Anti-pollution device for shipment of CSP (Chip Scale Package) chips

Abstract

The utility model discloses an anti-pollution device for shipment of CSP chips, and relates to the technical field of semiconductors, the anti-pollution device comprises a sorting table and a conveyor belt installed on the sorting table, one side of the top of the sorting table is provided with a position correcting piece, a detection piece and a sorting mechanism which are arranged side by side, and the sorting mechanism comprises a supporting rod fixedly installed on the top of the sorting table; a lifting frame is installed in the supporting rod in an up-down sliding mode, a guide block is slidably connected into the lifting frame, a hydraulic rod is fixedly installed at the end of the guide block through a connecting rod, and the output end of the hydraulic rod is fixedly connected with an equipment frame. According to the utility model, the sorting mechanism is arranged, the chips can be arranged on the delivery film in order, the delivery film is used for direct delivery, manual contact is not needed in the whole delivery process, the chips are prevented from being polluted, the film does not need to be poured repeatedly, the possibility that the chips are inclined is reduced, the arrangement uniformity of the chips is further ensured, and the product quality is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a device for preventing contamination during CSP chip shipment. Background Technology

[0002] In semiconductor CSP manufacturing processes, existing technologies typically employ a manual, multiple-layer casting process for chip shipment. During this process, operator sweat can easily contaminate the electrode surface, leading to soldering defects such as poor solder absorption by the customer. Furthermore, repeated casting can cause excessive tilting of the chip on the UV film, directly affecting the customer's SMT placement accuracy and causing assembly anomalies such as LED misalignment. The risk of chip displacement is exacerbated during multiple casting processes. Therefore, a contamination prevention device for CSP chip shipment is needed to address these issues. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a device for preventing contamination during CSP chip shipments, thus solving the technical problems mentioned in the background section.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a device for preventing contamination during CSP chip shipment, including a sorting table and a conveyor belt installed on the sorting table. A positioning component, a detection component, and a sorting mechanism are installed side-by-side on one side of the top of the sorting table. The sorting mechanism includes a support rod fixedly installed on the top of the sorting table. A lifting frame is slidably installed inside the support rod. A guide block is slidably connected inside the lifting frame. A hydraulic rod is fixedly installed at the end of the guide block via a connecting rod. An equipment frame is fixedly connected to the output end of the hydraulic rod. The equipment frame is slidably installed at the bottom of the lifting frame, and multiple equally spaced suction cups are provided at the bottom of the equipment frame.

[0005] A shipping platform is fixedly installed at one end of the sorting table, a shipping film is installed on one side of the shipping platform, and a pressing mechanism is installed on both sides of the top of the shipping platform.

[0006] Furthermore, a servo motor is fixedly installed at one end of the lifting frame, and a lead screw is fixedly connected to the output end of the servo motor. The lead screw is rotatably installed inside the lifting frame, and the guide block is threadedly connected to the outside of the lead screw.

[0007] Furthermore, a hydraulic cylinder that acts on the lifting frame is fixedly installed on one side of the inside of the sorting table.

[0008] Furthermore, the clamping mechanism includes a bracket fixedly installed at the end of the test piece, a threaded rod is threadedly connected inside the bracket, a pressure plate is rotatably installed at the lower end of the threaded rod, and the pressure plate is slidably installed inside the bracket.

[0009] Furthermore, a cutter is slidably mounted on the side of one of the brackets, and two connecting springs are fixedly mounted on the top of the cutter, with the upper ends of the connecting springs fixedly mounted on the top of the bracket.

[0010] Furthermore, the positioning component includes two electric push rods symmetrically mounted on the top of the sorting table, and the output end of the electric push rods is fixedly connected to a clamp.

[0011] Furthermore, a storage box is installed at the bottom of the sorting station.

[0012] By employing the above technical solution, this utility model provides a device for preventing contamination during CSP chip shipment, which has at least the following beneficial effects:

[0013] 1. This utility model is equipped with a sorting mechanism that can neatly arrange chips on the shipping film and ship them directly using the shipping film. The entire shipping process does not require manual contact, which prevents contamination of the chips. It also eliminates the need for repeated film rewinding, reducing the possibility of chip misalignment and thus ensuring the neatness of chip arrangement and improving product quality.

[0014] 2. By setting up a clamping mechanism, this utility model can fix the shipping film on the shipping table, ensuring the stability of the shipping film and preventing the chip from becoming skewed, thereby further ensuring the neatness of the chip shipment. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the sorting mechanism of this utility model;

[0018] Figure 3 This is a schematic diagram of the loading platform structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the pressing mechanism of this utility model.

