Vacuum platform device and chip upside-down mounting equipment

Abstract

The embodiment of the utility model provides a vacuum platform device and chip flip equipment, the vacuum platform device is used for adsorbing a substrate during flip packaging of a chip, and the device comprises a base, a platform support bottom arranged on the base, a vacuum platform arranged on the platform support bottom and a vacuum pipeline; the vacuum platform is provided with a plurality of adsorption protruding blocks used for adsorbing substrates, and the two ends of the vacuum pipeline are connected with the adsorption protruding blocks and the vacuum source respectively. The device further comprises at least two horizontal automatic adjusting mechanisms which are oppositely distributed and arranged on the base. And the horizontal automatic adjusting mechanism is used for automatically adjusting the vacuum platform to a horizontal position by controlling the lifting of the vacuum platform. The ascending and descending distance of the vacuum platform can be accurately controlled by arranging the horizontal automatic adjusting mechanism, so that the horizontal adjustment of the vacuum platform is realized; compared with manual adjustment, the equipment adjusting time is saved, the equipment utilization rate is improved, the output is increased, the profit is increased, operation is easy and convenient, cost is saved, and precision is improved.

Description

Technical Field

[0001] This disclosure pertains to the field of semiconductor packaging and testing technology, specifically relating to a vacuum platform device and a chip flip-chip device. Background Technology

[0002] With the increasing density of integrated circuit packaging, traditional wire bonding technology can no longer meet the requirements. Flip-chip bonding technology can adapt to the high density requirements of integrated circuit packaging and is now widely used. The semiconductor industry is developing rapidly, and processes are constantly changing, placing higher demands on semiconductor manufacturing equipment. Previously, a few or dozens of bonding wires were sufficient for a single chip, but this is now far from enough, especially for high-end central processing units (CPUs) or image processors.

[0003] The computational workload is enormous, requiring more input and output ports. Moreover, the application of integrating multiple chips onto a single substrate is becoming increasingly common. Chips, especially high-end chips, are valuable but also prone to damage or failure, thus requiring extremely high accuracy in every operation during their manufacturing process.

[0004] This is particularly evident in flip-chip bonding equipment. The most crucial part of the flip-chip process is mounting the chip with the solder balls facing down onto the substrate, where the solder balls connect to the metal pads on the substrate. With continuous technological advancements, chips are becoming larger and the processes more complex. The development of 2.3D and 3D products in recent years has placed increasingly higher demands on flip-chip equipment. This is mainly reflected in the increasing chip warpage, requiring higher precision in the equipment. Previously, a 20-micron level requirement was sufficient; now, it's impossible to meet the demand. To handle larger chip warpage, actual process precision is controlled within 10 microns. When a chip is larger than 30mm x 30mm, there can be thousands or even tens of thousands of solder balls underneath. If even one solder ball is not properly connected to the substrate, the entire product must be scrapped. Often, if the vacuum platform of the flip-chip equipment is not properly leveled, a certain area of ​​the chip may not be properly connected, forcing the scrapping of the entire product, resulting in significant losses for the company. Failure to detect this in time can lead to batch defects.

[0005] The current practice is to adjust the vacuum platform of the equipment to the required level before production. As mentioned earlier, to address large chip warpage, the leveling specifications for the vacuum platform have been tightened. Therefore, adjusting the vacuum platform to the required level requires a significant amount of manpower and time, resulting in lost production capacity. The main reason is the stricter requirements for the vacuum platform's level. Another reason is that the current adjustment method relies on manually adjusting screws to level the vacuum platform. Manually controlling the micron-level level is extremely difficult and requires highly skilled personnel. Inexperienced employees may need several hours to adjust it, greatly impacting output.

[0006] To address the aforementioned problems, it is necessary to propose a reasonably designed vacuum platform device and chip flip-chip equipment that can effectively improve these issues. Utility Model Content

[0007] The present disclosure aims to at least solve one of the technical problems existing in the prior art, and to provide a vacuum platform device and a chip flip-chip device.

[0008] One aspect of this disclosure provides a vacuum platform device for adsorbing a substrate during chip flip packaging, including a base, a platform support disposed on the base, a vacuum platform disposed on the platform support, and vacuum tubing;

[0009] The vacuum platform is provided with multiple adsorption bumps for adsorbing the substrate, and the two ends of the vacuum pipeline are respectively connected to the adsorption bumps and the vacuum source.

