsulating colloid 135. The photosensitive chip 134 senses light signals and converts them into electrical signals. The processing chip 137 amplifies and processes the electrical signals output by the photosensitive chip 134 to perform corresponding operations based on the processed electrical signals. Of course, in some embodiments, if the photosensitive chip 134 integrates amplification circuits or other processing circuits, the receiver body 130 may only include the photosensitive chip 134.

[0048] In some embodiments of this utility model, such as Figures 11 to 13 As shown, the shielding cover 138 includes a first hollow area 1380 and a plurality of second hollow areas 1381. The first hollow area 1380 is used to expose the photosensitive surface of the photosensitive chip 134 so that the photosensitive chip 134 can sense light signals. The plurality of second hollow areas 1381 are arranged in an array such that the structure between the plurality of second hollow areas 1381 is a grid structure, which is used to shield the electromagnetic interference of external signals to the photosensitive chip 134. Of course, in other embodiments, the structure and shape of the shielding cover 138 can also be set according to requirements, which will not be described in detail here.

[0049] As an optional implementation of the present invention, an embodiment of the present invention discloses an infrared receiving module, which includes a printed circuit board and an infrared receiver as disclosed in any of the above embodiments. The pins of the infrared receiver are electrically connected to the printed circuit board, and the support of the infrared receiver is located between the infrared receiver body and the printed circuit board, so that there is a gap between the receiver body and the printed circuit board.

[0050] Because when the infrared receiver is assembled onto the printed circuit board using the through-hole reflow soldering process, the gas generated by the solder paste due to heating can be discharged through the gap between the receiver body and the printed circuit board. Therefore, the gas generated by the solder paste due to heating can be prevented from impacting the infrared receiver and causing misalignment.

[0051] As an optional implementation of the disclosure of this utility model, an embodiment of this utility model discloses an electronic device that includes an infrared receiving module as disclosed in any of the above embodiments. This electronic device includes, but is not limited to, mobile phones, air conditioners, and televisions.

[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The above embodiments are merely illustrative of several implementation methods described in detail, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this specification, and these all fall within the protection scope of this specification. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. An infrared receiver, characterized in that, It includes a receiver body, pins located at the bottom of the receiver body, and a support member; the height of the support member protruding from the bottom of the receiver body is less than the height of the pins protruding from the bottom of the receiver body; The support member is used to support the receiver body, so that there is a gap between the receiver body and the printed circuit board.

2. The infrared receiver according to claim 1, characterized in that, The infrared receiver includes multiple support members, which are evenly arranged at the bottom of the receiver body, and the surfaces of the multiple support members facing away from the receiver body are located on the same plane.

3. The infrared receiver according to claim 1 or 2, characterized in that, The receiver body includes a lead frame, a photosensitive chip, and an encapsulating colloid. The lead frame includes a frame body and a plurality of pins; the photosensitive chip is fixed on the frame body and is electrically connected to the plurality of pins; the frame body and the photosensitive chip are encapsulated inside the encapsulating colloid; the plurality of pins extend from the bottom of the encapsulating colloid to the outside of the encapsulating colloid; at least one of the support members is disposed on the portion of at least one of the pins extending to the outside of the encapsulating colloid.

4. The infrared receiver according to claim 3, characterized in that, The lead frame further includes a shielding cover; the shielding cover is connected to the frame body; the shielding cover can be bent to the top of the photosensitive chip and extends to the outside of the encapsulating colloid; at least one of the support members includes a portion of the shielding cover extending to the outside of the encapsulating colloid.

5. The infrared receiver according to claim 4, characterized in that, The infrared receiver includes three pins and two supports. One support is located on the middle pin of the three pins, and the other support includes the portion of the shielding cover that extends to the outside of the encapsulation colloid.

6. The infrared receiver according to claim 4, characterized in that, The infrared receiver includes three pins and three supports. The first and second supports are respectively disposed on two pins located on both sides of the three pins. The third support includes the portion of the shielding cover that extends to the outside of the encapsulating colloid.

7. The infrared receiver according to claim 4, characterized in that, The infrared receiver includes three pins and four supports. The first to third supports are respectively disposed on the three pins, and the fourth support includes the portion of the shielding cover that extends to the outside of the encapsulation colloid.

8. The infrared receiver according to claim 4, characterized in that, The support member includes a strip-shaped structure that intersects with the pin; or, the support member includes a bent portion of the pin; or, the support member includes a trapezoidal structure at the tail end of the shielding cover.

9. An infrared receiving module, characterized in that, The device includes a printed circuit board and an infrared receiver as described in any one of claims 1 to 8, wherein the pins of the infrared receiver are electrically connected to the printed circuit board, and the support of the infrared receiver is located between the infrared receiver body of the infrared receiver and the printed circuit board.

10. An electronic device, characterized in that, Includes the infrared receiving module as described in claim 9.

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