[0020] In the diagram: 1. Sorting table; 2. Alignment component; 21. Electric actuator; 22. Clamping plate; 3. Detection component; 4. Sorting mechanism; 41. Support rod; 42. Lifting frame; 43. Guide block; 44. Connecting rod; 45. Hydraulic rod; 46. Equipment frame; 47. Suction cup; 48. Servo motor; 49. Lead screw; 410. Hydraulic cylinder; 5. Discharge film; 6. Pressing mechanism; 61. Bracket; 62. Threaded rod; 63. Pressure plate; 64. Cutter; 65. Connecting spring; 7. Discharge table; 8. Storage box. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Existing technologies typically employ a chip shipping solution that involves multiple manual film castings. During the manual casting process, the operator's sweaty fingers can easily contaminate the electrode surface, leading to soldering defects such as poor solder absorption by the customer. Furthermore, the repeated casting process may cause excessive tilting of the chip arrangement on the UV film, directly affecting the customer's SMT placement accuracy and causing assembly abnormalities such as LED misalignment.

[0023] Example 1

[0024] To address the deficiencies that exist in the use of the aforementioned device, please refer to [link / reference needed]. Figures 1-4This utility model provides a contamination prevention device for CSP chip shipment, which can prevent chip contamination and ensure neat chip shipment. The device is based on a sorting table 1 and a conveyor belt mounted on the sorting table 1. A positioning element 2, a detection element 3, and a sorting mechanism 4 are installed side-by-side on the top side of the sorting table 1. Chips are placed on the conveyor belt. When a chip is conveyed to the positioning element 2, the positioning element 2 can straighten the chip. The chip is then conveyed to the detection element 3, which identifies the chip. When a chip of a specified size is identified, the sorting mechanism 4 can pick up the chip. A storage box 8 is installed at the bottom of the sorting table 1. Chips of other sizes are then conveyed to the sorting table 1. The chips eventually fall into the collection box 8 for collection. To facilitate neat chip delivery, the sorting mechanism 4 needs to neatly pick up and arrange the chips. Therefore, the sorting mechanism 4 includes a support rod 41 fixedly installed on the top of the sorting table 1. A lifting frame 42 is slidably installed inside the support rod 41. A guide block 43 is slidably connected inside the lifting frame 42. A hydraulic rod 45 is fixedly installed at the end of the guide block 43 through a connecting rod 44. An equipment frame 46 is fixedly connected to the output end of the hydraulic rod 45. The equipment frame 46 is slidably installed at the bottom of the lifting frame 42, and multiple... The equally spaced suction cups 47, when the chips move with the conveyor belt to below the equipment rack 46, drive the hydraulic rod 45 to slide the equipment rack 46, sending the suction cups 47 above the chips. A hydraulic cylinder 410, acting on the lifting frame 42, is fixedly installed inside the sorting table 1. The hydraulic cylinder 410 drives the suction cups 47 down to the chip surface. The equipment rack 46 controls the suction cups 47 to create a vacuum, allowing the chips to be attracted to the suction cups 47 until all suction cups 47 have attracted the chips, resulting in a neat arrangement of the chips on the suction cups 47. A shipping platform 7 is fixedly installed at one end of the sorting table 1. A delivery film 5 is installed on one side, and a pressing mechanism 6 is set on both sides of the top of the delivery platform 7. The guide block 43 then drives the chip on the suction cup 47 to slide onto the delivery platform 7, pulls the delivery film 5 onto the delivery platform 7, and fixes the delivery film 5 on the delivery platform 7 through the pressing mechanism 6. Then, the chip on the suction cup 47 is controlled to fall down. In this way, the chip can be neatly arranged on the delivery film 5. The chip can be directly delivered using the delivery film 5. The entire delivery process does not require manual contact, which prevents contamination of the chip. It also eliminates the need for repeated film rewinding, ensuring the neatness of the chip arrangement, preventing the chip from tilting, and improving product quality.

[0025] Since the guide block 43 is needed to move the chip on the suction cup 47 to the delivery platform 7, a servo motor 48 is fixedly installed at one end of the lifting frame 42. The output end of the servo motor 48 is fixedly connected to a lead screw 49. The lead screw 49 is rotatably installed inside the lifting frame 42. The guide block 43 is threadedly connected to the outside of the lead screw 49. Driving the servo motor 48 can drive the lead screw 49 to rotate. The rotation of the lead screw 49 can drive the guide block 43 to slide. The sliding of the guide block 43 can drive the chip on the suction cup 47 to move to the delivery film 5 for delivery.