[0010] The device also includes at least two relatively distributed automatic horizontal adjustment mechanisms disposed on the base;

[0011] The automatic horizontal adjustment mechanism is used to automatically adjust the vacuum platform to a horizontal position by controlling the lifting and lowering of the vacuum platform.

[0012] Optionally, the automatic horizontal adjustment mechanism includes a drive motor, a connecting component, and a lifting drive component;

[0013] The drive motor is mounted on the base;

[0014] The first end of the connector is connected to the output shaft of the drive motor, and the second end of the connector is connected to the lifting drive component.

[0015] The lifting drive component is connected to the base and the platform bottom respectively. Under the control of the drive motor, the lifting drive component can drive the platform bottom to rise and fall, thereby automatically adjusting the vacuum platform to a horizontal position.

[0016] Optionally, the base is provided with a first threaded hole, and the platform support is provided with a second threaded hole that penetrates its thickness and corresponds to the first threaded hole;

[0017] The lifting drive component is an adjusting bearing, which is spirally inserted into the first threaded hole and the second threaded hole. The rotation of the adjusting bearing drives the platform to lift and lower.

[0018] Optionally, the drive motor is a motor, and the rotation direction of the motor can control the rotation direction of the adjusting bearing, thereby controlling the raising or lowering of the platform bottom support.

[0019] Optionally, the connector is a conveyor belt.

[0020] Optionally, the two said leveling automatic adjustment mechanisms are distributed opposite each other along the diagonal direction of the base.

[0021] Optionally, a first fastener may also be included;

[0022] The edge region of the vacuum platform is provided with a first fixing hole that penetrates its thickness, and the bottom of the platform is provided with a second fixing hole corresponding to the first fixing hole;

[0023] The first fastener passes through the first fixing hole and is inserted into the second fixing hole to fix the vacuum platform to the platform base.

[0024] Optionally, a second fastener may also be included;

[0025] The edge area of ​​the platform base is provided with a third fixing hole that penetrates its thickness, and the base is provided with a fourth fixing hole corresponding to the third fixing hole;

[0026] The second fastener passes through the third fixing hole and is inserted into the fourth fixing hole to fix the platform base to the base.

[0027] Another aspect of this disclosure provides a chip flipping apparatus, including the vacuum platform device described above.

[0028] The vacuum platform device and chip flip-chip device of this disclosure include at least two relatively distributed automatic horizontal adjustment mechanisms disposed on a base. These automatic horizontal adjustment mechanisms are used to automatically adjust the vacuum platform to a horizontal position by controlling its raising and lowering. By setting up these automatic horizontal adjustment mechanisms, the rising and falling distances of the vacuum platform can be precisely controlled, thereby achieving horizontal adjustment of the vacuum platform. Compared to manually adjusting the vacuum platform's level, adjusting the level via automatic adjustment mechanisms saves adjustment time, improves equipment utilization, increases output, increases profits, and is also simple to operate, cost-effective, and improves accuracy. Attached Figure Description

[0029] Figure 1 This is a cross-sectional view of a vacuum platform device according to one embodiment of the present disclosure;

[0030] Figure 2 This is a cross-sectional view of a vacuum platform device according to one embodiment of the present disclosure when the vacuum platform is not horizontal;

[0031] Figure 3 This is a top view of a vacuum platform device according to one embodiment of the present disclosure. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0033] like Figures 1 to 3 As shown, one aspect of this disclosure provides a vacuum platform device 100 for adsorbing substrates during chip flip packaging. The vacuum platform device 100 includes a base 110, a platform support 120 disposed on the base 110, a vacuum platform 130 disposed on the platform support 120, and a vacuum pipeline 140.

[0034] The vacuum platform 130 is provided with multiple adsorption bumps 131 for adsorbing the substrate, and the two ends of the vacuum pipeline 140 are connected to the adsorption bumps 131 and the vacuum source, respectively. Specifically, the adsorption bumps 131 are provided with multiple adsorption holes, and the two ends of the vacuum pipeline 140 are connected to the adsorption holes and the vacuum source, respectively. The substrate is adsorbed and fixed through the adsorption holes on the adsorption bumps 131.

[0035] like Figures 1 to 3 As shown, the vacuum platform device 100 also includes at least two relatively distributed automatic horizontal adjustment mechanisms 150 disposed on the base 110.

[0036] The automatic horizontal adjustment mechanism 150 is used to automatically adjust the vacuum platform 130 to a horizontal position by controlling the lifting and lowering of the vacuum platform 130.