[0026] To achieve the above-mentioned alignment effect of the alignment component 2 on the chip, the alignment component 2 is set as two electric push rods 21 symmetrically installed on the top of the sorting table 1. The output end of the electric push rod 21 is fixedly connected to the clamping plate 22. When the chip is transported to the alignment component 2, the electric push rods 21 on both sides are driven to drive the two clamping plates 22 to slide relative to each other. The two clamping plates 22 can hold the chip and straighten it, which facilitates the subsequent detection operation of the chip by the detection component 3 and the adsorption of the chip by the suction cup 47.

[0027] Example 2

[0028] To prevent chip misalignment during chip shipment, the stability of the shipping film 5 must be ensured. The shipping film 5 is fixed on the shipping platform 7. The clamping mechanism 6 includes a bracket 61 fixedly installed at the end of the detection piece 3. The bracket 61 has a threaded rod 62 internally connected to it. A pressure plate 63 is rotatably installed at the lower end of the threaded rod 62. The pressure plate 63 slides up and down inside the bracket 61. Pulling the shipping film 5 out allows it to pass under the two pressure plates 63 in sequence. Rotating the threaded rod 62 causes the pressure plate 63 to press down, which can tightly press the two ends of the shipping film 5, thereby fixing the shipping film 5 and facilitating subsequent chip shipment operations.

[0029] After the chip is shipped, the shipping film 5 needs to be cut. A cutter 64 is slidably mounted on the side of one of the brackets 61. Two connecting springs 65 are fixedly mounted on the top of the cutter 64. The upper end of the connecting springs 65 is fixedly mounted on the top of the bracket 61. Pressing the cutter 64 cuts the shipping film 5. The cutter 64 moves downward, causing the connecting springs 65 to deform. After the shipping film 5 is cut, the cutter 64 can slide upward and reset by the elastic force of the connecting springs 65, which is convenient for the next cutting operation.

[0030] The control method of this utility model is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the field. Since this utility model is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail.

[0031] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for preventing contamination during CSP chip shipment, comprising a sorting table (1) and a conveyor belt mounted on the sorting table (1), characterized in that: The sorting table (1) is equipped with a positioning component (2), a detection component (3) and a sorting mechanism (4) arranged side by side on one side. The sorting mechanism (4) includes a support rod (41) fixedly installed on the top of the sorting table (1). A lifting frame (42) is slidably installed inside the support rod (41). A guide block (43) is slidably connected inside the lifting frame (42). A hydraulic rod (45) is fixedly installed at the end of the guide block (43) through a connecting rod (44). An equipment frame (46) is fixedly connected at the output end of the hydraulic rod (45). The equipment frame (46) is slidably installed at the bottom of the lifting frame (42), and a plurality of equally spaced suction cups (47) are provided at the bottom of the equipment frame (46). A shipping platform (7) is fixedly installed at one end of the sorting platform (1), a shipping film (5) is installed on one side of the shipping platform (7), and a pressing mechanism (6) is installed on both sides of the top of the shipping platform (7).

2. The anti-contamination device for CSP chip shipment according to claim 1, characterized in that: A servo motor (48) is fixedly installed at one end of the lifting frame (42), and a lead screw (49) is fixedly connected to the output end of the servo motor (48). The lead screw (49) is rotatably installed inside the lifting frame (42), and the guide block (43) is threadedly connected to the outside of the lead screw (49).

3. The anti-contamination device for CSP chip shipment according to claim 1, characterized in that: A hydraulic cylinder (410) that acts on the lifting frame (42) is fixedly installed on one side of the inside of the sorting table (1).

4. The anti-contamination device for CSP chip shipment according to claim 1, characterized in that: The clamping mechanism (6) includes a bracket (61) fixedly installed at the end of the test piece (3). The bracket (61) is internally threaded with a threaded rod (62). A pressure plate (63) is rotatably installed at the lower end of the threaded rod (62). The pressure plate (63) is slidably installed inside the bracket (61).

5. The anti-contamination device for CSP chip shipment according to claim 4, characterized in that: A cutter (64) is slidably mounted on the side of one of the brackets (61), and two connecting springs (65) are fixedly mounted on the top of the cutter (64), with the upper end of the connecting springs (65) fixedly mounted on the top of the bracket (61).

6. The anti-contamination device for CSP chip shipment according to claim 1, characterized in that: The positioning component (2) includes two electric push rods (21) symmetrically mounted on the top of the sorting table (1), and the output end of the electric push rod (21) is fixedly connected to a clamp (22).

7. The anti-contamination device for CSP chip shipment according to claim 1, characterized in that: A storage box (8) is installed at the bottom of the sorting station (1).

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