[0037] Specifically, such as Figure 2 As shown, when the vacuum platform 130 tilts and becomes non-level, the automatic leveling mechanism 150 can automatically control the rise or fall of the vacuum platform 130, thereby automatically adjusting the vacuum platform 130 to a level position. During the adjustment process, at least two automatic leveling mechanisms 150 need to be adjusted simultaneously to achieve the leveling of the vacuum platform 130.

[0038] The vacuum platform device of this disclosure includes at least two relatively distributed automatic horizontal adjustment mechanisms disposed on a base. These mechanisms automatically adjust the vacuum platform to a horizontal position by controlling its raising and lowering. By using these automatic horizontal adjustment mechanisms, the rising and falling distances of the vacuum platform can be precisely controlled, thereby achieving horizontal adjustment. Compared to manual adjustment, this saves adjustment time, improves equipment utilization, increases output and profits, and is also simple to operate, cost-effective, and accurate.

[0039] For example, such as Figures 1 to 3 As shown, the automatic horizontal adjustment mechanism 150 includes a drive motor 151, a connector 152, and a lifting drive component 153.

[0040] The drive motor 151 is mounted on the base 110.

[0041] The first end of the connector 152 is connected to the output shaft of the drive motor 151, and the second end of the connector 152 is connected to the lifting drive component 153.

[0042] The lifting drive component 153 is connected to the base 110 and the platform support 120 respectively. Under the control of the drive motor 151, the lifting drive component 153 can drive the platform support 120 to rise and fall, thereby automatically adjusting the vacuum platform 130 to a horizontal position.

[0043] Specifically, the drive motor 151 serves as the driving source. When the drive motor 151 starts, it drives the lifting drive component 153 to rise or fall, thereby driving the platform support 120 to rise or fall, thus realizing the automatic horizontal adjustment of the vacuum platform 130.

[0044] For example, in this embodiment, the base 110 is provided with a first threaded hole, and the platform support 120 is provided with a second threaded hole that penetrates its thickness and corresponds to the first threaded hole.

[0045] The lifting drive component 153 is an adjusting bearing. The adjusting bearing is spirally inserted into the first threaded hole and the second threaded hole. The rotation of the adjusting bearing drives the platform support 120 to rise and fall.

[0046] It should be noted that in this embodiment, the lifting drive component 153 can also be other structures. This embodiment does not impose specific limitations and can be selected according to actual needs.

[0047] For example, in this embodiment, the drive motor 151 is a motor, and the rotation direction of the motor can control the rotation direction of the adjusting bearing, thereby controlling the rise or fall of the platform support 120. For instance, each revolution of the motor in the forward direction can cause the vacuum platform 130 to rise, and each revolution of the motor in the reverse direction can cause the vacuum platform 130 to fall.

[0048] It should be noted that in this embodiment, the drive motor 151 can also be other power sources, and this embodiment does not make specific limitations.

[0049] For example, in this embodiment, the connector 152 can be a conveyor belt. Of course, the connector 152 can also be other connection structures. This embodiment does not impose specific limitations and can be selected according to actual needs.

[0050] Specifically, in this embodiment, the motor's output shaft is connected to a transmission belt, which in turn is connected to an adjusting bearing. The motor's rotation drives the transmission belt, which in turn drives the adjusting bearing. The rotation of the adjusting bearing raises or lowers the vacuum platform 130. Each forward rotation of the motor raises the vacuum platform 130 by 10 μm; conversely, each reverse rotation lowers it by 10 μm. To raise the vacuum platform by 1 μm, a one-tenth rotation of the motor in the forward direction is sufficient. By controlling the number of rotations of the motor, the vacuum platform 130 is precisely raised or lowered, thus automatically adjusting its level.

[0051] For example, such as Figure 3 As shown, in this embodiment, two automatic horizontal adjustment mechanisms 150 are distributed opposite each other at the two corners of the base 110 along the diagonal direction of the base 110.

[0052] It should be noted that this embodiment does not specifically limit the number and distribution of the automatic horizontal adjustment mechanisms 150, as long as they can automatically adjust the vacuum platform 130 to a horizontal position. For example, there can be four automatic horizontal adjustment mechanisms 150, which can be distributed at the four corners of the base 110, etc.

[0053] For example, such as Figures 1 to 3 As shown, the vacuum platform device 100 also includes a first fastener 160. A first fixing hole penetrating the thickness of the vacuum platform 130 is provided on the edge region, and a second fixing hole is provided on the platform base 120 corresponding to the first fixing hole. The first fastener 160 passes through the first fixing hole and is inserted into the second fixing hole to fix the vacuum platform 130 to the platform base 120.

[0054] Specifically, such as Figure 3 As shown, there are four first fasteners 160, which are respectively located at the four corners of the vacuum platform 130.

[0055] For example, such as Figures 1 to 3As shown, the vacuum platform device 100 also includes a second fastener 170. A third fixing hole penetrating the thickness of the platform base 120 is provided on the edge region, and a fourth fixing hole is provided on the base 110 at the corresponding third fixing hole. The second fastener 170 passes through the third fixing hole and is inserted into the fourth fixing hole to fix the platform base 120 to the base 110.

[0056] Another aspect of this disclosure provides a chip flip-chip apparatus, including the vacuum platform device 100 described above. The specific structural features of the vacuum platform device 100 have been described in detail above and will not be repeated here.

[0057] The chip flip-chip apparatus of this disclosure includes the vacuum platform device described above. Before chip mounting, the vacuum platform can be automatically adjusted to a horizontal position by an automatic horizontal adjustment mechanism, saving the time of manual adjustment and perfectly solving the accuracy problem. This ensures that the chip can be mounted flatly onto the substrate surface, achieving a good connection and guaranteeing product yield. It effectively saves costs, improves efficiency, and reduces equipment downtime, thereby enabling higher production capacity and generating higher profits.

[0058] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the embodiments of this disclosure, and the embodiments of this disclosure are not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of this disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of this disclosure.

Claims

1. A vacuum platform device for adsorbing substrates during chip flip packaging, characterized in that, Includes a base, a platform support disposed on the base, a vacuum platform disposed on the platform support, and vacuum pipelines; The vacuum platform is provided with multiple adsorption bumps for adsorbing the substrate, and the two ends of the vacuum pipeline are respectively connected to the adsorption bumps and the vacuum source. The device also includes at least two relatively distributed automatic horizontal adjustment mechanisms disposed on the base; The automatic horizontal adjustment mechanism is used to automatically adjust the vacuum platform to a horizontal position by controlling the lifting and lowering of the vacuum platform.

2. The vacuum platform device according to claim 1, characterized in that, The automatic horizontal adjustment mechanism includes a drive motor, a connecting component, and a lifting drive component; The drive motor is mounted on the base; The first end of the connector is connected to the output shaft of the drive motor, and the second end of the connector is connected to the lifting drive component. The lifting drive component is connected to the base and the platform bottom respectively. Under the control of the drive motor, the lifting drive component can drive the platform bottom to rise and fall, thereby automatically adjusting the vacuum platform to a horizontal position.

3. The vacuum platform device according to claim 2, characterized in that, The base is provided with a first threaded hole, and the platform support is provided with a second threaded hole that penetrates its thickness and corresponds to the first threaded hole. The lifting drive component is an adjusting bearing, which is spirally inserted into the first threaded hole and the second threaded hole. The rotation of the adjusting bearing drives the platform to lift and lower.

4. The vacuum platform device according to claim 3, characterized in that, The drive motor is a motor, and the rotation direction of the motor can control the rotation direction of the adjusting bearing, thereby controlling the raising or lowering of the platform bottom support.

5. The vacuum platform device according to claim 2, characterized in that, The connector is a conveyor belt.

6. The vacuum platform apparatus according to any one of claims 1 to 5, characterized in that, The two automatic leveling mechanisms are distributed opposite each other along the diagonal direction of the base.

7. The vacuum platform apparatus according to any one of claims 1 to 5, characterized in that, It also includes the first fastener; The edge region of the vacuum platform is provided with a first fixing hole that penetrates its thickness, and the bottom of the platform is provided with a second fixing hole corresponding to the first fixing hole; The first fastener passes through the first fixing hole and is inserted into the second fixing hole to fix the vacuum platform to the platform base.

8. The vacuum platform apparatus according to any one of claims 1 to 5, characterized in that, It also includes a second fastener; The edge area of ​​the platform base is provided with a third fixing hole that penetrates its thickness, and the base is provided with a fourth fixing hole corresponding to the third fixing hole; The second fastener passes through the third fixing hole and is inserted into the fourth fixing hole to fix the platform base to the base.

9. A chip flip-chip device, characterized in that, Includes the vacuum platform apparatus according to any one of claims 1 to 8.

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